WO2004068692A3 - Low inductance electrical contacts and lga connector system - Google Patents
Low inductance electrical contacts and lga connector system Download PDFInfo
- Publication number
- WO2004068692A3 WO2004068692A3 PCT/US2004/001381 US2004001381W WO2004068692A3 WO 2004068692 A3 WO2004068692 A3 WO 2004068692A3 US 2004001381 W US2004001381 W US 2004001381W WO 2004068692 A3 WO2004068692 A3 WO 2004068692A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- transmission
- coil sections
- electrical contacts
- electrical
- connector system
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/621—Bolt, set screw or screw clamp
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Connecting Device With Holders (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The present invention provides an electrical contact having transmission-coil sections with at least two tightly wound turns. Active-coil sections are integral with, and positioned between the transmission-coil sections so as to provide electrical signal communication between the two transmission-coil sections, and spring characteristics. The transmission-coil sections are over coated with a conductive noble metal so as to fuse each of the tightly wound turns together to thereby provide for a shortened electrical transmission pathway through the electrical contact. An LGA interposer for providing data communication between a first and a second array of contact pads is also provided having a dielectric housing with an array of cavities; and a plurality of electrical contacts positioned within the cavities.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/350,600 US6846184B2 (en) | 2003-01-24 | 2003-01-24 | Low inductance electrical contacts and LGA connector system |
US10/350,600 | 2003-01-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004068692A2 WO2004068692A2 (en) | 2004-08-12 |
WO2004068692A3 true WO2004068692A3 (en) | 2004-12-02 |
Family
ID=32735599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/001381 WO2004068692A2 (en) | 2003-01-24 | 2004-01-20 | Low inductance electrical contacts and lga connector system |
Country Status (2)
Country | Link |
---|---|
US (1) | US6846184B2 (en) |
WO (1) | WO2004068692A2 (en) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE41663E1 (en) * | 2002-01-17 | 2010-09-14 | Ardent Concepts, Inc. | Compliant electrical contact assembly |
US7019222B2 (en) * | 2002-01-17 | 2006-03-28 | Ardent Concepts, Inc. | Compliant electrical contact assembly |
US7126062B1 (en) | 2002-01-17 | 2006-10-24 | Ardent Concepts, Inc. | Compliant electrical contact assembly |
US6909056B2 (en) * | 2002-01-17 | 2005-06-21 | Ardent Concepts, Inc. | Compliant electrical contact assembly |
US7446545B2 (en) * | 2003-05-08 | 2008-11-04 | Unitechno Inc. | Anisotropically conductive sheet |
US20040224148A1 (en) * | 2003-05-08 | 2004-11-11 | Hitoshi Matsunaga | Anisotropically conductive sheet |
JP2005051129A (en) * | 2003-07-30 | 2005-02-24 | Sony Corp | Electronic apparatus |
WO2006082745A1 (en) * | 2005-02-02 | 2006-08-10 | Sony Chemical & Information Device Corporation | Connection component, multilayer substrate |
JP4304189B2 (en) * | 2005-04-20 | 2009-07-29 | エスペック株式会社 | IC socket |
US7790987B2 (en) * | 2005-04-27 | 2010-09-07 | Sony Computer Entertainment Inc. | Methods and apparatus for interconnecting a ball grid array to a printed circuit board |
US20060245150A1 (en) * | 2005-04-29 | 2006-11-02 | Tingbao Chen | Interconnect Cartridge |
GB2426350A (en) * | 2005-05-17 | 2006-11-22 | Wan-Chuan Chou | Integral coil probe and method of transmitting signal. |
JP2007035400A (en) * | 2005-07-26 | 2007-02-08 | Yamaichi Electronics Co Ltd | Socket for semiconductor device |
KR100700283B1 (en) * | 2005-12-28 | 2007-03-26 | 동부일렉트로닉스 주식회사 | Method of fabricating the trench for isolation in semiconductor device |
US7393214B2 (en) | 2006-02-17 | 2008-07-01 | Centipede Systems, Inc. | High performance electrical connector |
JP5379474B2 (en) * | 2006-04-28 | 2013-12-25 | 日本発條株式会社 | Conductive contact holder |
US7601009B2 (en) * | 2006-05-18 | 2009-10-13 | Centipede Systems, Inc. | Socket for an electronic device |
CN101315392A (en) * | 2007-05-31 | 2008-12-03 | 佛山普立华科技有限公司 | Probe positioning device |
US7442045B1 (en) * | 2007-08-17 | 2008-10-28 | Centipede Systems, Inc. | Miniature electrical ball and tube socket with self-capturing multiple-contact-point coupling |
KR100791944B1 (en) * | 2007-08-21 | 2008-01-04 | (주)기가레인 | Probe block |
CN201112693Y (en) * | 2007-10-12 | 2008-09-10 | 富士康(昆山)电脑接插件有限公司 | Electric connector terminal |
TWM337870U (en) * | 2007-12-03 | 2008-08-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US7491069B1 (en) | 2008-01-07 | 2009-02-17 | Centipede Systems, Inc. | Self-cleaning socket for microelectronic devices |
US7520753B1 (en) * | 2008-03-31 | 2009-04-21 | International Business Machines Corporation | Method of using coil contact as electrical interconnect |
DE102008040180A1 (en) * | 2008-07-04 | 2010-01-14 | Robert Bosch Gmbh | Pre-assembly for a contact assembly of a sensor assembly |
JP5166176B2 (en) * | 2008-09-04 | 2013-03-21 | スリーエム イノベイティブ プロパティズ カンパニー | Socket for electronic devices |
TW201106540A (en) * | 2009-08-04 | 2011-02-16 | Hon Hai Prec Ind Co Ltd | Electrical connection device |
JP2011075313A (en) | 2009-09-29 | 2011-04-14 | Three M Innovative Properties Co | Ic device testing socket |
US7927109B1 (en) * | 2009-10-30 | 2011-04-19 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having plated conductive layer |
JP5960383B2 (en) | 2010-06-01 | 2016-08-02 | スリーエム イノベイティブ プロパティズ カンパニー | Contact holder |
US20120021316A1 (en) * | 2010-07-26 | 2012-01-26 | Energyor Technologies Inc. | Cell voltage monitoring (cvm) pick-up assembly for a fuel cell stack |
US8531821B2 (en) * | 2011-01-28 | 2013-09-10 | Raytheon Company | System for securing a semiconductor device to a printed circuit board |
US8613622B2 (en) * | 2011-02-15 | 2013-12-24 | Medallion Technology, Llc | Interconnection interface using twist pins for testing and docking |
JP5725353B2 (en) | 2011-08-11 | 2015-05-27 | 住友電装株式会社 | Connector with capacitor |
TWI574473B (en) | 2012-06-07 | 2017-03-11 | 鴻海精密工業股份有限公司 | Electrical connector assembly |
DE102013104237B4 (en) * | 2013-04-26 | 2019-12-19 | Semikron Elektronik Gmbh & Co. Kg | circuitry |
CN103808973A (en) * | 2013-12-30 | 2014-05-21 | 珠海拓优电子有限公司 | Micro-spring |
JP6344072B2 (en) * | 2014-06-10 | 2018-06-20 | 富士通株式会社 | Semiconductor component socket, printed circuit board unit, and information processing apparatus |
CN104702211B (en) * | 2014-07-14 | 2017-05-24 | 陕西众森电能科技有限公司 | Solar cell spring testing probe |
US9568388B2 (en) | 2014-08-05 | 2017-02-14 | Sensata Technologies, Inc. | Small form factor pressure sensor |
CN107290099B (en) | 2016-04-11 | 2021-06-08 | 森萨塔科技公司 | Pressure sensor, plug for a pressure sensor and method for producing a plug |
EP3236226B1 (en) | 2016-04-20 | 2019-07-24 | Sensata Technologies, Inc. | Method of manufacturing a pressure sensor |
US10545064B2 (en) | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
US10323998B2 (en) | 2017-06-30 | 2019-06-18 | Sensata Technologies, Inc. | Fluid pressure sensor |
US10724907B2 (en) | 2017-07-12 | 2020-07-28 | Sensata Technologies, Inc. | Pressure sensor element with glass barrier material configured for increased capacitive response |
US10557770B2 (en) | 2017-09-14 | 2020-02-11 | Sensata Technologies, Inc. | Pressure sensor with improved strain gauge |
CN207424024U (en) * | 2017-11-23 | 2018-05-29 | 周婷 | The elastomer structure of conducting probe |
DE102022208922A1 (en) * | 2022-08-29 | 2024-02-29 | Robert Bosch Gesellschaft mit beschränkter Haftung | EMC contact spring |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6174172B1 (en) * | 1995-12-28 | 2001-01-16 | Nhk Spring Co., Ltd. | Electric contact unit |
US20030006787A1 (en) * | 2000-06-28 | 2003-01-09 | Toshio Kazama | Conductive contact |
US20030016037A1 (en) * | 2001-07-20 | 2003-01-23 | Nhk Spring Co., Ltd. | Conductive coil contact member |
US6559665B1 (en) * | 1995-10-04 | 2003-05-06 | Cerprobe Corporation | Test socket for an IC device |
US20030176113A1 (en) * | 2000-09-22 | 2003-09-18 | Yuichiro Sasaki | Spring element, press-clamped connector, and holder with probe for electro-acoustic component |
Family Cites Families (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2153177A (en) | 1936-04-22 | 1939-04-04 | Ibm | Brush frame construction |
US3317885A (en) | 1965-02-26 | 1967-05-02 | Stromberg Carlson Corp | Electrical connector for printed circuit boards |
US3513434A (en) | 1965-10-23 | 1970-05-19 | Lawrence Zielke | Electrical terminal connector block |
US3795884A (en) | 1973-03-06 | 1974-03-05 | Amp Inc | Electrical connector formed from coil spring |
NL152716B (en) | 1973-08-08 | 1977-03-15 | Amp Inc | ELECTRICAL CONNECTING DEVICE FOR DETACHABLE CONNECTION OF TWO FIXED CONTACT SUPPLIES TO EITHER SIDES AND PROCEDURE FOR MANUFACTURING SUCH ELECTRICAL CONNECTING DEVICE. |
US4810213A (en) | 1975-01-30 | 1989-03-07 | Square D Company | Low resistance electrical connecting assembly |
US4029375A (en) | 1976-06-14 | 1977-06-14 | Electronic Engineering Company Of California | Miniature electrical connector |
NO148869C (en) | 1977-09-24 | 1983-12-28 | Amp Inc | PROCEDURE FOR MANUFACTURING A CONTACT PIECE |
US4508405A (en) | 1982-04-29 | 1985-04-02 | Augat Inc. | Electronic socket having spring probe contacts |
DK291184D0 (en) | 1984-06-13 | 1984-06-13 | Boeegh Petersen Allan | METHOD AND DEVICE FOR TESTING CIRCUIT PLATES |
US4620761A (en) | 1985-01-30 | 1986-11-04 | Texas Instruments Incorporated | High density chip socket |
US5829128A (en) | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
US4838815A (en) | 1986-09-26 | 1989-06-13 | Hosiden Electronics Co., Ltd. | Connector assembly |
US4820376A (en) | 1987-11-05 | 1989-04-11 | American Telephone And Telegraph Company At&T Bell Laboratories | Fabrication of CPI layers |
USRE34084E (en) | 1989-02-13 | 1992-09-29 | Burndy Corporation | Vertical action contact spring |
US4961709A (en) | 1989-02-13 | 1990-10-09 | Burndy Corporation | Vertical action contact spring |
US4922376A (en) | 1989-04-10 | 1990-05-01 | Unistructure, Inc. | Spring grid array interconnection for active microelectronic elements |
US5366380A (en) | 1989-06-13 | 1994-11-22 | General Datacomm, Inc. | Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
US5035628A (en) | 1990-05-29 | 1991-07-30 | Amp Incorporated | Electrical connector for electrically interconnecting two parallel surfaces |
US5174763A (en) | 1990-06-11 | 1992-12-29 | Itt Corporation | Contact assembly |
US5030109A (en) | 1990-08-24 | 1991-07-09 | Amp Incorporated | Area array connector for substrates |
US5663654A (en) | 1990-08-29 | 1997-09-02 | Micron Technology, Inc. | Universal wafer carrier for wafer level die burn-in |
US5007842A (en) | 1990-10-11 | 1991-04-16 | Amp Incorporated | Flexible area array connector |
US5207585A (en) | 1990-10-31 | 1993-05-04 | International Business Machines Corporation | Thin interface pellicle for dense arrays of electrical interconnects |
US5061191A (en) | 1990-12-21 | 1991-10-29 | Amp Incorporated | Canted coil spring interposing connector |
JPH07120545B2 (en) | 1991-03-27 | 1995-12-20 | 山一電機株式会社 | Nested pressure connector |
US5167512A (en) | 1991-07-05 | 1992-12-01 | Walkup William B | Multi-chip module connector element and system |
US5139427A (en) | 1991-09-23 | 1992-08-18 | Amp Incorporated | Planar array connector and flexible contact therefor |
US5184962A (en) | 1991-12-05 | 1993-02-09 | Burndy Corporation | Electrical spring contact |
JPH05182729A (en) | 1991-12-26 | 1993-07-23 | Yamaichi Electron Co Ltd | Contactor for electrical parts |
US5214563A (en) | 1991-12-31 | 1993-05-25 | Compaq Computer Corporation | Thermally reactive lead assembly and method for making same |
US5213513A (en) | 1992-02-27 | 1993-05-25 | Seatt Corporation | Electric terminal |
US5299939A (en) | 1992-03-05 | 1994-04-05 | International Business Machines Corporation | Spring array connector |
US5232372A (en) | 1992-05-11 | 1993-08-03 | Amp Incorporated | Land grid array connector and method of manufacture |
US5237743A (en) | 1992-06-19 | 1993-08-24 | International Business Machines Corporation | Method of forming a conductive end portion on a flexible circuit member |
US5248262A (en) | 1992-06-19 | 1993-09-28 | International Business Machines Corporation | High density connector |
US5521519A (en) | 1992-07-30 | 1996-05-28 | International Business Machines Corporation | Spring probe with piloted and headed contact and method of tip formation |
US5211566A (en) | 1992-08-11 | 1993-05-18 | Amp Incorporated | Docking connector for disk drives |
US5273438A (en) | 1992-08-19 | 1993-12-28 | The Whitaker Corporation | Canted coil spring array and method for producing the same |
EP0616394A1 (en) | 1993-03-16 | 1994-09-21 | Hewlett-Packard Company | Method and system for producing electrically interconnected circuits |
DE69405435T2 (en) | 1993-03-16 | 1998-01-22 | Hewlett Packard Co | Method and device for the production of electrically interconnected circuits |
US5334029A (en) | 1993-05-11 | 1994-08-02 | At&T Bell Laboratories | High density connector for stacked circuit boards |
JP2655802B2 (en) | 1993-06-30 | 1997-09-24 | 山一電機株式会社 | Coil type contact and connector using the same |
US5806181A (en) | 1993-11-16 | 1998-09-15 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US5772451A (en) | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
US5462440A (en) | 1994-03-11 | 1995-10-31 | Rothenberger; Richard E. | Micro-power connector |
US5473510A (en) | 1994-03-25 | 1995-12-05 | Convex Computer Corporation | Land grid array package/circuit board assemblies and methods for constructing the same |
US5519201A (en) | 1994-04-29 | 1996-05-21 | Us3, Inc. | Electrical interconnection for structure including electronic and/or electromagnetic devices |
US5428191A (en) | 1994-07-14 | 1995-06-27 | Alcatel Network Systems, Inc. | Consistent grounding technique between components of high frequency systems |
JP2648120B2 (en) | 1995-02-08 | 1997-08-27 | 山一電機株式会社 | Surface contact type connector |
US5791914A (en) | 1995-11-21 | 1998-08-11 | Loranger International Corporation | Electrical socket with floating guide plate |
US5919050A (en) | 1997-04-14 | 1999-07-06 | International Business Machines Corporation | Method and apparatus for separable interconnecting electronic components |
JP4060919B2 (en) | 1997-11-28 | 2008-03-12 | 富士通株式会社 | Electrical connection device, contact manufacturing method, and semiconductor test method |
US6079987A (en) | 1997-12-26 | 2000-06-27 | Unitechno, Inc. | Connector for electronic parts |
KR100549731B1 (en) | 1998-01-16 | 2006-02-07 | 소니 가부시끼 가이샤 | Ic socket and method for manufacturing ic |
US5967798A (en) | 1998-07-13 | 1999-10-19 | Unisys Corporation | Integrated circuit module having springy contacts of at least two different types for reduced stress |
US6074219A (en) | 1998-07-13 | 2000-06-13 | Unisys Corporation | Electromechanical subassembly including a carrier with springy contacts that exert large and small contact forces |
JP2000133338A (en) | 1998-10-23 | 2000-05-12 | Nokia Mobile Phones Ltd | Electric connection device and electronic appliance using it |
US6224392B1 (en) | 1998-12-04 | 2001-05-01 | International Business Machines Corporation | Compliant high-density land grid array (LGA) connector and method of manufacture |
US6042388A (en) | 1999-01-19 | 2000-03-28 | Unisys Corporation | Electromechanical module having a thin springy plate for establishing pressed electrical connections |
US6183267B1 (en) | 1999-03-11 | 2001-02-06 | Murray Hill Devices | Ultra-miniature electrical contacts and method of manufacture |
IL128997A (en) | 1999-03-15 | 2002-12-01 | Aprion Digital Ltd | Electrical connecting device |
CA2266158C (en) | 1999-03-18 | 2003-05-20 | Ibm Canada Limited-Ibm Canada Limitee | Connecting devices and method for interconnecting circuit components |
JP4414017B2 (en) | 1999-05-25 | 2010-02-10 | モレックス インコーポレイテド | IC socket |
US6313523B1 (en) | 1999-10-28 | 2001-11-06 | Hewlett-Packard Company | IC die power connection using canted coil spring |
KR100373152B1 (en) | 1999-11-17 | 2003-02-25 | 가부시키가이샤 아드반테스트 | Ic socket and ic testing apparatus |
US6264476B1 (en) | 1999-12-09 | 2001-07-24 | High Connection Density, Inc. | Wire segment based interposer for high frequency electrical connection |
US6183269B1 (en) | 2000-01-27 | 2001-02-06 | Itt Manufacturing Enterprises, Inc. | Termination adaptor for PCB |
US6299460B1 (en) | 2000-04-14 | 2001-10-09 | Hewlett Packard Company | Spring-loaded backing plate assembly for use with land grid array-type devices |
US6375473B1 (en) | 2000-05-05 | 2002-04-23 | Kelsey-Hayes Company | Electrical interconnection for an electro-hydraulic brake system using wire form buttons |
US6416330B1 (en) | 2000-07-17 | 2002-07-09 | Cray Inc. | Canted coil spring conductor electrical circuit connector |
JP2002141151A (en) | 2000-11-06 | 2002-05-17 | Texas Instr Japan Ltd | Socket |
US6439894B1 (en) | 2001-01-31 | 2002-08-27 | High Connection Density, Inc. | Contact assembly for land grid array interposer or electrical connector |
US6477058B1 (en) | 2001-06-28 | 2002-11-05 | Hewlett-Packard Company | Integrated circuit device package including multiple stacked components |
-
2003
- 2003-01-24 US US10/350,600 patent/US6846184B2/en not_active Expired - Lifetime
-
2004
- 2004-01-20 WO PCT/US2004/001381 patent/WO2004068692A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6559665B1 (en) * | 1995-10-04 | 2003-05-06 | Cerprobe Corporation | Test socket for an IC device |
US6174172B1 (en) * | 1995-12-28 | 2001-01-16 | Nhk Spring Co., Ltd. | Electric contact unit |
US20030006787A1 (en) * | 2000-06-28 | 2003-01-09 | Toshio Kazama | Conductive contact |
US20030176113A1 (en) * | 2000-09-22 | 2003-09-18 | Yuichiro Sasaki | Spring element, press-clamped connector, and holder with probe for electro-acoustic component |
US20030016037A1 (en) * | 2001-07-20 | 2003-01-23 | Nhk Spring Co., Ltd. | Conductive coil contact member |
Also Published As
Publication number | Publication date |
---|---|
WO2004068692A2 (en) | 2004-08-12 |
US6846184B2 (en) | 2005-01-25 |
US20040147140A1 (en) | 2004-07-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2004068692A3 (en) | Low inductance electrical contacts and lga connector system | |
CA2310345A1 (en) | Enhanced communication connector assembly with crosstalk compensation | |
US7708594B2 (en) | Electrical connector with magnetic module | |
US20090253300A1 (en) | Modular jack having an improved magnetic module | |
JP3115050U (en) | Electrical connector assembly | |
EP1128491A3 (en) | Electrical connection member | |
US8475183B2 (en) | Electrical connector with improved impedance continuity | |
US8272898B2 (en) | Electrical connector system with magnetic module | |
WO2009055242A3 (en) | Electrical connector assembly | |
WO2007005598A3 (en) | Electrical connector for interconnection assembly | |
JP2004342571A (en) | Coaxial cable connector | |
US5577924A (en) | Jack module with inductive monitor | |
WO2004049499A3 (en) | Chip antenna | |
US20080280493A1 (en) | Connector in the Field of Telecommunications and a Combination of at Least Two Connectors | |
TW200742294A (en) | Transmission device and communication production employing the same | |
WO2002075856A3 (en) | Electrical connector for power conductors | |
WO2002073219A3 (en) | High bandwidth probe assembly | |
JP3108239U (en) | Electrical connector | |
US20100221933A1 (en) | Cable connector assembly with grounding device | |
KR102025933B1 (en) | Board to board connector | |
KR20160082442A (en) | Connector | |
DK1826879T3 (en) | Connection element for communication systems having a contact pin arrangement and cross-compensating means for improved performance | |
CN110740399B (en) | Wireless earphone | |
US11431135B2 (en) | Electrical connector structure with three sets of terminals and a ground connecting structure | |
CA2402050A1 (en) | Electrical connector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase |