WO2004044672A2 - System and method for manufacturing wireless devices - Google Patents
System and method for manufacturing wireless devices Download PDFInfo
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- WO2004044672A2 WO2004044672A2 PCT/US2003/024503 US0324503W WO2004044672A2 WO 2004044672 A2 WO2004044672 A2 WO 2004044672A2 US 0324503 W US0324503 W US 0324503W WO 2004044672 A2 WO2004044672 A2 WO 2004044672A2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D3/00—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups
- G01D3/028—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure
- G01D3/036—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
- G01D3/0365—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves the undesired influence being measured using a separate sensor, which produces an influence related signal
Definitions
- the present invention relates to electronic devices, and more particularly to wireless sensors fabricated by thermal spray technology.
- Sensor signal extraction can be considered in two classes, wire-based and wireless.
- Wire-based sensors represent a large and diverse class of applications in which electrical wires are physically connected to the sensor or sensor system, and a signal is delivered to a point of interest, hi many situations, such an approach is adequate.
- Wireless sensors transmit the sensor data using electromagnetic, optical, acoustical, or other means of information transmittal to a suitable receiver.
- Electromagnetic (EM) wireless sensors represent a significant portion of wireless signal extraction techniques.
- Wireless EM sensors can be further classified as active or passive.
- Active wireless sensor systems modulate an EM signal in response to the sensor output and need some form of power supply in the sensor circuit itself to provide the energy needed to relay the sensor information to a suitable receiver.
- Such systems suffer from several significant drawbacks: they need either periodic replacement of the energy source, e.g., a battery, or some form of renewable energy source, which can be expensive, adds complexity, and can be unreliable. Further, they almost invariably incorporate silicon-based active electronics, which need additional measures for protection in harsh environments while also providing limits on the temperatures at which the devices can be used.
- Active wireless systems are typically large and bulky, and thus require additional space, special provisions for sensor, electronic, and power supply attachment, and can be difficult to integrate directly into functional components.
- Passive wireless sensors derive the energy needed for signal transmission from an outside source. Variations of this technique include 1) modulating an externally applied source signal, 2) temporarily storing the externally applied energy in a storage medium, after which it is used to transmit the signal, and 3) converting one form of energy into another. Passive wireless systems that temporarily store energy to power active electronics suffer from the same drawbacks as their active counterparts discussed above.
- U.S. Patent 6,254,548 by Ishikawa et al. represents an example of an active wireless sensor that needs no battery. It teachers of a small spherical-shaped wireless temperature transponder utilizing active electronics that are powered by converting an externally applied EM field into electrical energy suitable to drive the encapsulated electronics.
- the sensor however, is active, and utilizes silicon-based components.
- U.S. Patent 6,113,553 by Chubbuck teaches of a passive wireless sensor to measure intracranial pressure.
- the sensor element is embedded within the skull of the patient and an external probe is placed on the other side of the skull to record the pressure.
- a bellows in the sensor deforms according to the imposed pressure and alters the resonance frequency of the circuit, which is recorded by the external probe.
- the probe assembly is bulky, complicated, needs considerable labor and expense to fabricate, and relies on mechamcal deformation of the bellows (which can be unreliable and prone to failure), and needs the receiver (the probe) to be placed within a few millimeters of the sensor for accurate readout.
- U.S. Patent 5,818,340 by Yanklelun and Flanders discloses a passive wireless sensor system to measure moisture in the roofs of structural buildings.
- An inductor-capacitor resonant circuit is formed in which the capacitor is formed by two concentric plates with a moisture-sensitive dielectric between said plates. Variations in moisture result in variations in capacitance, which shift the resonant frequency of the circuit.
- An external antenna provides an RF pulse to an array of such sensors on a rooftop, and then records the resonant frequencies of the sensor systems. Moisture content is detected by a shift in resonant frequency from that of the dry sensors.
- U.S. Patent 5,278,442 by Prinz, Weiss, and Siewiorek teaches the use of thermal spray to form electronic packages and smart structures, including strain gauges and thermocouples.
- the thermal spray method of Prinz is complex, cumbersome, slow, and limited in feature size because it relies on a series of masks to selectively deposit material in a multi-layer fashion.
- the sensors need to be fabricated in a separate manufacturing step at a specialized facility for such devices, followed by the attachment of the sensor device to the surface or component of interest, typically after the component has been manufactured.
- antennas need to be added, adding additional cost, time, and labor.
- the addition of the sensing system in many cases degrades the performance of the component, for example, thermocouples that need to be cemented to surfaces for fluid flow can result in flow disturbance and turbulence formation as a result of the added devices.
- Electronic manufacturing with feature sizes in the meso-scale regime typically needs multi-step processes that include time-consuming photolithographic methodologies.
- the time needed between iterations is typically measured in terms of weeks, hi addition, thick film electronics based on the ceramic multi-chip module technology, including low temperature co-fired ceramic modules (LTCC-M) and high temperature co-fired ceramic modules (HTCC-M) need firing of the screen printed pastes to moderate -800C for LTCC-M or high 1400C for HTCC-M.
- the high temperature curing process sets-up issues associated with mismatch in thermal expansion between dissimilar materials and can lead to premature debonding. This needs to be accounted for during the processing through careful tailoring of the properties of the layered materials.
- Current screen printing technology is inherently limited in its fine feature capabilities; the line width being limited to 100 microns or higher.
- a differential wireless sensing device comprises a first resonant device impinged on a substrate having a predetermined natural frequency, the first resonant device having a changeable resonant frequency in response to an environmental condition and an second resonant device impinged on the substrate having a predetermined static resonant frequency.
- the differential device further comprises a frequency detector for receiving the changeable resonant frequency and the static resonant frequency. A difference between the changeable resonant frequency and the static resonant frequency is proportional to a change in the environmental condition.
- an electronic device comprises a substrate, and a feature comprising an output, wherein the feature is an accumulated material impinged on the substrate.
- the feature is a sensing device among a plurality of sensing devices placed in range of a transmitter, wherein each of the plurality of sensing devices emits a unique predetermined resonant frequency in response to a signal of the transmitter.
- the electronic device further comprises a receiver in the range of the plurality of sensing devices, wherein the receiver individually interrogates each of the plurality of sensing devices according to the resonant frequency of each of the plurality of sensing devices.
- the feature is a resonant device impinged on the substrate having a predetermined natural frequency, the first resonant device having a changeable resonant frequency in response to an environmental condition, wherein the output is the resonant frequency.
- the feature is a magnetic sensor for sensing a magnetic field of a current carrying conductor.
- the magnetic sensor has a nonlinear response to the magnetic field.
- the magnetic sensor comprises a coil around a permeable magnetic core, wherein the coil comprises two layers of impinged material formed on two sides of the permeable magnetic core, the two layers overlapping the magnetic core.
- the feature is a temperature sensor for sensing a temperature of a current carrying conductor.
- the feature is a voltage sensor for sensing a voltage of a current carrying conductor.
- the feature is functional as deposited.
- Figure 1 is a flow chart of a thermal spray method
- Figure 2 A is a diagram of a thermal spray system according to an embodiment of the present invention.
- Figure 2B is a diagram of a thermal spray system according to an embodiment of the present invention.
- Figures 3A-E are diagram of exemplary devices according to an embodiment of the present invention.
- Figures 4A to 4D are a diagram of a passive wireless radio-frequency identification tag according to an embodiment of the present invention
- Figure 4E is a graph of frequency responses according to the devices of Figure 4B to 4D;
- Figure 5 is a diagram of a wireless sensor read-out system according to an embodiment of the present invention
- Figure 6 is a graph of a voltage at a receiving coil as a function of frequency, according to an embodiment of the present invention
- Figure 7 is a diagram of an inductive-capacitive circuit according to an embodiment of the present invention.
- Figure 8 is a graph of a response signal of the device shown in Figure 7, according to an embodiment of the present invention.
- Figure 9 is a diagram of a differential sensor according to an embodiment of the present invention.
- Figure 10 is a diagram of a temperature-based passive wireless sensor circuit according to an embodiment of the present invention
- Figure 11 is a diagram of a varactor-based passive wireless sensor circuit according to an embodiment of the present invention
- Figure 12A is a diagram a response signal of a wireless magnetic-based current sensor according to the embodiment of the present invention.
- Figure 12B is a graph of a response signal of a wireless magnetic-based current sensor according to the embodiment of the present invention.
- thermal spray is a directed spray process in which material is accelerated to high velocities and impinged upon a substrate, where a dense and strongly adhered deposit is built.
- Material 101 is injected in the form of, for example, a powder, wire, or rod, into a high velocity combustion or thermal plasma flame 102, which imparts thermal and kinetic energy to the particles 103.
- a high velocity combustion or thermal plasma flame 102 which imparts thermal and kinetic energy to the particles 103.
- material state e.g., molten, softened
- the ability to melt, rapidly solidify and consolidate introduces the possibility of the synthesizing useful deposits at or near ambient temperature.
- the deposit is built-up by successive impingement of droplets, which yield flattened, solidified platelets, and referred to as 'splats' 104.
- thermal spray can be used for mesoscale (e.g., about lOO ⁇ m to 10mm) structures, particularly for electronic applications.
- Thermal spray methods can be used to form thick (e.g., about greater than 20 ⁇ m), smooth deposits of a wide range of ceramics, including for example, alumina, spinel, zirconia, and barium titanate.
- thin (e.g., about less than 200 ⁇ m wide) metallic lines of Ag, Cu, as well as Ni-based alloys have been produced with square sides and that have electrical conductivities as good as, and in some cases superior to, conductor lines formed using traditional thin-film methods.
- Methods for spray production of coatings and direct-write lines can be comprised of any thermal spray techniques, including combustion, wire-arc, thermal plasmas and non-thermal, solid-state deposition, such as cold-spray.
- the advantages of direct-write thermal spray for sensor fabrication include robust sensors integrated directly into coatings, thus providing improved coating performance monitoring, high-throughput manufacturing and high-speed direct-write capability, and useful materials electrical and mechanical properties in the as-deposited state.
- Other advantages include the cost effective nature, wherein the method is efficient and able to process in virtually any environment, robotics-capable implementations for difficult-to-access and severe environments, the methods can be applied on a wide range of substrates and conformal shapes, and the methods rapidly translatable development to manufacturing using existing infrastructure.
- Thermal spray methods can produce blanket deposits of films and coatings 105 as shown in Figure 1, as well as patches, lines and vias.
- Multilayered structures can be produced on plastic, metal, and ceramic substrates, both planar and conformal.
- Embedded functional electronics and sensors can be over coated with a protective coating, allowing applications in harsh environments. Such embedded harsh environment sensors can be used for condition-based maintenance of engineering components.
- Sensors deposited by thermal spray can be interrogated using a passive (e.g., non- energy consuming) readout strategy.
- sensors fabricated by thermal spray processes are designed to shift frequency, amplitude, phase, Q-factor, etc. in response to environmental conditions, including for example, temperature and emissions of other devices.
- the sensor parameters can be extracted according to changes in, for example, frequency, amplitude, phase, and Q-factor. Additional advantages of thermal spray techniques for fabricating sensors includes the ability to make multi-layer devices, to use a wide variety of materials, to fabricate devices onto conformal surfaces, and to fabricate sensors onto engineering components and pre-existing structures.
- a system for fabricating an electronic device comprises a thermal spray device 201 for depositing a material and a programmable motion device 202 supporting a thermal spray nozzle or a substrate 203 being written on.
- the programmable motion device 202 comprises a processor for receiving instructions and an articulated arm 204 supporting at least the thermal spray nozzle 205 or the substrate being written on as shown in Figure 2B.
- the articulated arm 204 follows the instructions received by the processor to write a device pattern to the substrate.
- the system for fabricating an electronic device comprising a thermal spray device maybe implemented in various forms of hardware, software, firmware, special purpose processors, or a combination thereof.
- the present invention may be implemented in software as an application program tangibly embodied on a program storage device.
- the application program may be uploaded to, and executed by, a machine comprising any suitable architecture.
- Direct-write thermal spray electronics technologies provide an opportunity to integrate mesoscopic electronic devices with a physical structure on which the electronic systems will be used, eliminating the need for a traditional printed wiring board substrate.
- a direct-write thermal spray system's ability to print electronic features on flexible substrates, e.g., fabrics, polymers, and brass, enables applications for deployable electronics, such as placing electronics in projectiles, for flexible satellite solar arrays, usage in rolled-up forms that can be inserted into symmetric or odd shapes, installed on military gear, as well as various surveillance equipment.
- Writing a device directly onto a component being monitored saves space and reduces weight through 3-D integration.
- Direct-write thermal spray provides a cost savings by reducing the number of discrete passive components in automated fabrication and minimizing procurement.
- Direct-write thermal spray reduces inventories of electronic components or parts. Specialty parts can be built on the "fly" without mass production set-up costs. Direct-write thermal spray also increases the reliability of rugged electronic components due to the automated assembly process and the absence of solder joints.
- electronic devices such as sensors and sensor systems are seamlessly integrated into the functional components.
- the devices are capable of withstanding harsh environments.
- a sensor system is transparent to a system being interrogated, e.g., the sensor system does not disturb or alter the system being interrogated.
- a sensor that is directly embedded into the component, in a coordinated manner has an advantage in terms of reliability, longevity, and minimal disturbance of system function. Methods, designs, and processes have been developed to fabricate a variety of sensors for harsh environments.
- examples include inductors/transformers (Figure 3A), thermistors (Figure 3B), magnetic sensors ( Figure 3C), RF elements (Figure 3D, and microheaters (Figure 3E) (e.g., for integration into chemical and biological sensors).
- Further examples include strain gauges, thermocouples, thermopiles (e.g., thermocouples in series for power generation), piezo sensors, interdigitated capacitors for L-C circuits, and antennas.
- sensor and electronic devices are prepared in-situ and in environmentally friendly "lean” manufacturing method.
- a suite of passive, wireless methodologies can be used to monitor sensor output.
- the sensors are fabricated using a direct-write thermal spray, and a wide variety of capabilities are possible.
- a passive radio-frequency (RF) tag is inductive-capacitive circuit (LC) as illustrated in Figure 4A.
- LC inductive-capacitive circuit
- the readout of these sensors needs detection of the resonance frequency and the excitation (transmitted) RF signal may interfere with detection.
- the ring down period after the excitation is turned off is used to detect the resonance frequency of the device ( Figure
- Remote detection can be used even if it is not possible to make an electric connection to the device.
- a humidity sensor can be placed inside of a sealed container and the integrity of the seal tested by determining the relative humidity by remote sensing.
- An RF transparent window into the container is provider to read the sensor.
- Uniquely resonant frequencies can be achieved according to a predetermined requirement.
- a RFID tag can be coupled to a host of sensors. When excited with a broadband signal sweep, the sensors will respond at their appropriate frequencies and can provide relevant information for unique identification and interrogation.
- Figure 4E show frequency responses for the devices shown in Figure 4B to 4D.
- differential detection can also be used with passive RF sensors.
- a number of similar LC devices are used: one has a capacitor that is sensitive to the parameter being measured, e.g., temperature or humidity and the other has a fixed capacitor with a fixed resonance frequency.
- the differential detection method can be used in continuous mode with a constant excitation in a frequency band encompassing the resonance frequency ( Figure 4A).
- the receiver used to detect the signal is tuned to a band encompassing the difference frequency.
- the value of the resonance frequency, f x of the sensor circuit can be determined.
- the value of the sensed parameter humidity, temperature, etc.
- a calibration curve can be determined to establish the relationship between fdiff and the sensed parameter.
- thermal spray can be used to design and optimize the response of the sensor circuit, for example the frequency change, for a given change in the source to be sensed.
- the appropriate choice of, for example, component values, materials, geometry, overcoating, componet proximity, and thermal spray deposition parameters can be made to provide the optimum, for example the largest, frequency shift for a fixed change in the source.
- Many sensors change resistance in response to a change in the measured variable of interest. Thermistors, magnetoresistive and piezoresistive sensors are examples. Also gas composition sensors using conductive oxides are of this type. The remote sensing of a change in resistance uses the change in the Q of the resonant circuit rather than a change in the resonant frequency.
- MIR Micropower Impulse Radar
- PFM Pulse Frequency Modulation
- AM Amplitude Modulation
- Magnetic fields or currents can be sensed by the change in inductance of a coil with a permeable core.
- the core When the core is saturated the permeability decreases and the change in the inductance of the coil changes the resonance frequency.
- the response is nonlinear so this type of magnetic field sensor is best suited for on/off sensing, for example, remotely determining if there is current flowing in a high tension power line.
- the conductor lines, dielectrics, inductors and sensor materials can be prepared having properties suitable for high quality RF circuits.
- thermal spray technology is implemented for developing multilayer sensors for enhanced performance.
- the wireless RF concepts discussed above can be extended by fabricating several devices on top of one another. For example different LC sensor systems can be fabricated on top of previous devices by thermal spraying an insulating layer between devices. In this fashion, all devices would experience approximately the same sensing environment, however each sensor would report on the individual quantity that it is measuring.
- properties of fabricated components can be increased without significant increase in surface area needed for their fabrication.
- Inductance and capacitance values for example, can be increased by fabricated several devices, for example parallel-plate capacitors, on top of each other, this fashion a far wider array of electronic component values can be achieved with the same physical footprint.
- thermal spray technology can be deposited on a wide variety of material.
- materials include a wide variety of metals, including refractory metals, semiconductor materials, ceramics, dielectric materials, plastics and polymers. This is in contrast to traditional electronics manufacturing techniques, which can be considerably limited in the types of materials that can be deposited. Only a small number of materials, for example, are compatible with most traditional microelectronics manufacturing.
- the unique material versatility of thermal spray provides the capability to produce sensors and electronics from a wide variety of material combinations, thus providing unique sensor and electronic capabilities. Examples include the ability to deposit refractory materials such as NiCr, tungsten, and molybdenum; semiconductors, such as silicon and germanium; and various ceramics. In addition interfaces for such materials, including semiconductor-metal, metal-metal, metal-dielectric junctions and interfaces, etc., can be fabricated with relative ease.
- sensors and electronic components can be fabricated on conformal, or non-flat surfaces. Since the deposition tool can move in three-dimensional space, it can follow the surface contour of a component, thus providing the unique capability to deposit material and fabricate sensors on complex geometries, for example, the inside or outside surfaces of automobile components, helmets, airplane components, etc. Furthermore, surfaces that are constantly deforming, for example melting or solidifying materials, objects undergoing strain or thermal expansion, moving objects, for example, on a manufacturing line, are well suited for this technology, for the write process can be dynamically adjusted in real time to accommodate the time- varying geometry of the surface. Direct-write thermal spray techriology is very robust in its ability to deposit on existing structures.
- Deposition can be done in atmospheric conditions at ambient pressure, as contrasted to the very high vacuum and contaminant-free conditions needed in thin-film manufacturing, for example.
- Examples of pre-existing structures comprising, for example, brick, concrete, stone and other natural materials, wood, both painted and bare metal, trees and plants, plastics, etc., are compatible with the thermal spray direct-write process.
- the sensors and electronics are functional immediately after deposition. No high-temperature firing, annealing, or other postprocessing is needed for these materials, which represents unique and significant advantage over many other processing techniques.
- Thermal spray can provide functional coatings for wear, thermal and corrosion protection for a wide variety of engineering components, including turbines and internal combustion engine components, bridges and other severe-weather structures, medical and dental implants, etc.
- Direct-write thermal spray for sensor fabrication is self-compatible with traditional thermal spray processes.
- Functional sensors can be embedded directly onto engineering components and pre-existing structures that are subsequently overcoated with traditional thermal spray or other protective coatings. In this fashion, sensors and electronics can be integrated directly into functional thermal spray coatings to protect components.
- the sensors are integrated directly into the coatings, the deleterious effects associated with mechanical attachment of third-party sensors to components is minimized, while the sensor itself enjoys protection from the coating in which it is embedded, resulting in improved reliability of the sensor, and thus the component, reduced maintenance costs, longer sensor life, and improved sensor accuracy over its life cycle.
- a Si-based thermistor is connected in parallel with a coil and capacitor to produce a resonant RLC circuit whose resonant amplitude varies as the thermistor resistance changes.
- the thermistor material in this case was thermal-sprayed doped silicon.
- RLC sensor circuit was placed between two circular coils separated by approximately 50cm. One coil is driven by a frequency generater, and the second is connected to a lock-in amplifier. The RLC sensor circuit is placed between the two coils, and the voltage at the receiving coil is monitored as a function of frequency, as a shown in the Figure 6.
- Humidity can be sensed by using a resonant LC circuit.
- a dielectric material whose dielectric constant depends on humidity, for example, Al 2 O 3 or MgO-3Al O 3
- An example of such LC device fabricated using thermal spray technology is shown in Figure 7.
- a differential sensor comprises an exposed sensing element and a protected sensing element.
- one or more components e.g., resistor, inductor, or capacitor, are exposed to a source to be sensed.
- a capacitor 901 of a first sensor 900 is exposed.
- the inductor 902 and resistor 903 are protected by a coating 904.
- a second device 905 is provided.
- the second device has a known characteristic.
- the second device may have the same layout as the first device.
- the second device is protected by a coating 906, such that the known characteristic does not change. Therefore, a difference between the first device 900 and the second device 905 can be determined.
- the deference corresponds to a condition of the source being sensed.
- a temperature-based passive wireless sensor circuit can be built using thermal spray.
- the temperature-based passive wireless sensor circuit comprises a first circuit 1000 including a temperature-dependent capacitor 1001.
- a second circuit 1002 is thermally coupled to the first circuit 1000.
- the second circuit 1002 comprises a voltage- producing sensor 1003, such as a thermocouple, thermopile, piezoelectric sensor, or a magnetic sensor.
- the voltage-producing sensor 1003 generates I R heating in resistor 1004, which is affected by the temperature-dependent capacitor 1001. Change in a capacitance value results in a shift in a resonant frequency of the first circuit 1000.
- the shift can be detected with a receiver in proportion to a change in the source to be sensed.
- FIG. 11 Yet another example of a device fabricated by thermal spray according to an embodiment of the present invention is shown in Figure 11 as a varactor-based passive wireless sensor circuit 1100.
- the sensor circuit 1100 comprises a varactor 1101 and a voltage-producing sensor 1102, e.g., a thermocouple, thermopile, piezoelectric sensor, or magnetic sensor.
- the voltage-producing sensor 1102 changes capcitance or the varactor 1101.
- a change in the capacitance of the varactor 1101 results in a shift in a resonant frequency of the LC circuit 1103.
- the shift in the resonant frequency can be detected with a receiver where the shift is proportional to a change in a condition of a source being sensed.
- a magnetic sensor as shown in Figure 3C can sense of a current carrying conductor.
- the current carrying conductor 1201 produces a magnetic field perpendicular to the current direction, I.
- the intensity of magnetic field is proportional to the current.
- Magnetic fields or currents can be sensed by the change in inductance of a coil 1202 with a permeable magnetic core, which is placed close to the current carrying conductor. Initial magnetic induction of the core is linear to the magnetic field and hence is expected to exhibit a linear response with the conductor current. Using a calibration of the inductor output, current can be measured directly.
- a second type of sensor can be developed for this setup, h this design, when the core is saturated the permeability decreases drastically and the inductance of the coil changes accordingly. This response is nonlinear so this type of magnetic field sensor is best suited for on/off sensing, for example, remotely determining if there is current flowing in a high tension power line.
- several sensors can be combined to monitor several parameters of a device or component. For example, temperature, current, and voltage sensors can be combined to simultaneously monitor temperature, current, and voltage, respectively, on a high tension power line. Each sensor would have its own unique resonant frequency in this case.
- the inductor sensor has a coil around a permeable magnetic core. The coil was made by direct-write process whereas the magnetic core was deposited by traditional thermal spray methods.
- FIG. 12A A schematic of an inductive current sensor is shown in Figure 12A.
- Two inductive sensors are placed close to the current carrying conductor. The sensors were connected in series so that the output voltage of the sensors is added and it can be measured as a function of conductor current. The current was varied from about 0 to 200 Amps using an A.C. current source.
- the preliminary results of inductive current sensor are shown in Figure 12B. One can observe a linear response between the sensor output and the current and it demonstrates the application of an inductive device as a current sensor.
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AU2003301935A AU2003301935A1 (en) | 2002-08-05 | 2003-08-05 | System and method for manufacturing wireless devices |
EP03811202A EP1573484A4 (en) | 2002-08-05 | 2003-08-05 | System and method for manufacturing wireless devices |
US10/491,689 US7477050B2 (en) | 2003-08-05 | 2003-08-05 | Magnetic sensor having a coil around a permeable magnetic core |
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US40115402P | 2002-08-05 | 2002-08-05 | |
US60/401,154 | 2002-08-05 |
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WO2006061384A1 (en) | 2004-12-08 | 2006-06-15 | Siemens Aktiengesellschaft | Cold gas spraying method |
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DE102008024504A1 (en) | 2008-05-21 | 2009-11-26 | Linde Ag | Method and apparatus for cold gas spraying |
DE102009053987A1 (en) | 2009-11-23 | 2011-06-01 | Linde Aktiengesellschaft | Method and device for producing a multilayer coil |
EP2333133A1 (en) | 2009-11-23 | 2011-06-15 | Linde Aktiengesellschaft | Method and device for manufacturing a multilayer coil |
US8444377B2 (en) | 2009-10-07 | 2013-05-21 | General Electric Company | Method for attaching a connector to deposited material |
EP2620751A1 (en) * | 2012-01-27 | 2013-07-31 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Measurement device with resonant sensors |
DE102005054393B4 (en) | 2004-11-25 | 2018-04-26 | Fuji Electric Co., Ltd. | Method for producing an insulating substrate |
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DE102005054393B4 (en) | 2004-11-25 | 2018-04-26 | Fuji Electric Co., Ltd. | Method for producing an insulating substrate |
CN101072897B (en) * | 2004-12-08 | 2010-05-12 | 西门子公司 | Cold gas spraying method |
WO2006061384A1 (en) | 2004-12-08 | 2006-06-15 | Siemens Aktiengesellschaft | Cold gas spraying method |
US8012601B2 (en) | 2004-12-08 | 2011-09-06 | Siemens Aktiengesellschaft | Cold gas spraying method |
NL1033148C2 (en) * | 2006-12-29 | 2008-07-01 | Univ Delft Tech | Electric measuring device, method and computer program product. |
WO2008082302A1 (en) * | 2006-12-29 | 2008-07-10 | Technische Universiteit Delft | Electrical measuring device, method and computer program product |
US8530391B2 (en) | 2008-05-21 | 2013-09-10 | Linde Aktiengesellschaft | Method and device for cold gas spraying |
DE102008024504A1 (en) | 2008-05-21 | 2009-11-26 | Linde Ag | Method and apparatus for cold gas spraying |
US8444377B2 (en) | 2009-10-07 | 2013-05-21 | General Electric Company | Method for attaching a connector to deposited material |
EP2333133A1 (en) | 2009-11-23 | 2011-06-15 | Linde Aktiengesellschaft | Method and device for manufacturing a multilayer coil |
DE102009053987A1 (en) | 2009-11-23 | 2011-06-01 | Linde Aktiengesellschaft | Method and device for producing a multilayer coil |
FR2986320A1 (en) * | 2012-01-27 | 2013-08-02 | Commissariat Energie Atomique | MEASURING DEVICE WITH RESONANT SENSORS |
EP2620751A1 (en) * | 2012-01-27 | 2013-07-31 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Measurement device with resonant sensors |
Also Published As
Publication number | Publication date |
---|---|
WO2004044672A3 (en) | 2009-07-16 |
AU2003301935A8 (en) | 2004-06-03 |
EP1573484A4 (en) | 2010-11-03 |
WO2004044672A9 (en) | 2004-07-08 |
AU2003301935A1 (en) | 2004-06-03 |
EP1573484A2 (en) | 2005-09-14 |
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