WO2004045016A3 - Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards - Google Patents

Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards Download PDF

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Publication number
WO2004045016A3
WO2004045016A3 PCT/US2003/035317 US0335317W WO2004045016A3 WO 2004045016 A3 WO2004045016 A3 WO 2004045016A3 US 0335317 W US0335317 W US 0335317W WO 2004045016 A3 WO2004045016 A3 WO 2004045016A3
Authority
WO
WIPO (PCT)
Prior art keywords
ltcc
high power
spreading layer
boards
structures
Prior art date
Application number
PCT/US2003/035317
Other languages
French (fr)
Other versions
WO2004045016A2 (en
Inventor
Joseph Mazzochette
Ellen Schwartz Tormey
Barry Jay Thaler
Original Assignee
Lamina Ceramics Inc
Joseph Mazzochette
Ellen Schwartz Tormey
Barry Jay Thaler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lamina Ceramics Inc, Joseph Mazzochette, Ellen Schwartz Tormey, Barry Jay Thaler filed Critical Lamina Ceramics Inc
Priority to EP03783173A priority Critical patent/EP1568070A4/en
Priority to AU2003291243A priority patent/AU2003291243A1/en
Priority to JP2004551781A priority patent/JP2006506810A/en
Publication of WO2004045016A2 publication Critical patent/WO2004045016A2/en
Publication of WO2004045016A3 publication Critical patent/WO2004045016A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreading layer on or near the outer surface and one or more thermal vias through the ceramic to thermally couple the spreading layer to the core. The vias and the spreading layer comprise electrically insulating thermally conductive materials. The resulting structure provides rapid heat dissipation for a high power component formed or mounted on or near the spreading layer.
PCT/US2003/035317 2002-11-12 2003-11-06 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards WO2004045016A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03783173A EP1568070A4 (en) 2002-11-12 2003-11-06 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
AU2003291243A AU2003291243A1 (en) 2002-11-12 2003-11-06 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
JP2004551781A JP2006506810A (en) 2002-11-12 2003-11-06 Method and structure for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42559902P 2002-11-12 2002-11-12
US60/425,599 2002-11-12

Publications (2)

Publication Number Publication Date
WO2004045016A2 WO2004045016A2 (en) 2004-05-27
WO2004045016A3 true WO2004045016A3 (en) 2005-07-07

Family

ID=32313022

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/035317 WO2004045016A2 (en) 2002-11-12 2003-11-06 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards

Country Status (5)

Country Link
EP (1) EP1568070A4 (en)
JP (1) JP2006506810A (en)
KR (1) KR20050086589A (en)
AU (1) AU2003291243A1 (en)
WO (1) WO2004045016A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7269017B2 (en) * 2004-11-19 2007-09-11 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices on laminate ceramic substrate
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
CN114614228A (en) * 2020-12-09 2022-06-10 深南电路股份有限公司 Coupler and electronic equipment
CN114804643A (en) * 2022-03-14 2022-07-29 重庆科技学院 High-bending-strength microcrystalline glass-based low-temperature co-fired ceramic material and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256469A (en) * 1991-12-18 1993-10-26 General Electric Company Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
US6023413A (en) * 1997-02-03 2000-02-08 Nec Corporation Cooling structure for multi-chip module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
US5386339A (en) * 1993-07-29 1995-01-31 Hughes Aircraft Company Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink
US5604673A (en) * 1995-06-07 1997-02-18 Hughes Electronics Low temperature co-fired ceramic substrates for power converters
JPH09153679A (en) * 1995-11-30 1997-06-10 Kyocera Corp Stacked glass ceramic circuit board
DE19640959A1 (en) * 1996-10-04 1998-04-09 Bosch Gmbh Robert Multilayer circuit or sensor substrate of glass-ceramic
DE29623190U1 (en) * 1996-11-28 1997-12-11 Siemens Ag Multi-layer circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256469A (en) * 1991-12-18 1993-10-26 General Electric Company Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
US6023413A (en) * 1997-02-03 2000-02-08 Nec Corporation Cooling structure for multi-chip module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1568070A4 *

Also Published As

Publication number Publication date
KR20050086589A (en) 2005-08-30
EP1568070A2 (en) 2005-08-31
WO2004045016A2 (en) 2004-05-27
JP2006506810A (en) 2006-02-23
AU2003291243A1 (en) 2004-06-03
EP1568070A4 (en) 2008-05-07
AU2003291243A8 (en) 2004-06-03

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