WO2004067600A1 - 電子材料組成物、電子用品及び電子材料組成物の使用方法 - Google Patents
電子材料組成物、電子用品及び電子材料組成物の使用方法 Download PDFInfo
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- WO2004067600A1 WO2004067600A1 PCT/JP2004/000837 JP2004000837W WO2004067600A1 WO 2004067600 A1 WO2004067600 A1 WO 2004067600A1 JP 2004000837 W JP2004000837 W JP 2004000837W WO 2004067600 A1 WO2004067600 A1 WO 2004067600A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4253—Rubbers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/08—Epoxidised polymerised polyenes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Definitions
- the present invention relates to an electronic material composition containing a special polyether compound as a curing component, an electronic article obtained using the same, and a method for using the electronic material composition.
- a curable resin such as an epoxy resin is used as an important component in an electronic material composition which is mixed with an electronic material powder such as a ferrite powder or a metal powder or used without being mixed.
- Electronic materials such as these resins and electronic material powders are widely used as exterior materials, mainly as materials for electronic components.
- 1 As shown in Fig. 1, for example, as shown in Fig. 1, 1 has a winding 3 in a central concave portion of a core T2 having flanges at both ends, and external terminal electrodes 4 and 4 at both flanges of a core 2. Further, a wound type chip coil having an outer package 5 made of a coating material on the winding 3 is used as the coating material. In this wound type chip coil, the electrodes 4 and 4 'are joined to the soldering lands 6a and 6a of the circuit pattern of the printed wiring board 6 by solders 7 and 7, respectively. Although not shown, other chip components are similarly attached to predetermined soldering lands, and an outer package 8 is provided on the entire surface of the printed wiring board 6 'including these components.
- the electronic material composition as an exterior material of a wound type chip coil is described in any of the above publications, and two liquids of a liquid containing a hardening component and a liquid containing a hardening component are separately used. It is mainly of the so-called two-pack type, which is manufactured and mixed at the time of use.It takes time and effort at the time of manufacture and use, and the one after use cannot be reused because the reaction proceeds in the solution. There is a need for an electronic material composition that can be used in one-pack type during production, storage, and use because it is often wasteful and wasteful. ⁇
- an electronic material composition obtained by mixing a resin component with a solvent is applied and cured, but the cured layer can expand and contract even when the environmental temperature changes as described above. It does not generate distortion following it, so that stress (thermal strain stress) due to this is hardly generated, residual stress is hardly generated, and cohesive failure that breaks inside it when it can withstand this stress, In such a case, it is required to have a performance that does not cause peeling failure that peels off from the winding part.
- an inductor component having an exterior body in the process of forming the exterior body, for example, in the case of the above-mentioned wound type chip coil, a material such as a curable resin is applied on the wound wire by paint, and applied. After drying, semi-curing the resin, press-fitting it into the mold to shape it by heating, and then heating it to complete the curing of the resin, a so-called shaping process. Until press-fitting occurs, the unreacted resin component mainly bleeds out (exposed) over time, and the surface becomes tacky, so that the parts stick together and cannot be pressed into the mold.
- a material such as a curable resin is applied on the wound wire by paint, and applied. After drying, semi-curing the resin, press-fitting it into the mold to shape it by heating, and then heating it to complete the curing of the resin, a so-called shaping process. Until press-fitting occurs, the unreacted resin component mainly bleeds out (exposed) over time, and the surface becomes
- the mold Even if the mold is made of rubber even if it is press-fitted into the mold, even if the mold is heated and cured during shaping, the bleeding of the unreacted resin component mainly occurs due to the restoring pressure as in the above case. Art is If this is taken out of the mold as it is and transferred to the next electrode forming step, the parts stick together when similar things are put together, and the electrode forming step will not be carried out smoothly. Performance that does not occur is required.
- the resin is semi-cured. The curing is slightly advanced. If the degree of curing is too low, it will be peeled off at the edge of the entrance when it is pressed into the mold.
- the electronic material composition as an exterior material is applied on the winding wire of a wound type chip coil, but when the application is performed in the air, air is entrained during the application, and particularly the uneven surface on the winding. In the case of (1), this is likely to occur, and a void (bubble) is generated in the applied material.
- the applied material is heated in a stiffening furnace to semi-harden, the porosity expands, and When the base material and the resin component of the applied material do not have good wettability, the resin component is less likely to flow because the resin component is less likely to flow, and the poid cannot be filled with the resin component. It remains and partly comes out on the surface of the coating.
- the poid becomes a pinhole, and even if the resin content of the resin caused by heating in the subsequent shaping process cannot be sufficiently filled in the pinhole, the pinhole remains and remains as it is. This may cause a decrease in yield due to imperfections in appearance, but the electronic material composition as an exterior material is required to have such performance.
- a first object of the present invention is to provide a one-pack type electronic material composition, an electronic article using the same, and a method for using an electronic material tartar.
- a second object of the present invention is to prevent the occurrence of cohesive failure and peeling failure even when the environmental temperature changes, and to provide an electronic material composition, an electronic article using the same, and a method of using the electronic material composition. To provide.
- a third object of the present invention is to provide an electronic material composition capable of improving the ease of handling in a packaging step and the like, an electronic article using the same, and a method of using the electronic material composition.
- a fourth object of the present invention is to provide an electronic material composition capable of forming a shaped surface or the like that does not impair the appearance of the electronic material, an electronic device using the same, and a method of using the electronic material composition.
- a fifth object of the present invention is to provide an electronic material in which the magnetic and electric properties which are improved by forming an outer package on an electronic article are less likely to decrease even when the content of the inorganic filler in the cured coating material is increased.
- Composition, electronic article and electronic material composition using the same It is to provide a usage method.
- the present invention provides (1) an epoxy-based curable resin having an epoxy group, and an electronic material containing at least a terminal carboxyl group-modified polyether compound as a curing component that reacts with the epoxy group. It provides a composition. -The present invention also provides (2) a butadiene-based polymer-modified epoxy resin having a lipoxyl group as an epoxy-based curable resin having an epoxy group, and a terminal carboxyl group-modified as a curing component that reacts with the epoxy group. An electronic material composition containing at least a polyether compound; (3) an electronic material composition according to the above (1) or (2) containing ultrafine silica gel; and (4) a terminal lipoxyl group-modified poly as a curing component.
- a formed body comprising an electronic material obtained by using the electronic material composition for an electronic product, a molded body composed of a molding material, a filler composed of a filler, a coated body composed of a coating material,
- An electronic article having a coating, an electrode, or a bonding body; (10) the above-mentioned, wherein the coating is an exterior body coated on a winding of a wound type chip coil, and the wound type chip coil having the exterior body is The electronic article according to 9, wherein (11) the electronic material composition according to any one of (1) to (8) is used in a semi-cured state, and the molded article, the filled body, and the coating in the semi-hardened state are used.
- ester-based solvent When Use of the electronic material composition according to (.12) above, wherein a semi-cured coating is formed using an electronic material composition containing a petroleum-based solvent in a mass ratio of 0: 100 to 100: 0: 0. It provides a method.
- FIG. 1 is a partial cross-sectional view of an electronic component mounted on a printed circuit board according to a first embodiment of the present invention.
- FIG. 2 is a sectional view of a casing of a second embodiment of the electronic article of the present invention.
- FIG. 3 is a perspective view of an LC laminated composite electronic component according to a third embodiment of the electronic product of the present invention.
- FIG. 4 shows a radiation noise prevention cable according to a fourth embodiment of the electronic article of the present invention.
- FIG. 5 is a perspective view of a part of an outer wall of a building according to a fifth embodiment of the electronic device of the present invention.
- examples of the “epoxy-based curable resin having an epoxy group” include bisphenol-type epoxy resins such as bisphenol A-type epoxy resin, nopolak-type epoxy resins such as phenol nopolak-type epoxy resin, and other known epoxy resins. Resins. A carboxyl-containing butadiene-based polymer-modified epoxy resin obtained by reacting these epoxy resins with a butadiene-based polymer having a hepoxyl group can also be used.
- examples of the butadiene-based polymer of the butadiene-based polymer having a lipoxyl group include acrylic nitrile-butadiene rubber, styrene-butadiene rubber, and polybutadiene, and these may be liquid.
- an acryl nitrile butene rubber modified epoxy resin having a carboxyl group obtained by reacting an acrylyl nitrile butadiene rubber having a carboxyl group with epoxy resin is preferable. Those having a carboxyl group at the terminal of the molecule are preferred.
- terminal lipoxyl group-modified polyether compound refers to a compound in which a carboxyl group is introduced into the terminal of a polyester compound.
- the terminal hydroxyl group of a polyether polyol is reacted with an acid anhydride or the like. Both are linked by an ester bond or the like to introduce a carboxyl group.
- the terminal carboxyl group may be singular or plural.
- those which can introduce a carbonyl group by the same method not only at the terminal but also in the middle of the molecular chain may be used.
- the polyether polyol is selected from cyclic ether compounds such as ethylene oxide, propylene oxide, alkylene oxides such as butylene oxide, aromatic oxides such as styrene oxide, and alicyclic oxides such as tetrahydrofuran.
- the polymer may be a polymer obtained by addition polymerization of at least one of the above, that is, one or two or more. Examples thereof include polyalkylene glycols such as polyethylene glycol, polypropylene daricol, and addition copolymers of ethylene daricol and propylene daricol, but other products can be obtained according to these.
- a polyether polyol obtained by subjecting one or more of the above cyclic ether compounds to addition polymerization of one or more of compounds having two or more active hydrogens may be used.
- the compound having two or more active hydrogens include polyhydric alcohols, amines, and alkanolamines.
- Polyhydric alcohols include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, glycerin, 1,1,1-trimethylolpropane, 1,2,5-hexanetriol, 1,3- Butanediol, 1,4-butanediol, 4,4'-dihydroxyphenylpropane, 4,4'-dihydroxyphenylmethane pen-erythritol, etc.
- the amines are ethylenediamine, propanolamine, etc.
- the alkanolamines include ethanolamine, propanolamine and the like.
- the acid anhydride may be succinic acid, daltaric acid, adipic acid, azelaic acid, sebacic acid, or decamethylene dicarboxylic acid.
- Acid, phthalic acid, maleic acid, trimellitic acid, pyromellitic acid, tetrahydrophthalic acid, hexahi Examples include anhydrides of polycarboxylic acids such as drophthalic acid and methylhexahydrophthalic acid.
- a polyether compound modified with terminal lipoxyl group using trimellitic acid is preferable from the viewpoint of curability with an epoxy resin.
- the molecular weight of the thus-obtained lipoxyl group-modified polyether compound is 800 to 800 ', preferably 800 to 500' in terms of weight average molecular weight. By setting the content within this range, the toughness and heat resistance can be improved.
- the epoxy group-modified polyester compound with low terminal strength has low reactivity with epoxy group of epoxy curable resin at room temperature, and the solution containing both has relatively small increase in viscosity over time. it can.
- the electronic material composition of the present invention preferably contains, in addition to the epoxy-based curable resin having an epoxy group and the terminal carboxyl group-modified polyether compound, an ultrafine powdered silica gel.
- an ultrafine powdered silica gel include RY200S (manufactured by Nippon Aerosil Co., Ltd.).
- the use ratio of the epoxy-based curable resin having an epoxy group to the terminal lipoxyl group-modified polyester compound may be, for example, 99: 1 to 1:99 by mass ratio, preferably 90%. : 10 to 40: 60.
- the use ratio of the ultrafine silica gel is preferably 1 to 70% by mass relative to the resin component.
- the terminal carboxyl group-modified polyether compound when the terminal carboxyl group-modified polyether compound is reacted with the epoxy-based curable resin having an epoxy group to form a hardened product, or when a cured product is further formed by containing an ultrafine powdered silica gel,
- the glass transition temperature T g and Young's modulus of the cured product can be reduced, and so-called flexibility can be imparted.
- the residual stress of the cured product can be reduced, and especially the ultrafine silica This is effective when a gel is used in combination, and can improve the performances of the above (1), and can particularly improve the heat cycle resistance that can withstand a heat cycle test.
- an epoxy-based hardening resin having an epoxy group is a butadiene-based polymer-modified epoxy resin having a lipoxyl group, particularly an acrylnitrile butadiene rubber-modified epoxy resin having a lipoxyl group, or
- the former is better, but the latter is also toughened by rubber modification, and the heat cycle resistance can be further improved.
- the electronic material composition of the present invention includes, in addition to the epoxy-based curable resin having an epoxy group described above, a terminal lipoxyl group-modified polyether compound, and a phenolic resin such as phenol nopolak resin and cresol nopolak resin.
- a phenolic resin such as phenol nopolak resin and cresol nopolak resin.
- the solvents include ester solvents having a boiling point of 1.0 to 200, such as acetic acid-2-butoxyl, and boiling points of 100 to 200 ° C, such as petroleum hydrocarbon compounds.
- ester solvents having a boiling point of 1.0 to 200, such as acetic acid-2-butoxyl, and boiling points of 100 to 200 ° C, such as petroleum hydrocarbon compounds.
- the use ratio of ultrafine silica gel to other components is as described above.However, when press-fitting the above-mentioned semi-cured chip components into a mold, especially for rubber molds, The unreacted resin components etc. are squeezed out due to a large amount of restoring pressure, and pre-det out.However, the pre-ed-out components are absorbed with silica gel to control the adhesiveness of the surface of the shaped article This eliminates sticking of parts after shaping and improves the ease of handling in the next process.
- the phenol nopolak-based resin is used in an amount of 0 to 60 parts by mass, preferably 40 to 50 parts by mass, based on 100 parts by mass of the epoxy-based curable resin having an epoxy group. If this resin component is present on the surface in the semi-cured state, the surface hardness at room temperature will increase. When press-fitting, it will not be peeled off at the edge of the mold, and this resin component will soften due to heat at the time of heating shaping, causing fluidity and good without deteriorating the shape at the time of shaping It can perform various shaping.
- the electronic material composition of the present invention may contain a filler in addition to the epoxy-based curable resin having an epoxy group and the polyether compound modified with a terminal lipoxyl group.
- a filler include inorganic powders such as silica, alumina, ferrite, silver, parium titanate, and nickel.
- the filler of the clay powder is contained in an amount of 0 to 10 parts by mass, preferably 1 to 4 parts by mass with respect to 100 parts by mass of the epoxy-based curable resin having an epoxy group.
- the compound reacts more smoothly with the epoxy-based curable resin having an epoxy group. It is possible to obtain high fluidity and fill the pinholes in the semi-cured exterior material with a softening material such as resin.
- the filler especially the inorganic clay, flows while swelling. This filler fills and flattens the surface, and apparently improves the wettability of the winding base material.
- the presence of the recess greatly reduces the size of pinholes, which are likely to occur due to the presence of the recess. Can be reduced.
- the resin material composition itself containing each of the above components is also used as an electronic material composition, but by mixing with an electronic material powder and using it, a conductor material composition, a magnetic material material composition, etc. It is also used as an electronic material composition.
- the magnetic material powder When the above-mentioned components (excluding the case where the filler is not used, and the others are the same) are used in combination with the magnetic material powder, the magnetic material powder is 0 to 60% by volume. 40 to 100% by volume, and if necessary, other resins, solvents, and other additives are added thereto (the same applies to the above resin material composition). To obtain a magnetic material composition. Various ferrite powders can be used as the magnetic material powder. When the above components are mixed and used with the conductive material powder, the conductive material is mixed in an amount of 0 to 60% by volume and the components are mixed in an amount of 40 to 100% by volume. Depending on the conditions, other resins, solvents and other additives are added to obtain a conductive material composition.
- the conductor material powder examples include silver, copper, aluminum and other metal powders, and power pump racks. Fullerenes (C60, C70 type power) can also be used. In addition, for example, the above “0 to 60% by volume” may be “60% by volume or less” or “not more than 60% by volume”, and the other cases of “0 to” also conform to this. As described above, the magnetic material powder and the conductive material powder can also be referred to as a filler.
- the electronic material composition according to the present invention may be prepared by mixing an epoxy-based curable resin having an epoxy group and a terminal lipoxyl group-modified polyether compound with an electronic material powder such as a magnetic powder or a conductive powder.
- electronic materials such as powders or conductive powders are not used.
- the former can be achieved by selecting the type of electronic material powder as appropriate, so that the coating material (exterior material),
- the coating material (exterior material)
- Examples of electronic supplies to which these can be applied include inductors such as the above-mentioned wire-wound chip coils, electronic component-mounted circuit boards, and the like, and can be used as exterior materials thereof.
- inductors such as the above-mentioned wire-wound chip coils, electronic component-mounted circuit boards, and the like
- a chip-type electronic component as in the case of the above-mentioned wound chip coil, for example, a method in which a coating material of an exterior material is pressed into a mold having a prismatic concave portion in a heat-resistant rubber plate and heat shaping is performed.
- the shaping or molding may be performed by any of the injection method, the transfer method, the rubber molding method, and the casting method.
- FIG. 2 9 is an electromagnetic shielding casing, which consists of a display section 10 and a main body 11 inside which other electronic components are installed.
- the casing 12 is provided with a stepped portion 12, and a cover of an electromagnetic shield layer 13 is provided on the entire outer wall of the casing.
- reference numeral 14 denotes an LC multilayer composite electronic component, which is provided between the capacitor unit 15 and the inductor unit 16.
- a bonded body 17 is interposed, and external terminal electrodes 1'8, 18 are formed at both ends, and a ground-side external terminal electrode 19 of the capacitor is formed at the center thereof.
- FIG. 2 9 is an electromagnetic shielding casing, which consists of a display section 10 and a main body 11 inside which other electronic components are installed.
- the casing 12 is provided with a stepped portion 12, and a cover of an electromagnetic shield layer 13 is provided on the entire outer wall of the casing.
- reference numeral 14 denotes an LC multilayer composite electronic component, which is provided between the capacitor unit 15 and the in
- reference numeral 20 denotes a radiation noise prevention cable, which has a sheath 22 on the outer periphery of the cable, which is the insulated wire 21. Also, as shown in Fig. 5, 23 is the outer wall of the building, and the electromagnetic shielding board, panels or tiles 24, 24 are filled with electromagnetic shielding caulking material at the seams to form fillers 25, 25 ing.
- a cured product of an electronic material composition comprising a resin material composition containing no electronic material powder or containing no filler and other fillers can have the following physical property values.
- the glass transition temperature is-20 to 120 ° C
- Residual stress value is 200 g ⁇ / mm 2 or less
- a cured product of the electronic material composition of the present invention containing the electronic material powder or containing the filler and other fillers can have the following physical property values.
- the glass transition temperatures of (a) and (a) 'above are measured by differential scanning calorimetry (DSC). It is the measured value of glass transition temperature (Tg) from the change in specific heat by the temperature rise method.
- Tg glass transition temperature
- the rigidity of the above (b) and (b) ′ at a temperature of Tg or less and the rigidity of the above (c) and (c) ′ at a temperature of Tg or more are determined by the rheometer-based rigidity method. It is a measured value depending on the rate temperature.
- the change in specific heat with respect to temperature has a large rate of change in the process of transition from the glass state to the rubber state, and is distinguished from a glass state or a rubber state with a small change rate due to the large change rate.
- the glass transition temperature is in the temperature range corresponding to the change curve in the range where the rate of change is large, and is expressed by T g.
- the dynamic storage modulus (G ') which represents the size of the elastic element of the polymer, decreases with increasing temperature; In contrast, G 'does not continue to decrease in the rubber area, while the cross-linked polymer remains flat or increases.
- the relationship between the dynamic loss elastic modulus (G ',), which represents the size of the polymer's viscous element, and the temperature is shown by a curve having a maximum point.
- the temperature at which the curve G ′ ′ shows a peak value of t an ⁇ 5 is the Tg (glass transition temperature) of the dynamic measurement, and this may be the above-mentioned glass transition temperature T.
- the cured product of epoxy resin used in the field of conventional electronic materials has a Tg of more than 50 ° C and a Tg of more than 50 ° C. more rigidity in the rubber state of is at 10 8 Pa or more, rigidity in the following glassy state Tg is generally to be 3X 10 8 P a to 9X 10 9 P a, whereas, conventional elastic Crosslinked rubbers with a high Tg generally have a Tg that is more than twice as low as 150.
- the present invention relates to an inorganic material having the characteristics (a) ′ to (c) ′ Iraichi (including electronic material powder) Used as an electronic material with a high content, it can have flexibility, toughness, and chapters on thermal stress.
- the resin component used in the present invention is distinguishable from a thermoplastic component by being curable.
- the electronic material composition used in the present invention has the above-mentioned characteristics (a) ′ to (c) ′ even when the content of the inorganic filler is large, but in addition to these characteristics, By adding ', (e)' properties, it can be better differentiated from other materials.
- the value of (d) ′ with a critical elongation at break of 1.5% or more is a value measured by a strain-stress (S—S) carp according to a tensile test method of a cured product of an electronic material composition for an electronic device exterior. Yes, it shows the ability to absorb external force before it breaks.
- the cured product of the epoxy resin used in the conventional electronic materials field breaks at a shear strain of ⁇ 50: 5%, and the critical elongation at break is 0.5 to 5% below Tg.
- the cured product of the electronic material composition used in the present invention is 1.5% or more below the solid content, but is preferably 5% or more, and may exceed 50%. You can make it stand out.
- the value of 200 gf / mm 2 or less in the above (e) ′ is a measured value of distortion by the bimetal method.
- Kati ⁇ epoxy ⁇ used in conventional electronic materials field 2 5 ° is a 100 to 350 gf / mm 2 at a temperature and C
- the cured product of the electronic material sets Narubutsu used in the present invention 200 gf / mm 2 or less, preferably 0 to 150 gf / mm 2, and more preferably less than 100 g ⁇ / mm 2 .
- the exterior chip type electronic component having the exterior body of the cured product of the electronic material composition having the physical properties of (a) to (e) and (a) ′ to (e) ′ is as follows.
- a so-called heat cycle test (repeatedly placed between 125 ° C and 125 ° C) In the case of a crack that occurs in the exterior body when the cycle goes back and forth (one cycle), no occurrence of one of the 100 parts was observed even in the 100 cycles, whereas In the cured product of the composition using the epoxy resin of the above, 40% in 100 cycles (cracks occurred in 40 out of 100 parts, hereinafter the same), and 1 in 300 cycles It can be as high as 0%.
- the suction nozzle of the mount is the part of the object to be adsorbed.
- the exterior of the wire-wound chip coil uses a low-elasticity, flexible polymer component to deform the exterior along the shape of the contact surface of the suction nozzle, leaving no gap between the two. As a result, slippage is eliminated, and mounting errors can be reduced. After mounting, the original shape is restored, and there is no disadvantage in the external shape of the component.
- the electronic material composition of the present invention can be used in a state where the polymer component is in a semi-cured state. By this, the heating temperature and the heating time can be controlled. Thermal damage can be eliminated or reduced, and other advantages can be obtained.
- the following components are mixed by a roll mill or a stirring and dispersing machine to produce a magnetic material composition.
- Clay quaternary ammonium cation-modified montmorillonite
- Ultra fine silica gel (RY200S (Nippon AEROSIL Co., Ltd.) (FILA-1) 3-8 parts Trimethyl borate (additive) 0.4-0.8 parts Epoxy resin amine adduct (imidal type) (PN40 (Ajinomoto Co.) 6 ⁇ 10 copies
- Acetic acid-2-butoxystil (BGA (manufactured by Daicel Chemical) (Solvent 1) 30 to 35 parts Petroleum hydrocarbon compound (solvesso 150 (manufactured by Etsuso Chemical Co.) (Solvent 2)
- the average number of terminal carboxyl groups per molecule of polypropylene carboxyl group-modified polypropylene dalicol is 4, and the weight average molecular weight (GPC method) is 2,500.
- the viscosity of the above-mentioned magnetic material composition was measured at 25 ° C using a B-type viscometer for the initial material after production and for the material left at room temperature for 14 days.
- the former was 36 Pa, and the latter was 36.
- the viscosity increase rate ([(the latter—the former) Z the former) ⁇ 100%) was 1.7%.
- the magnetic material composition was injected onto the winding 3 of the wound type chip coil 1 in FIG. 1 by a nozzle, dried, and further heated in a curing furnace at 130 ° C. for 5 minutes to be semi-cured. A touch-drying test was performed on the surface of the semi-cured coating material, and the result was acceptable.
- the cured product was measured for specific heat by a differential scanning calorimeter (DSC) using a differential scanning calorimeter (DSC) to find that the Tg was in the range of 0 to 60 ° C.
- DSC differential scanning calorimeter
- Tg or higher was measured by a rheometer
- the critical elongation at break is measured by the S-S curve (stress-strain curve) by the tensile test method. As a result, it was possible to achieve 2 to 50%.
- the residual stress was measured by the bimetal method, it was able to be set to 0 to 150 gf / mm 2 .
- Example 1 a heat cycle test is repeated for 100 pieces of the wound type chip coil packaged as described above, in which reciprocating between 150 ° C. and + 125 ° C. is one cycle. As a result, no crack was found.
- solvent 2 when 43.7 parts of solvent 2 were not used and instead 43.7 parts of solvent 1 were used (solvent 1 used a total of 75 parts), solvent 2 was used.
- the heating time required to pass the dry-to-touch test was 15 minutes, which was longer, but the use of ultrafine silica gel resulted in similar magnetic properties, except that it was not used.
- the performance for the dry-to-touch test is superior, and other performances should be almost the same as those in Example 1. Can be.
- Example 1 when the filler 1 was not used, the pinhole was not seen as in the case of Example 1, but the hardener 1 was used. Therefore, when the curing agent 2 is used instead (the curing agent 2 becomes 32.8 parts in total) (Comparative Example 1 described later), the performance is much less than that of the first embodiment. And can be almost the same.
- Example 1 when filler 3 was not used, it can be said that the effect of preventing sticking of the products after shaping was not as high as in Example 1, but the other performances were as in Example 1. Can be almost the same as the ones. .
- Example 1 when the curing agent 2 was not used, it can be said that the performance of being not peeled off at the edge when pressed into a mold is not as good as in Example 1. However, since solvent 2 is used, when solvent 1 is used instead ( The performance is improved compared to (solvent 1 uses 75 parts in total), and the other performances can be almost the same as those in Example 1.
- the following components are mixed by a roll mill or a stirring and dispersing machine to produce a magnetic material composition.
- Ultra fine silica gel (RY200S (Nippon AEROSIL CO., LTD.) (FILA-1 2) 2 to 6 parts Epoxy resin amine adduct (imidal type) (PN40 (Ajinomoto Co.) 2 to 12 parts (curing catalyst)
- the above-mentioned magnetic material composition was wound in the same manner as in Example 1 except that the wound type coil 1 shown in FIG.
- the Tg was able to be in the range of 110 to 60 ° C.
- the rigidity at Tg or lower and Tg or higher was measured by a rheometer, they were 10 8 to 10 Pa and 10 6 to 10 8 Pa, respectively.
- the critical elongation at break was measured by an S—S force (stress-strain curve) by a tensile test method, and was able to be 2 to 50%. Then, when the residual stress was measured by a bimetallic method, it was able to be set to 0 to 150 gf / mm 2 .
- the residual stress value of the above-mentioned cured body was measured by the pi-metal method (25), and the inductance value (L value) of the component was measured by using the LCR method.
- Example 1 A similar electronic material composition was prepared in Example 1 except that the filler 11 was not used, and the same examination was performed as in Example 1. As a result, no pinhole was found in the completely cured product.
- the temperature was able to be in the range of 0 to 60 ° C.
- the stiffness at Tg or lower and Tg or higher was measured by a rheometer, they were 10 8 to 10 9 Pa and 10 6 to 10 8 Pa, respectively.
- the critical elongation at break was measured by an S—S curve (stress-strain curve) by a tensile test method, and was found to be 10 to 100%.
- a magnetic material composition was produced in the same manner as in Example 1, except that the curing agent 1 was not used and the curing agent 2 was used instead (the curing agent 2 was 32.8 parts in total). Then, various performances were examined in the same manner as in Example 1.
- the viscosity increase rate was 100%, it could not be used as a one-pack type, the heating time to pass the finger test was 15 minutes, and the handling was easier than that of Example 1.
- the Tg was in the range of 100 to 150 ° C, and the rigidity at Tg or lower and Tg or higher was measured. the by the rheometer. Ri was measured and found to be respectively 1 0 8 ⁇ 10 1 'P a , 10 6 ⁇ 10 8 P a.
- the critical elongation at break was measured by an SS curve (stress-strain curve) by a tensile test method.
- the residual stress value of the above-mentioned cured body was measured by the bimetal method (25 ° C), and the inductance value (L value) of the part was measured.
- L and Lt are the inductance values before and after the exterior (residual stress is 0) and after the exterior (when the residual stress is generated)), respectively.
- the epoxy-modified polyether compound is used, so that even if it is a one-pack type, the viscosity changes over time do not hinder practical use, and cohesive failure or peeling failure occurs even when the environmental temperature changes. It is difficult to improve the ease of handling in the exterior process, etc., and does not impair the appearance.
- the inorganic filler content of the cured coating material is increased, the exterior body is formed on the electronic product. Accordingly, it is possible to provide an electronic material composition which is improved in magnetic and electric properties which is hardly reduced, an electronic article using the same, and a method of using the electronic material composition.
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Abstract
Description
Claims
Priority Applications (1)
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US10/514,499 US20050167639A1 (en) | 2003-01-30 | 2004-01-29 | Electronic material composition, electronic product and method of using electronic material composition |
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JP2003021270A JP4099761B2 (ja) | 2003-01-30 | 2003-01-30 | 電子材料用組成物、電子用品及び電子材料用組成物の使用方法 |
JP2003/21270 | 2003-01-30 |
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US (1) | US20050167639A1 (ja) |
JP (1) | JP4099761B2 (ja) |
KR (1) | KR100966938B1 (ja) |
CN (1) | CN100430427C (ja) |
TW (1) | TW200504144A (ja) |
WO (1) | WO2004067600A1 (ja) |
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JP4705377B2 (ja) * | 2004-03-03 | 2011-06-22 | ソニー株式会社 | 配線基板 |
TW200743434A (en) * | 2006-05-11 | 2007-11-16 | Delta Electronics Inc | Packaged electronic component for shielding electromagnetic interference |
JP4883706B2 (ja) * | 2007-08-10 | 2012-02-22 | Necトーキン株式会社 | 線輪部品 |
JP5769549B2 (ja) * | 2011-08-25 | 2015-08-26 | 太陽誘電株式会社 | 電子部品及びその製造方法 |
CN104205256B (zh) * | 2012-03-29 | 2017-04-26 | 株式会社村田制作所 | 线圈部件 |
KR101652850B1 (ko) * | 2015-01-30 | 2016-08-31 | 삼성전기주식회사 | 칩 전자부품, 그 제조방법 및 이를 구비한 기판 |
JP2018098334A (ja) * | 2016-12-13 | 2018-06-21 | Tdk株式会社 | コイル部品及びその製造方法、並びに、コイル部品を備えた電子回路 |
CN107541017A (zh) * | 2017-09-01 | 2018-01-05 | 张峰 | 一种具有屏蔽辐射作用的封装材料及其制备方法和应用 |
KR102617523B1 (ko) * | 2018-07-25 | 2023-12-27 | 아지노모토 가부시키가이샤 | 자성 페이스트 |
JP6984755B2 (ja) * | 2018-07-25 | 2021-12-22 | 味の素株式会社 | 磁性ペースト |
KR102184559B1 (ko) * | 2019-07-05 | 2020-12-01 | 삼성전기주식회사 | 코일 부품 |
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- 2003-01-30 JP JP2003021270A patent/JP4099761B2/ja not_active Expired - Lifetime
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- 2004-01-29 KR KR1020057014115A patent/KR100966938B1/ko active IP Right Grant
- 2004-01-29 TW TW093102057A patent/TW200504144A/zh not_active IP Right Cessation
- 2004-01-29 CN CNB2004800032897A patent/CN100430427C/zh not_active Expired - Lifetime
- 2004-01-29 WO PCT/JP2004/000837 patent/WO2004067600A1/ja active Application Filing
- 2004-01-29 US US10/514,499 patent/US20050167639A1/en not_active Abandoned
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Also Published As
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KR100966938B1 (ko) | 2010-06-30 |
JP4099761B2 (ja) | 2008-06-11 |
KR20050096172A (ko) | 2005-10-05 |
CN100430427C (zh) | 2008-11-05 |
US20050167639A1 (en) | 2005-08-04 |
JP2004262956A (ja) | 2004-09-24 |
TWI323271B (ja) | 2010-04-11 |
TW200504144A (en) | 2005-02-01 |
CN1745118A (zh) | 2006-03-08 |
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