WO2004053942A2 - Measuring alignment between a wafer chuck and polishing/plating receptacle - Google Patents
Measuring alignment between a wafer chuck and polishing/plating receptacle Download PDFInfo
- Publication number
- WO2004053942A2 WO2004053942A2 PCT/US2003/039221 US0339221W WO2004053942A2 WO 2004053942 A2 WO2004053942 A2 WO 2004053942A2 US 0339221 W US0339221 W US 0339221W WO 2004053942 A2 WO2004053942 A2 WO 2004053942A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensors
- wafer chuck
- gap
- section walls
- sensor
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Definitions
- the present application relates generally to electropolishing and/or electroplating metal layers on semiconductor wafers, and more particularly to measuring alignment between a wafer chuck and polishing/plating receptacle.
- wafers are initially sliced from a silicon ingot. The wafers then undergo multiple masking, etching, and deposition processes to form the electronic circuitry of semiconductor devices.
- electroplating a conductive film on a wafer is disclosed in U.S. Patent No. 6,391,166 Bl, titled PLATING APPARATUS AND METHOD, filed on January 15, 1999, which is incorporated herein by reference in its entirety.
- Electropolishing a metal layer on a wafer is disclosed in U.S. Patent No. 6,395,152, titled METHODS AND APPARATUS FOR ELECTROPOLISHING METAL INTERCONNECTIONS ON SEMICONDUCTOR DEVICES, filed on July 2, 1999, which is incorporated herein by reference in its entirety, and U.S. Patent No.
- an apparatus for electropolishing and/or electroplating metal layers on a semiconductor wafer includes a receptacle having a plurality of section walls.
- the apparatus includes a wafer chuck configured to hold the semiconductor wafer and to position the semiconductor wafer within the receptacle with a surface of the semiconductor wafer adjacent to top portions of the plurality of section walls.
- the apparatus also includes a first plurality of sensors configured to measure alignment between the center of one of the plurality of section walls to the center of the wafer chuck, and thus the center of the semiconductor wafer.
- FIG. 1 A is a top view of an exemplary polishing/plating receptacle
- FIG. IB is a side view of the exemplary polishing/plating receptacle depicted in FIG. 1 A taken along line IB-IB;
- FIG. 2A is a top view of another exemplary polishing/plating receptacle.
- FIG. 2B is a side view of the exemplary polishing/plating receptacle depicted in FIG. 2 A taken along line 2B-2B.
- receptacle 102 is depicted.
- receptacle 102 is depicted as being divided into six sections 108, 110, 112, 114, 116, and 118 by section walls 120, 122, 124, 126, and 128. It should be recognized, however, that receptacle 102 can be divided into any number of sections by any suitable number of section walls.
- a wafer chuck 104 holds and positions a wafer 106 within receptacle 102. More particularly, wafer 106 is positioned above the tops of sections walls 120, 122, 124, 126, and 128 to form a gap of about 0.5 millimeters to about 10 millimeters, preferably 5 millimeters. The gap facilitates the flow of electrolyte between the bottom surface of wafer 106 and the tops of sections walls 120, 122, 124, 126, and 128. As also depicted in FIG. IB, wafer chuck 104 can rotate wafer 106 within receptacle 102.
- Matching/aligning the center of chuck 104, and thus the center of wafer 106, with the center of section walls 120, 122, 124, 126, and 128 is desirable/critical to achieve uniform electrolyte flow pattern, and to obtain good uniformity of metal film plated on wafer 106. More particularly, in the present exemplary embodiment, wafer 106 and section walls 120, 122, 124, 126, and 128 are cylindrical in shape. Concentrically aligning the centers of wafer 106 and section walls 120, 122, 124, 126, and 128 increases the uniformity of the metal film plated on wafer 106 or polished from wafer 106. The centers are preferably matched/aligned within a tolerance in a range of 0.001 mm to 1 mm, and preferably less than 0.01 mm.
- sensors 130 and 132 are placed on section wall 120 and chuck 104, respectively, to measure the alignment.
- sensors 130 are disposed around the circumference of section wall 120, which lies within receptacle 102.
- sensors 132 are disposed around the circumference of chuck 104.
- sensors 130 and 132 are paired together. Each pair of sensors 130 and 132 measures a gap between section wall 120 and chuck 104. When the gaps measured by the pairs of sensors 130 and 132 are even, then the center of chuck 104, and thus wafer 106, is aligned concentric with the center of section wall 120.
- the center of wafer 106 and section walls 120, 122, 124, 126, and 128 are aligned to a tolerance in a range of 0.001 mm to 1 mm, and preferably less than 0.01 mm.
- the centers of chuck 104 and section wall 120 can be aligned for each wafer 106 processed in receptacle 102.
- the centers of chuck 104 and section wall 120 can be aligned after a set number of wafers 106 have been processed in receptacle 102.
- the alignment of centers of chuck 104 and section wall 120 can be measured before processing and after processing a wafer 106.
- the present exemplary embodiment is depicted having fours sensors 130 and 132 equally distributed in the circumference of tops of section wall 120 and chuck 104, respectively. It should be recognized, however, that any number of sensors, such as two sensors, can be used around the circumference of section wall 120 and chuck 104. It should also be recognized that sensors 130 can be disposed in various locations within receptacle 102.
- sensors 130 are disposed in perimeter wall 138.
- sensors 132 are disposed in an outer surface of chuck 104 rather than an inner surface of chuck 104.
- each pair of sensors 130 and 132 measure a gap between perimeter wall 138 and chuck 104.
- perimeter wall 138 is cylindrical and concentric with section walls 120, 122, 124, 126, and 128.
- the center of chuck 104 and thus the center of wafer 106, is aligned with the center of perimeter wall 138, and thus section walls 120, 122, 124, 126, and 128.
- Disposing sensors 130 in perimeter wall 138 and sensors 132 in an outer surface of chuck 104 has the advantage of shielding sensors 130 and 132 from the electrolyte, which is applied to wafer 106 during the electropolishing/electroplating process .
- sensors 130 and 132 can be optical sensors using optical reflectivity to measure the gap, or magnetic sensors, or capacitance type sensors, or ultrasonic sensors. Sensors 130 and 132 are preferably covered or shielded by coating anti- corrosive materials on the surface to prevent chemical corrosion from the electrolyte.
- sensors 134 and 136 are placed inside the bottom of receptacle 102 and chuck 104, respectively. As depicted in FIG. IB, sensors 134 and 136 are paired together. Each pair of sensors 134 and 136 measures a gap between bottom of receptacle 102 and chuck 104, which can be used to measure the gap between the top of section walls 120, 122, 124, 126, and 128 and wafer 106. It should also be recognized that sensors 134 can be disposed in various locations within receptacle 102, such as in perimeter wall 138.
- Sensors 134 and 136 can be optical sensors using optical reflectivity to measure the gap, or magnetic sensors, or capacitance type sensors, or ultrasonic sensors. Sensors 134 and 136 are preferably covered or shielded by coating anti-corrosive materials on the surface to prevent chemical corrosion from the electrolyte.
- the gap between wafer 106 and the tops of section walls 120, 122, 124, 126, and 128 can be measured for each wafer 106 processed in receptacle 102. Alternatively, the gap can be measured after a set number of wafers 106 have been processed in receptacle 102. Additionally, the gap can be measured before processing and after processing a wafer 106.
- sensors 130 are disposed in receptacle 102 by being embedded into perimeter wall 138, and sensors 132 are disposed in chuck 104 by being embedded in chuck 104.
- sensors 130 can be disposed in various locations within receptacle 102, such as in section wall 120 (as depicted in FIGs. 1A and IB).
- any number of sensors 130 can be used.
- sensors 130 can be a sensor ring formed at the top of perimeter wall 138.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020057010341A KR101299701B1 (en) | 2002-12-09 | 2003-12-09 | Measuring alignment between a wafer chuck and polishing/plating receptacle |
AU2003297814A AU2003297814A1 (en) | 2002-12-09 | 2003-12-09 | Measuring alignment between a wafer chuck and polishing/plating receptacle |
US10/538,402 US20070039827A1 (en) | 2003-12-09 | 2003-12-09 | Measuring alignment between a wafer chuck and polishing/plating receptacle |
JP2004558643A JP2006517055A (en) | 2002-12-09 | 2003-12-09 | Measuring alignment of wafer chuck and polishing / plating container |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43191602P | 2002-12-09 | 2002-12-09 | |
US60/431,916 | 2002-12-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004053942A2 true WO2004053942A2 (en) | 2004-06-24 |
WO2004053942A3 WO2004053942A3 (en) | 2006-12-07 |
Family
ID=32507823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/039221 WO2004053942A2 (en) | 2002-12-09 | 2003-12-09 | Measuring alignment between a wafer chuck and polishing/plating receptacle |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2006517055A (en) |
KR (1) | KR101299701B1 (en) |
CN (1) | CN100514581C (en) |
AU (1) | AU2003297814A1 (en) |
WO (1) | WO2004053942A2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5281358B2 (en) * | 2008-10-27 | 2013-09-04 | 学校法人常翔学園 | Polymer, transepithelial absorption promoter, and pharmaceutical preparation |
CN103590092B (en) * | 2012-08-16 | 2017-05-10 | 盛美半导体设备(上海)有限公司 | Device and method used for electrochemical polishing/electroplating |
CN105088328B (en) * | 2014-05-07 | 2018-11-06 | 盛美半导体设备(上海)有限公司 | Electrochemical polish liquid feed device |
CN111272089B (en) * | 2020-03-03 | 2022-06-28 | 中国科学院光电技术研究所 | In-situ gap detection device and detection method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6572742B1 (en) * | 1997-04-04 | 2003-06-03 | University Of Southern California | Apparatus for electrochemical fabrication using a conformable mask |
US6586342B1 (en) * | 2000-04-25 | 2003-07-01 | Novellus Systems, Inc. | Edge bevel removal of copper from silicon wafers |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63140529A (en) * | 1986-12-02 | 1988-06-13 | Toshiba Corp | Gap controller |
JP2547905B2 (en) * | 1991-08-30 | 1996-10-30 | 株式会社東芝 | Axis system abnormality detection device |
JP2988168B2 (en) * | 1992-12-25 | 1999-12-06 | 日立プラント建設株式会社 | Automatic piping groove alignment device |
JP3800616B2 (en) * | 1994-06-27 | 2006-07-26 | 株式会社ニコン | Target moving device, positioning device, and movable stage device |
KR100474746B1 (en) * | 1998-02-12 | 2005-03-08 | 에이씨엠 리서치, 인코포레이티드 | Plating apparatus and method |
US6395152B1 (en) * | 1998-07-09 | 2002-05-28 | Acm Research, Inc. | Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
JP2002193780A (en) | 1998-12-22 | 2002-07-10 | Marine Bio Kk | Ultraviolet light screening agent |
JP2002310153A (en) | 2001-04-18 | 2002-10-23 | Meidensha Corp | Rotating machine having magnetic bearing |
-
2003
- 2003-12-09 KR KR1020057010341A patent/KR101299701B1/en active IP Right Grant
- 2003-12-09 AU AU2003297814A patent/AU2003297814A1/en not_active Abandoned
- 2003-12-09 CN CNB2003801055158A patent/CN100514581C/en not_active Expired - Fee Related
- 2003-12-09 WO PCT/US2003/039221 patent/WO2004053942A2/en active Application Filing
- 2003-12-09 JP JP2004558643A patent/JP2006517055A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6572742B1 (en) * | 1997-04-04 | 2003-06-03 | University Of Southern California | Apparatus for electrochemical fabrication using a conformable mask |
US6586342B1 (en) * | 2000-04-25 | 2003-07-01 | Novellus Systems, Inc. | Edge bevel removal of copper from silicon wafers |
Also Published As
Publication number | Publication date |
---|---|
CN101233607A (en) | 2008-07-30 |
JP2006517055A (en) | 2006-07-13 |
KR20050084196A (en) | 2005-08-26 |
KR101299701B1 (en) | 2013-08-28 |
WO2004053942A3 (en) | 2006-12-07 |
AU2003297814A8 (en) | 2004-06-30 |
AU2003297814A1 (en) | 2004-06-30 |
CN100514581C (en) | 2009-07-15 |
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