WO2004064468A1 - Board piece, composite wiring board using the board piece, and openable/closable device - Google Patents

Board piece, composite wiring board using the board piece, and openable/closable device Download PDF

Info

Publication number
WO2004064468A1
WO2004064468A1 PCT/JP2004/000024 JP2004000024W WO2004064468A1 WO 2004064468 A1 WO2004064468 A1 WO 2004064468A1 JP 2004000024 W JP2004000024 W JP 2004000024W WO 2004064468 A1 WO2004064468 A1 WO 2004064468A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
substrate
housing
flexible wiring
composite
Prior art date
Application number
PCT/JP2004/000024
Other languages
French (fr)
Japanese (ja)
Inventor
Takashi Murayama
Original Assignee
Sony Chemicals Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp. filed Critical Sony Chemicals Corp.
Publication of WO2004064468A1 publication Critical patent/WO2004064468A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards

Definitions

  • the present invention relates to the technical field of wiring boards, and more particularly to a composite wiring board comprising a rigid wiring board and a flexible wiring board.
  • Reference numeral 101 in FIG. 42 is a composite wiring board according to the related art of the present invention.
  • FIG. 44 is an exploded view showing the structure of the composite wiring board 10 ⁇ , and reference numerals 17 1 ⁇ , ⁇ 72 A, 17 1 B, and 17 2 B are laminated rigid wiring boards.
  • Reference numeral 178 indicates a single-layer or laminated flexible wiring board.
  • the flexible wiring board 178 is made of resin and has a flexible base film 111 and a wiring film 112 arranged on the base film 111.
  • Wiring film ⁇ 21 is connected to wiring film 1 1 2 of flexible wiring board 1 78, flexible wiring Plates 178 are fixed to the front and back surfaces at both ends.
  • Rigid laminated board 1 7 1 ⁇ , ⁇ 7 2 ⁇ , 1 7 1 ⁇ , 1 7 2 ⁇ are shorter than flexible wiring board 1 7 8, and rigid laminated board 1 7 ⁇ , 1 7 2 at one end
  • the ⁇ ⁇ and the rigid laminated boards 17 1 B and 17 2 B at the other end are connected by a central portion of a flexible wiring board 178.
  • the electronic component 144 when the electronic component 144 is mounted on the rigid laminates 17 1 A, 17 A, 17 B, 17 B, the electronic component 14 They are interconnected by wiring films 1 1 2 and 1 2,1.
  • the rigid laminated boards 17 1 A and 17 2 A located at one end of the composite wiring board 101 are placed inside the housing on the keyport side.
  • the rigid laminate 17 1 B and 17 2 B located at the other end are placed inside the housing on the liquid crystal display panel side, the keyboard and liquid crystal display are displayed while the liquid crystal display panel is openable and closable. Panels can be connected by flexible wiring boards 17 8.
  • the present invention has been made to solve the disadvantages of the related art described above, and its object is to provide a low-cost composite wiring board that is easy to handle. Disclosure of the invention
  • the present invention provides a substrate element in which at least one flexible wiring board and a plurality of rigid wiring boards are laminated, wherein the flexible wiring board and the rigid wiring board And a connection portion protruding from a side surface of the substrate piece main body, which is an end portion of the flexible wiring board, wherein the connection portion includes: At least a part of the wiring film of the flexible wiring board is an exposed substrate piece.
  • the wiring film of the adjacent rigid wiring board is a substrate piece connected by a conductive projection.
  • the present invention is a substrate piece in which the length of the connection portion is shorter than the length of the substrate piece body.
  • the present invention has first and second substrate pieces and a flexible wiring board for connection, wherein the first and second substrate pieces are at least one flexible wiring board and a plurality of flexible wiring boards.
  • the connection portion of the second substrate piece is a composite wiring board connected to an end of the flexible wiring board for connection.
  • the present invention is a composite wiring board having a reinforcing film affixed between the connection flexible wiring board and the connection portions of the first and second substrate pieces.
  • the present invention is the composite wiring board, wherein a length of the flexible wiring board for connection is longer than a length of the connection portion of the first and second substrate pieces.
  • the present invention is a composite wiring board having an electronic component mounted on at least one of the first and second substrate pieces.
  • the substrate piece of the first invention is configured as described above, and an adhesive film is disposed on the surface of a single-layer rigid wiring board ⁇ a flexible wiring board, and laminated by heating and pressing. Then, the wiring film of each rigid wiring board is connected to the wiring film of the flexible wiring board.
  • the composite wiring board of the first invention is configured as described above, Both of the two substrate pieces are connected by a flexible wiring board for connection. Assuming that the two substrate pieces are first and second substrate pieces, the wiring films of the first and second substrate pieces are connected via a wiring film of a flexible wiring board for connection. I have.
  • one of the substrate pieces can be arranged on the display side of the portable computer and the other can be freely opened and closed.
  • the composite wiring board is bent and the bending is extended with the opening / closing operation of the first and second housings.
  • the portion where is connected is bent and is not arranged in the portion where the bending is returned, so that no stress is applied.
  • the first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and the first and second substrate pieces are connected to a flexible connection.
  • a composite wiring board having a wiring board is built in, one of the first and second base plate pieces is disposed in the first housing, and the other is disposed in the second housing.
  • first and second substrate pieces are board pieces on which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, and wherein the flexible wiring A board piece main body composed of a portion where a board and the rigid wiring board are overlapped with each other, and a connection portion that is an end of the flexible wiring board and protrudes from a side surface of the board piece main body.
  • the connecting portion at least a wiring film of the flexible wiring board is provided.
  • connection portion of the first and second substrate pieces is connected to an end of the flexible wiring board for connection, and at least one of the first and second substrate pieces is An electronic component is mounted, and a portion where the first and second substrate pieces and the flexible wiring board for connection are connected, An openable / closable device disposed at a position where the first and second housings are opened and closed and the connection flexible wiring board is not bent when the connection flexible wiring board is bent.
  • the first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and the first and second substrate pieces are connected to a flexible connection.
  • a composite wiring board having a wiring board is built in, one of the first and second base plate pieces is disposed in the first housing, and the other is disposed in the second housing.
  • An openable / closable device wherein the first and second board pieces are board pieces on which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, A substrate piece main body composed of a portion where the wiring board and the rigid wiring board are overlapped; and a connection portion that is an end of the flexible wiring board and protrudes from a side surface of the substrate piece main body.
  • connection portion has at least a wiring film of the flexible wiring board.
  • the connection part of the first and second substrate pieces is connected to an end of the connection flexible wiring board, and at least one of the first and second substrate pieces is An electronic component is mounted, the connection flexible wiring board passes through the shaft, and a portion where the connection portion of the first and second substrate pieces is connected to the connection flexible wiring board Is an openable / closable device in which one is located inside the first housing and the other is located inside the second housing.
  • the first housing and the second housing are configured to be relatively rotatable about an axis by a predetermined angle, and the first and second substrate pieces are connected to a flexible connection.
  • a composite wiring board having a wiring board is built in, one of the first and second base plate pieces is disposed in the first housing, and the other is disposed in the second housing.
  • An openable / closable device wherein the first and second board pieces are board pieces on which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, Wiring board and the rigid arrangement
  • a substrate piece main body composed of a portion where a wire plate is overlapped; and a connection part which is an end of the flexible wiring board and protrudes from a side surface of the substrate piece main body.
  • connection portion of the first and second substrate pieces is connected to an end of the connection flexible wiring board.
  • An electronic component is mounted on at least one of the first or second substrate element, and the connection portion of one of the first or second substrate element is connected in the axis.
  • a portion of the first and second substrate pieces where the connection portion and the connection flexible wiring board are connected is disposed inside one of the first and second housings. It is a switchgear type device.
  • the present invention is a composite wiring board in which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, and the first and second substrate pieces are connected to each other.
  • the substrate piece is a substrate piece body composed of a portion where the flexible wiring board and the rigid wiring board are overlapped, and an end of the flexible wiring board, And a bridge portion protruding from a side surface. In the bridge portion, a contact portion is formed at a portion where at least a part of the wiring film of the flexible wiring board is exposed, and the contact portion is formed.
  • the first and second substrate pieces are composite wiring boards in which the contact portions are electrically connected to each other.
  • the present invention is a composite wiring board in which wiring films of the rigid wiring board adjacent to the first and second substrate pieces are connected by conductive protrusions.
  • the present invention is a composite wiring board in which a reinforcing film is attached between the bridge portions of the first and second substrate pieces.
  • one of the bridge portions of the first and second flexible wiring boards is longer than the other, and the difference between the lengths is two times the length of the portion where the contact portions overlap.
  • This is a composite wiring board that has been doubled or more.
  • the present invention is a composite wiring board having an electronic component mounted on at least a part of its surface.
  • the third substrate piece is a substrate piece body composed of a portion where the flexible wiring board and the rigid wiring board are overlapped, An end portion, and a bridge portion protruding from a side surface of the substrate piece main body.
  • the bridge portion has a wiring film of the flexible wiring board, at least a part of which is exposed and contacted.
  • the fourth substrate element is configured such that at least a part of the wiring film is exposed on the surface, and the third and fourth substrate elements are the third substrate element.
  • the wiring film exposed at the bridge portion; And the wiring layer exposed on the surface of the board piece is electrically connected a composite wiring board.
  • the present invention is a composite wiring board having electronic components mounted on at least a part of its surface.
  • the first housing and the second housing are configured to be relatively rotatable about an axis by a predetermined angle, and at least one flexible wiring board and a plurality of rigid wiring boards are provided.
  • a fourth board element in which a plurality of rigid wiring boards are stacked, and a composite wiring board in which a plurality of rigid wiring boards are stacked.
  • One of the element pieces is disposed in the first housing, and the other is an open / close type device disposed in the second housing, wherein the third substrate element includes the flexible wiring board and A substrate piece main body composed of a portion where the rigid wiring board is overlapped; and a bridge part which is an end of the flexible wiring board and protrudes from a side surface of the substrate piece main body.
  • the bridge portion has a wiring film of the flexible wiring board, At least a part is exposed to form a contact portion.
  • the fourth substrate element has at least a part of a wiring film exposed on the surface thereof, and the third and fourth substrate element has the contact part.
  • the wiring film exposed on the bridge portion of the third substrate element is electrically connected to the wiring film exposed on the surface of the fourth substrate element, and the composite wiring board is reduced in number.
  • An electronic component is mounted on a part of the surface of the first and second contact pieces of the first and second substrate pieces, the first and second housings are opened and closed, and the bridging is performed. This is an open / close type device that is placed in a position where it does not bend when the joint bends and stretches.
  • the first housing and the second housing are configured to be relatively rotatable about a shaft by a predetermined angle, and at least one flexible wiring board and a plurality of rigid wirings are provided.
  • a third board element in which a plurality of rigid wiring boards are stacked and a composite wiring board in which a fourth board element in which a plurality of rigid wiring boards are stacked is built in;
  • One of the substrate pieces is disposed in the first housing, and the other is an opening / closing device disposed in the second housing, wherein the third substrate piece is a flexible wiring board.
  • the rigid wiring board are overlapped with each other, and a substrate piece main body is formed of a portion overlapped with the rigid wiring board;
  • the wiring film of the flexible wiring board is less At least a part of the wiring film is exposed at the surface of the fourth substrate element, and the third and fourth substrate elements are at least partially exposed at the surface.
  • the wiring film exposed at the bridge portion of the third substrate element is electrically connected to the wiring film exposed at the surface of the fourth substrate element, and at least the composite wiring board is
  • An electronic component is mounted on a part of the surface, the bridge portion passes through the shaft, and the portion of the first and second substrate pieces where the contact portions are connected to each other is the shaft. And an openable / closable type disposed inside one of the first and second housings. Equipment.
  • the substrate piece of the second invention is configured as described above, and the rigid wiring boards are arranged between the flexible wiring boards or between the rigid wiring boards and the flexible wiring boards. It is connected by an adhesive film.
  • the length of the flexible wiring board of the board piece is longer than the length of the rigid wiring board, and part of the flexible wiring board is the side of the board piece body on which the flexible wiring board and the rigid wiring board are laminated. Sticking out of.
  • the protruding portion is used as a bridge portion, and the substrate pieces are connected by the bridge portion to form a composite wiring board.
  • Board pieces can be assembled into composite wiring boards just before electronic components are mounted, making them easy to handle and store.
  • the flexible wiring board can be bent freely, it is possible to configure a portable computer that can open and close the display freely by using one substrate piece that constitutes the composite wiring board for the display and the other board piece for the keyboard. In monkey.
  • the composite wiring board is bent and the bending is extended with the opening / closing operation of the first and second housings.
  • the portion where is connected is bent and is not arranged in the portion where the bending is returned, so that no stress is applied.
  • FIG. 1 is a cross-sectional view for explaining a state before assembling a substrate piece according to an example of the present invention.
  • FIG. 2 is a cross-sectional view for explaining a substrate piece according to an example of the present invention.
  • FIG. 3 is a cross-sectional view (1) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 4 is a cross-sectional view (2) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 5 is a sectional view (3) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 6 is a cross-sectional view (4) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 7 is a sectional view (5) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 8 is a cross-sectional view for explaining a substrate piece according to a second example of the present invention.
  • FIG. 9 is a sectional view of a composite wiring board of a second example using the substrate piece.
  • FIG. 10 is a sectional view of a substrate piece according to a third embodiment of the present invention.
  • FIG. 11 is a sectional view of a composite wiring board of a third example using the substrate piece.
  • FIG. 12a, FIG. 12b, and FIG. 12c are diagrams (1) for explaining a process of connecting a connection portion and a flexible wiring board.
  • FIG. 13a, FIG. 13b, and FIG. 13c are diagrams (2) for explaining a process of connecting the connection portion and the flexible wiring board.
  • FIG. 14a, FIG. 14b, and FIG. 14c are diagrams (3) for explaining a step of connecting the connection portion and the flexible wiring board.
  • FIG. 15a is a plan view of a part of the substrate piece main body and a connection portion
  • FIG. 15b is a plan view of an end portion of a flexible wiring board for connection.
  • FIG. 16 is a sectional view of a composite wiring board according to a fourth example of the present invention.
  • FIG. 17 is a cross-sectional view showing a state before assembling a substrate piece that can be used for the composite wiring board of the present invention.
  • FIG. 18 is a cross-sectional view showing a state where the substrate pieces are assembled.
  • FIG. 19 is a cross-sectional view (1) for explaining a manufacturing process of a composite wiring board assembled using the first and second substrate pieces.
  • FIG. 20 is a cross-sectional view (2) for explaining the manufacturing process of the composite wiring board assembled using the first and second substrate pieces.
  • FIG. 21 is a cross-sectional view (3) for explaining a manufacturing process of the composite wiring board assembled using the first and second substrate pieces.
  • FIG. 22 is a cross-sectional view (4) for explaining the manufacturing process of the composite wiring board assembled using the first and second substrate pieces.
  • FIG. 23 is a cross-sectional view showing another substrate piece that can be used for the composite wiring board of the present invention.
  • FIG. 24 is a sectional view showing a state in which an anisotropic conductive film is arranged on the substrate piece.
  • FIG. 25 is a sectional view showing an example of the composite wiring board of the present invention assembled using the substrate pieces.
  • FIG. 26 is a cross-sectional view (1) for explaining a process of a composite wiring board assembled using the substrate pieces of the modified example.
  • FIG. 27 is a cross-sectional view (2) for explaining a process of a composite wiring board assembled using the substrate pieces of the modified example.
  • FIG. 28 is a cross-sectional view (1) illustrating a step of a composite wiring board assembled using the third and fourth substrate pieces.
  • FIG. 29 is a cross-sectional view (1) for explaining a step of the composite wiring board assembled using the third and fourth substrate pieces.
  • FIG. 30 is a plan view of a part of the bridge part and a connector part.
  • FIG. 31a, FIG. 31b, and FIG. 31c are diagrams for explaining an example of alignment of bridge portions having the same width.
  • FIG. 5 is a diagram for describing an example of alignment between bridge portions.
  • FIGS. 33a, 33b, and 33c are diagrams for explaining an example of alignment of circular bridge portions in which one width is wider than the other. .
  • Fig. 34 is a cross-sectional view of an example of a substrate piece having a ridge portion having a difference in length.
  • FIG. 35 is a cross-sectional view of an example of a composite wiring board using the substrate piece.
  • FIG. 36 is a sectional view showing a closed state of the first example of the switchgear of the present invention.
  • FIG. 37 is a sectional view showing an open state of the first example of the switchgear of the present invention.
  • FIG. 38 is a sectional view showing a closed state of the second example of the switchgear of the present invention.
  • FIG. 39 is a sectional view showing an open state of the second example of the switchgear of the present invention.
  • FIG. 40 is a sectional view showing a closed state of the third example of the switchgear of the present invention.
  • FIG. 41 is a sectional view showing an open state of the third example of the switchgear of the present invention.
  • FIG. 42 is a cross-sectional view of a composite wiring board according to the related art.
  • FIG. 43 is a cross-sectional view of a related-art composite wiring board with electronic components mounted.
  • FIG. 44 is a cross-sectional view for explaining the structure of the composite wiring board of the related art.
  • FIGS. 1 to 16 and FIGS. 38 to 41 show the first invention.
  • reference numeral 8 denotes a flexible wiring board for connection;
  • 0, 4 0 represents a flexible wiring board,
  • reference numeral 2 0 ⁇ 2 0 3, 3 0 ⁇ 3 0 3 indicates Riji' de wiring board,
  • Reference numeral 3 denotes a wiring film of a rigid substrate
  • reference numerals 2 to 4 denote substrate pieces
  • reference numerals 41 and 43 denote a substrate piece main body
  • reference numerals 42, 4 and 4 and 8 denote connection portions.
  • reference numeral 2 2 - 2 2 3 2 ⁇ 3 2 3 represents the wiring film
  • reference numeral 2 4 ⁇ 2 4 3 3 4 ⁇ 3 4 3 shows conductive protrusions
  • reference numeral 4-9 electronic Indicates parts Reference numeral 67 denotes a switchgear type device
  • reference numerals 71 to 74 denote composite wiring boards.
  • Fig. 17 to Fig. 37 show the second invention.
  • reference numerals 2, 2A, 2B, 2'A, 2'B, 3, 4, 6A, 6B represents a board piece
  • reference numeral 1 0, 4 0 indicates Furekishipuru wiring board
  • ⁇ 3 2 3 represents the wiring film
  • reference numeral 1 3 contactor shows the door unit
  • reference numeral 1 7 shows an anisotropic conductive film
  • 5 0, - 5 0 5 indicates Riji' de wiring board
  • reference numeral 2 4 ⁇ 2 4 3 3 4 ⁇ 3 4 3 shows conductive protrusions
  • reference numeral 4 1, 4 3 represents a board piece body
  • numeral 4 2, 4 4, 4 8 pre Tsu di unit
  • Reference numeral 49 indicates an electronic component
  • reference numerals 81 to 85 indicate a composite wiring board
  • reference numeral 60 indicates a switchgear
  • Reference numeral 2 in FIG. 2 shows an example of a substrate piece of the present invention
  • FIG. 1 shows components of the substrate piece 2 before assembly.
  • Board piece 2 has 1 to a plurality of flexible wiring boards 1 0, more re jitter de-wiring board 2 0 ⁇ 2 0 3, 3 0, a ⁇ 3 0 3.
  • the flexible wiring board 10 has a base film 11 made of a resin film, and a wiring film 12 routed on the front and back surfaces of the base film 11.
  • the wiring film 12 is formed by patterning a metal thin film into a predetermined shape.
  • the wiring films 12 located on the front side and the back side are connected by a conductive plug 14 made of a conductive material such as a metal filled in the through hole.
  • Wiring film 2 2 ⁇ 2 2 3, 3 2, ⁇ 3 2 3, the base substrate 2 1 ⁇ 2 1 3 3 0, is disposed on one side of the ⁇ 3 0 3, on a surface opposite to in the state before lamination, a wiring layer 2 2, and 2 2 3, 3 2, ⁇ 3 2 3 connected to the conductive protrusions 2 4 ⁇ 2 4 3 3 4, the tip of ⁇ 3 4 3 It is sticking out.
  • Conductive protrusions 2 4 ⁇ 2 4 3 3 4 it is possible to 3 4 3 which may be formed by curing the conductive resin (conductive resin paste Bok), is grown metal formed.
  • a plurality of lysine, head circuit board 2 0, ⁇ 2 0 3, of SOSO s ', 1 to several sheets double Riji' de wiring board ZO' ZO s is disposed on the front side of the flexible wiring board 1 0, other of 1 to Riji' de wiring board 3 0 of multiple films, ⁇ 3 0 3 is disposed on the back side of the frame Kishipuru wiring board I 0.
  • the flexible wiring board 1 0 Riji' de wiring board 2 0 ⁇ 2 0 2, 3 0, - 3 0 2 is also a long than at least one end, Riji' de wiring board 2 0 which are stacked, 1-2 It protrudes from the sides of 0 2 and 30 1 to 30 2 .
  • Reference numeral 41 in FIG. 2 denotes a substrate piece body composed of a portion where rigid wiring boards 20, 20 , 30, 30, and 32 and a flexible wiring board 10 are overlapped.
  • Reference numeral 42 denotes an end portion of the flexible wiring board 10, which indicates a connection portion protruding from the substrate piece main body 41.
  • the length of the connecting portion 4 2 L is summer shorter than the length L 2 of the board piece body 4 1 (L, ⁇ L 2 ).
  • the surface of the wiring film 12 is covered with a cover film 6 except for a part.
  • the cover film 16 is not provided at the tip portion, and only the tip portion of the wiring film 12 is exposed.
  • FIG. 15a is a partial plan view of the substrate piece 2, showing a part of the substrate piece body 41 and the connection portion 42.
  • a plurality of wiring films 12 are arranged in parallel, and the exposed portion at the tip is widened.
  • Reference numerals 2A and 2B in FIG. 3 denote substrate pieces having the same structure as the above-mentioned substrate piece 2, respectively. Assuming that the piece 2B is, as shown in FIG. 3, first, the surface of the wiring film 12 exposed at the position of the connection portion 42 of the first and second substrate pieces 2A and 2B is anisotropically formed. Place the conductive film 17 on it.
  • Reference numeral 8 in FIG. 4 denotes a connection It is a flexible wiring board.
  • a wiring film 52 is disposed on at least one surface of the base film 51. Except for both ends of the flexible wiring board 8 for connection, a cover film 56 is disposed on the surface of the wiring film 52, and only the both ends of the wiring film 52 are exposed.
  • FIG. 15b is a plan view of the end of the flexible wiring board 8 for connection. The end of the wiring film 52 of the flexible wiring board 8 is exposed on the connection portion 4'2. It is patterned into a shape and position corresponding to the shape and position of 12.
  • the exposed portion of the wiring film 52 is pressed against the anisotropic conductive film 17 on the connection portion 42, and is heated and pressed as shown in FIG.
  • a composite wiring board 71 is obtained.
  • wiring layer 1 2, 2 2 of the first board piece 2 A, ⁇ 2 2 3, 3 2, ⁇ 3 2 3 and the wiring film of the second board piece 2 B 1 2, 2 2, ⁇ 2 2 3 , 3 2, to 3 2 3 are mutually connected via the wiring film 52 of the flexible wiring board 8 for connection.
  • the flexible wiring board 10 of the substrate pieces 2 A and 2 B and the flexible wiring board 8 for connection have flexibility, and the wiring films 1 of the first and second substrate pieces 2 A and 2 B are provided. 2, 2 2, and 2 2 3, 3 2, while maintaining the connection between 1-3 2 3, can be bent off Rekishiburu wiring board 8.
  • the connection portion 42 of the flexible wiring board 10 of the substrate pieces 2 A and 2 B also bends together, and the stress generated at the connection portion between the wiring films 12 and 52 of the flexible wiring boards 10 and 8. Is alleviated.
  • FIGS. 12a to 12c are diagrams for explaining a process of superposing and connecting a tip portion of the connection portion 42 and an end portion of the flexible wiring board 8 for connection. It is a drawing, and members such as the wiring film 52 and the cover films 16 and 56 are omitted.
  • the flexible wiring board 8 for connection and the connection portion 42 are firmly connected by the reinforcing film # 8, even if the flexible wiring board 8 for connection is greatly bent, the flexible wiring board 8 And the connection part 42 are not separated.
  • the width W c of the wide KuNatsu was part of one of the flexible wiring board 8, If the other flexible wiring board 10 is narrower than the width W A , B of the widened portion, as shown in FIG. 14b, the widened leading ends are overlapped, and FIG. As shown in the figure, the reinforcing film 18 wider than the tip of the narrower flexible wiring board 8 and narrower than the tip of the wider flexible wiring board 10 protrudes from the edge of the narrower flexible wiring board 8. Even if it is covered with the reinforcing film 18 so as not to be damaged, the strength is increased.
  • the electronic component 49 is arranged on the first and second substrate pieces 2A and 2B, and the electronic component 49 Riji' de wiring board 2 terminals, the outermost layer of 0 3, 3 0 3 of the wiring film 2 2 3, 3
  • Electronic component 4 9 Connecting to 2 3, first, the mounting tower to the second board piece 2 A, 2 B.
  • the electronic component 4 9, first, second board piece 2 A, 2 wiring film 1 2 B, 2 2 iota-2 23, 3 2, and ⁇ 3 2 3, conductive protrusions 2 4, to 2 4 3 ,
  • each electronic component 49 is also connected to another electronic circuit such as a power supply. Connected.
  • the base films 11 and 51 of the flexible wiring boards 10 and 8 and the cover films 16 and 56 are polyimide films of tens to tens of Atm.
  • the wiring layer 1 2, 5 2, 2 2, and 2 2 2 3, 3 2, ⁇ 3 2 3 is a copper foil having a thickness of ten to several tens of m is configured by being patterned into a predetermined shape, base It bends together with the films 11 and 51 and the cover films 16 and 56 so that the flexibility of the flexible wiring boards 8 and 10 is not impaired.
  • Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0, the base substrate 2 1 ⁇ 3 0 3 ⁇ 2 1 3 3 0 ⁇ 3 0 3 is made of a glass epoxy resin or the like, the thickness It is a thin plate of about 50 to 500 ⁇ m and does not have flexibility. Therefore, once the mounted electronic components 4 9, and summer as stress is not applied between the terminals of the electronic component 4 9 and the wiring film 2 2 3, 3 2.
  • Reference numeral 3 in FIG. 8 denotes a substrate piece of the second example of the present invention, and the substrate piece 2 of the first example is different from the substrate piece 2 of the flexible wiring board 40 in that The only difference is that they are longer.
  • the tip of the cover film 46 is not adhered to the wiring film 12 or the base film 11, and the surface of the wiring film 12 is exposed at that portion.
  • Reference numerals 3A and 3B in FIG. 9 denote two substrate pieces having such a configuration, and anisotropically conductive portions are provided on the exposed portions of the wiring films 12 of the substrate pieces 3A and 3B.
  • the flexible film 17 is disposed, the flexible wiring board 8 for connection is attached, and the peeled portion of the cover film 46 is further attached to the flexible wiring board 8 for connection.
  • a composite wiring board 72 is formed.
  • the peeled portion of the cover film 46 from the base film 11 or the like is used as a reinforcing film.
  • the peeled portion of the cover film 46 is affixed to the base film 51 of the flexible wiring board 8 for connection.
  • the end opposite to the peeled portion may end at the end of the substrate piece main body 41, or may extend to the inside of the substrate piece main body 41.
  • connection part 4 4 and cover film 4 of flexible wiring board 8 for connection On the opposite side, the reinforcing film 18 used in the composite wiring board 71 of the first example can be attached.
  • the length L of the connection portion 4 4 is equal to the substrate piece body 4
  • the length of 1 is shorter than 1_2.
  • the flexible wiring board 1 0, 4 0 of the substrate piece 2, 3 is Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0, and was located between 1-3 0 3 of the laminate
  • the present invention is not limited to this, and the present invention also includes a substrate piece located at the outermost layer.
  • Code 4 of the first 0 Figure is an example of such a board piece, a plurality of Riji' de wiring board 2 0 on one side of Furekishibu Le wiring board 1 0 ⁇ 2 0 6 are laminated, flexible wiring plate 1 0 and Riji' de wiring board 2 0 ⁇ 2 0 6 board piece body 4 5 is composed of stacked portions, connected by a portion of the flexible wiring board 1 0 protruding from board piece body 4 5
  • the part 48 is composed.
  • Reference numerals 4A and 4B in FIG. 11 denote board pieces having the above-described configuration, and are connected to each other by a flexible wiring board 8 for connection. It is configured.
  • the composite wiring boards 71 to 73 of the first to third examples can be appropriately selected according to the shape of the space of the electronic device to be used. Also, each substrate piece 4 ⁇ ! ⁇ 4 3 can be freely combined. For example, the substrate piece 2 of the first example and the substrate piece 4 of the third example may be connected by a flexible wiring board 8.
  • the fourth composite wiring board 74 of the present invention may be configured by connecting a component represented by 17 A.
  • the length of the flexible wiring board 8 for connection is Is longer than the connecting portions 42, 44, 48, but conversely, the shorter case is also included in the present invention. Further, the lengths of the connecting portions 42, 44, 48 may be longer than the substrate pieces 41, 43.
  • the electronic components 49 may be mounted after assembling the substrate pieces 2 to 4 and the flexible wiring board 8 for connection into composite wiring boards 71 to 73, or mounting the electronic components on the substrate element. After being mounted on the pieces 2 to 4, the flexible wiring board 8 for connection may be connected to form the composite wiring boards 71 to 73.
  • the flexible wiring board 8 used for the connection and the flexible wiring boards 10 and 40 constituting the connecting portions 42, 44 and 48 have a single layer, but a plurality of flexible wiring boards are laminated. You may comprise.
  • the composite wiring boards 71 to 73 of the present invention can be provided in an opening / closing device that opens and closes a lid of a mobile phone, a notebook personal computer, or the like.
  • a part of the composite wiring board 71 to 73 is bent with opening and closing, but the wiring film 52 of the flexible wiring board 8 for connection and the first and second substrate pieces 2 A If the portion of the 2B flexible wiring board 10 electrically connected to the wiring film 12 is not positioned at the bent portion, the reliability of the entire device is improved.
  • FIGS. 38 and 39 show a switchgear 66 incorporating the composite wiring board 71 of the present invention shown in FIG.
  • the opening / closing device 66 is a mobile phone.
  • the opening / closing device 66 includes a first housing 61 serving as a lid on the display device side, and a second housing 62 closely contacting the first housing 61 on the operation panel side. Have.
  • the shaft 63 has a diameter approximately equal to the thickness of the first and second housings 61 and 62, and penetrates a part of the first and second housings 61 and 62. I have.
  • the first and second housings 61 and 62 are mounted so as to be relatively rotatable about a central axis of the shaft 63 by a predetermined angle.
  • First and second housings 6 1 and 6 2 When rotated by a large angle, the lid is opened as shown in Fig. 37.
  • the composite wiring board 7 1 inside the switchgear type device 6 6 has one of the board pieces 2 A and 2 B located at both ends, and one of the board pieces 2 A is arranged inside the first housing 61.
  • the other substrate piece 2B is arranged inside the second housing 62.
  • the flexible wiring board 8 for connection passes through the inside of the shaft 63, and both ends thereof are located in the first and second housings 61 and 62.
  • the portion where the flexible wiring board 8 for connection and the connection portion 42 of the substrate pieces 2A and 2B are connected is not located within the shaft 63 and the first or second housing Located in 61,62.
  • one of the two interconnected portions 6 5 6 5 2 is disposed on the first housing 6 1 and the other was located in the second housing 6 within 2 but interconnect portion 6 5 ,, 6 5 2 is not disposed in the shaft 6 3, it is sufficient that bent such odd.
  • FIG. 2 shows an example in which the first housing 61 is disposed.
  • the composite wiring boards 72 and 73 shown in FIGS. 9 and 11 also have a flexible wiring board 8 for connection and two board pieces (reference numerals) when placed in the switchgear 66. 3A and 3B, 4A and 4B), the interconnecting part between them is not arranged in the shaft 63 and the first or second housing 61, 62 It may be located inside one or both, and no stress is applied to the interconnect.
  • the shaft 63 may be a member that rotatably connects at least a part of the first and second housings 61 and 62, and does not necessarily mean one rotating shaft. For example, it may be divided into a plurality in the length direction, or a slit or the like may be formed in the circumferential direction.
  • the composite wiring board of the second invention and a substrate element as a component thereof will be described with reference to FIGS. 17 to 42 using a surface.
  • Reference numeral 2 in FIG. 18 shows an example of a substrate piece that can be used in the composite wiring board of the present invention, and FIG. 17 shows a state before assembly of the substrate piece 2. .
  • Board piece 2 has 1 to a plurality of flexible wiring boards 1 0, more re jitter de-wiring board 2 0, a ⁇ 2 0 3, 3 0 ⁇ 3 0 3.
  • the flexible wiring board 10 is a base film 1 made of a resin film.
  • the wiring film 12 is formed by patterning a metal thin film into a predetermined shape.
  • the wiring films 12 located on the front side and the rear side are connected by a conductive plug 14 made of metal or the like filled in the through hole.
  • Wiring film 2 2 ⁇ 2 2 3, 3 2, ⁇ 3 2 3, the base substrate 2 1 ⁇ 2 1 3 3 0, is disposed on one side of the ⁇ 3 0 3.
  • These wiring film 2 2 ⁇ 2 2 3 3 2 1-3 2 3 conductive protrusions 2 4 1-2 4 3, the 3 4, - 3 4 3 is connected.
  • the flexible wiring board 1 0 and Riji' de wiring board 2 0 ⁇ 2 0 2, 3 0, - 3 0 2 of the wiring layer 1 2, 2 2, and 2 2 3, 3 2, ⁇ 3 2 3, based respectively substrate 2 1 ⁇ 2 1 3 3 0 ⁇ 3 0 3 Yabe on one Sufuirumu 1 1 is divided into a plurality of spaced from each other, with each other electrically conductive collision force predetermined ones of them 2 4 ⁇ 2 4 3 3 4 - 3 together against the 4 3 or the conductive plug 1 4 Has been continued.
  • Riji' flexible wiring board 1 0 Riji' de wiring board 2 0 ⁇ 2 0 2, 3 0, an elongated than ⁇ 3 0 2, at least one end of the flexible wiring board 1 0 stacked de-wiring board 2 0 ⁇ 2 0 2, 3 0, and protrudes from 1-3 0 2 sides.
  • Code 4 1 of the first 8 diagram Riji' de wiring board 2 0 ⁇ 2 0 2, and SOSO s and the flexible wiring board 1 0 indicates a board piece Body made of superposed summed portion.
  • Reference numeral 42 denotes an end portion of the flexible wiring board 10, which indicates a bridge portion which is a portion protruding from the substrate piece main body 41.
  • the surface of the wiring film 12 is covered with a cover film 16 except for a part.
  • the cover film 16 is not provided at the front end portion, and only the front end portion or a portion close to the front end of the wiring film 12 is exposed to form the contact portion 13.
  • FIG. 30 is a partial plan view of the substrate piece 2, showing a part of the substrate piece main body 41 and the bridge portion 42. A plurality of wiring films 12 are arranged in parallel with each other, and the exposed portion at the tip is widened.
  • Reference numerals 2A and 2B in FIG. 19 denote board pieces having the same structure as the above-described board piece 2, respectively. The left side of the drawing is the first board piece 2A, and the right side is the second board.
  • an anisotropic conductive film 17 is placed on the surface of the contact portion 13 of one or both of the base plate pieces 2A and 2B.
  • the anisotropic conductive film 17 is placed on the surface of the contact portion 13 of the first substrate piece 2A, but is placed on the contact portion 13 of the second substrate piece 2B. Also, the contact part of both substrate pieces 2A and 2B You may put on the surface of 13.
  • the edge portions 42 of the first and second substrate pieces 2A and 2B are aligned with each other, and the surface of the contact portion 13 of the second substrate piece 2B is made different.
  • the conductive film 17 is brought into close contact with the surface.
  • FIGS. 31a to 31c are drawings for explaining the alignment process, and members such as the wiring film ⁇ 2, the cover film 16 and the anisotropic conductive film 17 are omitted. is there.
  • Reference numeral 47 in this figure and other figures described later indicates a portion of the bridge portion 42 overlapped by alignment.
  • the contact portions 13 of the first and second substrate pieces 2 A and 2 B are heated and pressed together in a state of being in close contact, and the wiring films 12 constituting the contact portions 13 are anisotropically conductive.
  • a composite wiring board 81 is obtained as shown in FIG.
  • the wiring films 1 2,? ? , ⁇ ⁇ Yo? , ⁇ Yo? 3 and the wiring films 12, 2 2 1-2 2 3, 3 2, to 3 2 3 of the second substrate piece 2 B are electrically connected to each other.
  • the flexible wiring board 10 of the first and second substrate pieces 2 A and 2 B has flexibility or flexibility, and the first and second substrate pieces 2 A and 2 B
  • the flexible wiring board 10 of the first and second substrate pieces 2A, 2B can be bent while maintaining the electrical connection between the contact portions 13 of the flexible wiring board 10 of FIG.
  • the reinforcing film 18 is attached over the bridge portion 42 of the substrate pieces 2A and 2B.
  • the flexible wiring boards 10 constituting the bridge portions 42 of the first and second substrate pieces 2A, 2B are mechanically connected to each other.
  • the reinforcing film 18 is attached so that the tip of the flexible wiring board 10 is not exposed, the reinforcing film 18 may be attached to only one of the surfaces. Alternatively, a single reinforcing film 18 may be wound around the overlapping portion 47 to mechanically connect both the front side and the back side.
  • the width W A of the bridge portion 42 of the portion where the contact portion 13 of the first substrate piece 2A is located is equal to the width of the second substrate piece 2A. If the width of the bridge portion 42 of the segment 2B where the contact portion 13 is located is wider than the width WB (W A > WB, or vice versa, W A ⁇ WB may be used). As shown in Fig. 32b, the narrow part is positioned so that it is located inside the wide part, and the two parts are overlapped with each other. ⁇ Connect 3 electrically.
  • a reinforcing film 18 may be attached so as to cover the three sides at the front end of the narrower contact portion 42. Further, a reinforcing film 18 can be attached to the back side. Also, as shown in FIG. 33a, of the bridge portion 42, the tip portion where the contact portion 13 is located is wider than the root portion, and the widths W A and WB of the tip portion are smaller. If one is wider than the other, as shown in Fig. 33b, the narrower is positioned so that it is located inside the wider and then overlapped, and similarly electrically connected.
  • the electronic component 49 is placed on one or both of the first and second substrate pieces 2A and 2B. Can be mounted.
  • the electronic component 4 9 Since the electronic component 4 9 is connected to the terminals on the wiring layer 2 2 3, 3 2 3 of the outermost layer of Riji' de wiring board 2 0 3, 3 0 3, the electronic component 4 9, first, second board piece 2 a, 2 wiring film 1 2, 2 2 B ⁇ 2 2 3, 3 2, ⁇ 3 2 3 or a conductive protrusions 2 4 ⁇ 2 4 3 3 4 ⁇ 3 4 3 etc. Accordingly, the electronic components 49 are connected to each other, and are connected to another circuit such as a power supply.
  • the base film 11 and the cover film 16 of the flexible wiring board 10 are formed by cutting a polyimide film of tens to several tens of meters into a predetermined shape.
  • the wiring films 12, 22, to 22 3 , 32, to 32 3 are formed by patterning copper foil having a thickness of tens to several tens ⁇ m into a predetermined shape.
  • the copper foil forming the wiring films 1 2, 2 2, to 2 2 3 , 3 2, to 3 2 3 is thin, it bends together when the base film 11 and the cover film 16 bend, so a flexible wiring board The flexibility of 10 is not compromised.
  • Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0, the base substrate 2 1 ⁇ 3 0 3 ⁇ 2 1 3 3 0 ⁇ 3 0 3 is made of a glass epoxy resin or the like, Thick It is formed into a thin plate of about 50 to 500 Atm. Therefore, Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0 ⁇ 3 0 3 has no flexible and bendable. Me other, is not applied stress between equipped with a terminal of the electronic component 4 9 and the wiring film 2 2 3, 3 2 3.
  • the first portion is reduced to reduce the stress applied to the contact portion 13 of the first and second substrate pieces 2A, 2B.
  • the length of the ridge portion 42 of the second substrate pieces 2A and 2B can be made longer than the minus side, so that the contact portion 13 is not positioned at the bent portion.
  • Reference numerals 2'A and 2'B in FIG. 34 denote the first and second substrate elements except that they have a short bridge portion 42A and a long bridge portion 42B.
  • the contact pieces 13 of the two kinds of board pieces 2 A and 2 B are connected to each other to form a composite wiring board 85 as shown in FIG. 35. can get.
  • the central portion of the connected bridge portion 42 is usually bent.
  • the total length of the two bridge parts in the connected state is P
  • the length of the overlapping part of the two bridge parts is Q
  • the length of the short bridge section 42A is less than (P / 2-Q)
  • the length of the long bridge section 42B is (PZ2 + Q) or longer (the difference between the length of the short bridge 42 A and the length of the long bridge 2 B is 2 ⁇ Q or more).
  • the composite wiring board of the present invention 8! -85 When connecting to a portable device such as a mobile phone or notebook computer that can be opened and closed, If not, the reliability of the whole equipment will be improved.
  • FIGS. 36 and 37 show a switchgear type device 6 incorporating the composite wiring board 85 of the present invention.
  • the opening / closing device 60 is a mobile phone.
  • the opening / closing device 60 includes a first housing 61 serving as a lid on the display device side, and a second housing 62 closely contacting the first housing 61 on the operation panel side. Have.
  • the shaft 63 has a diameter approximately equal to the thickness of the first and second housings 61 and 62, and penetrates a part of the first and second housings 61 and 62. I have.
  • the first and second housings 61 and 62 are mounted so as to be relatively rotatable about a central axis of the shaft 63 by a predetermined angle. When the first and second casings 62 and 62 are rotated by the maximum angle, the lid is opened as shown in FIG.
  • a composite wiring board 85 shown in FIG. 35 is arranged inside the switchgear 60.
  • the composite wiring board 85 inside the opening / closing device 60 is configured such that one of the first and second substrate pieces 2 ′ ′ and 2 ′ ′ is disposed inside the first housing 61, The other is arranged inside the second housing 62.
  • a long bridge portion 42 ⁇ passes through the inside of the shaft 63, and inside one housing (here, the first housing 61), a short bridge portion 422 ⁇ . Is connected to. Therefore, when the first and second housings 61 and 62 are opened and closed, the portion of the bridge portion 42B located inside the shaft 63 is bent.
  • connection portion 65 in FIGS. 36 and 37 indicate a connection portion between the bridge portions 42A and 42B.
  • the connection portion is not located inside the shaft 63, and the connection portion 65 is bent. Not to be. Therefore, no stress is applied to the connection portions 65, and the contact portions 13 do not separate from each other.
  • the connecting portion 53 is not located inside the shaft 63, the lengths of the bridge portions 42A and 24B are not limited.
  • the connection portion where the contact portions 13 are connected to each other is not arranged in the shaft 63, but is arranged in the first or second housing 61, 62, so that no stress is applied. .
  • the shaft 63 may be a member that rotatably connects at least a part of the first and second housings 61 and 62, and does not necessarily mean one rotating shaft. For example, it may be divided into a plurality in the length direction, or a slit or the like may be formed in the circumferential direction.
  • Reference numeral 3 in FIG. 23 indicates a modification of the substrate piece that can be used in the composite wiring board of the present invention.
  • the flexible wiring board 40 of the substrate piece 3 of this modification is the flexible wiring board 40 described above. As in the case of the simple wiring board 10, it protrudes outward from the side surface of the substrate piece main body 41, and the portion constitutes a bridge portion 44.
  • the cover film 46 of the flexible wiring board 40 has the same length as or longer than the base film 11, and the leading end extends to the contact portion 13.
  • the tip portion is not bonded to the wiring film 12 or the base film 11, and therefore, the surface of the wiring film 12 at the tip portion is exposed, and the contact portion 13 is formed at that portion. Have been.
  • Other configurations are the same as the configurations of the first and second substrate pieces 2A and 2B.
  • the anisotropic conductive film 1 is placed on the contact portion 13 of the substrate piece 3. Then, the contact portion of the first or second substrate piece 2 is pressed onto the anisotropic conductive film 17 to electrically connect the flexible wiring boards 40 and 10 to each other.
  • the substrate element 3 of the modified example is attached to the base film 11 side of the flexible wiring board 10 of the first or second substrate element 2.
  • the tip of the cover film 46 is attached, the tip of the first or second substrate piece 2 is sandwiched between the cover film 46 of the modified substrate piece 3 and the base film 11. State.
  • the cover film 46 functions as a reinforcing film, and the flexible wiring boards 40 and 10 are mechanically connected to each other by the cover film 46, so that a strong composite wiring board 82 is obtained.
  • Another reinforcing film 18 may be attached to the back surface of the cover film 46.
  • the end of the cover film 46 of the modified example of the substrate piece 3 opposite to the contact portion 13 ends at the edge of the substrate piece body 41, and the entire cover film 46 is formed on the substrate. It may be located outside the element body 41, or the end of the cover film 46 opposite to the contact part 13 extends to the inside of the substrate element body 41, and the rigid wiring board 2 0, may be adhered.
  • Each board piece 2 A, 2 B, 3 A flexible wiring board 1 0, 4 0, Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0 ⁇ 3 0 3 of the laminate 2 0, 3 Although it was located between 0, the present invention is not limited to the composite wiring boards 81 and 82 constituted by such substrate pieces.
  • Code 6 A, 6 B of the second 6 diagram is an example of such a board pieces, deflection Kishiburu wiring board 1 0, Riji' de wiring board 2 0 ⁇ 2 0 6 laminate 2 0 'of the Affixed to the surface of the outermost layer.
  • an anisotropic conductive film 17 is arranged on the contact part 13 of one substrate piece 6A, and the contact part of the other substrate piece 6B 1 3 is pressed against the surface of the anisotropic conductive film 17 to electrically connect the wiring films 12 of the flexible wiring boards 10 of both substrate pieces 6 A and 6 B to each other. Subsequently, when the reinforcing films 18 are attached to both surfaces of the front end of the flexible wiring board 10, the composite substrate 83 of the present invention is obtained as shown in FIG.
  • the bridge section is provided so that the connection portions of the board pieces 6A and 6B are not located at the bent portions.
  • One of 48 can be short and the other long.
  • the length of the bridge section 48 on the short side is less than (P / 2-Q), and the longer side is longer than (P / 2 + Q). Good.
  • the combination of the above substrate pieces 2A, 2B, 3, 6A, and 6B is an example, and the composite wiring board of the present invention can be configured by freely combining them.
  • the composite wiring boards 81 to 83 were configured using the respective substrate pieces 2A, 2B, 3, 6A, and 6B having the flexible wiring boards 10 and 40.
  • Substrate pieces 2A, 2B, 3, 6A, and 6B are used as third substrate pieces, and a fourth base piece made of a laminate of rigid wiring boards without a flexible wiring board is used.
  • the composite wiring board of the present invention can be composed of the third substrate element and the fourth substrate element.
  • Code 4 of the second 8 diagram shows the fourth board piece constituted by the Riji' de-wiring board 2 0 - 2 0 5 and Riji' de wiring board 5 0 having the same structure, the ⁇ 5 0 5 laminated Reference numeral 6A indicates a third substrate piece.
  • the surface of the metal wiring film is exposed, and a part of the surface of the metal wiring film or the contact portion 13 of the third substrate element 6 A is formed.
  • the anisotropic conductive film 17 is arranged, and as shown in FIG. 29, the contact portion 13 of the third substrate piece 6A is placed between the anisotropic conductive film 17 and the When a metal wiring film on the surface of the fourth substrate piece 4 is electrically connected by heating and pressing, a composite wiring board 84 according to a modified example of the present invention is obtained.
  • the cover film 46 of the flexible wiring board 40 is combined with the fourth substrate piece 4. It can be extended to the top, and a cover film 46 can be affixed to the surface of the fourth substrate piece 4 to replace the reinforcing film.
  • the electronic components 49 mounted on the substrate element bodies 41 and 43 are assembled by assembling the substrate elements 2A, 2B, 3, 6A, 6B and 4 into a composite wiring board 8 "!
  • the electronic parts 49 may be mounted later, or mounted on the substrate pieces 2A, 2B, 3, 6A, 6B, 4 and then assembled to form the composite wiring boards 81 to 84. You may.
  • the flexible wiring boards 10 and 40 of the substrate pieces 28, 2B, 3, 6A, and 6B are single layers, a plurality of flexible wiring boards are stacked to form a bridge section 4. 2, 4, 4, and 48 may be configured.
  • the composite wiring board can be assembled from the substrate pieces when necessary, so that the workability is good.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Single layer or laminated rigid wiring boards (20, 30) and a flexible wiring board (10) are stacked in such a way that a connection portion (42) which is an edge of the flexible wiring board (10) projects from the side of the stack. This stack and another stack of the same structure are used as first and second board pieces (2A, 2B), respectively. Connection portions (42) of the first and second board pieces (2A, 2B) are interconnected, thereby constituting a composite wiring board. Until the interconnection, the first and second board pieces (2A, 2B) are separately handled, and hence the workability is high.

Description

明細書  Specification
次に示すように国際調査機関が作成 た。 Prepared by the International Searching Authority as follows.
基板素片とその基板素片を用いた複合配線板及び開閉型機器 技術分野  Substrate pieces, composite wiring boards and switchgear devices using the substrate pieces
本発明は、 配線板の技術分野にかかり、 特に、 リジッ ド配線板とフレ キシブル配線板とから成る複合配線板に関する。 背景技術  The present invention relates to the technical field of wiring boards, and more particularly to a composite wiring board comprising a rigid wiring board and a flexible wiring board. Background art
第 4 2図の符号 1 0 1 は、 本発明の関連技術の複合配線板である。  Reference numeral 101 in FIG. 42 is a composite wiring board according to the related art of the present invention.
第 4 4図は、 この複合配線板 1 0 Ί の構造を示す分解図であり、 符号 1 7 1 Α、 Ί 7 2 A、 1 7 1 B、 1 7 2 Bは、 リジッ ド配線板を積層し たリジッ ド積層板を示しており、 符号 1 7 8は、 単層又は積層構造のフ レキシブル配線板を示している。  FIG. 44 is an exploded view showing the structure of the composite wiring board 10 Ί, and reference numerals 17 1 Α, Ί 72 A, 17 1 B, and 17 2 B are laminated rigid wiring boards. Reference numeral 178 indicates a single-layer or laminated flexible wiring board.
フレキシブル配線板 1 7 8は、 樹脂から成り、 可撓性を有するベース フイルム 1 1 1 と、 ベースフイルム 1 1 1 上に配置された配線膜 1 1 2 を有している。  The flexible wiring board 178 is made of resin and has a flexible base film 111 and a wiring film 112 arranged on the base film 111.
リジッ ド積層板 1 7 1 A、 1 7 2 A、 1 7 1 B、 1 7 2 Bの配線膜 Ί 2 1 は、 フレキシプル配線板 1 7 8の配線膜 1 1 2 に接続され、 フレキ シブル配線板 1 7 8の両端の表面と裏面に固定されている。  Rigid laminated board 17 1 A, 17 2 A, 17 1 B, 17 2 B Wiring film Ί 21 is connected to wiring film 1 1 2 of flexible wiring board 1 78, flexible wiring Plates 178 are fixed to the front and back surfaces at both ends.
リジッ ド積層板 1 7 1 Α、 Ί 7 2 Α、 1 7 1 Β、 1 7 2 Βは、 フレキ シブル配線板 1 7 8よりも短く、 一端のリジッ ド積層板 1 7 Ί Α、 1 7 2 Αと他端のリジッ ド積層板 1 7 1 B、 1 7 2 B間は、 フレキシブル配 線板 1 7 8の中央部分によって接続されている。  Rigid laminated board 1 7 1 Α, Ί 7 2 Α, 1 7 1 Β, 1 7 2 Β are shorter than flexible wiring board 1 7 8, and rigid laminated board 1 7 Α, 1 7 2 at one end The 積 層 and the rigid laminated boards 17 1 B and 17 2 B at the other end are connected by a central portion of a flexible wiring board 178.
そして、 第 4 3図に示すように、 リジッ ド積層板 1 7 1 A、 1 7 2 A、 1 7 Ί B , 1 7 2 Bに電子部品 1 4 5を搭載すると、 電子部品 1 4 5は 配線膜 1 1 2、 1 2,1 によって相互に接続される。 上記のような複合配線板 1 0 1 を例えば携帯型コンピュータに用いる 場合、 複合配線板 1 0 1 の一端に位置するリジッ ド積層板 1 7 1 A、 1 7 2 Aをキーポー ド側の筐体内に配置し、 他端に位置するリジッ ド積層 板 1 7 1 B、 1 7 2 Bを液晶表示パネル側の筐体内に配置すると、 液晶 表示パネルを開閉自在に構成しながら、 キーボー ドと液晶表示パネルを フレキシブル配線板 1 7 8によって接続することができる。 Then, as shown in FIG. 43, when the electronic component 144 is mounted on the rigid laminates 17 1 A, 17 A, 17 B, 17 B, the electronic component 14 They are interconnected by wiring films 1 1 2 and 1 2,1. When the above-described composite wiring board 101 is used in, for example, a portable computer, the rigid laminated boards 17 1 A and 17 2 A located at one end of the composite wiring board 101 are placed inside the housing on the keyport side. When the rigid laminate 17 1 B and 17 2 B located at the other end are placed inside the housing on the liquid crystal display panel side, the keyboard and liquid crystal display are displayed while the liquid crystal display panel is openable and closable. Panels can be connected by flexible wiring boards 17 8.
本発明の先行技術文献には特開平 0 5— 2 4 3 7 3 8号公報がある。 しかしながら、 フレキシブル配線板 1 7 8が長い場合、 上記の複合配 線板 1 0 1 では、 その取り扱いが不便であり、 電子部品 1 4 5の搭載作 業の作業性が悪い。 また、 両端のリジッ ド部 1 7 1 A、 1 7 1 B、 1 7 2 A、 1 7 2 Bの一方だけが不良品であっても、 良品の方も一緒に廃棄 しなければならない。  As a prior art document of the present invention, there is Japanese Patent Application Laid-Open No. H05-243738. However, when the flexible wiring board 178 is long, the above-described composite wiring board 101 is inconvenient to handle, and the work of mounting the electronic component 145 is poor. In addition, even if only one of the rigid sections at both ends, 17A, 17B, 17A, and 17B, is defective, the good product must be discarded together.
本発明は上記関連技術の不都合を解決するために創作されたものであ リ、 その目的は、 取り扱いが容易で、 低コス トの複合配線板を提供する ことにめる。 発明の開示  The present invention has been made to solve the disadvantages of the related art described above, and its object is to provide a low-cost composite wiring board that is easy to handle. Disclosure of the invention
上記課題を解決するために、 本発明は、 少なくとも一枚のフレキシブ ル配線板と、 複数のリジッ ド配線板とが積層された基板素片であって、 前記フレキシブル配線板と前記リジッ ド配線板とが重ねあわされた部分 から成る基板素片本体と、 前記フレキシブル配線板の端部であって、 前 記基板素片本体の側面からはみ出た接続部とを有し、 前記接続部には、 前記フレキシブル配線板の配線膜が、 少なく とも一部は露出された基板 素片である。  In order to solve the above-mentioned problems, the present invention provides a substrate element in which at least one flexible wiring board and a plurality of rigid wiring boards are laminated, wherein the flexible wiring board and the rigid wiring board And a connection portion protruding from a side surface of the substrate piece main body, which is an end portion of the flexible wiring board, wherein the connection portion includes: At least a part of the wiring film of the flexible wiring board is an exposed substrate piece.
本発明は、 隣接する前記リジッ ド配線板の配線膜は導電性突起によつ て接続された基板素片である。 本発明は、 前記基板素片本体の長さよりも、 前記接続部の長さのほう が短い基板素片である。 In the present invention, the wiring film of the adjacent rigid wiring board is a substrate piece connected by a conductive projection. The present invention is a substrate piece in which the length of the connection portion is shorter than the length of the substrate piece body.
本発明は、 第一、 第二の基板素片と、 接続用のフレキシブル配線板と を有し、 前記第一、 第二の基板素片は、 少なく とも一枚のフレキシブル 配線板と、 複数のリジッ ド配線板とが積層された基板素片であって、 前 記フレキシプル配線板と前記リジッ ド配線板とが重ねあわされた部分か ら成る基板素片本体と、 前記フレキシブル配線板の端部であって、 前記 基板素片本体の側面からはみ出た接続部とを有し、 前記接続部には、 前 記フレキシブル配線板の配線膜が、 少なく とも一部は露出され、 前記第 一、 第二の基板素片の接続部は、 前記接続用のフレキシブル配線板の端 部に接続された複合配線板である。  The present invention has first and second substrate pieces and a flexible wiring board for connection, wherein the first and second substrate pieces are at least one flexible wiring board and a plurality of flexible wiring boards. A substrate element on which a rigid wiring board is laminated, the substrate element body comprising a portion where the flexible wiring board and the rigid wiring board are overlapped, and an end of the flexible wiring board. A connection portion protruding from a side surface of the substrate piece main body, wherein at least a part of the wiring film of the flexible wiring board is exposed to the connection portion, The connection portion of the second substrate piece is a composite wiring board connected to an end of the flexible wiring board for connection.
本発明は、 前記接続用のフレキシブル配線板と前記第一、 第二の基板 素片の前記接続部の間に亘つて補強フィル厶が貼付された複合配線板で ある。  The present invention is a composite wiring board having a reinforcing film affixed between the connection flexible wiring board and the connection portions of the first and second substrate pieces.
本発明は、 前記接続用のフレキシブル配線板の長さは、 前記第一、 第 二の基板素片の前記接続部の長さよりも長い複合配線板である。  The present invention is the composite wiring board, wherein a length of the flexible wiring board for connection is longer than a length of the connection portion of the first and second substrate pieces.
本発明は、 前記第一又は第二の基板素片の少なくとも一方には、 電子 部品が搭載された複合配線板である。  The present invention is a composite wiring board having an electronic component mounted on at least one of the first and second substrate pieces.
本発明のうち、 第一発明の基板素片は上記のように構成されており、 単層のリジッ ド配線板ゃフレキシブル配線板の表面に接着フィル厶を配 置し、 加熱 · 加圧して積層させ、 各リ ジッ ド配線板が有する配線膜を、 フレキシブル配線板の配線膜に接続している。  In the present invention, the substrate piece of the first invention is configured as described above, and an adhesive film is disposed on the surface of a single-layer rigid wiring board ゃ a flexible wiring board, and laminated by heating and pressing. Then, the wiring film of each rigid wiring board is connected to the wiring film of the flexible wiring board.
フレキシプル配線板の長さをリジッ ド配線板よりも長くすると、 フレ キシブル配線板とリジッ ド配線板とが積層された基板素片.本体から、 フ レキシプル配線板の端部を接続部として突き出させることができる。 また、 第一発明の複合配線板は上記のように構成されており、 少なく とも 2個の基板素片が、 接続用のフレキシブル配線板によって接続され ている。 2個の基板素片を第一、 第二の基板素片とすると、 第一、 第二 の基板素片の配線膜同士は、 接続用のフレキシブル配線板の配線膜を介 して接続されている。 When the length of the flexible wiring board is made longer than the rigid wiring board, the flexible wiring board and the rigid wiring board are laminated, and the end of the flexible wiring board protrudes from the main body as a connection part. be able to. Further, the composite wiring board of the first invention is configured as described above, Both of the two substrate pieces are connected by a flexible wiring board for connection. Assuming that the two substrate pieces are first and second substrate pieces, the wiring films of the first and second substrate pieces are connected via a wiring film of a flexible wiring board for connection. I have.
そして、 接続用のフレキシブル配線板は自由に曲げられるので、 一方 の基板素片を携帯型コンピュー夕のディスプレイ側、 他方の基板素片を キーボード側に配置し、 開閉自在にすることができる。  Since the flexible wiring board for connection can be freely bent, one of the substrate pieces can be arranged on the display side of the portable computer and the other can be freely opened and closed.
また、 本発明の開閉型機器では、 第一、 第二の筐体の開閉操作に伴い、 複合配線板が曲げられ、 且つ、 その曲げが伸ばされるが、 接続部と接続 用のフレキシブル配線板とが接続された部分は、 曲げられ、 且つ、 曲げ が戻される部分には配置されておらず、 応力が加わらないようになって いる。  Further, in the opening / closing device of the present invention, the composite wiring board is bent and the bending is extended with the opening / closing operation of the first and second housings. The portion where is connected is bent and is not arranged in the portion where the bending is returned, so that no stress is applied.
本発明は、 第一の筐体と第二の筐体とが、 軸を中心として所定角度だ け相対的に回転可能に構成され、 第一、 第二の基板素片と、 接続用フレ キシブル配線板とを有する複合配線板が内蔵され、 前記第一、 第二の基 板素片のうちの一方が前記第一の筐体内に配置され、 他方が前記第二の 筐体内に配置された開閉型機器であって、 前記第一、 第二の基板素片は、 少なくとも一枚のフレキシブル配線板と、 複数のリジッ ド配線板とが積 層された基板素片であって、 前記フレキシブル配線板と前記リジッ ド配 線板とが重ねあわされた部分から成る基板素片本体と、 前記フレキシブ ル配線板の端部であって、 前記基板素片本体の側面からはみ出た接続部 とを有し、 前記接続部には、 前記フレキシブル配線板の配線膜が、 少な くとも一部は露出され、 前記第一、 第二の基板素片の接続部は、 前記接 続用のフレキシブル配線板の端部に接続され、 前記第一又は第二の基板 素片の少なくとも一方には電子部品が搭載され、 前記第一、 第二の基板 素片と前記接続用のフレキシブル配線板とが接続された部分は、 前記第 一、 第二の筐体が開閉されて前記接続用のフレキシブル配線板が曲がる ときに曲がらない位置に配置された開閉型機器である。 According to the present invention, the first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and the first and second substrate pieces are connected to a flexible connection. A composite wiring board having a wiring board is built in, one of the first and second base plate pieces is disposed in the first housing, and the other is disposed in the second housing. An openable / closable device, wherein the first and second substrate pieces are board pieces on which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, and wherein the flexible wiring A board piece main body composed of a portion where a board and the rigid wiring board are overlapped with each other, and a connection portion that is an end of the flexible wiring board and protrudes from a side surface of the board piece main body. In the connecting portion, at least a wiring film of the flexible wiring board is provided. The connection portion of the first and second substrate pieces is connected to an end of the flexible wiring board for connection, and at least one of the first and second substrate pieces is An electronic component is mounted, and a portion where the first and second substrate pieces and the flexible wiring board for connection are connected, An openable / closable device disposed at a position where the first and second housings are opened and closed and the connection flexible wiring board is not bent when the connection flexible wiring board is bent.
本発明は、 第一の筐体と第二の筐体とが、 軸を中心として所定角度だ け相対的に回転可能に構成され、 第一、 第二の基板素片と、 接続用フレ キシブル配線板とを有する複合配線板が内蔵され、 前記第一、 第二の基 板素片のうちの一方が前記第一の筐体内に配置され、 他方が前記第二の 筐体内に配置された開閉型機器であって、 前記第一、 第二の基板素片は、 少なく とも一枚のフレキシブル配線板と、 複数のリジッ ド配線板とが積 層された基板素片であって、 前記フレキシブル配線板と前記リジッ ド配 線板とが重ねあわされた部分から成る基板素片本体と、 前記フレキシプ ル配線板の端部であって、 前記基板素片本体の側面からはみ出た接続部 とを有し、 前記接続部には、 前記フレキシブル配線板の配線膜が、 少な くとも一部は露出され、 前記第一、 第二の基板素片の接続部は、 前記接 続用のフレキシブル配線板の端部に接続され、 前記第一又は第二の基板 素片の少なくとも一方には電子部品が搭載され、 前記接続用のフレキシ プル配線板は前記軸内を通り、 前記第一、 第二の基板素片の前記接続部 と、 前記接続用のフレキシブル配線板とが接続された部分は、 一方が前 記第一の筐体の内部に位置し、 他方が前記第二の筐体の内部に配置され た開閉型機器である。  According to the present invention, the first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and the first and second substrate pieces are connected to a flexible connection. A composite wiring board having a wiring board is built in, one of the first and second base plate pieces is disposed in the first housing, and the other is disposed in the second housing. An openable / closable device, wherein the first and second board pieces are board pieces on which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, A substrate piece main body composed of a portion where the wiring board and the rigid wiring board are overlapped; and a connection portion that is an end of the flexible wiring board and protrudes from a side surface of the substrate piece main body. The connection portion has at least a wiring film of the flexible wiring board. The connection part of the first and second substrate pieces is connected to an end of the connection flexible wiring board, and at least one of the first and second substrate pieces is An electronic component is mounted, the connection flexible wiring board passes through the shaft, and a portion where the connection portion of the first and second substrate pieces is connected to the connection flexible wiring board Is an openable / closable device in which one is located inside the first housing and the other is located inside the second housing.
本発明は、 第一の筐体と第二の筐体とが、 軸を中心として所定角度だ け相対的に回転可能に構成され、 第一、 第二の基板素片と、 接続用フレ キシブル配線板とを有する複合配線板が内蔵され、 前記第一、 第二の基 板素片のうちの一方が前記第一の筐体内に配置され、 他方が前記第二の 筐体内に配置された開閉型機器であって、 前記第一、 第二の基板素片は、 少なく とも一枚のフレキシブル配線板と、 複数のリジッ ド配線板とが積 層された基板素片であって、 前記フレキシブル配線板と前記リジッ ド配 線板とが重ねあわされた部分から成る基板素片本体と、 前記フレキシプ ル配線板の端部であって、 前記基板素片本体の側面からはみ出た接続部 とを有し、 前記接続部には、 前記フレキシブル配線板の配線膜が、 少な くとも一部は露出され、 前記第一、 第二の基板素片の接続部は、 前記接 続用のフレキシブル配線板の端部に接続され、 前記第一又は第二の基板 素片の少なく とも一方には電子部品が搭載され、 前記第一又は第二の基 板素片のうちの一方の基板素片の前記接続部が前記軸内を通り、 前記第 一、 第二の基板素片の前記接続部と前記接続用のフレキシブル配線板と が接続された部分は、 前記第一、 第二の筐体のいずれか一方の内部に配 置された開閉型機器である。 According to the present invention, the first housing and the second housing are configured to be relatively rotatable about an axis by a predetermined angle, and the first and second substrate pieces are connected to a flexible connection. A composite wiring board having a wiring board is built in, one of the first and second base plate pieces is disposed in the first housing, and the other is disposed in the second housing. An openable / closable device, wherein the first and second board pieces are board pieces on which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, Wiring board and the rigid arrangement A substrate piece main body composed of a portion where a wire plate is overlapped; and a connection part which is an end of the flexible wiring board and protrudes from a side surface of the substrate piece main body. At least a part of a wiring film of the flexible wiring board is exposed, and a connection portion of the first and second substrate pieces is connected to an end of the connection flexible wiring board. An electronic component is mounted on at least one of the first or second substrate element, and the connection portion of one of the first or second substrate element is connected in the axis. As described above, a portion of the first and second substrate pieces where the connection portion and the connection flexible wiring board are connected is disposed inside one of the first and second housings. It is a switchgear type device.
本発明は、 少なくとも一枚のフレキシブル配線板と、 複数のリジッ ド 配線板とが積層された第一、 第二の基板素片同士を接続した複合配線板 であって、 前記第一、 第二の基板素片は、 前記フレキシブル配線板と前 記リジッ ド配線板とが重ねあわされた部分から成る基板素片本体と、 前 記フレキシブル配線板の端部であって、 前記基板素片本体の側面からは み出たブリ ッジ部とをそれぞれ有し、 前記ブリ ッジ部では、 前記フレキ シブル配線板の配線膜の少なくとも一部が露出された部分でコンタク 卜 部が構成され、 前記第一、 第二の基板素片は、 前記コンタク ト部同士が 互いに電気的に接続された複合配線板である。  The present invention is a composite wiring board in which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, and the first and second substrate pieces are connected to each other. The substrate piece is a substrate piece body composed of a portion where the flexible wiring board and the rigid wiring board are overlapped, and an end of the flexible wiring board, And a bridge portion protruding from a side surface. In the bridge portion, a contact portion is formed at a portion where at least a part of the wiring film of the flexible wiring board is exposed, and the contact portion is formed. The first and second substrate pieces are composite wiring boards in which the contact portions are electrically connected to each other.
本発明は、 前記第一、 第二の基板素片の隣接する前記リジッ ド配線板 の配線膜は導電性突起によって接続された複合配線板である。  The present invention is a composite wiring board in which wiring films of the rigid wiring board adjacent to the first and second substrate pieces are connected by conductive protrusions.
本発明は、 前記第一、 第二の基板素片の前記ブリ ッジ部の間に亘つて 補強フィル厶が貼付された複合配線板である。  The present invention is a composite wiring board in which a reinforcing film is attached between the bridge portions of the first and second substrate pieces.
本発明は、 前記第一、 第二のフレキシブル配線板のブリ ッジ部は、 一 方が他方よりも長く、 その長さの差は、 前記コンタク ト部が重ね合わさ れる部分の長さの 2倍以上にされた複合配線板である。 本発明は、 少なくとも一部表面に電子部品が搭載された複合配線板で ある。 In the present invention, it is preferable that one of the bridge portions of the first and second flexible wiring boards is longer than the other, and the difference between the lengths is two times the length of the portion where the contact portions overlap. This is a composite wiring board that has been doubled or more. The present invention is a composite wiring board having an electronic component mounted on at least a part of its surface.
本発明は、 少なくとも一枚のフレキシブル配線板と、 複数のリジッ ド 配線板とが積層された第三の基板素片と、 複数のリジッ ド配線板が積層 された第四の基板素片とが積層された複合配線板であって、 前記第三の 基板素片は、 前記フレキシブル配線板と前記リジッ ド配線板とが重ねあ わされた部分から成る基板素片本体と、 前記フレキシブル配線板の端部 であって、 前記基板素片本体の側面からはみ出たブリ ッジ部とを有し、 前記ブリ ッジ部には、 前記フレキシブル配線板の配線膜が、 少なくとも 一部は露出されてコンタク ト部が構成され、 前記第四の基板素片は、 表 面には配線膜の少なくとも一部が露出され、 前記第三、 第四の基板素片 は、 前記第三の基板素片の前記ブリ ッジ部で露出する前記配線膜と、 前 記第四の基板素片の表面に露出する前記配線膜とが電気的に接続された 複合配線板である。  According to the present invention, at least one flexible wiring board, a third substrate piece on which a plurality of rigid wiring boards are stacked, and a fourth substrate piece on which a plurality of rigid wiring boards are stacked are provided. In the laminated composite wiring board, the third substrate piece is a substrate piece body composed of a portion where the flexible wiring board and the rigid wiring board are overlapped, An end portion, and a bridge portion protruding from a side surface of the substrate piece main body. The bridge portion has a wiring film of the flexible wiring board, at least a part of which is exposed and contacted. The fourth substrate element is configured such that at least a part of the wiring film is exposed on the surface, and the third and fourth substrate elements are the third substrate element. The wiring film exposed at the bridge portion; And the wiring layer exposed on the surface of the board piece is electrically connected a composite wiring board.
本発明は、 少なく とも一部表面に電子部品が搭載された複合配線板で あ 。  The present invention is a composite wiring board having electronic components mounted on at least a part of its surface.
本発明は、 第一の筐体と第二の筐体とが、 軸を中心として所定角度だ け相対的に回転可能に構成され、 少なくとも一枚のフレキシブル配線板 と、 複数のリジッ ド配線板とが積層された第三の基板素片と、 複数のリ ジッ ド配線板が積層された第四の基板素片とが積層された複合配線板が 内蔵され、 前記第三、 第四の基板素片のうちの一方が前記第一の筐体内 に配置され、 他方が前記第二の筐体内に配置された開閉型機器であって、 前記第三の基板素片は、 前記フレキシブル配線板と前記リジッ ド配線板 とが重ねあわされた部分から成る基板素片本体と、 前記フレキシブル配 線板の端部であって、 前記基板素片本体の側面からはみ出たブリ ッジ部 とを有し、 前記ブリ ッジ部には、 前記フレキシブル配線板の配線膜が、 少なく とも一部は露出されてコンタク 卜部が構成され、. 前記第四の基板 素片は、 表面には配線膜の少なくとも一部が露出され、 前記第三、 第四 の基板素片は、 前記第三の基板素片の前記プリ ッジ部で露出する前記配 線膜と、 前記第四の基板素片の表面に露出する前記配線膜とが電気的に 接続され、 前記複合配線板は少なく とも一部表面に電子部品が搭載され、 前記第一、 第二の基板素片の前記コンタク 卜部同士が互いに接続された 部分は、 前記第一、 第二の筐体が開閉され、 前記ブリ ッジ部が屈伸する ときに、 屈伸しない位置に配置された開閉型機器である。 According to the present invention, the first housing and the second housing are configured to be relatively rotatable about an axis by a predetermined angle, and at least one flexible wiring board and a plurality of rigid wiring boards are provided. And a fourth board element in which a plurality of rigid wiring boards are stacked, and a composite wiring board in which a plurality of rigid wiring boards are stacked. One of the element pieces is disposed in the first housing, and the other is an open / close type device disposed in the second housing, wherein the third substrate element includes the flexible wiring board and A substrate piece main body composed of a portion where the rigid wiring board is overlapped; and a bridge part which is an end of the flexible wiring board and protrudes from a side surface of the substrate piece main body. The bridge portion has a wiring film of the flexible wiring board, At least a part is exposed to form a contact portion. The fourth substrate element has at least a part of a wiring film exposed on the surface thereof, and the third and fourth substrate element has the contact part. The wiring film exposed on the bridge portion of the third substrate element is electrically connected to the wiring film exposed on the surface of the fourth substrate element, and the composite wiring board is reduced in number. An electronic component is mounted on a part of the surface of the first and second contact pieces of the first and second substrate pieces, the first and second housings are opened and closed, and the bridging is performed. This is an open / close type device that is placed in a position where it does not bend when the joint bends and stretches.
本発明は、 第一の筐体と第二の筐体とが、 軸を中心として所定角度だ け相対的に回転可能に構成され、 少なく とも一枚のフレキシブル配線板 と、 複数のリジッ ド配線板とが積層された第三の基板素片と、 複数のリ ジッ ド配線板が積層された第四の基板素片とが積層された複合配線板が 内蔵され、 前記第三、 第四の基板素片のうちの一方が前記第一の筐体内 に配置され、 他方が前記第二の筐体内に配置された開閉型機器であって、 前記第三の基板素片は、 前記フレキシブル配線板と前記リジッ ド配線板 とが重ねあわされた部分から成る基板素片本体と、 前記フレキシブル配 線板の端部であって、 前記基板素片本体の側面からはみ出たプリ ッジ部 とを有し、 前記ブリ ッジ部には、 前記フレキシブル配線板の配線膜が、 少なく とも一部は露出されてコンタク 卜部が構成され、 前記第四の基板 素片は、 表面には配線膜の少なく とも一部が露出され、 前記第三、 第四 の基板素片は、 前記第三の基板素片の前記プリ ッジ部で露出する前記配 線膜と、 前記第四の基板素片の表面に露出する前記配線膜とが電気的に 接続され、 前記複合配線板は少なく とも一部表面に電子部品が搭載され、 前記ブリ ッジ部は前記軸内を通り、 且つ、 前記第一、 第二の基板素片の 前記コンタク ト部同士が互いに接続された部分は、 前記軸の外部であつ て、 前記第一又は第二の筐体のいずれか一方の内部に配置された開閉型 機器である。 According to the present invention, the first housing and the second housing are configured to be relatively rotatable about a shaft by a predetermined angle, and at least one flexible wiring board and a plurality of rigid wirings are provided. A third board element in which a plurality of rigid wiring boards are stacked and a composite wiring board in which a fourth board element in which a plurality of rigid wiring boards are stacked is built in; One of the substrate pieces is disposed in the first housing, and the other is an opening / closing device disposed in the second housing, wherein the third substrate piece is a flexible wiring board. And the rigid wiring board are overlapped with each other, and a substrate piece main body is formed of a portion overlapped with the rigid wiring board; In the bridge portion, the wiring film of the flexible wiring board is less At least a part of the wiring film is exposed at the surface of the fourth substrate element, and the third and fourth substrate elements are at least partially exposed at the surface. The wiring film exposed at the bridge portion of the third substrate element is electrically connected to the wiring film exposed at the surface of the fourth substrate element, and at least the composite wiring board is An electronic component is mounted on a part of the surface, the bridge portion passes through the shaft, and the portion of the first and second substrate pieces where the contact portions are connected to each other is the shaft. And an openable / closable type disposed inside one of the first and second housings. Equipment.
本発明のうち、 第二発明の基板素片は上記のように構成されており、 リジッ ド配線板同士ゃフレキシブル配線板同士、 又はリジッ ド配線板と フレキシブル配線板は、 配線板間に配置された接着フィル厶によって接 続されている。  In the present invention, the substrate piece of the second invention is configured as described above, and the rigid wiring boards are arranged between the flexible wiring boards or between the rigid wiring boards and the flexible wiring boards. It is connected by an adhesive film.
基板素片のフレキシブル配線板の長さはリジッ ド配線板の長さよりも 長くされており、 フレキシブル配線板の一部は、 フレキシブル配線板と リジッ ド配線板が積層された基板素片本体の側面から突き出ている。 この突き出た部分はプリ ッジ部として用いられ、 基板素片間がプリ ッ ジ部によって接続され、 複合配線板が構成される。  The length of the flexible wiring board of the board piece is longer than the length of the rigid wiring board, and part of the flexible wiring board is the side of the board piece body on which the flexible wiring board and the rigid wiring board are laminated. Sticking out of. The protruding portion is used as a bridge portion, and the substrate pieces are connected by the bridge portion to form a composite wiring board.
基板素片は、 電子部品を搭載する直前に複合配線板に組み立てること ができるので、 取り扱いや保存が便利である。  Board pieces can be assembled into composite wiring boards just before electronic components are mounted, making them easy to handle and store.
フレキシプル配線板は自由に曲げられるので、 複合配線板を構成する 一方の基板素片をディスプレイ側、 他方の基板素片をキーボード側に用 い、 ディスプレイが開閉自在な携帯型コンピュータを構成することがで さる。  Since the flexible wiring board can be bent freely, it is possible to configure a portable computer that can open and close the display freely by using one substrate piece that constitutes the composite wiring board for the display and the other board piece for the keyboard. In monkey.
また、 本発明の開閉型機器では、 第一、 第二の筐体の開閉操作に伴い、 複合配線板が曲げられ、 且つ、 その曲げが伸ばされるが、 接続部と接続 用のフレキシブル配線板とが接続された部分は、 曲げられ、 且つ、 曲げ が戻される部分には配置されておらず、 応力が加わらないようになって いる。 図面の簡単な説明  Further, in the opening / closing device of the present invention, the composite wiring board is bent and the bending is extended with the opening / closing operation of the first and second housings. The portion where is connected is bent and is not arranged in the portion where the bending is returned, so that no stress is applied. BRIEF DESCRIPTION OF THE FIGURES
第 1 図は本発明の一例の基板素片を組み立てる前の状態を説明するた めの断面図である。  FIG. 1 is a cross-sectional view for explaining a state before assembling a substrate piece according to an example of the present invention.
第 2図は本発明の一例の基板素片を説明するための断面図である。 第 3図は本発明の一例の複合配線板を組み立てる工程を説明するため の断面図（ 1 )である。 FIG. 2 is a cross-sectional view for explaining a substrate piece according to an example of the present invention. FIG. 3 is a cross-sectional view (1) for explaining a step of assembling the composite wiring board of one example of the present invention.
第 4図は本発明の一例の複合配線板を組み立てる工程を説明するため の断面図（2 )である。  FIG. 4 is a cross-sectional view (2) for explaining a step of assembling the composite wiring board of one example of the present invention.
第 5図は本発明の一例の複合配線板を組み立てる工程を説明するため の断面図（3 )である。  FIG. 5 is a sectional view (3) for explaining a step of assembling the composite wiring board of one example of the present invention.
第 6図は本発明の一例の複合配線板を組み立てる工程を説明するため の断面図（ 4 )である。  FIG. 6 is a cross-sectional view (4) for explaining a step of assembling the composite wiring board of one example of the present invention.
第 7図は本発明の一例の複合配線板を組み立てる工程を説明するため の断面図（5 )である。  FIG. 7 is a sectional view (5) for explaining a step of assembling the composite wiring board of one example of the present invention.
第 8図は本発明の第二例の基板素片を説明するための断面図である。 第 9図はその基板素片を用いた第二例の複合配線板の断面図である。 第 1 0図は本発明の第三例の基板素片の断面図である。  FIG. 8 is a cross-sectional view for explaining a substrate piece according to a second example of the present invention. FIG. 9 is a sectional view of a composite wiring board of a second example using the substrate piece. FIG. 10 is a sectional view of a substrate piece according to a third embodiment of the present invention.
第 1 1 図はその基板素片を用いた第三例の複合配線板の断面図である。 第 1 2 a図、 第 1 2 b図、 第 1 2 c図は接続部とフレキシプル配線板 とを接続する工程を説明するための図（1 )である。  FIG. 11 is a sectional view of a composite wiring board of a third example using the substrate piece. FIG. 12a, FIG. 12b, and FIG. 12c are diagrams (1) for explaining a process of connecting a connection portion and a flexible wiring board.
第 1 3 a図、 第 1 3 b図、 第 1 3 c図は接続部とフレキシブル配線板 とを接続する工程を説明するための図（2 )である。  FIG. 13a, FIG. 13b, and FIG. 13c are diagrams (2) for explaining a process of connecting the connection portion and the flexible wiring board.
第 1 4 a図、 第 1 4 b図、 第 1 4 c図は接続部とフレキシブル配線板 とを接続する工程を説明するための図（3 )である。  FIG. 14a, FIG. 14b, and FIG. 14c are diagrams (3) for explaining a step of connecting the connection portion and the flexible wiring board.
第 1 5 a図は基板素片本体の一部と接続部の平面図であり、 第 1 5 b 図は接続用のフレキシブル配線板の端部の平面図である。  FIG. 15a is a plan view of a part of the substrate piece main body and a connection portion, and FIG. 15b is a plan view of an end portion of a flexible wiring board for connection.
第 1 6図は本発明の第四例の複合配線板の断面図である。  FIG. 16 is a sectional view of a composite wiring board according to a fourth example of the present invention.
第 1 7図は本発明の複合配線板に用いることができる基板素片の組み 立て前の状態を示す断面図である。  FIG. 17 is a cross-sectional view showing a state before assembling a substrate piece that can be used for the composite wiring board of the present invention.
第 1 8図はその基板素片を組み立てた状態を示す断面図である。 第 1 9図は第一、 第二の基板素片を用いて組み立てる複合配線板の製 造工程を説明するための断面図（1 )である。 FIG. 18 is a cross-sectional view showing a state where the substrate pieces are assembled. FIG. 19 is a cross-sectional view (1) for explaining a manufacturing process of a composite wiring board assembled using the first and second substrate pieces.
第 2 0図は第一、 第二の基板素片を用いて組み立てる複合配線板の製 造工程を説明するための断面図（2 )である。  FIG. 20 is a cross-sectional view (2) for explaining the manufacturing process of the composite wiring board assembled using the first and second substrate pieces.
第 2 1 図は第一、 第二の基板素片を用いて組み立てる複合配線板の製 造工程を説明するための断面図（3 )である。  FIG. 21 is a cross-sectional view (3) for explaining a manufacturing process of the composite wiring board assembled using the first and second substrate pieces.
第 2 2図は第一、 第二の基板素片を用いて組み立てる複合配線板の製 造工程を説明するための断面図（4 )である。  FIG. 22 is a cross-sectional view (4) for explaining the manufacturing process of the composite wiring board assembled using the first and second substrate pieces.
第 2 3図は本発明の複合配線板に用いることができる他の基板素片を 示す断面図である。  FIG. 23 is a cross-sectional view showing another substrate piece that can be used for the composite wiring board of the present invention.
第 2 4図はその基板素片に異方導電性フィル厶を配置した状態を示す 断面図である。  FIG. 24 is a sectional view showing a state in which an anisotropic conductive film is arranged on the substrate piece.
第 2 5図はその基板素片を用いて組み立てた本発明の複合配線板の例 を示す断面図である。  FIG. 25 is a sectional view showing an example of the composite wiring board of the present invention assembled using the substrate pieces.
第 2 6図は変形例の基板素片を用いて組み立てる複合配線板の工程を 説明するための断面図（1 )である。  FIG. 26 is a cross-sectional view (1) for explaining a process of a composite wiring board assembled using the substrate pieces of the modified example.
第 2 7図は変形例の基板素片を用いて組み立てる複合配線板の工程を 説明するための断面図（2 )である。  FIG. 27 is a cross-sectional view (2) for explaining a process of a composite wiring board assembled using the substrate pieces of the modified example.
第 2 8図は第三、 第四の基板素片を用いて組み立てる複合配線板のェ 程を説明するための断面図（1 )である。  FIG. 28 is a cross-sectional view (1) illustrating a step of a composite wiring board assembled using the third and fourth substrate pieces.
第 2 9図は第三、 第四の基板素片を用いて組み立てる複合配線板のェ 程を説明するための断面図（1 )である。  FIG. 29 is a cross-sectional view (1) for explaining a step of the composite wiring board assembled using the third and fourth substrate pieces.
第 3 0図はブリツジ部の一部及びコン夕ク 卜部の平面図である。 第 3 1 a図、 第 3 1 b図、 第 3 1 c図は幅が同じブリッジ部の位置合 わせの一例を説明するための図である。  FIG. 30 is a plan view of a part of the bridge part and a connector part. FIG. 31a, FIG. 31b, and FIG. 31c are diagrams for explaining an example of alignment of bridge portions having the same width.
第 3 2 a図、 第 3 2 b図、 第 3 2 c図は一方の幅が他方の幅よリも広 ぃブリッジ部同士の位置合わせの一例を説明するための図である。 In Fig. 32a, Fig. 32b and Fig. 32c, one width is wider than the other. FIG. 5 is a diagram for describing an example of alignment between bridge portions.
第 3 3 a図、 第 3 3 b図、 第 3 3 c図は一方の幅が他方の幅よリも広 く、 円形のブリツジ部同士の位置合わせの一例を説明するための図であ る。  FIGS. 33a, 33b, and 33c are diagrams for explaining an example of alignment of circular bridge portions in which one width is wider than the other. .
3 4図は長さに差があるプリッジ部を有する基板素片の例の断面図 である  Fig. 34 is a cross-sectional view of an example of a substrate piece having a ridge portion having a difference in length.
第 3 5図はその基板素片を用いた複合配線板の例の断面図である。 第 3 6図は本発明の開閉機器第一例の閉状態を示す断面図である。 第 3 7図は本発明の開閉機器第一例の開状態を示す断面図である。 第 3 8図は本発明の開閉機器第二例の閉状態を示す断面図である。 第 3 9図は本発明の開閉機器第二例の開状態を示す断面図である。 第 4 0図は本発明の開閉機器第三例の閉状態を示す断面図である。 第 4 1 図は本発明の開閉機器第三例の開状態を示す断面図である。 第 4 2図は関連技術の複合配線板の断面図である。  FIG. 35 is a cross-sectional view of an example of a composite wiring board using the substrate piece. FIG. 36 is a sectional view showing a closed state of the first example of the switchgear of the present invention. FIG. 37 is a sectional view showing an open state of the first example of the switchgear of the present invention. FIG. 38 is a sectional view showing a closed state of the second example of the switchgear of the present invention. FIG. 39 is a sectional view showing an open state of the second example of the switchgear of the present invention. FIG. 40 is a sectional view showing a closed state of the third example of the switchgear of the present invention. FIG. 41 is a sectional view showing an open state of the third example of the switchgear of the present invention. FIG. 42 is a cross-sectional view of a composite wiring board according to the related art.
第 4 3図は電子部品が搭載された状態の関連技術の複合配線板の断面 図である  FIG. 43 is a cross-sectional view of a related-art composite wiring board with electronic components mounted.
第 4 4図は関連技術の複合配線板の構造を説明するための断面図であ る。  FIG. 44 is a cross-sectional view for explaining the structure of the composite wiring board of the related art.
第 1 図〜第 1 6図、 第 3 8図〜第 4 1 図は第一の発明を示しており、 示す第一の発明では、 符号 8は接続用のフレキシブル配線板を示し、 符 号 1 0、 4 0はフレキシブル配線板を示し、 符号 2 0 ，〜 2 03、 3 0，〜 3 03はリジッ ド配線板を示し、 符号 2 2，〜 2 23、 3 2，~ 3 23はリジ ッ ド基板の配線膜を示し、 符号 2〜 4は基板素片を示し、 符号 4 1 、 4 3は基板素片本体を示し、 符号 4 2、 4 4、 4 8は接続部を示し、 符号 2 2 ,- 2 2 3 2 ,〜 3 23は配線膜を示し、 符号 2 4 ，〜 2 43、 3 4 ，〜 3 43は導電性突起を示し、 符号 4 9は電子部品を示し、 符号 6 6、 6 7は開閉型機器を示し、 符号 7 1 ~ 7 4は複合配線板を示す。 FIGS. 1 to 16 and FIGS. 38 to 41 show the first invention. In the first invention shown, reference numeral 8 denotes a flexible wiring board for connection; 0, 4 0 represents a flexible wiring board, reference numeral 2 0 ~ 2 0 3, 3 0 ~ 3 0 3 indicates Riji' de wiring board, reference numeral 2 2 ~ 2 2 3, 3 2, ~ 3 2 Reference numeral 3 denotes a wiring film of a rigid substrate, reference numerals 2 to 4 denote substrate pieces, reference numerals 41 and 43 denote a substrate piece main body, and reference numerals 42, 4 and 4 and 8 denote connection portions. shown, reference numeral 2 2 - 2 2 3 2 ~ 3 2 3 represents the wiring film, reference numeral 2 4 ~ 2 4 3 3 4 ~ 3 4 3 shows conductive protrusions, reference numeral 4-9 electronic Indicates parts, Reference numeral 67 denotes a switchgear type device, and reference numerals 71 to 74 denote composite wiring boards.
第 1 7図〜第 3 7図は第二の発明を示しており、 第二の発明では符号 2、 2 A、 2 B、 2 ' A、 2 ' B、 3、 4、 6 A、 6 Bは基板素片を示し、 符号 1 0、 4 0はフレキシプル配線板を示し、 符号 1 2、 2 2 ，〜 2 23、 3 2 ，〜 3 23は配線膜を示し、 符号 1 3はコンタク ト部を示し、 符号 1 7は異方導電性フイルムを示し、 符号 2 0 ,〜 2 06、 3 0，〜 3 03、 5 0，〜 5 05はリジッ ド配線板を示し、 符号 2 4，〜 2 43、 3 4，〜 3 43 は導電性突起を示し、 符号 4 1 、 4 3は基板素片本体を示し、 符号 4 2、 4 4、 4 8はプリ ッジ部を示し、 符号 4 9は電子部品を示し、 符号 8 1 〜 8 5は複合配線板を示し、 符号 6 0は開閉型機器を示す。 発明を実施するための最良の形態 Fig. 17 to Fig. 37 show the second invention. In the second invention, reference numerals 2, 2A, 2B, 2'A, 2'B, 3, 4, 6A, 6B represents a board piece, reference numeral 1 0, 4 0 indicates Furekishipuru wiring board, reference numeral 1 2, 2 2, and 2 2 3, 3 2, ~ 3 2 3 represents the wiring film, reference numeral 1 3 contactor shows the door unit, reference numeral 1 7 shows an anisotropic conductive film, reference numeral 2 0 ~ 2 0 6 3 0 ~ 3 0 3, 5 0, - 5 0 5 indicates Riji' de wiring board, reference numeral 2 4 ~ 2 4 3 3 4 ~ 3 4 3 shows conductive protrusions, reference numeral 4 1, 4 3 represents a board piece body, numeral 4 2, 4 4, 4 8 pre Tsu di unit Reference numeral 49 indicates an electronic component, reference numerals 81 to 85 indicate a composite wiring board, and reference numeral 60 indicates a switchgear type device. BEST MODE FOR CARRYING OUT THE INVENTION
(1 )第一の発明  (1) First invention
本発明のうち、 第一発明の複合配線板および、 その部品である基板素 片を第 1 図〜第 1 5図を用いて説明する。  Among the present invention, the composite wiring board of the first invention and a substrate piece as a component thereof will be described with reference to FIGS. 1 to 15.
第 2図の符号 2は、 本発明の基板素片の一例を示しており、 第 1 図は、 その基板素片 2の組み立て前の状態の構成部品を示している。  Reference numeral 2 in FIG. 2 shows an example of a substrate piece of the present invention, and FIG. 1 shows components of the substrate piece 2 before assembly.
基板素片 2は、 1 乃至複数枚のフレキシブル配線板 1 0と、 複数のリ ジッ ド配線板 2 0 ,~ 2 03、 3 0 ，〜 3 03を有している。 Board piece 2 has 1 to a plurality of flexible wiring boards 1 0, more re jitter de-wiring board 2 0 ~ 2 0 3, 3 0, a ~ 3 0 3.
フレキシブル配線板 1 0は、 樹脂フイルムから成るベースフイルム 1 1 と、 ベースフイルム 1 1 の表面及び裏面に引き回された配線膜 1 2を 有している。 配線膜 1 2は金属薄膜が所定形状にパターニングされて構 成されている。  The flexible wiring board 10 has a base film 11 made of a resin film, and a wiring film 12 routed on the front and back surfaces of the base film 11. The wiring film 12 is formed by patterning a metal thin film into a predetermined shape.
表面側と裏側に位置する配線膜 1 2は、 スルーホールに充填された金 属等の導電性材料から成る導電性プラグ 1 4によって接続されている。  The wiring films 12 located on the front side and the back side are connected by a conductive plug 14 made of a conductive material such as a metal filled in the through hole.
リジッ ド配線板 2 0 ,- 2 03、 3 0，〜 3 03は、 ベース基板 2 1 ，〜 2 1 、 3 0，〜 3 0 と配線膜 2 2，~ 2 2 、 3 2，〜 3 2 3とを有している。 配線膜 2 2，〜 2 2 3、 3 2，~ 3 2 3は、 ベース基板 2 1 ，~ 2 1 3、 3 0，〜 3 0 3の片面に配置されており、 反対側の面には、 積層前の状態で は、 配線膜 2 2，~ 2 2 3、 3 2，〜 3 2 3に接続された導電性突起 2 4，〜 2 4 3、 3 4，~ 3 4 3の先端が突き出されている。 導電性突起 2 4，〜 2 4 3、 3 4，〜 3 4 3は導電性樹脂（導電性樹脂ペース 卜）を硬化させて形成 したり、 金属を成長させて形成することができる。 Riji' de wiring board 2 0, - 2 0 3, 3 0 ~ 3 0 3, the base substrate 2 1 ~ 2 1, 3 0 ~ 3 0 and the wiring layer 2 2, and 2 2, 3 2, and a ~ 3 2 3. Wiring film 2 2 ~ 2 2 3, 3 2, ~ 3 2 3, the base substrate 2 1 ~ 2 1 3 3 0, is disposed on one side of the ~ 3 0 3, on a surface opposite to in the state before lamination, a wiring layer 2 2, and 2 2 3, 3 2, ~ 3 2 3 connected to the conductive protrusions 2 4 ~ 2 4 3 3 4, the tip of ~ 3 4 3 It is sticking out. Conductive protrusions 2 4 ~ 2 4 3 3 4, it is possible to 3 4 3 which may be formed by curing the conductive resin (conductive resin paste Bok), is grown metal formed.
複数のリジ,ッ ド配線板 2 0，~ 2 0 3、 S O S O sのうち'、 1 乃至複 数枚のリジッ ド配線板 Z O ' Z O sは、 フレキシブル配線板 1 0の表側 に配置され、 他の 1 乃至複数膜のリジッ ド配線板 3 0，〜 3 0 3は、 フレ キシプル配線板 Ί 0の裏面側に配置されている。 A plurality of lysine, head circuit board 2 0, ~ 2 0 3, of SOSO s ', 1 to several sheets double Riji' de wiring board ZO' ZO s is disposed on the front side of the flexible wiring board 1 0, other of 1 to Riji' de wiring board 3 0 of multiple films, ~ 3 0 3 is disposed on the back side of the frame Kishipuru wiring board I 0.
各リジッ ド配線板 2 0，〜 2 0 3、 3 0 3 0 3の導電性突起 2 4，〜 2 4 3、 3 4，~ 3 4 3の先端を、 フレキシブル配線板 1 0側に向け、 リジッ ド配線板 2 0，〜 2 0 3、 3 0，〜 3 0 3の間、 及びリジッ ド配線板 2 0，、 3 0，とフレキシブル配線板 1 0の間に接着フイルムを配置し、 導電性突 起 2 4，~ 2 4 3、 3 4，〜 3 4 3の先端を、 隣接するリジッ ド配線板 2 0 〜？ 。 3 0 3 0 2又は隣接するフレキシプル配線板 1 0の金属膜 1 2、 2 2，〜 2 2 3、 3 2，〜 3 2 3に当接させ、 リジッ ド配線板 2 0，〜 2 0 3 0，〜 3 0 3とフレキシブル配線板 1 0 とを重ね合わせ、 加熱 · 押圧によって接着すると、 第 2図に示すような、 基板素片 2が得られる。 Each Riji' de wiring board 2 0 ~ 2 0 3, 3 0 3 0 3 conductive projections 2 4 ~ 2 4 3 3 4, the tip of the ~ 3 4 3, toward the flexible wiring board 1 side 0, Riji' de wiring board 2 0 ~ 2 0 3, 3 0, disposed between 1-3 0 3, and Riji' de wiring board 2 0 ,, 3 0, and the adhesive film between the flexible wiring board 1 0, conductive sex collision force 2 4 ~ 2 4 3 3 4 ~ 3 4 3 tip, Riji' de wiring board 2 0 adjacent ~? . 3 0 3 0 2 or a metal film 1 2 adjacent Furekishipuru wiring board 1 0, 2 2, and 2 2 3, 3 2, is brought into contact with ~ 3 2 3, Riji' de wiring board 2 0 ~ 2 0 3 0, superimposed and ~ 3 0 3 and the flexible wiring board 1 0, when bonded by heating and pressing, as shown in FIG. 2, the substrate piece 2 is obtained.
フレキシブル配線板 1 0とリジッ ド配線板 2 0 ,〜 2 0 2、 3 0 ,- 3 0 2の配線膜 1 2、 2 2，〜 2 2 3、 ミ 2，〜 3 2 3は、 互いに離間された複数 本に分割されている。 The flexible wiring board 1 0 and Riji' de wiring board 2 0 ~ 2 0 2, 3 0, - 3 0 2 of the wiring layer 1 2, 2 2, and 2 2 3, Mi 2, ~ 3 2 3, separated from each other It is divided into multiple pieces.
リジッ ド配線板 2 0，〜 2 0 2、 S C^ S O s内の配線膜 2 2，〜 2 2 3、 3 2，〜 3 2 3とフレキシブル配線板 1 0内の配線膜 1 2の所定のもの同 士が、 導電性突起 2 4，~ 2 4 3、 3 4，〜 3 4 3と導電性プラグ 1 4によ つて互いに接続されている。 フレキシブル配線板 1 0は、 リジッ ド配線 板 2 0，〜 2 0 2、 3 0，〜 3 0 2よりも長尺であリ、 少なくとも一端は、 積層されたリジッ ド配線板 2 0，〜 2 0 2、 3 0 1 ~ 3 0 2の側面からはみ 出ている。 Rigid wiring board 20, ~ 20 2 , wiring film 22 in SC ^ SO s, 2 ~ 2 3 , 32, ~ 32 3 and wiring film 12 in flexible wiring board 10 What happened also has conductive protrusions 2 4 ~ 2 4 3 3 4, the ~ 3 4 3 and the conductive plug 1 4 Connected to each other. The flexible wiring board 1 0 Riji' de wiring board 2 0 ~ 2 0 2, 3 0, - 3 0 2 is also a long than at least one end, Riji' de wiring board 2 0 which are stacked, 1-2 It protrudes from the sides of 0 2 and 30 1 to 30 2 .
第 2図の符号 4 1 は、 リジッ ド配線板 2 0，~ 2 0 2、 3 0，~ 3 0 2と フレキシプル配線板 1 0とが重ねあわされた部分から成る基板素片本体 を示しており、 符号 4 2は、 フレキシブル配線板 1 0の端部であって、 基板素片本体 4 1 からはみ出た接続部を示している。 Reference numeral 41 in FIG. 2 denotes a substrate piece body composed of a portion where rigid wiring boards 20, 20 , 30, 30, and 32 and a flexible wiring board 10 are overlapped. Reference numeral 42 denotes an end portion of the flexible wiring board 10, which indicates a connection portion protruding from the substrate piece main body 41.
接続部 4 2の、 基板素片本体 4 1 からはみ出た方向の長さを符号 L，、 その同じ方向の基板素片本体 4 1 の長さを符号し 2で表すと、 取り扱いを 容易にするため、 接続部 4 2の長さ L，は、 基板素片本体 4 1 の長さ L 2 よりも短くなつている（L，< L 2 )。 If the length of the connection part 42 in the direction protruding from the board piece main body 41 is denoted by L, and the length of the board piece body 41 in the same direction is denoted by 2 and denoted by 2 , the handling is easy. Therefore, the length of the connecting portion 4 2 L, is summer shorter than the length L 2 of the board piece body 4 1 (L, <L 2 ).
フレキシブル配線板 1 0の接続部 4 2を構成する部分では、 配線膜 1 2表面には、 一部部分を除いてカバーフイルム Ί 6で覆われている。 こ こでは先端部分にはカバ一フイルム 1 6は設けられておらず、 配線膜 1 2の先端部分だけが露出されている。  In a portion constituting the connection portion 42 of the flexible wiring board 10, the surface of the wiring film 12 is covered with a cover film 6 except for a part. In this case, the cover film 16 is not provided at the tip portion, and only the tip portion of the wiring film 12 is exposed.
第 1 5 a図は、 基板素片 2の部分的な平面図であり、 基板素片本体 4 1 の一部と接続部 4 2 とが示されている。 配線膜 1 2は複数本が平行に 配置されており、 その先端の露出部分は幅広にされている。  FIG. 15a is a partial plan view of the substrate piece 2, showing a part of the substrate piece body 41 and the connection portion 42. A plurality of wiring films 12 are arranged in parallel, and the exposed portion at the tip is widened.
次に、 基板素片 2を部品とする複合配線板の製造工程を説明する。 第 3図の符号 2 Aと符号 2 Bは、 それぞれ上記基板素片 2と同じ構造 の基板素片であり、 図面左方を第一の基板素片 2 A、 右方を第二の基板 素片 2 Bとすると、 第 3図に示すように、 先ず、 第一、 第二の基板素片 2 A、 2 Bの接続部 4 2の位置で露出された配線膜 1 2表面に、 異方導 電性フィル厶 1 7を乗せる。  Next, a process for manufacturing a composite wiring board using the substrate piece 2 as a component will be described. Reference numerals 2A and 2B in FIG. 3 denote substrate pieces having the same structure as the above-mentioned substrate piece 2, respectively. Assuming that the piece 2B is, as shown in FIG. 3, first, the surface of the wiring film 12 exposed at the position of the connection portion 42 of the first and second substrate pieces 2A and 2B is anisotropically formed. Place the conductive film 17 on it.
第 4図の符号 8は、 上記フレキシブル配線膜 1 0とは別の、 接続用の フレキシブル配線板である。 この接続用のフレキシブル配線板 8では、 ベースフイルム 5 1 の少なくとも片面に配線膜 5 2が配置されている。 接続用フレキシブル配線板 8の両端部分を除き、 配線膜 5 2の表面に はカバーフイルム 5 6が配置され、 配線膜 5 2は、 両端部分だけが露出 されている。 第 1 5 b図は、 接続用のフレキシブル配線板 8の端部の平 面図であり、 このフレキシブル配線板 8の配線膜 5 2の端部は、 接続部 4' 2上で露出する配線膜 1 2の形状及び位置に対応した形状及び位置に パターニングされている。 Reference numeral 8 in FIG. 4 denotes a connection It is a flexible wiring board. In this flexible wiring board 8 for connection, a wiring film 52 is disposed on at least one surface of the base film 51. Except for both ends of the flexible wiring board 8 for connection, a cover film 56 is disposed on the surface of the wiring film 52, and only the both ends of the wiring film 52 are exposed. FIG. 15b is a plan view of the end of the flexible wiring board 8 for connection. The end of the wiring film 52 of the flexible wiring board 8 is exposed on the connection portion 4'2. It is patterned into a shape and position corresponding to the shape and position of 12.
そして、 配線膜 5 2の露出部分を、 接続部 4 2上の異方導電性フィル 厶 1 7 に押し当て、 第 5図に示すように、 加熱 ' 押圧し、 接続用のフレ キシブル配線板 8の配線膜 5 2を、 第一、 第二の基板素片 2 A、 2 Bの フレキシブル配線板 1 0の配線膜 1 2 に電気的に接続すると、 複合配線 板 7 1 が得られる。  Then, the exposed portion of the wiring film 52 is pressed against the anisotropic conductive film 17 on the connection portion 42, and is heated and pressed as shown in FIG. By electrically connecting the wiring film 52 to the wiring film 12 of the flexible wiring board 10 of the first and second substrate pieces 2A and 2B, a composite wiring board 71 is obtained.
この複合配線板 7 1 では、 第一の基板素片 2 Aの配線膜 1 2、 2 2 ，〜 2 2 3、 3 2 ，〜 3 2 3と第二の基板素片 2 Bの配線膜 1 2、 2 2 , - 2 2 3、 3 2 ，~ 3 2 3とは、 接続用のフレキシブル配線板 8の配線膜 5 2を介 して相互に接続される。 In the composite wiring board 71, wiring layer 1 2, 2 2 of the first board piece 2 A, ~ 2 2 3, 3 2, ~ 3 2 3 and the wiring film of the second board piece 2 B 1 2, 2 2, −2 2 3 , 3 2, to 3 2 3 are mutually connected via the wiring film 52 of the flexible wiring board 8 for connection.
基板素片 2 A、 2 Bのフレキシブル配線板 1 0と接続用フレキシブル 配線板 8とは可撓性を有しており、 第一、 第二の基板素片 2 A、 2 Bの 配線膜 1 2、 2 2 ，〜 2 2 3、 3 2 ，〜 3 2 3間の接続を維持しながら、 フ レキシブル配線板 8を曲げることができる。 このとき、 基板素片 2 A、 2 Bのフレキシブル配線板 1 0の接続部 4 2も一緒に曲がり、 フレキシ ブル配線基板 1 0、 8の配線膜 1 2、 5 2間の接続部分に生じる応力が 緩和される。 The flexible wiring board 10 of the substrate pieces 2 A and 2 B and the flexible wiring board 8 for connection have flexibility, and the wiring films 1 of the first and second substrate pieces 2 A and 2 B are provided. 2, 2 2, and 2 2 3, 3 2, while maintaining the connection between 1-3 2 3, can be bent off Rekishiburu wiring board 8. At this time, the connection portion 42 of the flexible wiring board 10 of the substrate pieces 2 A and 2 B also bends together, and the stress generated at the connection portion between the wiring films 12 and 52 of the flexible wiring boards 10 and 8. Is alleviated.
第 1 2 a図〜第 1 2 c図は、 接続部 4 2の先端部分と接続用のフレキ シブル配線板 8の端部とを重ね合わせて接続する工程を説明するための 図面であり、 配線膜 5 2やカバ一フイルム 1 6、 5 6等の部材は省略す る。 FIGS. 12a to 12c are diagrams for explaining a process of superposing and connecting a tip portion of the connection portion 42 and an end portion of the flexible wiring board 8 for connection. It is a drawing, and members such as the wiring film 52 and the cover films 16 and 56 are omitted.
第 1 2 a図に示すとおり、 接続部 4 2を構成するフレキシブル配線板 1 0の幅 W A, Bと、 接続用のフレキシブル配線板 8の幅 W cがほぼ同じ大 きさである場合（W A, B = W c )は、 第 1 2 b図に示すように、 幅方向の両 端をそろえ、 位置あわせして重ね合わせ（この図及び後述する他の図中の 符号 4 7は重ねあわされた部分を示している）、 配線膜 1 2、 5 2同士を 接続した後、 第 1 2 c図に示すように、 接続部 4 2 と接続用のフレキシ ブル配線板 8間に亘つて、 補強フイルム 1 8を貼付すると、 少なく とも 接続用のフレキシプル配線板 8と、 接続部 4 2を構成するフレキシブル 配線板 8とが補強フイルム 1 8によって機械的に接続される。 As shown in FIG. 12a, when the widths W A and B of the flexible wiring boards 10 constituting the connection portions 42 and the width W c of the flexible wiring board 8 for connection are substantially the same ( As shown in Fig. 12b, W A , B = W c) are aligned at both ends in the width direction, aligned and overlapped (the reference numeral 47 in this figure and other figures described later is overlapped). After the wiring films 12 and 52 are connected to each other, as shown in FIG. 12c, the wiring film extends between the connecting portion 42 and the flexible wiring board 8 for connection. When the reinforcing film 18 is attached, at least the flexible wiring board 8 for connection and the flexible wiring board 8 forming the connecting portion 42 are mechanically connected by the reinforcing film 18.
ここでは、 第 6図に示すように、 接続用のフレキシブル配線板 8の表 面側の両端と裏面側の両端の合計四箇所に、 それぞれ別の補強フィル厶 1 8を貼付し、 フレキシブル配線板 8， 1 0の先端が露出しないように した。  Here, as shown in FIG. 6, separate reinforcing films 18 are attached to the flexible wiring board 8 for connection at a total of four places on both ends on the front side and both ends on the back side, respectively. The tip of 8,10 was not exposed.
以上のように、 補強フイルム Ί 8によって接続用のフレキシブル配線 板 8と、 接続部 4 2 とは強固に接続されるので、 接続用のフレキシブル 配線板 8が大きく曲げられても、 フレキシブル配線板 8と接続部 4 2と が分離しないようになる。  As described above, since the flexible wiring board 8 for connection and the connection portion 42 are firmly connected by the reinforcing film # 8, even if the flexible wiring board 8 for connection is greatly bent, the flexible wiring board 8 And the connection part 42 are not separated.
上記とは異なり、 第 1 3 a図に示すように、 フレキシブル配線板 8、 1 0の先端が、 一方の幅が他方の幅よリも狭い場合（W A, 8 > £：，又は く W c)、 第 1 3 b図に示すように、 狭い方のフレキシブル配線板 8の 先端が、 広い方のフレキシブル配線板 1 0の先端の内側に位置するよう に重ね合わせ、 第 1 3 c図に示すように、 狭いほうのフレキシブル配線 板 8の先端の三辺を覆うように、 補強フイルム 1 8を貼付すると、 一層 強度は増す。 また、 第 ί 4 a図に示すように、 フレキシブル配線板 8、 1 0の先端 が、 根本部分よりも広くなつており、 一方のフレキシブル配線板 8の広 くなつた部分の幅 Wcが、 他方のフレキシブル配線板 1 0の広くなつた部 分の幅 WA, Bよりも狭い場合も、 第 1 4 b図に示すように、 広くなつた先 端部分を重ね合わせ、 第 1 4 c図に示すように、 狭い方のフレキシブル 配線板 8の先端形状よりも広く、 広いほうのフレキシブル配線板 1 0の 先端形状よりも狭い補強フイルム 1 8を、 狭い方のフレキシブル配線板 8の縁がはみ出ないように補強フイルム 1 8によって覆うようにしても、 強度は増す。 In contrast to the above, as shown in Fig. 13a, when the end of the flexible wiring board 8, 10 is narrower than one of the other (W A , 8 > £ : or c ), as shown in Fig. 13b, superimpose so that the tip of the narrow flexible wiring board 8 is located inside the tip of the wide flexible wiring board 10, and as shown in Fig. 13c. As shown, when the reinforcing film 18 is attached so as to cover the three sides at the tip of the narrower flexible wiring board 8, the strength is further increased. Further, as shown in ί 4 a view, the tip of the flexible wiring board 8, 1 0, and summer wider than the base portion, the width W c of the wide KuNatsu was part of one of the flexible wiring board 8, If the other flexible wiring board 10 is narrower than the width W A , B of the widened portion, as shown in FIG. 14b, the widened leading ends are overlapped, and FIG. As shown in the figure, the reinforcing film 18 wider than the tip of the narrower flexible wiring board 8 and narrower than the tip of the wider flexible wiring board 10 protrudes from the edge of the narrower flexible wiring board 8. Even if it is covered with the reinforcing film 18 so as not to be damaged, the strength is increased.
以上のように補強フィル厶 1 8を貼付した後、 第 7図に示すように、 第一、 第二の基板素片 2 A、 2 B上に電子部品 4 9を配置し、 電子部品 4 9の端子を、 最外層のリジッ ド配線板 2 03、 3 03の配線膜 2 23、 3After attaching the reinforcing film 18 as described above, as shown in FIG. 7, the electronic component 49 is arranged on the first and second substrate pieces 2A and 2B, and the electronic component 49 Riji' de wiring board 2 terminals, the outermost layer of 0 3, 3 0 3 of the wiring film 2 2 3, 3
23に接続すると電子部品 4 9は、 第一、 第二の基板素片 2 A、 2 Bに搭 載される。 Electronic component 4 9 Connecting to 2 3, first, the mounting tower to the second board piece 2 A, 2 B.
この状態では、 電子部品 4 9は、 第一、 第二の基板素片 2 A、 2 Bの 配線膜 1 2、 2 2 ι ~ 2 23 , 3 2 ，〜 3 23や、 導電性突起 2 4，〜 2 43、In this state, the electronic component 4 9, first, second board piece 2 A, 2 wiring film 1 2 B, 2 2 iota-2 23, 3 2, and ~ 3 2 3, conductive protrusions 2 4, to 2 4 3 ,
3 4，〜 3 43等によって、 接続用のフレキシブル配線板 8の配線膜 5 2 に接続されたり、 又は電子部品 4 9同士が相互に接続される。 3 4, by 1-3 4 3, etc., or is connected to the wiring layer 5 and second flexible wiring board 8 for connection, or the electronic components 4 9 together are connected to each other.
また、 第一、 第二の基板素片 2 A、 2 Bのうちの一方が、 電源や他の 電子回路に接続されると、 各電子部品 4 9は、 電源等の他の電子回路に も接続される。  Further, when one of the first and second substrate pieces 2A and 2B is connected to a power supply or another electronic circuit, each electronic component 49 is also connected to another electronic circuit such as a power supply. Connected.
なお、 上記フレキシブル配線板 1 0、 8のベースフイルム 1 1 、 5 1 やカバ一フイルム 1 6、 5 6は、 十〜数十 At mのポリイミ ドフイルムで ある。  The base films 11 and 51 of the flexible wiring boards 10 and 8 and the cover films 16 and 56 are polyimide films of tens to tens of Atm.
また、 配線膜 1 2、 5 2、 2 2，〜 2 23、 3 2 ，~ 3 23は厚さ十〜数 十 mの銅箔が所定の形状にパターニングされて構成されており、 ベー スフイルム 1 1 、 5 1 やカバーフイルム 1 6、 5 6 と一緒に曲がり、 フ レキシプル配線板 8、 1 0の柔軟性を損なわないようになつている。 他方、 リジッ ド配線板 2 0，〜 2 0 3、 3 0，〜 3 0 3のベース基板 2 1 ，〜 2 1 3、 3 0，〜 3 0 3は、 ガラスエポキシ樹脂等から成り、 厚さ 5 0 〜 5 0 0 μ m程度の薄板であり、 可撓性は有さない。 そのため、 一旦電 子部品 4 9を搭載すると、 電子部品 4 9の端子と配線膜 2 2 3、 3 2 と の間に応力が加わらないようになつている。 The wiring layer 1 2, 5 2, 2 2, and 2 2 3, 3 2, ~ 3 2 3 is a copper foil having a thickness of ten to several tens of m is configured by being patterned into a predetermined shape, base It bends together with the films 11 and 51 and the cover films 16 and 56 so that the flexibility of the flexible wiring boards 8 and 10 is not impaired. On the other hand, Riji' de wiring board 2 0 ~ 2 0 3, 3 0, the base substrate 2 1 ~ 3 0 3 ~ 2 1 3 3 0 ~ 3 0 3 is made of a glass epoxy resin or the like, the thickness It is a thin plate of about 50 to 500 μm and does not have flexibility. Therefore, once the mounted electronic components 4 9, and summer as stress is not applied between the terminals of the electronic component 4 9 and the wiring film 2 2 3, 3 2.
次に、 本発明の他の例を説明する。 第 8図の符号 3は、 本発明の第二 例の基板素片であり、 第一例の基板素片 2 とは、 フレキシブル配線板 4 0のカバーフイルム 4 6が、 接続部 4 4の長さよりも長くされている点 だけが異なっている。  Next, another example of the present invention will be described. Reference numeral 3 in FIG. 8 denotes a substrate piece of the second example of the present invention, and the substrate piece 2 of the first example is different from the substrate piece 2 of the flexible wiring board 40 in that The only difference is that they are longer.
そして、 カバーフイルム 4 6の先端部分は、 配線膜 1 2やベースフィ ル厶 1 1 には接着されておらず、 その部分で、 配線膜 1 2の表面は露出 されている。  The tip of the cover film 46 is not adhered to the wiring film 12 or the base film 11, and the surface of the wiring film 12 is exposed at that portion.
第 9図の符号 3 Aと符号 3 Bは、 このような構成の二個の基板素片で あり、 各基板素片 3 A、 3 Bの配線膜 1 2の露出された部分に異方導電 性フイルム 1 7が配置され、 接続用のフレキシブル配線板 8が貼付され、 更に、 カバ一フィル厶 4 6の剥離部分が接続用のフレキシブル配線板 8 に貼付されて、 本発明の第二例の複合配線板 7 2が構成される。  Reference numerals 3A and 3B in FIG. 9 denote two substrate pieces having such a configuration, and anisotropically conductive portions are provided on the exposed portions of the wiring films 12 of the substrate pieces 3A and 3B. The flexible film 17 is disposed, the flexible wiring board 8 for connection is attached, and the peeled portion of the cover film 46 is further attached to the flexible wiring board 8 for connection. A composite wiring board 72 is formed.
従って、 この複合配線板 7 2では、 カバーフィル厶 4 6のベースフィ ル厶 1 1 等からの剥離部分が補強フイルムとして用いられている。 なお、 ここでは、 カバーフイルム 4 6の剥離部分は、 接続用のフレキシブル配 線板 8のベースフイルム 5 1 に貼付される。 剥離部分とは反対側の端部 は、 基板素片本体 4 1 の端部で終了してもよいし、 基板素片本体 4 1 の 内部まで伸びていてもよい。  Therefore, in the composite wiring board 72, the peeled portion of the cover film 46 from the base film 11 or the like is used as a reinforcing film. Here, the peeled portion of the cover film 46 is affixed to the base film 51 of the flexible wiring board 8 for connection. The end opposite to the peeled portion may end at the end of the substrate piece main body 41, or may extend to the inside of the substrate piece main body 41.
接続部 4 4及び接続用のフレキシブル配線板 8のカバーフィル厶 4 6 とは反対側の面は、 第一例の複合配線板 7 1 で用いられた補強フイルム 1 8を貼付することができる。 Connection part 4 4 and cover film 4 of flexible wiring board 8 for connection On the opposite side, the reinforcing film 18 used in the composite wiring board 71 of the first example can be attached.
なお、 この基板素片 3でも、 接続部 4 4の長さ L ,は、 基板素片本体 4 Note that, also in this substrate piece 3, the length L of the connection portion 4 4 is equal to the substrate piece body 4
1 の長さ 1_ 2よりも短くされている。 The length of 1 is shorter than 1_2.
以上は、 基板素片 2， 3のフレキシブル配線板 1 0、 4 0が、 リジッ ド配線板 2 0，〜 2 0 3、 3 0，〜 3 0 3の積層体の間に位置していたが、 それに限定されるものではなく、 最外層に位置する基板素片も本発明に 含まれる。 Above, the flexible wiring board 1 0, 4 0 of the substrate piece 2, 3 is Riji' de wiring board 2 0 ~ 2 0 3, 3 0, and was located between 1-3 0 3 of the laminate However, the present invention is not limited to this, and the present invention also includes a substrate piece located at the outermost layer.
第 1 0図の符号 4は、 そのような基板素片の一例であり、 フレキシブ ル配線板 1 0の片面に複数のリジッ ド配線板 2 0，〜 2 0 6が積層されて おり、 フレキシブル配線板 1 0とリジッ ド配線板 2 0 , ~ 2 0 6が積層さ れた部分で基板素片本体 4 5が構成され、 基板素片本体 4 5からはみ出 たフレキシブル配線板 1 0の部分で接続部 4 8が構成されている。 Code 4 of the first 0 Figure is an example of such a board piece, a plurality of Riji' de wiring board 2 0 on one side of Furekishibu Le wiring board 1 0 ~ 2 0 6 are laminated, flexible wiring plate 1 0 and Riji' de wiring board 2 0 ~ 2 0 6 board piece body 4 5 is composed of stacked portions, connected by a portion of the flexible wiring board 1 0 protruding from board piece body 4 5 The part 48 is composed.
第 1 1 図の符号 4 Aと符号 4 Bは、 それぞれ上記構成の基板素片であ リ、 接続用のフレキシブル配線板 8によって互いに接続され、 本発明の 第三例の複合配線板 7 3が構成されている。  Reference numerals 4A and 4B in FIG. 11 denote board pieces having the above-described configuration, and are connected to each other by a flexible wiring board 8 for connection. It is configured.
上記第一例〜第三例の複合配線板 7 1 〜 7 3は、 用いる電子装置のス ペースの形状に従い、 適切なものを選択することができる。 また、 各基 板素片 4 ·！ 〜 4 3を自由に組み合わせることもできる。 例えば、 第一例 の基板素片 2と第三例の基板素片 4とをフレキシプル配線板 8によって 接続してもよい。  The composite wiring boards 71 to 73 of the first to third examples can be appropriately selected according to the shape of the space of the electronic device to be used. Also, each substrate piece 4 ·! ~ 4 3 can be freely combined. For example, the substrate piece 2 of the first example and the substrate piece 4 of the third example may be connected by a flexible wiring board 8.
また、 第 1 6図に示すように、 上記本発明の基板素片 2 Aと、 接続用 フレキシブル配線板 8と、 リジッ ド配線板の積層基板、 例えば、 第 4 4 図の符号 1 7 1 ゃ 1 7 2 Aで表されるようなものとを接続し、 本発明 の第四の複合配線板 7 4を構成してもよい。  Also, as shown in FIG. 16, a laminated substrate of the substrate piece 2 A of the present invention, the flexible wiring board 8 for connection, and the rigid wiring board, for example, the reference numeral 17 1 in FIG. The fourth composite wiring board 74 of the present invention may be configured by connecting a component represented by 17 A.
更にまた、 上記各実施例では、 接続用のフレキシブル配線板 8の長さ は、 接続部 4 2、 4 4、 4 8より も長かったが、 逆に、 短い場合も本発 明に含まれる。 また、 接続部 4 2 、 4 4、 4 8の長さが、 基板素片 4 1 、 4 3よりも長くてもよい。 Furthermore, in each of the above embodiments, the length of the flexible wiring board 8 for connection is Is longer than the connecting portions 42, 44, 48, but conversely, the shorter case is also included in the present invention. Further, the lengths of the connecting portions 42, 44, 48 may be longer than the substrate pieces 41, 43.
なお、 上記電子部品 4 9は、 基板素片 2〜 4 と接続用のフレキシブル 配線板 8とを複合配線板 7 1 〜 7 3 に組み立てた後、 搭載してもよいし、 電子部品を基板素片 2 〜 4 に搭載した後、 接続用のフレキシブル配線板 8を接続し、 複合配線板 7 1 〜 7 3を構成させてもよい。  The electronic components 49 may be mounted after assembling the substrate pieces 2 to 4 and the flexible wiring board 8 for connection into composite wiring boards 71 to 73, or mounting the electronic components on the substrate element. After being mounted on the pieces 2 to 4, the flexible wiring board 8 for connection may be connected to form the composite wiring boards 71 to 73.
また、 接続に用いた上記フレキシブル配線板 8や接続部 4 2、 4 4、 4 8を構成するフレキシブル配線板 1 0、 4 0は単層であつたが、 複数 のフレキシブル配線板を積層して構成してもよい。  In addition, the flexible wiring board 8 used for the connection and the flexible wiring boards 10 and 40 constituting the connecting portions 42, 44 and 48 have a single layer, but a plurality of flexible wiring boards are laminated. You may comprise.
本発明の複合配線板 7 1 〜 7 3は、 携帯電話やノー 卜型パソコン等の 蓋が開閉される開閉機器内に設けることができる。 その場合、 開閉に伴 い、 複合配線板 7 1 〜 7 3の一部が曲げられるが、 接続用のフレキシブ ル配線板 8の配線膜 5 2と、 第一、 第二の基板素片 2 A、 2 Bのフレキ シブル配線板 1 0の配線膜 1 2とが電気的に接続された部分が曲げ部分 に位置しないようにすると、 機器全体の信頼性が向上する。  The composite wiring boards 71 to 73 of the present invention can be provided in an opening / closing device that opens and closes a lid of a mobile phone, a notebook personal computer, or the like. In this case, a part of the composite wiring board 71 to 73 is bent with opening and closing, but the wiring film 52 of the flexible wiring board 8 for connection and the first and second substrate pieces 2 A If the portion of the 2B flexible wiring board 10 electrically connected to the wiring film 12 is not positioned at the bent portion, the reliability of the entire device is improved.
それを説明すると、 第 3 8、 3 9図は、 第 7図に示した本発明の複合 配線板 7 1 を内蔵する開閉機器 6 6を示している。 この開閉型機器 6 6 は携帯電話である。  To explain this, FIGS. 38 and 39 show a switchgear 66 incorporating the composite wiring board 71 of the present invention shown in FIG. The opening / closing device 66 is a mobile phone.
開閉型機器 6 6は、 表示装置側であって蓋となる第一の筐体 6 1 と、 操作盤側であって第一の筐体 6 1 と密着する第二の筐体 6 2とを有して いる。  The opening / closing device 66 includes a first housing 61 serving as a lid on the display device side, and a second housing 62 closely contacting the first housing 61 on the operation panel side. Have.
軸 6 3は、 第一、 第二の筐体 6 1 、 6 2の厚みと同程度の直径を有し ており、 第一、 第二の筐体 6 1 、 6 2の一部分を貫通している。 第一、 第二の筐体 6 1 、 6 2は、 軸 6 3の中心軸線の回りに所定角度だけ相対 的に回転可能に取り付けられている。 第一、 第二の筐体 6 1 、 6 2を最 大角度回転させると、 第 3 7図に示すように、 蓋が開けられた状態にな る。 The shaft 63 has a diameter approximately equal to the thickness of the first and second housings 61 and 62, and penetrates a part of the first and second housings 61 and 62. I have. The first and second housings 61 and 62 are mounted so as to be relatively rotatable about a central axis of the shaft 63 by a predetermined angle. First and second housings 6 1 and 6 2 When rotated by a large angle, the lid is opened as shown in Fig. 37.
開閉型機器 6 6内部の複合配線板 7 1 は、 両端に位置する基板素片 2 A、 2 Bのうち、 一方の基板素片 2 Aは第一の筐体 6 1 の内部に配置さ れ、 他方の基板素片 2 Bは第二の筐体 6 2の内部に配置されている。 そして、 接続用のフレキシプル配線板 8は、 軸 6 3の内部を通り、 そ の両端部は、 第一、 第二の筐体 6 1 、 6 2内に位置している。  The composite wiring board 7 1 inside the switchgear type device 6 6 has one of the board pieces 2 A and 2 B located at both ends, and one of the board pieces 2 A is arranged inside the first housing 61. The other substrate piece 2B is arranged inside the second housing 62. Then, the flexible wiring board 8 for connection passes through the inside of the shaft 63, and both ends thereof are located in the first and second housings 61 and 62.
従って、 接続用のフレキシプル配線板 8と、 基板素片 2 A、 2 Bの接 続部 4 2とが接続される部分は、 軸 6 3内に位置せず、 第一又は第二の 筐体 6 1 、 6 2内に位置している。  Therefore, the portion where the flexible wiring board 8 for connection and the connection portion 42 of the substrate pieces 2A and 2B are connected is not located within the shaft 63 and the first or second housing Located in 61,62.
第 3 8、 3 9図の符号 6 5，、 6 5 2は、 接続部 4 2とフレキシプル配 線板 8との相互接続部分である。 各相互接続部分 6 5 ，、 6 5 2は軸 6 3 内部に位置せず、 相互接続部分 6 5 ，、 6 5 2が曲げられないようになつ ている。 従って、 相互接続部分 6 5 " 6 5 2には応力は加わらず、 配線 膜 1 2、 5 2間が分離することはない。 Third 8, 3 of 9 Figure numeral 6 5 ,, 6 5 2 is an interconnection portion between the connecting part 4 2 and Furekishipuru wiring board 8. Each interconnect portion 6 5 ,, 6 5 2 not located within the shaft 6 3, and summer as interconnects 6 5 ,, 6 5 2 is not bent. Accordingly, the interconnect portion 6 5 "6 5 2 stress is not applied to, does not interconnect layer 1 2, 5 2 while separated.
第 3 8、 3 9図では、 二個の相互接続部分 6 5 6 5 2の一方が第一 の筐体 6 1 内に配置され、 他方が第二の筐体 6 2内に配置されていたが、 相互接続部分 6 5 ，、 6 5 2が軸 6 3内に配置されておらず、 曲げられな いようになっていればよい。 In the third 8, 3 9 Figure, one of the two interconnected portions 6 5 6 5 2 is disposed on the first housing 6 1 and the other was located in the second housing 6 within 2 but interconnect portion 6 5 ,, 6 5 2 is not disposed in the shaft 6 3, it is sufficient that bent such odd.
従って、 第 4 0、 4 1 図の開閉型機器 6 7のように、 二個の相互接続 部分 6 5 ，、 6 5 2が、 同じ筐体内に配置されていてもよい。 同図は、 第 一の筐体 6 1 内に配置された例である。 Therefore, as in the fourth 0, 4 of Figure 1 open-and-close type instrument 6 7, two of the interconnects 6 5 ,, 6 5 2 may be arranged in the same housing. FIG. 2 shows an example in which the first housing 61 is disposed.
なお、 第 9、 1 1 図に示した複合配線板 7 2、 7 3についても、 開閉 機器 6 6内に配置する場合に、 接続用のフレキシブル配線板 8と、 二個 の基板素片（符号 3 Aと 3 B、 符号 4 Aと 4 B )の接続部 4 2との間の相 互接続部分が軸 6 3内に配置されず、 第一又は第二の筐体 6 1 、 6 2の いずれか一方又は両方の内部に配置され、 相互接続部分に応力が加わら なければよい。 The composite wiring boards 72 and 73 shown in FIGS. 9 and 11 also have a flexible wiring board 8 for connection and two board pieces (reference numerals) when placed in the switchgear 66. 3A and 3B, 4A and 4B), the interconnecting part between them is not arranged in the shaft 63 and the first or second housing 61, 62 It may be located inside one or both, and no stress is applied to the interconnect.
軸 6 3は、 第一、 第二の筐体 6 1 、 6 2の少なくとも一部を、 回転可 能に連結する部材であればよく、 必ずしも一本の回転軸を意味しない。 例えば長さ方向に複数に分割されていてもよく、 また、 円周方向にスリ ッ 卜などが形成されていてもよい。  The shaft 63 may be a member that rotatably connects at least a part of the first and second housings 61 and 62, and does not necessarily mean one rotating shaft. For example, it may be divided into a plurality in the length direction, or a slit or the like may be formed in the circumferential direction.
( 2 ) 第二の発明  (2) Second invention
本発明のうち、 第二発明の複合配線板および、 その部品である基板素 片を第 1 7図〜第 4 2図を用いて面を用いて説明する。  Of the present invention, the composite wiring board of the second invention and a substrate element as a component thereof will be described with reference to FIGS. 17 to 42 using a surface.
第 1 8図の符号 2は、 本発明の複合配線板に用いることができる基板 素片の一例を示しており、 第 1 7図は、 その基板素片 2の組み立て前の 状態を示している。  Reference numeral 2 in FIG. 18 shows an example of a substrate piece that can be used in the composite wiring board of the present invention, and FIG. 17 shows a state before assembly of the substrate piece 2. .
基板素片 2は、 1 乃至複数枚のフレキシブル配線板 1 0と、 複数のリ ジッ ド配線板 2 0 ，〜 2 0 3、 3 0 ι〜 3 0 3を有している。 Board piece 2 has 1 to a plurality of flexible wiring boards 1 0, more re jitter de-wiring board 2 0, a ~ 2 0 3, 3 0 ι~ 3 0 3.
フレキシブル配線板 1 0は、 樹脂フイルムから成るベースフイルム 1 The flexible wiring board 10 is a base film 1 made of a resin film.
1 と、 ベースフイルム 1 1 の表面及び裏面に引き回された配線膜 1 2を 有している。 配線膜 1 2は金属薄膜が所定形状にパターニングされて構 成されている。 1 and a wiring film 12 routed on the front and back surfaces of the base film 11. The wiring film 12 is formed by patterning a metal thin film into a predetermined shape.
表面側と裏側に位置する配線膜 1 2は、 スルーホールに充填された金 属等から成る導電性プラグ 1 4によって接続されている。  The wiring films 12 located on the front side and the rear side are connected by a conductive plug 14 made of metal or the like filled in the through hole.
各リジッ ド配線板 2 0 ,- 2 0 3、 3 0 1 ~ 3 0 3は、 ベース基板 2 1 ，〜 2 Ί 3、 3 0 ，〜 3 0 3と配線膜 2 2，〜 2 2 3、 3 2，〜 3 2 3とをそれぞれ 有している。 Each Riji' de wiring board 2 0, - 2 0 3, 3 0 1-3 0 3, the base substrate 2 1 ~ 2 I 3, 3 0 ~ 3 0 3 and the wiring layer 2 2, and 2 2 3, 32 and to 32 3 respectively.
配線膜 2 2，〜 2 2 3、 3 2，〜 3 2 3は、 ベース基板 2 1 ，~ 2 1 3、 3 0，〜 3 0 3の片面に配置されている。 これら配線膜 2 2，~ 2 2 3、 3 2 1〜 3 2 3には導電性突起 2 4 1~ 2 4 3、 3 4 ,- 3 4 3が接続されている。 導電性突起 2 4 ，~ 2 4 3、 3 4，〜 3 4 3は導電性樹脂（導電性樹脂ペース 卜）を硬化させて形成したり、 金属を成長させて形成することができる。 積層前の状態では、 ベース基板 2 1 ，~ 2 1 3、 3 0 , - 3 0 3の配線膜 2 2 ，〜 2 2 3、 3 2 1 ~ 3 2 3が配置された面とは反対側の面には、 導電 性突起 2 4 ，〜 2 4 3、 3 4 ，~ 3 4 3の先端が突き出されている。 Wiring film 2 2 ~ 2 2 3, 3 2, ~ 3 2 3, the base substrate 2 1 ~ 2 1 3 3 0, is disposed on one side of the ~ 3 0 3. These wiring film 2 2 ~ 2 2 3 3 2 1-3 2 3 conductive protrusions 2 4 1-2 4 3, the 3 4, - 3 4 3 is connected. Conductive protrusions 2 4 ~ 2 4 3 3 4, it is possible to 3 4 3 which may be formed by curing the conductive resin (conductive resin paste Bok), is grown metal formed. In the state prior to lamination, the base substrate 2 1 ~ 2 1 3 3 0 - 3 0 3 of the wiring layer 2 2, and 2 2 3 3 2 1-3 2 3 opposite to the arranged surface the surface, conductive protrusions 2 4 ~ 2 4 3 3 4, the tip of ~ 3 4 3 protrudes.
複数のリジッ ド配線板 2 0，~ 2 0 3、 3 0，~ 3 0 3のうち、 1 乃至複 数枚のリジッ ド配線板 2 0 ， ~ 2 0 3は、 フレキシブル配線板 1 0の片面 に配置され、 他の 1 乃至複数膜のリジッ ド配線板 3 0 ι〜 3 0 3は、 それ とは反対側の面に配置されている。 Multiple Riji' de wiring board 2 0 ~ 2 0 3, 3 0, of 1-3 0 3, 1 to several sheets double Riji' de-wiring board 2 0 ~ 2 0 3, one side of the flexible wiring board 1 0 to be arranged, the Riji' de wiring board 3 0 ι~ 3 0 3 other one or plural films are disposed on the opposite side from that.
各リジッ ド配線板 2 0 ，~ 2 0 3、 3 0 ι ~ 3 0 3の導電性突起 2 4，~ 2 4 3、 3 4 1〜 3 4 3の先端を、 フレキシブル配線板 1 0側に向け、 リジッ ド配線板 2 0，〜 2 0 3、 3 0，〜 3 0 3の間、 及びリジッ ド配線板 2 0，、 3 0，とフレキシブル配線板 1 0の間に接着フイルムを配置し、 導電性突 起 2 4，~ 2 4 3、 3 4 ，〜 3 4 3の先端を、 隣接するリジッ ド配線板 2 0 , ~ 2 0 2, 3 0，~ 3 0 2又は隣接するフレキシブル配線板 Ί 0の金属膜 1 2、 2 2 1 ~ 2 2 3 , 3 2 ，〜 3 2 3に当接させ、 リジッ ド配線板 2 0 ，〜 2 0 3、 3 0，〜 3 0 3とフレキシブル配線板 1 0とを重ね合わせ、 加熱 - 押圧によって接着すると、 第 1 8図に示すような、 基板素片 2が得られ る。 Each Riji' de wiring board 2 0 ~ 2 0 3, 3 0 iota ~ 3 0 3 conductive projections 2 4 ~ 2 4 3 3 4 1-3 4 3 of the tip, the flexible wiring board 1 side 0 towards, Riji' de wiring board 2 0 ~ 2 0 3, 3 0, disposed between 1-3 0 3, and Riji' de wiring board 2 0 ,, 3 0, and the adhesive film between the flexible wiring board 1 0 , conductive collision force 2 4 ~ 2 4 3 3 4 ~ 3 4 3 tip, adjacent Riji' de wiring board 2 0 ~ 2 0 2, 3 0, - 3 0 2 or an adjacent flexible wiring metal film plate I 0 1 2, 2 2 1 - 2 2 3, 3 2, is brought into contact with ~ 3 2 3, Riji' de wiring board 2 0 ~ 2 0 3, 3 0 ~ 3 0 3 and flexible When the wiring board 10 is overlaid and bonded by heating and pressing, a substrate piece 2 as shown in FIG. 18 is obtained.
第 1 8図及び後述する各図の符号 2 0、 3 0は、 リジッ ド配線板 2 0 ，〜 2 0 2、 3 0，~ 3 0 2を積層した積層体を示している。 Code 2 0, 3 0 of each drawing view and later first 8 Riji' de wiring board 2 0 ~ 2 0 2, 3 0, shows ~ 3 0 2 was laminated stack.
フレキシブル配線板 1 0 とリジッ ド配線板 2 0 ，〜 2 0 2、 3 0，〜 3 0 2の配線膜 1 2、 2 2 , ~ 2 2 3 , 3 2 ，~ 3 2 3は、 それぞれベース基板 2 1 , ~ 2 1 3、 3 0，〜 3 0 3やべ一スフイルム 1 1 上で、 互いに離間され た複数本に分割されており、 それらのうちの所定のもの同士が導電性突 起 2 4 ，〜 2 4 3、 3 4 , - 3 4 3又は導電性プラグ 1 4 によって互いに接 続されている。 The flexible wiring board 1 0 and Riji' de wiring board 2 0 ~ 2 0 2, 3 0, - 3 0 2 of the wiring layer 1 2, 2 2, and 2 2 3, 3 2, ~ 3 2 3, based respectively substrate 2 1 ~ 2 1 3 3 0 ~ 3 0 3 Yabe on one Sufuirumu 1 1 is divided into a plurality of spaced from each other, with each other electrically conductive collision force predetermined ones of them 2 4 ~ 2 4 3 3 4 - 3 together against the 4 3 or the conductive plug 1 4 Has been continued.
そして、 フレキシブル配線板 1 0は、 リジッ ド配線板 2 0 ，〜 2 0 2、 3 0，~ 3 0 2よりも長尺であり、 フレキシブル配線板 1 0の少なく とも 一端は、 積層されたリジッ ド配線板 2 0 ，〜 2 0 2、 3 0，〜 3 0 2の側面 からはみ出ている。 Then, Riji' flexible wiring board 1 0 Riji' de wiring board 2 0 ~ 2 0 2, 3 0, an elongated than ~ 3 0 2, at least one end of the flexible wiring board 1 0 stacked de-wiring board 2 0 ~ 2 0 2, 3 0, and protrudes from 1-3 0 2 sides.
第 1 8図の符号 4 1 は、 リジッ ド配線板 2 0，〜 2 0 2、 S O S O s とフレキシブル配線板 1 0とが重ねあわされた部分から成る基板素片本 体を示している。 符号 4 2はフレキシブル配線板 1 0の端部であって、 基板素片本体 4 1 からはみ出た部分から成るプリ ッジ部を示している。 Code 4 1 of the first 8 diagram Riji' de wiring board 2 0 ~ 2 0 2, and SOSO s and the flexible wiring board 1 0 indicates a board piece Body made of superposed summed portion. Reference numeral 42 denotes an end portion of the flexible wiring board 10, which indicates a bridge portion which is a portion protruding from the substrate piece main body 41.
フレキシブル配線板 1 0のブリ ッジ部 4 2を構成する部分では、 配線 膜 1 2表面には、 一部部分を除いてカバーフイルム 1 6で覆われている。 ここでは先端部分にはカバーフイルム 1 6は設けられておらず、 配線膜 1 2の先端部分又は先端に近い部分だけが露出され、 コンタク ト部 1 3 が構成されている。  In a portion constituting the bridge portion 42 of the flexible wiring board 10, the surface of the wiring film 12 is covered with a cover film 16 except for a part. Here, the cover film 16 is not provided at the front end portion, and only the front end portion or a portion close to the front end of the wiring film 12 is exposed to form the contact portion 13.
第 3 0図は、 基板素片 2の部分的な平面図であり、 基板素片本体 4 1 の一部とブリ ッジ部 4 2とが示されている。 配線膜 1 2は複数本が互い に平行に配置されており、 その先端の露出部分は幅広にされている。 次に、 基板素片 2を部品とする複合配線板の製造工程を説明する。 第 1 9図の符号 2 Aと符号 2 Bは、 それぞれ上記基板素片 2と同じ構 造の基板素片であり、 図面左側を第一の基板素片 2 A、 右側を第二の基 板素片 2 Bとすると、 第 1 9図に示すように、 先ず、 一方又は両方の基 板素片 2 A、 2 Bのコンタク ト部 1 3の表面に異方導電性フイルム 1 7 を乗せる。  FIG. 30 is a partial plan view of the substrate piece 2, showing a part of the substrate piece main body 41 and the bridge portion 42. A plurality of wiring films 12 are arranged in parallel with each other, and the exposed portion at the tip is widened. Next, a process of manufacturing a composite wiring board using the substrate piece 2 as a component will be described. Reference numerals 2A and 2B in FIG. 19 denote board pieces having the same structure as the above-described board piece 2, respectively.The left side of the drawing is the first board piece 2A, and the right side is the second board. As shown in FIG. 19, first, an anisotropic conductive film 17 is placed on the surface of the contact portion 13 of one or both of the base plate pieces 2A and 2B.
ここでは、 第一の基板素片 2 Aのコンタク ト部 1 3の表面に異方導電 性フイルム 1 7を乗せているが、 第二の基板素片 2 Bのコンタク 卜部 1 3側に乗せてもよく、 また、 両方の基板素片 2 A、 2 Bのコンタク ト部 1 3の表面に乗せてもよい。 Here, the anisotropic conductive film 17 is placed on the surface of the contact portion 13 of the first substrate piece 2A, but is placed on the contact portion 13 of the second substrate piece 2B. Also, the contact part of both substrate pieces 2A and 2B You may put on the surface of 13.
その状態で、 第一、 第二の基板素片 2 A、 2 Bのプリ ッジ部 4 2同士 を位置合わせし、 第二の基板素片 2 Bのコンタク ト部 1 3の表面を、 異 方導電性フイルム 1 7の表面に密着させる。  In this state, the edge portions 42 of the first and second substrate pieces 2A and 2B are aligned with each other, and the surface of the contact portion 13 of the second substrate piece 2B is made different. The conductive film 17 is brought into close contact with the surface.
第 3 1 a図〜第 3 1 c図は、 位置合わせ工程を説明するための図面で あり、 配線膜 Ί 2やカバーフイルム 1 6、 異方導電性フィル厶 1 7等の 部材は省略してある。  FIGS. 31a to 31c are drawings for explaining the alignment process, and members such as the wiring film Ί2, the cover film 16 and the anisotropic conductive film 17 are omitted. is there.
第 3 1 a図は、 第一、 第二の基板素片 2 A、 2 Bのコンタク ト部 1 3 が位置する部分のプリ ッジ部 4 2の幅 W A、 W Bがほぼ同じ大きさである 場合（W A = W B)を示しており、 この場合は、 第 3 1 b図に示すように、 位置合わせによってプリ ッジ部 4 2の幅方向の両端をそろえて密着させ る。 Fig. 31a shows the widths W A and W B of the portion 42 where the contact portion 13 of the first and second substrate pieces 2 A and 2 B are located, which are almost the same size. and when represents a (W a = WB) is, in this case, as shown in 3 1 b view, Ru is adhered to align the ends of the pre-Tsu di portion 4 2 in the width direction by the alignment.
この図及び後述する他の図中の符号 4 7は、 位置合わせによって重ね あわされたブリ ッジ部 4 2の部分を示している。  Reference numeral 47 in this figure and other figures described later indicates a portion of the bridge portion 42 overlapped by alignment.
密着した状態で第一、 第二の基板素片 2 A、 2 Bのコンタク ト部 1 3 同士を加熱 ' 押圧し、 コンタク ト部 1 3を構成する配線膜 1 2同士を、 異方導電性フイルム 1 7内に分散された導電粒子を介して電気的に接続 すると、 第 2 0図に示すように、 複合配線板 8 1 が得られる。  The contact portions 13 of the first and second substrate pieces 2 A and 2 B are heated and pressed together in a state of being in close contact, and the wiring films 12 constituting the contact portions 13 are anisotropically conductive. When electrically connected via conductive particles dispersed in the film 17, a composite wiring board 81 is obtained as shown in FIG.
この状態の複合配線板 8 1 では、 第一の基板素片 2 Aの配線膜 1 2、 ？ ？ ，〜 ^ ョ ？ ，〜ョ ？ 3と第二の基板素片 2 Bの配線膜 1 2、 2 2 1 - 2 2 3 , 3 2 ，〜 3 2 3とは相互に電気的に接続されている。 In the composite wiring board 81 in this state, the wiring films 1 2,? ? , ~ ^ Yo? , ~ Yo? 3 and the wiring films 12, 2 2 1-2 2 3, 3 2, to 3 2 3 of the second substrate piece 2 B are electrically connected to each other.
ここで、 第一、 第二の基板素片 2 A、 2 Bのフレキシブル配線板 1 0 は可撓性或いは屈曲性を有しており、 第一、 第二の基板素片 2 A、 2 B のフレキシブル配線板 1 0のコンタク ト部 1 3同士の電気的接続を維持 しながら、 第一及び第二の基板素片 2 A、 2 Bのフレキシブル配線板 1 0を曲げることができる。 次に、 上記のように異方導電性フイルム 1 7によって、 コンタク ト部 1 3を構成する配線膜 1 2同士を電気的に接続した後、 第 3 1 c図に示 すように、 両方の基板素片 2 A、 2 Bのブリ ッジ部 4 2 に亘つて補強フ イルム 1 8を貼付する。 Here, the flexible wiring board 10 of the first and second substrate pieces 2 A and 2 B has flexibility or flexibility, and the first and second substrate pieces 2 A and 2 B The flexible wiring board 10 of the first and second substrate pieces 2A, 2B can be bent while maintaining the electrical connection between the contact portions 13 of the flexible wiring board 10 of FIG. Next, as described above, after the wiring films 12 constituting the contact part 13 are electrically connected to each other by the anisotropic conductive film 17, as shown in FIG. The reinforcing film 18 is attached over the bridge portion 42 of the substrate pieces 2A and 2B.
この補強フイルム 1 8によって、 第一、 第二の基板素片 2 A、 2 Bの プリ ッジ部 4 2を構成するフレキシブル配線板 1 0同士が機械的に接続 される。  By means of the reinforcing film 18, the flexible wiring boards 10 constituting the bridge portions 42 of the first and second substrate pieces 2A, 2B are mechanically connected to each other.
ここでは、 第 2 Ί 図に示すように、 互いに接続された第一、 第二の基 板素片 2 A、 2 Bのフレキシブル配線板 1 0の表面側と裏面側に、 それ ぞれ別の補強フイルム 1 8を貼付し、 フレキシブル配線板 1 0の先端が 露出しないようにしたが、 いずれか一方の面にだけ補強フイルム 1 8を 貼付してもよい。 また、 一枚の補強フイルム 1 8を重ね合わせ部分 4 7 に巻回し、 表面側と裏面側の両方を機械的に接続してもよい。  Here, as shown in FIG. 2, separate front and back sides of the flexible wiring board 10 of the first and second substrate pieces 2 A and 2 B connected to each other are respectively provided. Although the reinforcing film 18 is attached so that the tip of the flexible wiring board 10 is not exposed, the reinforcing film 18 may be attached to only one of the surfaces. Alternatively, a single reinforcing film 18 may be wound around the overlapping portion 47 to mechanically connect both the front side and the back side.
以上のように、 補強フイルム 1 8によってレキシブル配線板 1 0同士 が機械的に接続されると、 フレキシブル配線板 1 0が大きく曲げられて も、 コンタク ト部 1 3同士が剥離しないようになる。  As described above, when the flexible wiring boards 10 are mechanically connected to each other by the reinforcing film 18, even if the flexible wiring board 10 is greatly bent, the contact portions 13 do not peel off from each other.
上記とは異なり、 第 3 2 a図に示すように、 第一の基板素片 2 Aのコ ンタク 卜部 1 3が位置する部分のブリ ッジ部 4 2の幅 W Aが、 第二の基板 素片 2 Bのコンタク 卜部 1 3が位置する部分のブリ ッジ部 4 2の幅 W Bよ リも広い場合（W A > W B，又は、 その逆に、 W A < W Bでもよい。 ：)は、 第 3 2 b図に示すように、 狭い方が、 広い方の内側に位置するように位置合 わせをして重ね合わせ、 上記と同様に、 異方導電性フイルム 1 7を介し てコンタク 卜部 Ί 3同士を電気的に接続する。 Unlike the above, as shown in FIG. 32a, the width W A of the bridge portion 42 of the portion where the contact portion 13 of the first substrate piece 2A is located is equal to the width of the second substrate piece 2A. If the width of the bridge portion 42 of the segment 2B where the contact portion 13 is located is wider than the width WB (W A > WB, or vice versa, W A <WB may be used). As shown in Fig. 32b, the narrow part is positioned so that it is located inside the wide part, and the two parts are overlapped with each other. Ί Connect 3 electrically.
そして、 第 3 2 c図に示すように、 狭いほうのコンタク ト部 4 2の先 端の三辺を覆うように補強フイルム 1 8を貼付するよい。 また、 更に裏 面側にも補強フイルム 1 8を貼付することができる。 また、 第 3 3 a図に示すように、 ブリ ッジ部 4 2のうち、 コンタク ト 部 1 3が位置する先端部分が根本部分よりも広くなつており、 先端部分 の幅 W A、 W Bの一方が他方よりも広い場合は、 第 3 3 b図に示すように、 狭い方が広い方の内側に位置するように位置合わせをして重ね合わせ、 同様に電気的に接続する。 Then, as shown in FIG. 32c, a reinforcing film 18 may be attached so as to cover the three sides at the front end of the narrower contact portion 42. Further, a reinforcing film 18 can be attached to the back side. Also, as shown in FIG. 33a, of the bridge portion 42, the tip portion where the contact portion 13 is located is wider than the root portion, and the widths W A and WB of the tip portion are smaller. If one is wider than the other, as shown in Fig. 33b, the narrower is positioned so that it is located inside the wider and then overlapped, and similarly electrically connected.
この場合では、 第 3 3 c図に示すように、 狭い方と広い方の中間の大 きさの補強フイルム 1 8を用い、 狭い方のブリ ッジ部 4 2の周囲を覆う ように貼付することができる。  In this case, as shown in Fig. 33c, use a reinforcing film 18 with a medium size between the narrow and wide sides, and attach it so as to cover the narrow bridge portion 42. be able to.
以上のように補強フィル厶 1 8を貼付した後は、 第 2 2図に示すよう に、 第一、 第二の基板素片 2 A、 2 Bの一方又は両方の上に電子部品 4 9を搭載することができる。  After attaching the reinforcing film 18 as described above, as shown in FIG. 22, the electronic component 49 is placed on one or both of the first and second substrate pieces 2A and 2B. Can be mounted.
電子部品 4 9は、 その端子を最外層のリジッ ド配線板 2 0 3、 3 0 3の 配線膜 2 2 3、 3 2 3に接続されるので、 電子部品 4 9は、 第一、 第二の 基板素片 2 A、 2 Bの配線膜 1 2、 2 2，〜 2 2 3、 3 2，~ 3 2 3や導電 性突起 2 4 ，〜 2 4 3、 3 4 ，~ 3 4 3等によって、 電子部品 4 9同士が相 互に接続され、 また、 電源等の他の回路に接続される。 Since the electronic component 4 9 is connected to the terminals on the wiring layer 2 2 3, 3 2 3 of the outermost layer of Riji' de wiring board 2 0 3, 3 0 3, the electronic component 4 9, first, second board piece 2 a, 2 wiring film 1 2, 2 2 B ~ 2 2 3, 3 2, ~ 3 2 3 or a conductive protrusions 2 4 ~ 2 4 3 3 4 ~ 3 4 3 etc. Accordingly, the electronic components 49 are connected to each other, and are connected to another circuit such as a power supply.
なお、 上記フレキシブル配線板 1 0のべ一スフイルム 1 1 やカバーフ イルム 1 6は、 十〜数十 mのポリイミ ドフイルムが所定形状に裁断さ れて構成されている。 また、 配線膜 1 2、 2 2，〜 2 2 3、 3 2，〜 3 2 3 は厚さ十〜数十 μ mの銅箔が所定の形状にパターニングされて構成され ている。 The base film 11 and the cover film 16 of the flexible wiring board 10 are formed by cutting a polyimide film of tens to several tens of meters into a predetermined shape. The wiring films 12, 22, to 22 3 , 32, to 32 3 are formed by patterning copper foil having a thickness of tens to several tens μm into a predetermined shape.
配線膜 1 2、 2 2，〜 2 2 3、 3 2，〜 3 2 3を構成する銅箔は薄いので、 ベースフイルム 1 1 やカバーフイルム 1 6が曲がるときに一緒に曲がる ので、 フレキシブル配線板 1 0の柔軟性は損なわれない。 Since the copper foil forming the wiring films 1 2, 2 2, to 2 2 3 , 3 2, to 3 2 3 is thin, it bends together when the base film 11 and the cover film 16 bend, so a flexible wiring board The flexibility of 10 is not compromised.
他方、 リジッ ド配線板 2 0，〜 2 0 3、 3 0，〜 3 0 3のベース基板 2 1 ，〜 2 1 3、 3 0，〜 3 0 3はガラスエポキシ樹脂等で構成されており、 厚 さ 5 0 ~ 5 0 0 At m程度の薄板に成形されている。 従って、 リジッ ド配 線板 2 0，~ 2 0 3、 3 0 ,〜 3 0 3は可撓性や屈曲性は有さない。 そのた め、 搭載した電子部品 4 9の端子と配線膜 2 2 3、 3 2 3との間には応力 が加わらない。 On the other hand, Riji' de wiring board 2 0 ~ 2 0 3, 3 0, the base substrate 2 1 ~ 3 0 3 ~ 2 1 3 3 0 ~ 3 0 3 is made of a glass epoxy resin or the like, Thick It is formed into a thin plate of about 50 to 500 Atm. Therefore, Riji' de wiring board 2 0 ~ 2 0 3, 3 0 ~ 3 0 3 has no flexible and bendable. Me other, is not applied stress between equipped with a terminal of the electronic component 4 9 and the wiring film 2 2 3, 3 2 3.
上記複合配線板 8 1 のブリ ッジ部 4 2が曲げられる場合、 第一、 第二 の基板素片 2 A、 2 Bのコンタク ト部 1 3 に加わる応力を減少させるた めに、 第 1 、 第 2の基板素片 2 A、 2 Bのプリ ツジ部 4 2の長さを、 ― 方よりも他方を長く し、 コンタク ト部 1 3が曲げ部分に位置しないよう にすることができる。  When the bridge portion 42 of the composite wiring board 81 is bent, the first portion is reduced to reduce the stress applied to the contact portion 13 of the first and second substrate pieces 2A, 2B. The length of the ridge portion 42 of the second substrate pieces 2A and 2B can be made longer than the minus side, so that the contact portion 13 is not positioned at the bent portion.
第 3 4図の符号 2 ' A、 2 ' Bは、 短尺のブリ ッジ部 4 2 Aと長尺のブ リ ッジ部 4 2 Bを有する他は、 上記第一、 第二の基板素片 2 A、 2 Bと 同じ基板素片であり、 この二種類の基板素片 2 A、 2 Bのコンタク 卜部 1 3同士を接続すると、 第 3 5図に示すような複合配線板 8 5が得られ る。  Reference numerals 2'A and 2'B in FIG. 34 denote the first and second substrate elements except that they have a short bridge portion 42A and a long bridge portion 42B. The contact pieces 13 of the two kinds of board pieces 2 A and 2 B are connected to each other to form a composite wiring board 85 as shown in FIG. 35. can get.
この複合配線板 8 5は、 通常、 接続したブリ ッジ部 4 2の中央部分が 曲げられる。 接続部分が曲げ部分に位置しないようにするためには、 接 続した状態の 2枚のブリ ッジ部の合計長さ Pとし、 2枚のブリ ッジ部の 重ね合わせ部分の長さを Qとすると、 短尺のブリ ッジ部 4 2 Aの長さは、 ( P / 2 — Q )以下の長さであり、 長尺のブリ ッジ部 4 2 Bの長さは、 （P Z 2 + Q )の長さ以上（短尺のブリ ッジ部 4 2 Aと長尺のブリッジ部 2 B の長さの差は 2 · Q以上）にするとよい。  In the composite wiring board 85, the central portion of the connected bridge portion 42 is usually bent. In order to prevent the connecting part from being located at the bent part, the total length of the two bridge parts in the connected state is P, and the length of the overlapping part of the two bridge parts is Q Then, the length of the short bridge section 42A is less than (P / 2-Q), and the length of the long bridge section 42B is (PZ2 + Q) or longer (the difference between the length of the short bridge 42 A and the length of the long bridge 2 B is 2 · Q or more).
なお、 後述する複合配線板 8 3 についても同様であり、 基板素片のフ レキシブル配線板で構成されたプリッジ部同士を接続する場合、 その接 続部分が曲げ部分に位置しないようにすることができる。  The same applies to the composite wiring board 83, which will be described later.When connecting the bridging parts formed of the flexible wiring boards of the substrate pieces, it is necessary to make sure that the connecting part is not located at the bent part. it can.
特に、 本発明の複合配線板 8 ■！ 〜 8 5は、 携帯電話やノー卜パソコン 等の蓋が開閉される開閉型機器に内蔵させる場合、 接続部分が曲げ部分 に位置しないようにすると、 機器全体の信頼性が向上する。 In particular, the composite wiring board of the present invention 8! -85: When connecting to a portable device such as a mobile phone or notebook computer that can be opened and closed, If not, the reliability of the whole equipment will be improved.
第 3 6、 3 7図は、 本発明の複合配線板 8 5を内蔵する開閉型機器 6 FIGS. 36 and 37 show a switchgear type device 6 incorporating the composite wiring board 85 of the present invention.
0を示している。 この開閉型機器 6 0は携帯電話である。 0 is shown. The opening / closing device 60 is a mobile phone.
開閉型機器 6 0は、 表示装置側であって蓋となる第一の筐体 6 1 と、 操作盤側であって第一の筐体 6 1 と密着する第二の筐体 6 2とを有して いる。  The opening / closing device 60 includes a first housing 61 serving as a lid on the display device side, and a second housing 62 closely contacting the first housing 61 on the operation panel side. Have.
軸 6 3は、 第一、 第二の筐体 6 1 、 6 2の厚みと同程度の直径を有し ており、 第一、 第二の筐体 6 1 、 6 2の一部分を貫通している。 第一、 第二の筐体 6 1 、 6 2は、 軸 6 3の中心軸線の回りに所定角度だけ相対 的に回転可能に取り付けられている。 第一、 第二の筐体 6 Ί 、 6 2を最 大角度回転させると、 第 3 7図に示すように、 蓋が開けられた状態にな る。  The shaft 63 has a diameter approximately equal to the thickness of the first and second housings 61 and 62, and penetrates a part of the first and second housings 61 and 62. I have. The first and second housings 61 and 62 are mounted so as to be relatively rotatable about a central axis of the shaft 63 by a predetermined angle. When the first and second casings 62 and 62 are rotated by the maximum angle, the lid is opened as shown in FIG.
開閉型機器 6 0の内部には、 第 3 5図に示された複合配線板 8 5が配 置されている。 開閉型機器 6 0内部の複合配線板 8 5は、 第一、 第二の 基板素片 2 Α '、 2 Β 'のうち、 一方が第一の筐体 6 1 の内部に配置され ており、 他方が第二の筐体 6 2の内部に配置されている。  Inside the switchgear 60, a composite wiring board 85 shown in FIG. 35 is arranged. The composite wiring board 85 inside the opening / closing device 60 is configured such that one of the first and second substrate pieces 2 ′ ′ and 2 ′ ′ is disposed inside the first housing 61, The other is arranged inside the second housing 62.
そして、 長尺のブリ ッジ部 4 2 Βが、 軸 6 3の内部を通り、 一方の筐 体（ここでは第一の筐体 6 1 )の内部で、 短尺のプリ ッジ部 4 2 Αと接続 されている。 従って、 第一、 第二の筐体 6 1 、 6 2を開閉すると、 軸 6 3内に位置する部分のプリ ッジ部 4 2 Bが曲げられる。  Then, a long bridge portion 42 Β passes through the inside of the shaft 63, and inside one housing (here, the first housing 61), a short bridge portion 422 Β. Is connected to. Therefore, when the first and second housings 61 and 62 are opened and closed, the portion of the bridge portion 42B located inside the shaft 63 is bent.
第 3 6、 3 7図の符号 6 5は、 ブリ ッジ部 4 2 A、 4 2 B同士の接続 部分であり、 接続部分は軸 6 3内部に位置せず、 接続部分 6 5が曲げら れないようになっている。 従って、 接続部分 6 5 に応力は加わらず、 コ ンタク 卜部 1 3同士が分離することはない。 接続部分 5 3が軸 6 3内部 に位置しなければ、 ブリ ッジ部 4 2 A、 2 4 Bの長さは限定されない。 第 2 5、 2 7、 2 9図に示した複合配線板 8 2、 8 3、 8 4について も、 コンタク ト部 1 3同士が接続される接続部分が、 軸 6 3内に配置さ れず、 第一又は第二の筐体 6 1 、 6 2内に配置され、 応力が加わらなけ れぱよい。 Reference numerals 65 in FIGS. 36 and 37 indicate a connection portion between the bridge portions 42A and 42B.The connection portion is not located inside the shaft 63, and the connection portion 65 is bent. Not to be. Therefore, no stress is applied to the connection portions 65, and the contact portions 13 do not separate from each other. If the connecting portion 53 is not located inside the shaft 63, the lengths of the bridge portions 42A and 24B are not limited. Composite wiring boards 82, 83, 84 shown in Figs. 25, 27, 29 Also, the connection portion where the contact portions 13 are connected to each other is not arranged in the shaft 63, but is arranged in the first or second housing 61, 62, so that no stress is applied. .
軸 6 3は、 第一、 第二の筐体 6 1 、 6 2の少なくとも一部を、 回転可 能に連結する部材であればよく、 必ずしも一本の回転軸を意味しない。 例えば長さ方向に複数に分割されていてもよく、 また、 円周方向にスリ ッ 卜などが形成されていてもよい。  The shaft 63 may be a member that rotatably connects at least a part of the first and second housings 61 and 62, and does not necessarily mean one rotating shaft. For example, it may be divided into a plurality in the length direction, or a slit or the like may be formed in the circumferential direction.
次に、 本発明の複合配線板の他の例を説明する。 第 2 3図の符号 3は、 本発明の複合配線板に用いることができる基板素片の変形例を示してお リ、 この変形例の基板素片 3のフレキシブル配線板 4 0は、 上記フレキ シプル配線板 1 0と同様に、 基板素片本体 4 1 の側面から外側に突き出 されており、 その部分でプリ ッジ部 4 4が構成されている。  Next, another example of the composite wiring board of the present invention will be described. Reference numeral 3 in FIG. 23 indicates a modification of the substrate piece that can be used in the composite wiring board of the present invention. The flexible wiring board 40 of the substrate piece 3 of this modification is the flexible wiring board 40 described above. As in the case of the simple wiring board 10, it protrudes outward from the side surface of the substrate piece main body 41, and the portion constitutes a bridge portion 44.
この基板素片 3では、 フレキシプル配線板 4 0のカバーフィル厶 4 6 は、 ベースフイルム 1 1 と同じ長さか、 それよりも長く、 先端部分はコ ンタク 卜部 1 3上まで伸びている。  In the substrate piece 3, the cover film 46 of the flexible wiring board 40 has the same length as or longer than the base film 11, and the leading end extends to the contact portion 13.
但し、 その先端部分は、 配線膜 1 2やベースフイルム 1 1 には接着さ れておらず、 そのため、 先端部分の配線膜 1 2の表面は露出され、 その 部分でコンタク ト部 1 3が構成されている。 他の構成は、 第一、 第二の 基板素片 2 A、 2 Bの構成と同じである。  However, the tip portion is not bonded to the wiring film 12 or the base film 11, and therefore, the surface of the wiring film 12 at the tip portion is exposed, and the contact portion 13 is formed at that portion. Have been. Other configurations are the same as the configurations of the first and second substrate pieces 2A and 2B.
上記基板素片 3を用いて複合配線板を製造する工程を説明すると、 先 ず、 第 2 4図に示すように、 この基板素片 3のコンタク ト部 1 3上に異 方導電性フイルム 1 7を乗せ、 上記第一、 又は第二の基板素片 2のコン タク 卜部を異方導電性フイルム 1 7上に押し当て、 フレキシブル配線板 4 0、 1 0同士を電気的に接続する。  The process of manufacturing a composite wiring board using the substrate piece 3 will be described first. As shown in FIG. 24, the anisotropic conductive film 1 is placed on the contact portion 13 of the substrate piece 3. Then, the contact portion of the first or second substrate piece 2 is pressed onto the anisotropic conductive film 17 to electrically connect the flexible wiring boards 40 and 10 to each other.
このとき、 第 2 5図に示すように、 第一又は第二の基板素片 2のフレ キシブル配線板 1 0のベースフイルム 1 1 側に、 変形例の基板素片 3の カバ一フイルム 4 6の先端部分を貼付すると、 第一又は第二の基板素片 2の先端は、 変形例の基板素片 3のカバ一フイルム 4 6とベースフィル 厶 1 1 とで挟まれた状態になる。 At this time, as shown in FIG. 25, the substrate element 3 of the modified example is attached to the base film 11 side of the flexible wiring board 10 of the first or second substrate element 2. When the tip of the cover film 46 is attached, the tip of the first or second substrate piece 2 is sandwiched between the cover film 46 of the modified substrate piece 3 and the base film 11. State.
この状態では、 カバーフイルム 4 6は補強フイルムとして機能し、 フ レキシプル配線板 4 0、 1 0同士はカバーフイルム 4 6によって機械的 に接続され、 強固な複合配線板 8 2が得られる。 カバ一フイルム 4 6の 裏面側には、 他の補強フイルム 1 8を貼付してもよい。  In this state, the cover film 46 functions as a reinforcing film, and the flexible wiring boards 40 and 10 are mechanically connected to each other by the cover film 46, so that a strong composite wiring board 82 is obtained. Another reinforcing film 18 may be attached to the back surface of the cover film 46.
なお、 変形例の基板素片 3のカバ一フィル厶 4 6のコンタク ト部 1 3 と反対側の端部は、 基板素片本体 4 1 の縁部で終了し、 カバーフイルム 4 6全体が基板素片本体 4 1 の外部に位置していてもよいし、 カバーフ イルム 4 6のコンタク ト部 1 3と反対側の端部が、 基板素片本体 4 1 の 内部まで伸び、 リジッ ド配線板 2 0，に接着されていてもよい。  In addition, the end of the cover film 46 of the modified example of the substrate piece 3 opposite to the contact portion 13 ends at the edge of the substrate piece body 41, and the entire cover film 46 is formed on the substrate. It may be located outside the element body 41, or the end of the cover film 46 opposite to the contact part 13 extends to the inside of the substrate element body 41, and the rigid wiring board 2 0, may be adhered.
上記各基板素片 2 A、 2 B、 3は、 フレキシブル配線板 1 0、 4 0が、 リジッ ド配線板 2 0，~ 2 0 3、 3 0，~ 3 0 3の積層体 2 0、 3 0の間に 位置していたが、 本発明は、 そのような基板素片で構成された複合配線 板 8 1 、 8 2に限定されるものではない。 Each board piece 2 A, 2 B, 3 A flexible wiring board 1 0, 4 0, Riji' de wiring board 2 0 ~ 2 0 3, 3 0 ~ 3 0 3 of the laminate 2 0, 3 Although it was located between 0, the present invention is not limited to the composite wiring boards 81 and 82 constituted by such substrate pieces.
第 2 6図の符号 6 A、 6 Bは、 そのような基板素片の例であり、 フレ キシブル配線板 1 0が、 リジッ ド配線板 2 0，〜 2 0 6の積層体 2 0 'の最 外層の表面に貼付されている。 この基板素片 6 A、 6 Bでは、 フレキシ プル配線板 1 0とリジッ ド配線板 2 0，〜 2 0 6の積層体 2 0 'とで基板素 片本体 4 3が構成されており、 基板素片本体 4 3からはみ出たフレキシ ブル配線板 1 0の部分でブリッジ部 4 8が構成されている。 Code 6 A, 6 B of the second 6 diagram is an example of such a board pieces, deflection Kishiburu wiring board 1 0, Riji' de wiring board 2 0 ~ 2 0 6 laminate 2 0 'of the Affixed to the surface of the outermost layer. In the board pieces 6 A, 6 B, Flexi-pull circuit board 1 0 and Riji' de wiring board 2 0, it is ~ 2 0 6 laminate 2 0 'and the de-board the fragment body 4 3 is constituted, the substrate A bridge portion 48 is constituted by the portion of the flexible wiring board 10 protruding from the element body 43.
上記基板素片 6 A、 6 Bのうち、 一方の基板素片 6 Aのコンタク ト部 1 3上に異方導電性フィル厶 1 7を配置し、 他方の基板素片 6 Bのコン タク 卜部 1 3を異方導電性フイルム 1 7表面に押し当て、 両方の基板素 片 6 A、 6 Bのフレキシブル配線板 1 0の配線膜 1 2同士を電気的に接 続し、 フレキシブル配線板 1 0の先端の両面に補強フイルム 1 8を貼付 すると、 第 2 7図で示すように、 本発明の複合基板 8 3が得られる。 Of the above-mentioned substrate pieces 6A and 6B, an anisotropic conductive film 17 is arranged on the contact part 13 of one substrate piece 6A, and the contact part of the other substrate piece 6B 1 3 is pressed against the surface of the anisotropic conductive film 17 to electrically connect the wiring films 12 of the flexible wiring boards 10 of both substrate pieces 6 A and 6 B to each other. Subsequently, when the reinforcing films 18 are attached to both surfaces of the front end of the flexible wiring board 10, the composite substrate 83 of the present invention is obtained as shown in FIG.
この複合配線板 8 3でも、 基板素片 6 A、 6 Bの接続部分が曲げ部分 に位置しないようにするために、 上記基板素片 2 ' Α、 2 ' Bと同様に、 ブリ ッジ部 4 8の一方を短尺、 他方を長尺にすることができる。 短尺の 方にブリ ッジ部 4 8の長さは、 （P / 2— Q )以下の長さであり、 長尺の 方長さは、 （P / 2 + Q )の長さ以上にするとよい。  In this composite wiring board 83 as well, as in the case of the above-mentioned board pieces 2'Α and 2'B, the bridge section is provided so that the connection portions of the board pieces 6A and 6B are not located at the bent portions. One of 48 can be short and the other long. The length of the bridge section 48 on the short side is less than (P / 2-Q), and the longer side is longer than (P / 2 + Q). Good.
上記基板素片 2 A、 2 B、 3、 6 A、 6 Bの組合せ方は一例であり、 自由に組合わせて本発明の複合配線板を構成することができる。  The combination of the above substrate pieces 2A, 2B, 3, 6A, and 6B is an example, and the composite wiring board of the present invention can be configured by freely combining them.
更にまた、 上記例ではフレキシブル配線板 1 0、 4 0を有する各基板 素片 2 A、 2 B、 3 、 6 A、 6 Bを用いて複合配線板 8 1 〜 8 3を構成 したが、 上記基板素片 2 A、 2 B、 3、 6 A、 6 Bを第三の基板素片と し、 フレキシブル配線板を有さず、 リジッ ド配線板の積層体から成る基 板素片を第四の基板素片として、 第三の基板素片と第四の基板素片とか ら本発明の複合配線板を構成することもできる。  Furthermore, in the above example, the composite wiring boards 81 to 83 were configured using the respective substrate pieces 2A, 2B, 3, 6A, and 6B having the flexible wiring boards 10 and 40. Substrate pieces 2A, 2B, 3, 6A, and 6B are used as third substrate pieces, and a fourth base piece made of a laminate of rigid wiring boards without a flexible wiring board is used. The composite wiring board of the present invention can be composed of the third substrate element and the fourth substrate element.
第 2 8図の符号 4は、 上記リジッ ド配線板 2 0 ~ 2 0 5と同じ構成の リジッ ド配線板 5 0，~ 5 0 5を積層して構成した第四の基板素片を示し ており、 符号 6 Aは、 第三の基板素片を示している。 Code 4 of the second 8 diagram shows the fourth board piece constituted by the Riji' de-wiring board 2 0 - 2 0 5 and Riji' de wiring board 5 0 having the same structure, the ~ 5 0 5 laminated Reference numeral 6A indicates a third substrate piece.
第四の基板素片 4表面には、 金属配線膜の表面が露出されており、 そ の金属配線膜の表面の一部又は第三の基板素片 6 Aのコンタク ト部 1 3 の上に異方導電性フィル厶 1 7を配置し、 第 2 9図に示すように、 異方 導電性フイルム 1 7を間にして、 第三の基板素片 6 Aのコンタク ト部 1 3を、 第四の基板素片 4の表面の金属配線膜に加熱 · 押圧して電気的に 接続すると、 本発明の変形例の複合配線板 8 4が得られる。  On the surface of the fourth substrate element 4, the surface of the metal wiring film is exposed, and a part of the surface of the metal wiring film or the contact portion 13 of the third substrate element 6 A is formed. The anisotropic conductive film 17 is arranged, and as shown in FIG. 29, the contact portion 13 of the third substrate piece 6A is placed between the anisotropic conductive film 17 and the When a metal wiring film on the surface of the fourth substrate piece 4 is electrically connected by heating and pressing, a composite wiring board 84 according to a modified example of the present invention is obtained.
そして、 第四の基板素片 4の表面とフレキシブル配線板 1 0の表面の 間に亘つて補強フイルム 1 8を貼付すると、 第三の基板素片 6 Aと第四 の基板素片 4とが機械的に接続される。 Then, when the reinforcing film 18 is attached between the surface of the fourth substrate piece 4 and the surface of the flexible wiring board 10, the third substrate piece 6A and the fourth The substrate piece 4 is mechanically connected.
また、 第 2 3図の基板素片 3を第三の基板素片として第四の基板素片 4 と組合わせる場合、 フレキシブル配線板 4 0のカバ一フイルム 4 6を 第四の基板素片 4上まで伸ばし、 カバ一フイルム 4 6を第四の基板素片 4表面に貼付して補強フィル厶の代わりにすることもできる。  When the substrate piece 3 in FIG. 23 is combined with the fourth substrate piece 4 as a third substrate piece, the cover film 46 of the flexible wiring board 40 is combined with the fourth substrate piece 4. It can be extended to the top, and a cover film 46 can be affixed to the surface of the fourth substrate piece 4 to replace the reinforcing film.
なお、 基板素片本体 4 1 、 4 3 に搭載する電子部品 4 9は、 基板素片 2 A、 2 B、 3、 6 A、 6 B、 4を複合配線板 8 "！ 〜 8 4に組み立てた 後で搭載してもよいし、 電子部品 4 9を基板素片 2 A、 2 B、 3 、 6 A、 6 B、 4に搭載した後に組み立てて複合配線板 8 1 〜 8 4を構成させて もよい。  The electronic components 49 mounted on the substrate element bodies 41 and 43 are assembled by assembling the substrate elements 2A, 2B, 3, 6A, 6B and 4 into a composite wiring board 8 "! The electronic parts 49 may be mounted later, or mounted on the substrate pieces 2A, 2B, 3, 6A, 6B, 4 and then assembled to form the composite wiring boards 81 to 84. You may.
また、 上記基板素片 2八、 2 B、 3、 6 A、 6 Bのフレキシブル配線 板 1 0、 4 0は単層であつたが、 複数のフレキシブル配線板を積層して ブリ ッジ部 4 2、 4 4、 4 8を構成してもよい。 産業上の利用可能性  In addition, although the flexible wiring boards 10 and 40 of the substrate pieces 28, 2B, 3, 6A, and 6B are single layers, a plurality of flexible wiring boards are stacked to form a bridge section 4. 2, 4, 4, and 48 may be configured. Industrial applicability
第一、 第二の発明の両方とも、 必要なときに基板素片から複合配線板 を組み立てることができるので、 作業性がよい。  In both of the first and second inventions, the composite wiring board can be assembled from the substrate pieces when necessary, so that the workability is good.

Claims

請求の範囲 The scope of the claims
1 . 少なく とも一枚のフレキシブル配線板と、 複数のリジッ ド配線板と が積層された基板素片であって、  1. A substrate piece in which at least one flexible wiring board and a plurality of rigid wiring boards are laminated,
前記フレキシブル配線板と前記リジッ ド配線板とが重ねあわされた部 分から成る基板素片本体と、  A substrate piece main body composed of an overlapped portion of the flexible wiring board and the rigid wiring board,
前記フレキシブル配線板の端部であって、 前記基板素片本体の側面か らはみ出た接続部とを有し、  An end portion of the flexible wiring board, and a connection portion protruding from a side surface of the substrate piece main body;
前記接続部には、 前記フレキシブル配線板の配線膜が、 少なく とも一 部は露出された基板素片。  A wiring board of the flexible wiring board is at least partially exposed at the connection part.
2 . 隣接する前記リジッ ド配線板の配線膜は導電性突起によって接続さ れた請求の範囲第 1 項記載の基板素片。 2. The substrate piece according to claim 1, wherein the wiring films of the adjacent rigid wiring boards are connected by conductive protrusions.
3 . 前記基板素片本体の長さよりも、 前記接続部の長さのほうが短い請 求の範囲第 1 項記載の基板素片。  3. The substrate piece according to claim 1, wherein the length of the connection portion is shorter than the length of the substrate piece main body.
4 . 請求の範囲第 1 項記載の基板素片である第一、 第二の基板素片と、 接続用のフレキシブル配線板とを有し、  4. It has the first and second substrate pieces, which are the substrate pieces according to claim 1, and a flexible wiring board for connection,
前記第一、 第二の基板素片の接続部は、 前記接続用のフレキシブル配 線板の端部に接続された複合配線板。  The composite wiring board, wherein the connection part of the first and second substrate pieces is connected to an end of the flexible wiring board for connection.
5 . 前記接続用のフレキシブル配線板と前記第一、 第二の基板素片の前 記接続部の間に亘つて補強フィル厶が貼付された請求の範囲第 4項記載 の複合配線板。  5. The composite wiring board according to claim 4, wherein a reinforcing film is attached between the flexible wiring board for connection and the connection portion of the first and second substrate pieces.
6 . 前記接続用のフレキシブル配線板の長さは、 前記第一、 第二の基板 素片の前記接続部の長さよリも長い請求の範囲第 4項記載の複合配線板。  6. The composite wiring board according to claim 4, wherein a length of the flexible wiring board for connection is longer than a length of the connection part of the first and second substrate pieces.
7 . 前記第一又は第二の基板素片の少なくとも一方には、 電子部品が搭 載された請求の範囲第 4項記載の複合配線板。 7. The composite wiring board according to claim 4, wherein an electronic component is mounted on at least one of the first and second substrate pieces.
8 . 第一の筐体と第二の筐体とが、 軸を中心として所定角度だけ相対的 に回転可能に構成され、 前記第一、 第二の基板素片のうちの一方が前記 第一の筐体内に配置され、 他方が前記第二の筐体内に配置された請求の 範囲第 7項記載の複合配線板を内蔵する開閉型機器であって、 8. The first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and one of the first and second substrate pieces is An open / close device incorporating the composite wiring board according to claim 7, wherein the open / close device is arranged in a first housing, and the other is arranged in the second housing,
前記第一、 第二の基板素片と前記接続用のフレキシブル配線板とが接 続された部分は、 前記第一、 第二の筐体が開閉されて前記接続用のフレ キシプル配線板が曲がるときに曲がらない位置に配置された開閉型機器。 In the portion where the first and second substrate pieces and the flexible wiring board for connection are connected, the first and second housings are opened and closed to bend the flexible wiring board for connection. An opening / closing device that is placed in a position where it does not bend.
9 . 第一の筐体と第二の筐体とが、 軸を中心として所定角度だけ相対的 に回転可能に構成され、 前記第一、 第二の基板素片のうちの一方が前記 第一の筐体内に配置され、 他方が前記第二の筐体内に配置された請求の 範囲第 7項記載の複合配線板を内蔵する開閉型機器であって、 9. The first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and one of the first and second substrate pieces is the first housing. An open / close type device incorporating the composite wiring board according to claim 7, wherein the open / close type device is disposed in the second housing, and the other is disposed in the second housing.
前記接続用のフレキシブル配線板は前記軸内を通り、 前記第一、 第二 の基板素片の前記接続部と、 前記接続用のフレキシブル配線板とが接続 された部分は、 一方が前記第一の筐体の内部に位置し、 他方が前記第二 の筐体の内部に配置された開閉型機器。  The connection flexible wiring board passes through the shaft, and the connection portion of the first and second substrate pieces and the portion where the connection flexible wiring board is connected, one of which is the first An openable / closable device located inside the second housing and the other arranged inside the second housing.
1 0 . 第一の筐体と第二の筐体とが、 軸を中心として所定角度だけ相対 的に回転可能に構成され、 前記第一、 第二の基板素片のうちの一方が前 記第一の筐体内に配置され、 他方が前記第二の筐体内に配置された請求 の範囲第 7項記載の複合配線板を内蔵する開閉型機器であって、  10. The first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and one of the first and second substrate pieces is provided as described above. An open / close device incorporating the composite wiring board according to claim 7, wherein the open / close type device is disposed in a first housing, and the other is disposed in the second housing.
前記第一又は第二の基板素片のうちの一方の基板素片の前記接続部が 前記軸内を通り、 前記第一、 第二の基板素片の前記接続部と前記接続用 のフレキシブル配線板とが接続された部分は、 前記第一、 第二の筐体の いずれか一方の内部に配置された開閉型機器。  The connection portion of one of the first and second substrate pieces passes through the axis, and the connection portion of the first and second substrate pieces and the flexible wiring for connection A part connected to the plate is an openable / closable device disposed inside one of the first and second housings.
1 1 . 少なくとも一枚のフレキシブル配線板と、 複数のリジッ ド配線板 とが積層された第一、 第二の基板素片同士を接続した複合配線板であつ て、  1 1. A composite wiring board in which at least one flexible wiring board and a plurality of rigid wiring boards are stacked and the first and second substrate pieces are connected to each other,
前記第一、 第二の基板素片は、 前記フレキシブル配線板と前記リジッ ド配線板とが重ねあわされた部分から成る基板素片本体と、 前記フレキ 37 シブル配線板の端部であって、 前記基板素片本体の側面からはみ出たブ リ ッジ部とをそれぞれ有し、 The first and second substrate pieces are a substrate piece body composed of a portion where the flexible wiring board and the rigid wiring board are overlapped with each other; 37 end portions of the sibling wiring board, each having a bridging portion protruding from a side surface of the substrate piece main body,
前記プリ ッジ部では、 前記フレキシブル配線板の配線膜の少なくとも 一部が露出された部分でコンタク 卜部が構成され、  In the bridge portion, a contact portion is configured by a portion where at least a part of the wiring film of the flexible wiring board is exposed,
前記第一、 第二の基板素片は、 前記コンタク ト部同士が互いに電気的 に接続された複合配線板。  The first and second substrate pieces are a composite wiring board in which the contact portions are electrically connected to each other.
1 2 . 前記第一、 第二の基板素片の隣接する前記リジッ ド配線板の配線 膜は導電性突起によって接続された請求の範囲第 1 1 項記載の複合配線 板。  12. The composite wiring board according to claim 11, wherein the wiring films of the rigid wiring board adjacent to the first and second substrate pieces are connected by conductive protrusions.
1 3 . 前記第一、 第二の基板素片の前記ブリ ッジ部の間に亘つて補強フ ィル厶が貼付された請求の範囲第 1 1 項記載の複合配線板。  13. The composite wiring board according to claim 11, wherein a reinforcing film is attached between said bridge portions of said first and second substrate pieces.
1 . 前記第一、 第二のフレキシブル配線板のブリ ッジ部は、 一方が他 方よりも長く、 その長さの差は、 前記コンタク ト部が重ね合わされる部 分の長さの 2倍以上にされた請求の範囲第 1 1 項記載の複合配線板。 1 5 . 少なくとも一部表面に電子部品が搭載された請求の範囲第 1 1 項 記載の複合配線板。  1. One of the bridge portions of the first and second flexible wiring boards is longer than the other, and the difference in length is twice the length of the portion where the contact portions overlap. 12. The composite wiring board according to claim 11, which is configured as described above. 15. The composite wiring board according to claim 11, wherein an electronic component is mounted on at least a part of the surface.
1 6 . 少なくとも一枚のフレキシブル配線板と、 複数のリジッ ド配線板 とが積層された第三の基板素片と、 複数のリジッ ド配線板が積層された 第四の基板素片とが積層された複合配線板であって、  16. At least one flexible wiring board, a third board piece on which a plurality of rigid wiring boards are stacked, and a fourth board piece on which a plurality of rigid wiring boards are stacked. Composite wiring board,
前記第三の基板素片は、 前記フレキシブル配線板と前記リジッ ド配線 板とが重ねあわされた部分から成る基板素片本体と、 前記フレキシブル 配線板の端部であって、 前記基板素片本体の側面からはみ出たプリ ッジ 部とを有し、  The third substrate element is a substrate element body composed of a portion where the flexible wiring board and the rigid wiring board are overlapped with each other, and an end of the flexible wiring board, wherein the substrate element body is And a prism portion protruding from the side of the
前記ブリ ッジ部には、 前記フレキシブル配線板の配線膜が、 少なく と も一部は露出されてコンタク ト部が構成され、  In the bridge part, a wiring film of the flexible wiring board is at least partially exposed to form a contact part,
前記第四の基板素片は、 表面には配線膜の少なくとも一部が露出され、 前記第三、 第四の基板素片は、 前記第三の基板素片の前記ブリ ッジ部 で露出する前記配線膜と、 前記第四の基板素片の表面に露出する前記配 線膜とが電気的に接続された複合配線板。 In the fourth substrate element, at least a part of the wiring film is exposed on the surface, The third and fourth substrate pieces may include: the wiring film exposed at the bridge portion of the third substrate piece; and the wiring film exposed on the surface of the fourth substrate piece. Is a composite wiring board that is electrically connected.
1 7 . 少なくとも一部表面に電子部品が搭載された請求の範囲第 1 6項 記載の複合配線板。  17. The composite wiring board according to claim 16, wherein an electronic component is mounted on at least a part of the surface.
1 8 . 第一の筐体と第二の筐体とが、 軸を中心として所定角度だけ相対 的に回転可能に構成され、 前記第三、 第四の基板素片のうちの一方が前 記第一の筐体内に配置され、 他方が前記第二の筐体内に配置された請求 の範囲第 1 7項記載の複合配線板を内蔵する開閉型機器であって、 前記第三、 第四の基板素片の前記コンタク ト部同士が互いに接続され た部分は、 前記第一、 第二の筐体が開閉され、 前記ブリ ッジ部が屈伸す るときに、 屈伸しない位置に配置された開閉型機器。  18. The first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and one of the third and fourth substrate pieces is as described above. The open / close device incorporating the composite wiring board according to claim 17, wherein the third and fourth devices are disposed in a first housing, and the other is disposed in the second housing. A portion of the substrate piece where the contact portions are connected to each other is an opening / closing portion arranged at a position where the first and second housings are opened and closed and the bridge portion is bent and stretched. Type equipment.
1 9 . 第一の筐体と第二の筐体とが、 軸を中心として所定角度だけ相対 的に回転可能に構成され、 前記第三、 第四の基板素片のうちの一方が前 記第一の筐体内に配置され、 他方が前記第二の筐体内に配置された請求 の範囲第 1 6項記載の複合配線板を内蔵する開閉型機器であって、 前記ブリ ッジ部は前記軸内を通り、 且つ、 前記第三、 第四の基板素片 の前記コン夕ク 卜部同士が互いに接続された部分は、 前記軸の外部であ つて、 前 ΐ己第一又は第二の筐体のいずれか一方の内部に配置された開閉 型機器。  19. The first housing and the second housing are configured to be relatively rotatable about an axis by a predetermined angle, and one of the third and fourth substrate pieces is as described above. An open / close device incorporating the composite wiring board according to claim 16, wherein the bridge portion is disposed in the first housing, and the other is disposed in the second housing. The portion of the third and fourth substrate pieces that are connected to each other and that pass through the shaft and are connected to each other is outside the shaft and is the first or second housing. A switchgear device located inside one of the body.
PCT/JP2004/000024 2003-01-09 2004-01-07 Board piece, composite wiring board using the board piece, and openable/closable device WO2004064468A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003-003439 2003-01-09
JP2003003439 2003-01-09
JP2003-115489 2003-04-21
JP2003115489A JP2004266238A (en) 2003-01-09 2003-04-21 Composite wiring board and substrate element piece

Publications (1)

Publication Number Publication Date
WO2004064468A1 true WO2004064468A1 (en) 2004-07-29

Family

ID=32716376

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/000024 WO2004064468A1 (en) 2003-01-09 2004-01-07 Board piece, composite wiring board using the board piece, and openable/closable device

Country Status (3)

Country Link
JP (1) JP2004266238A (en)
TW (1) TWI249764B (en)
WO (1) WO2004064468A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8354596B2 (en) 2008-05-19 2013-01-15 Ibiden Co., Ltd. Multilayer wiring board and method for manufacturing the same
CN105578752A (en) * 2016-02-25 2016-05-11 广东欧珀移动通信有限公司 Soft and rigid combination plate and mobile terminal
CN111508903A (en) * 2019-01-30 2020-08-07 相互股份有限公司 Packaging substrate structure of electronic device and manufacturing method thereof

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173477A (en) * 2005-12-21 2007-07-05 Sumitomo Electric Ind Ltd Flexible printed wiring board
JP5095117B2 (en) * 2006-04-12 2012-12-12 日本メクトロン株式会社 Multilayer circuit board having cable portion and method for manufacturing the same
TW200803636A (en) * 2006-06-30 2008-01-01 Fujitsu Ltd Mound structure of printed board
CN101803482A (en) * 2007-07-13 2010-08-11 揖斐电株式会社 Wiring board and manufacturing method thereof
CN104684281B (en) * 2013-11-29 2018-02-23 深南电路有限公司 The preparation method and circuit board systems of circuit board systems
TWI620481B (en) * 2015-02-05 2018-04-01 Nippon Mektron Kk Method for manufacturing flexible printed circuit board and intermediate product for manufacturing flexible printed circuit board
JP6330956B2 (en) * 2017-07-11 2018-05-30 株式会社村田製作所 Resin multilayer substrate structure

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63188997A (en) * 1987-01-30 1988-08-04 日本写真印刷株式会社 Printed wiring board and manufacture of the same
JPH0336163U (en) * 1989-08-22 1991-04-09
JPH0420257U (en) * 1990-06-07 1992-02-20
JPH0575270A (en) * 1991-09-11 1993-03-26 Sony Chem Corp Manufacture of compound multilayer wiring board
JPH06268348A (en) * 1993-03-12 1994-09-22 Sony Chem Corp Composite flexible printed board
JPH06310874A (en) * 1993-04-23 1994-11-04 Nec Corp Folding type electronic apparatus
JPH06326424A (en) * 1993-05-17 1994-11-25 Sharp Corp Multilayer interconnection board
JPH0837379A (en) * 1994-07-21 1996-02-06 Hitachi Chem Co Ltd Manufacture of multilayered wiring board with terminal
JPH10224037A (en) * 1997-02-04 1998-08-21 Sharp Corp Manufacture of composite multilayer printed wiring board
JP2001251053A (en) * 2000-03-06 2001-09-14 Sony Corp Printed wiring board and method for manufacturing printed wiring board
WO2002003764A1 (en) * 2000-06-30 2002-01-10 Sanyo Electric Co., Ltd. Flexible printed circuit board and foldable cell phone terminal
JP2002290028A (en) * 2001-03-23 2002-10-04 Denso Corp Connection structure and method for printed wiring board

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63188997A (en) * 1987-01-30 1988-08-04 日本写真印刷株式会社 Printed wiring board and manufacture of the same
JPH0336163U (en) * 1989-08-22 1991-04-09
JPH0420257U (en) * 1990-06-07 1992-02-20
JPH0575270A (en) * 1991-09-11 1993-03-26 Sony Chem Corp Manufacture of compound multilayer wiring board
JPH06268348A (en) * 1993-03-12 1994-09-22 Sony Chem Corp Composite flexible printed board
JPH06310874A (en) * 1993-04-23 1994-11-04 Nec Corp Folding type electronic apparatus
JPH06326424A (en) * 1993-05-17 1994-11-25 Sharp Corp Multilayer interconnection board
JPH0837379A (en) * 1994-07-21 1996-02-06 Hitachi Chem Co Ltd Manufacture of multilayered wiring board with terminal
JPH10224037A (en) * 1997-02-04 1998-08-21 Sharp Corp Manufacture of composite multilayer printed wiring board
JP2001251053A (en) * 2000-03-06 2001-09-14 Sony Corp Printed wiring board and method for manufacturing printed wiring board
WO2002003764A1 (en) * 2000-06-30 2002-01-10 Sanyo Electric Co., Ltd. Flexible printed circuit board and foldable cell phone terminal
JP2002290028A (en) * 2001-03-23 2002-10-04 Denso Corp Connection structure and method for printed wiring board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8354596B2 (en) 2008-05-19 2013-01-15 Ibiden Co., Ltd. Multilayer wiring board and method for manufacturing the same
US8536457B2 (en) 2008-05-19 2013-09-17 Ibiden Co., Ltd. Multilayer wiring board and method for manufacturing the same
CN105578752A (en) * 2016-02-25 2016-05-11 广东欧珀移动通信有限公司 Soft and rigid combination plate and mobile terminal
CN111508903A (en) * 2019-01-30 2020-08-07 相互股份有限公司 Packaging substrate structure of electronic device and manufacturing method thereof

Also Published As

Publication number Publication date
JP2004266238A (en) 2004-09-24
TWI249764B (en) 2006-02-21
TW200421424A (en) 2004-10-16

Similar Documents

Publication Publication Date Title
WO2004064469A1 (en) Board piece and composite wiring board using the board piece
JP6140731B2 (en) Piezoelectric actuator, piezoelectric vibration device, and portable terminal
JP2022529170A (en) Rotation display device for electronic devices
WO2004064468A1 (en) Board piece, composite wiring board using the board piece, and openable/closable device
WO2008013070A1 (en) Flexible printed board, electronic device mounted with this, and flexible printed board folding method
WO1998038261A1 (en) Adhesive, liquid crystal device, method of manufacturing liquid crystal device, and electronic apparatus
WO2002015652A1 (en) Flexible wiring board for front-back connection
JPH1124097A (en) Liquid crystal display device
TW202018980A (en) Piezoelectric device and electronic device
JP4865067B1 (en) Electronics
KR20140099563A (en) Piezoelectric actuator, piezoelectric vibration apparatus and portable terminal
JP2007103466A (en) Multilayered printed circuit board and its manufacturing method, and electronic apparatus
JPS6139144A (en) Small-sized electronic equipment
JP2005011859A (en) Composite wiring board
JP5168586B2 (en) Flexible printed wiring board and electronic device
WO2018079110A1 (en) Multilayer substrate
JP4599117B2 (en) Plasma display device
JP2007299623A (en) Connecting board of folding-back type electric equipment
US20070163865A1 (en) Thin film circuit board of keyboard
WO2012161152A1 (en) Liquid crystal display device and electrical coupling structure
JP2006041044A (en) Multilayer flexible wiring circuit board
JP5547410B2 (en) Circuit device and electronic device
JP2011253926A (en) Double-sided flexible printed wiring board, connection structure and electronic apparatus
JP2023099458A (en) Vibration apparatus and apparatus including the same
JPS62276659A (en) Sheet-shaped compact electronic equipment

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)