WO2004081629A1 - Active alignment of fiber and optical modul - Google Patents

Active alignment of fiber and optical modul Download PDF

Info

Publication number
WO2004081629A1
WO2004081629A1 PCT/GB2004/000972 GB2004000972W WO2004081629A1 WO 2004081629 A1 WO2004081629 A1 WO 2004081629A1 GB 2004000972 W GB2004000972 W GB 2004000972W WO 2004081629 A1 WO2004081629 A1 WO 2004081629A1
Authority
WO
WIPO (PCT)
Prior art keywords
optic
fibre
carrier
chip
alignment
Prior art date
Application number
PCT/GB2004/000972
Other languages
French (fr)
Inventor
Antony Oldroyd
Philip Pentney
Nadhum Zayer
Original Assignee
Bookham Technology Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bookham Technology Plc filed Critical Bookham Technology Plc
Publication of WO2004081629A1 publication Critical patent/WO2004081629A1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element

Definitions

  • the present invention relates to a technique for actively aligning an optic fibre with an optical element defined in an optic chip, for which a relatively high degree of precision is required.
  • the technique of active alignment involves adjusting the alignment of an optic fibre with respect to an optic element whilst transmitting light between the optic element and the optic fibre, and fixing the position of the optic fibre on the basis of measurements of the degree of optical coupling as the alignment of the fibre is adjusted.
  • the present invention provides a method of actively aligning an optic fibre with an optic element defined in an optic chip supported on a carrier, wherein the active alignment process is carried out with the fibre held in molten glass on the carrier, and the glass is solidified at the end of the active alignment process to fix the fibre in the desired alignment with respect to the optic element.
  • a method of optically coupling an optic fibre to an optic element defined in an optic chip including the steps of: (a) providing the optic chip on a carrier, (b) holding the fibre in molten glass on the carrier in an alignment in which light can be transmitted between the optic fibre and the optic element; (c) moving the fibre in the molten glass so as to adjust the alignment of the optic fibre with the optic element whilst transmitting light between the optic element and the optic fibre, and making measurements of the degree of optical coupling between the fibre and optic element as the fibre is so moved; and (d) solidifying the glass with the optic fibre in an alignment selected on the basis of said measurements.
  • the optic chip is a laser chip.
  • the technique of the present invention is also applicable to the coupling of optic fibres to other types of optic chips such as those including passive elements such as an optical waveguide leading to a plurality of photodiodes via, for example, a wavelength dispersive elements such as an array waveguide grating (AWG).
  • AWG array waveguide grating
  • a method of optically coupling an optic fibre to a light-emitting device defined in an optic chip including the steps of: (a) providing the optic chip on a carrier, (b) holding the fibre in molten glass on the carrier in an alignment in which light can be transmitted between the light-emitting device and the optic fibre; (c) moving the fibre in the molten glass so as to adjust the alignment of the optic fibre with the light- emitting device whilst operating the light-emitting device to transmit light between
  • optical coupling between the light-emitting device and the fibre as the fibre is so moved ; and (d) solidifying the glass with the optic fibre in an alignment selected on the basis of said measurements; wherein the alignment of the optic fibre at the time of solidifying is selected taking into account the temperature to which the light-emitting device is. exposed during its operation in step (c).
  • glass Whilst glass is known as a hermetic sealant, the inventors have found that it is also good for fixing and maintaining the alignment of an optic fibre to a relatively high degree of precision in an active alignment technique. It has been observed that the small movement upon freezing is relatively consistent and reproducible compared to that of solder, which small and reproducible movement is good for achieving good optical coupling between the optic chip and the fibre without the need for multiple re- freezes. Also, it has been observed that glass does not suffer from long term "creep" effect, whereby large changes in optical coupling efficiency over time can be avoided.
  • the alignment technique of the present invention is useful for example for coupling the output of a laser chip, particularly a single mode output, with an optic fibre, particularly single mode optic fibre.
  • the optic fibre is aligned for receiving light from a side edge of the optic chip (i.e. an edge where the chip has been diced from a wafer during its production), which side edge may have been polished or otherwise finished to improve the coupling efficiency.
  • the optic fibre thus receives light propagated in a direction perpendicular to the direction in which the layers of the optic chip are
  • the alignment technique of the present invention is particularly useful, for example, for cases where the alignment is carried out to sub-micron precision, such as when the optic chip and the optic fibre are of a type wherein a 0.5dB coupling loss results from a deviation as little as 0.3 microns or less.
  • the carrier is housed in a package, and a hermetic seal is provided between the fibre and the package at the fibre entry point so as to provide a hermetically sealed environment for the carrier/optic chip.
  • the present invention also provides a carrier for an optic chip, wherein the carrier is made of a material having a thermal conductivity no less than that of aluminium nitride.
  • the present invention also provides a carrier for mounting an optic chip on a first portion of a first surface thereof and including a heater at a second portion of said first surface for melting a material used to fix a fibre in a position aligned with the output of the optic chip, wherein the carrier defines slots for controlling the transfer of heat generated by the heater to the optic chip; the slots including a first slot extending downwards from said first surface and dividing said first and second portions of the first surface, and a second slot below the heater.
  • The-slots ⁇ are-o cupied ⁇ by ⁇ a" ⁇ aOuum carrier/optic chip is housed or by another material of relatively low thermal conductivity compared to the carrier material.
  • the present invention also provides a combination of a carrier as described above with an optic chip mounted thereon.
  • Figure 1 shows an optic chip/carrier assembly for use in an embodiment of the technique of the present invention
  • Figure 2 shows a glass pre-form for use in an embodiment of the technique of the present invention
  • Figure 3 shows the carrier of Figure 1 with an optic fibre held in molten glass on the carrier according to an embodiment of the technique of the present invention
  • Figure 4 shows a cross-sectional view of an optic fibre held on the carrier within a solidified glass fillet at the end of an active alignment technique according to an embodiment of the present invention
  • Figure 5 shows a schematic view of the carrier/optic chip in a hermetically sealed housing after the alignment process is completed.
  • an optical laser chip 4 is mounted on a carrier 2 made of a material selected for good dissipation of heat away from the laser chip during its normal operation.
  • a carrier 2 made of a material selected for good dissipation of heat away from the laser chip during its normal operation.
  • An example of a suitable material is
  • an optic fibre 12 stripped of its protective claddings is placed on the carrier with its end roughly aligned with the end of the laser chip, and an arch-shaped (horseshoe-shaped) low temperature melting glass pre-form 14a is positioned on the carrier over the optic fibre 12 at a location (area marked 18 in Figure 1) slightly spaced from the end of the laser chip by a vertical slot 6 cut into the carrier 2.
  • the shape of the glass pre-form 14a is selected such that when appropriately heated it collapses over the fibre forming a well-shaped fillet to attach the fibre to the carrier.
  • the glass pre-form 14a is controllably melted by heat provided through the carrier 2 from a resistive heater strip 10 (the associated circuitry is not shown in the figures) provided on a portion of the surface of the carrier 2 adjacent to where the glass preform 14a is located. Positioning the glass pre-form 14a on a portion of the carrier adjacent the heater strip such that the glass pre-form is only indirectly heated by the heater strip via the transfer of heat therefrom through the carrier allows better control of the melting of the glass perform 14a.
  • the heater strip may for example be made.of tantalum nitride.
  • the melted glass pre-form 14a forms a molten glass fillet 14b around the optic fibre within which the optic fibre can be moved.
  • the laser chip is then operated and the power of the light transmitted from the laser through the optic fibre is measured at a light detector 16.
  • the optic fibre is then moved within the molten glass fillet 14b to
  • optimum alignment of the end of the optic fibre relative to the laser chip is determined on the basis of the power levels measured at the light detector as the alignment of the end of the optic fibre is adjusted.
  • the molten glass fillet 14b is then cooled and solidified after first incorporating an offset into the alignment of the optic fibre within the molten glass fillet to take into account (a) the unavoidable movement of the fibre accompanying the solidification of the glass fillet and also (b) the fact that the laser is operated during the alignment procedure at a temperature higlier than that of normal operation as a result of the relatively large amount of heat (350°C) needed to melt the glass fillet.
  • the size of the offset is determined experimentally for a given set of repeatedly reproducible process conditions.
  • a thermally conductive material is selected for the carrier with a view to dissipating heat away from the laser chip during its normal operation.
  • a vertical slot 6 is formed in the carrier between the portion of the carrier on which the laser chip is located and the portion of the chip on. which the glass fillet and heater strip are located.
  • a horizontal slot 8 is- formed in a portion of the carrier underlying the heater strip 10 for the primary purpose of reducing the transfer of heat from the heater strip through the base of the structure and avoiding excess heating of any elements in that path, such as solder joints, and a thermoelectric cooler if such is provided for use during normal operation of the laser chip.
  • the horizontal slot is also effective in improving the efficiency of the heater strip at heating the glass pre-form and hence reducing the heater current required to melt the glass perform.. This is good for heater strip reliability.
  • Figure 5 shows the carrier/optic chip housed in a hermetically sealed package 19 after the alignment process is completed.
  • the package includes a base 21 and a lid 20,. and a hermetic seal 22 is provided between the base and lid, and between the fibre and the base and lid at the point of fibre entry.
  • the package may be closed under vacuum conditions or in an atmosphere of an inert gas to provide a suitable environment for the optic chip. Either way, the slots 6, 8 are thus occupied by a material having a thermal conductivity lower than that of the carrier material.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

A method of actively aligning an optic fibre with an optic element defined in an optic chip supported on a carrier, such as an aluminium nitride carrier including slots to control heat transfer, wherein the active alignment process is carried out with the fibre held in molten glass on the carrier, and the glass is solidified at the end of the active alignment process to fix the fibre in the desired alignment with respect to the optic element.

Description

ACTIVE ALIGNMENT OP FIBER AND OPTICAL MODUL
The present invention relates to a technique for actively aligning an optic fibre with an optical element defined in an optic chip, for which a relatively high degree of precision is required.
The technique of active alignment involves adjusting the alignment of an optic fibre with respect to an optic element whilst transmitting light between the optic element and the optic fibre, and fixing the position of the optic fibre on the basis of measurements of the degree of optical coupling as the alignment of the fibre is adjusted.
With optic chips, a relatively high degree of precision is required, and it is an aim of the present invention to provide a new improved active alignment technique for use with optic chips.
The present invention provides a method of actively aligning an optic fibre with an optic element defined in an optic chip supported on a carrier, wherein the active alignment process is carried out with the fibre held in molten glass on the carrier, and the glass is solidified at the end of the active alignment process to fix the fibre in the desired alignment with respect to the optic element.
According to one embodiment of the invention there is provided a method of optically coupling an optic fibre to an optic element defined in an optic chip, the method including the steps of: (a) providing the optic chip on a carrier, (b) holding the fibre in molten glass on the carrier in an alignment in which light can be transmitted between the optic fibre and the optic element; (c) moving the fibre in the molten glass so as to adjust the alignment of the optic fibre with the optic element whilst transmitting light between the optic element and the optic fibre, and making measurements of the degree of optical coupling between the fibre and optic element as the fibre is so moved; and (d) solidifying the glass with the optic fibre in an alignment selected on the basis of said measurements.
In one. embodiment, the optic chip is a laser chip. However, the technique of the present invention is also applicable to the coupling of optic fibres to other types of optic chips such as those including passive elements such as an optical waveguide leading to a plurality of photodiodes via, for example, a wavelength dispersive elements such as an array waveguide grating (AWG).
According to another embodiment of the present invention, there is provided a method of optically coupling an optic fibre to a light-emitting device defined in an optic chip, the method including the steps of: (a) providing the optic chip on a carrier, (b) holding the fibre in molten glass on the carrier in an alignment in which light can be transmitted between the light-emitting device and the optic fibre; (c) moving the fibre in the molten glass so as to adjust the alignment of the optic fibre with the light- emitting device whilst operating the light-emitting device to transmit light between
Figure imgf000004_0001
optical coupling between the light-emitting device and the fibre as the fibre is so moved; and (d) solidifying the glass with the optic fibre in an alignment selected on the basis of said measurements; wherein the alignment of the optic fibre at the time of solidifying is selected taking into account the temperature to which the light-emitting device is. exposed during its operation in step (c).
Whilst glass is known as a hermetic sealant, the inventors have found that it is also good for fixing and maintaining the alignment of an optic fibre to a relatively high degree of precision in an active alignment technique. It has been observed that the small movement upon freezing is relatively consistent and reproducible compared to that of solder, which small and reproducible movement is good for achieving good optical coupling between the optic chip and the fibre without the need for multiple re- freezes. Also, it has been observed that glass does not suffer from long term "creep" effect, whereby large changes in optical coupling efficiency over time can be avoided.
The alignment technique of the present invention is useful for example for coupling the output of a laser chip, particularly a single mode output, with an optic fibre, particularly single mode optic fibre.
In the embodiment described below, the optic fibre is aligned for receiving light from a side edge of the optic chip (i.e. an edge where the chip has been diced from a wafer during its production), which side edge may have been polished or otherwise finished to improve the coupling efficiency. The optic fibre thus receives light propagated in a direction perpendicular to the direction in which the layers of the optic chip are
deposited~on-a~substrate_duringrpr^^^ diced. The alignment technique of the present invention is particularly useful, for example, for cases where the alignment is carried out to sub-micron precision, such as when the optic chip and the optic fibre are of a type wherein a 0.5dB coupling loss results from a deviation as little as 0.3 microns or less.
In one embodiment, the carrier is housed in a package, and a hermetic seal is provided between the fibre and the package at the fibre entry point so as to provide a hermetically sealed environment for the carrier/optic chip.
The present invention also provides a carrier for an optic chip, wherein the carrier is made of a material having a thermal conductivity no less than that of aluminium nitride.
The present invention also provides a carrier for mounting an optic chip on a first portion of a first surface thereof and including a heater at a second portion of said first surface for melting a material used to fix a fibre in a position aligned with the output of the optic chip, wherein the carrier defines slots for controlling the transfer of heat generated by the heater to the optic chip; the slots including a first slot extending downwards from said first surface and dividing said first and second portions of the first surface, and a second slot below the heater.
The-slots~are-o cupied~by~a"^aOuum carrier/optic chip is housed or by another material of relatively low thermal conductivity compared to the carrier material. The present invention also provides a combination of a carrier as described above with an optic chip mounted thereon.
An embodiment of the present invention is described hereunder, by way of example only, with reference to the accompanying drawings, in which:
Figure 1 shows an optic chip/carrier assembly for use in an embodiment of the technique of the present invention;
Figure 2 shows a glass pre-form for use in an embodiment of the technique of the present invention;
Figure 3 shows the carrier of Figure 1 with an optic fibre held in molten glass on the carrier according to an embodiment of the technique of the present invention;
Figure 4 shows a cross-sectional view of an optic fibre held on the carrier within a solidified glass fillet at the end of an active alignment technique according to an embodiment of the present invention; and
Figure 5 shows a schematic view of the carrier/optic chip in a hermetically sealed housing after the alignment process is completed.
With reference to the accompanying Figures 1 to 4, an optical laser chip 4 is mounted on a carrier 2 made of a material selected for good dissipation of heat away from the laser chip during its normal operation. An example of a suitable material is
Figure imgf000007_0001
the figures. Also not shown in the figures are other components (such as other optical components and temperature control means) that are used dirring normal operation of the laser chip but are not used in the active alignment procedure. The end length of an optic fibre 12 stripped of its protective claddings is placed on the carrier with its end roughly aligned with the end of the laser chip, and an arch-shaped (horseshoe-shaped) low temperature melting glass pre-form 14a is positioned on the carrier over the optic fibre 12 at a location (area marked 18 in Figure 1) slightly spaced from the end of the laser chip by a vertical slot 6 cut into the carrier 2. The shape of the glass pre-form 14a is selected such that when appropriately heated it collapses over the fibre forming a well-shaped fillet to attach the fibre to the carrier. The glass pre-form 14a is controllably melted by heat provided through the carrier 2 from a resistive heater strip 10 (the associated circuitry is not shown in the figures) provided on a portion of the surface of the carrier 2 adjacent to where the glass preform 14a is located. Positioning the glass pre-form 14a on a portion of the carrier adjacent the heater strip such that the glass pre-form is only indirectly heated by the heater strip via the transfer of heat therefrom through the carrier allows better control of the melting of the glass perform 14a. The heater strip may for example be made.of tantalum nitride.
The melted glass pre-form 14a forms a molten glass fillet 14b around the optic fibre within which the optic fibre can be moved. The laser chip is then operated and the power of the light transmitted from the laser through the optic fibre is measured at a light detector 16. The optic fibre is then moved within the molten glass fillet 14b to
Figure imgf000008_0001
optimum alignment of the end of the optic fibre relative to the laser chip is determined on the basis of the power levels measured at the light detector as the alignment of the end of the optic fibre is adjusted. The molten glass fillet 14b is then cooled and solidified after first incorporating an offset into the alignment of the optic fibre within the molten glass fillet to take into account (a) the unavoidable movement of the fibre accompanying the solidification of the glass fillet and also (b) the fact that the laser is operated during the alignment procedure at a temperature higlier than that of normal operation as a result of the relatively large amount of heat (350°C) needed to melt the glass fillet. For a given carrier/chip assembly, the size of the offset is determined experimentally for a given set of repeatedly reproducible process conditions.
As mentioned above, a thermally conductive material is selected for the carrier with a view to dissipating heat away from the laser chip during its normal operation. In order to control the amount of heat transferred from the heater strip to the laser chip during the active alignment ' procedure, a vertical slot 6 is formed in the carrier between the portion of the carrier on which the laser chip is located and the portion of the chip on. which the glass fillet and heater strip are located. A horizontal slot 8 is- formed in a portion of the carrier underlying the heater strip 10 for the primary purpose of reducing the transfer of heat from the heater strip through the base of the structure and avoiding excess heating of any elements in that path, such as solder joints, and a thermoelectric cooler if such is provided for use during normal operation of the laser chip. The horizontal slot is also effective in improving the efficiency of the heater strip at heating the glass pre-form and hence reducing the heater current required to melt the glass perform.. This is good for heater strip reliability.
The above-described technique is applicable to any type of optic fibre, including cylindrically-lensed fibres. Figure 5 shows the carrier/optic chip housed in a hermetically sealed package 19 after the alignment process is completed. The package includes a base 21 and a lid 20,. and a hermetic seal 22 is provided between the base and lid, and between the fibre and the base and lid at the point of fibre entry. The package may be closed under vacuum conditions or in an atmosphere of an inert gas to provide a suitable environment for the optic chip. Either way, the slots 6, 8 are thus occupied by a material having a thermal conductivity lower than that of the carrier material.
The applicant draws attention to the fact that the present invention may include any feature or combination of features disclosed herein either implicitly or explicitly or any generalisation thereof, without limitation to the scope of any definitions set out above. In view of the foregoing description it will be evident to a person skilled in the art that various modifications may be made within the scope of the invention. For example, a remote laser could be used instead of the integral heater strip to melt the glass.

Claims

CLAIMS:
1. A method of actively aligning an optic fibre with an optic element defined in an optic chip supported on a carrier, wherein the active alignment process is carried out with the fibre held in molten glass on the carrier, and the glass is solidified at the end of the active alignment process to fix the fibre in the desired alignment with respect to the optic element.
2. A method of optically coupling an optic fibre to an optic element defined in an optic chip, the method including the steps of: (a) providing the optic chip on a carrier, (b) holding the fibre in molten glass on the carrier in an alignment in which light can be transmitted between the optic fibre and the optic element; (c) moving the fibre in the molten glass so as to adjust the alignment of the optic fibre with the optic element whilst transmitting light between the optic element and the optic fibre, and making measurements of the degree of optical coupling between the fibre and optic element as the fibre is so moved; and (d) solidifying the glass with the optic fibre in an alignment selected on the basis of said measurements.
3. . A method of optically coupling an optic fibre to a light-emitting device defined in an optic chip, the method including the steps of: (a) providing the optic chip on a carrier, (b) holding the fibre in molten glass on the carrier in an alignment in
"wMch~l ghtτ aniDe^^
(c) moving the fibre in the molten glass so as to adjust the alignment of the optic fibre with the light-emitting device whilst operating the light-emitting device to transmit light between the optic element and the optic fibre, and making measurements of the degree of optical coupling between the light-emitting device and the fibre as the fibre is so moved; and (d) solidifying the glass with the optic fibre in an alignment selected on the basis of said measurements; wherein the alignment of the optic fibre at the time of solidifying is selected taking into account the temperature to which the light- emitting device is exposed during its operation in step (c).
4. A method according to any preceding claim wherein the glass is melted via heat transferred through the carrier from a heater strip provided in thermal contact with the carrier.
5. A method according to claim 4, wherein the optic chip, glass and heater strip are provided at different locations on a common side of the carrier, the glass being located between the heater strip and the optic chip.
6. A method according to • claim 5, wherein a slot is cut into a portion of the carrier underlying the heater strip to control the transfer of heat from the heater strip through the carrier to the optic chip.
7. A method according to any preceding claim, wherein the optic chip is a laser chip.
"8 A"method"-according"to "any"preceding laim7^vterem"the Opti -fibrei.'S_aligned" for receiving light from a side edge of the optic chip.
9. A method according to any preceding claim, where the alignment is carried out to sub-micron precision.
10. A method according to any preceding claim, wherein the optic element and the optic fibre are of a type wherein a 0.5dB coupling loss would result from a deviation from optimal alignment of 0.3 microns or less.
11. A method according to any preceding claim, wherein the carrier is housed in a package, and a hermetic seal is provided between the fibre and the package at the fibre entry point so as to provide a hermetically sealed environment for the carrier/optic chip.
12. A carrier for an optic chip, wherein the carrier is made of a material having a thermal conductivity no less than that of aluminium nitride.
13. A carrier according to claim 12, wherein the carrier material is urninium nitride.
14. A carrier for mounting an optic chip on a first portion of a first surface thereof and including a heater at a second portion of said first surface for melting a material used to fix a fibre in a position aligned with the output of the optic chip, wherein the "carrier ιfe£nes~sfo ts^or ∞n^ optic chip; the slots including a first slot extending downwards from said first surface and dividing said first and second portions of the first surface, and a second slot below the heater.
15. A carrier according to claim 14, wherein the slots are occupied by a vacuum or the gas of the environment in which the carrier/optic chip is housed.
16. A combination of a carrier, according to any of claims 12 to 15, and an optic chip mounted on the carrier.
17. A method according to any of claims 1 to 11, wherein the laser chip provides a single mode output and the optic fibre is a single mode fibre.
18. A method according to any of claims 1 to 11, wherein the optic chip is a 980nm laser chip.
19. An optic assembly including an optic chip supported on a carrier and an optic fibre actively aligned with an optic element defined in the optic chip and fixed by- glass on the carrier in the desired alignment with respect to the optic element.
PCT/GB2004/000972 2003-03-14 2004-03-11 Active alignment of fiber and optical modul WO2004081629A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0305890A GB0305890D0 (en) 2003-03-14 2003-03-14 Active alignment technique
GB0305890.6 2003-03-14

Publications (1)

Publication Number Publication Date
WO2004081629A1 true WO2004081629A1 (en) 2004-09-23

Family

ID=9954796

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2004/000972 WO2004081629A1 (en) 2003-03-14 2004-03-11 Active alignment of fiber and optical modul

Country Status (2)

Country Link
GB (1) GB0305890D0 (en)
WO (1) WO2004081629A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008011525A1 (en) * 2008-02-27 2009-09-10 Jenoptik Laserdiode Gmbh Method for producing a light transmission arrangement and light transmission arrangement
CN103018854A (en) * 2012-12-19 2013-04-03 武汉电信器件有限公司 Accurate alignment fixing structure and alignment fixing method of optic fiber of photoelectron device
CN107442931A (en) * 2017-06-30 2017-12-08 中山诺顿科研技术服务有限公司 Automatic optical fiber cutting device with simple structure
EP2507830A4 (en) * 2009-12-01 2018-01-10 Cisco Technology, Inc. Slotted configuration for optimized placement of micro-components using adhesive bonding
CN111474642A (en) * 2019-09-06 2020-07-31 南通赛勒光电科技有限公司 Coupling alignment structure and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4865410A (en) * 1988-01-25 1989-09-12 E. I. Du Pont De Nemours And Company Decoupled fiber optic feedthrough assembly
EP0579439A1 (en) * 1992-07-16 1994-01-19 AT&T Corp. Article that comprises a laser coupled to an optical fiber
US6074104A (en) * 1997-04-18 2000-06-13 Nec Corporation Method for hermetically sealing optical fiber introducing section and hermetically sealed structure
US20020081075A1 (en) * 2000-11-29 2002-06-27 The Furukawa Electric Co., Ltd. Method for aligning laser diode and optical fiber
US20030026557A1 (en) * 2001-06-28 2003-02-06 Roberto Galeotti Optical bench for an opto-electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4865410A (en) * 1988-01-25 1989-09-12 E. I. Du Pont De Nemours And Company Decoupled fiber optic feedthrough assembly
EP0579439A1 (en) * 1992-07-16 1994-01-19 AT&T Corp. Article that comprises a laser coupled to an optical fiber
US6074104A (en) * 1997-04-18 2000-06-13 Nec Corporation Method for hermetically sealing optical fiber introducing section and hermetically sealed structure
US20020081075A1 (en) * 2000-11-29 2002-06-27 The Furukawa Electric Co., Ltd. Method for aligning laser diode and optical fiber
US20030026557A1 (en) * 2001-06-28 2003-02-06 Roberto Galeotti Optical bench for an opto-electronic device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008011525A1 (en) * 2008-02-27 2009-09-10 Jenoptik Laserdiode Gmbh Method for producing a light transmission arrangement and light transmission arrangement
EP2507830A4 (en) * 2009-12-01 2018-01-10 Cisco Technology, Inc. Slotted configuration for optimized placement of micro-components using adhesive bonding
US10175448B2 (en) 2009-12-01 2019-01-08 Cisco Technology, Inc. Slotted configuration for optimized placement of micro-components using adhesive bonding
CN103018854A (en) * 2012-12-19 2013-04-03 武汉电信器件有限公司 Accurate alignment fixing structure and alignment fixing method of optic fiber of photoelectron device
CN107442931A (en) * 2017-06-30 2017-12-08 中山诺顿科研技术服务有限公司 Automatic optical fiber cutting device with simple structure
CN111474642A (en) * 2019-09-06 2020-07-31 南通赛勒光电科技有限公司 Coupling alignment structure and method

Also Published As

Publication number Publication date
GB0305890D0 (en) 2003-04-16

Similar Documents

Publication Publication Date Title
EP0978910B1 (en) Optical component assembly
EP0196875B1 (en) Optical component mounting
US8821042B2 (en) Optical module with lens assembly directly mounted on carrier by soldering and laser diode indirectly mounted on carrier through sub-mount
CN101986178B (en) Light emitting semiconductor device
EP1328047B1 (en) Optical component attachment to optoelectronic packages
US6712528B2 (en) Optical bench for an opto-electronic device
CA2022533A1 (en) Multi-fiber alignment package for tilted facet optoelectronic components
EP1574888A1 (en) Optical module, manufacturing method therefor, protective component for a light guide, and protective component having electric wiring
US7263260B2 (en) Low cost, high precision multi-point optical component attachment
WO2016154372A1 (en) Control of thermal energy in optical devices
WO2004081629A1 (en) Active alignment of fiber and optical modul
US5553182A (en) Alignment fixture and associated method for controllably positioning on optical fiber
US7056035B2 (en) Optical module, optical apparatus including optical module, and method for using optical module
CN100523883C (en) Precision fiber attachment
US6941043B1 (en) Wavelength stabilization of an external cavity laser diode (ECLD)
CN101299082B (en) Optical module
USRE41840E1 (en) Method and apparatus for maintaining alignment of a laser diode with an optical fiber
US20100309643A1 (en) Multi-chip hybrid-mounted device and method of manufacturing the same
US10895702B2 (en) Integrated heater structures in a photonic integrated circuit for solder attachment applications
JP2000091692A (en) Optical element mounting part structure
EP1271209A1 (en) Optical bench for an opto-electronic device
EP3994777B1 (en) Laser engine supporting multiple laser sources
JPH02247093A (en) Structure for fixing ld chip carrier
FR3115412B1 (en) PHOTONIC DEVICE WITH IMPROVED HEAT DISSIPATION FOR III-V/SI HETEROGENEOUS LASER AND ASSOCIATED FABRICATION METHOD
Combs et al. Silicon microbench heater elements for packaging optoelectronic devices

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase