WO2004036232A1 - Electric connector - Google Patents

Electric connector Download PDF

Info

Publication number
WO2004036232A1
WO2004036232A1 PCT/JP2002/010836 JP0210836W WO2004036232A1 WO 2004036232 A1 WO2004036232 A1 WO 2004036232A1 JP 0210836 W JP0210836 W JP 0210836W WO 2004036232 A1 WO2004036232 A1 WO 2004036232A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
probe
lower plate
electrical connection
connection device
Prior art date
Application number
PCT/JP2002/010836
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroyuki Aso
Atsushi Tanabe
Koji Noro
Yutaka Funamizu
Original Assignee
Kabushiki Kaisha Nihon Micronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Nihon Micronics filed Critical Kabushiki Kaisha Nihon Micronics
Priority to PCT/JP2002/010836 priority Critical patent/WO2004036232A1/en
Priority to AU2002343999A priority patent/AU2002343999A1/en
Publication of WO2004036232A1 publication Critical patent/WO2004036232A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18—End pieces terminating in a probe

Definitions

  • the present invention relates to an electrical connection device such as a probe card used for an electrical test of a test object such as a semiconductor device such as an integrated circuit.
  • the extension direction of each probe that is, the thickness direction of the plate member to which the probe is attached is referred to as the vertical direction.
  • the device under test such as a semiconductor device
  • a conduction test to determine whether or not the internal circuit operates according to specifications.
  • Such an energization test is performed using an electrical connection device such as a probe card in which a plurality of contacts, such as probes, whose needle tips are pressed against electrodes of a device under test, are arranged on the lower surface of an insulating substrate.
  • this type of electrical connection device there is a vertical device in which a plurality of probes made of thin metal wires are vertically assembled on a substrate, and a needle tip (lower end) is pressed against an electrode of a device under test.
  • a vertical device in which a plurality of probes made of thin metal wires are vertically assembled on a substrate, and a needle tip (lower end) is pressed against an electrode of a device under test.
  • the vertical type device is easier to assemble the probe than a conventional general device in which an L-shaped bent probe is mounted on a substrate in a cantilever shape, so it is inexpensive and has a needle tip. Since the arrangement density of the electrodes can be increased, it is suitable for a current test of a high-density test object having a large number of electrodes.
  • the lower plate and the upper plate are arranged at an interval in the vertical direction, and the middle plate is arranged between the upper and lower plates to serve as a probe support.
  • Board There is a device in which a probe is assembled to a probe support while penetrating the probe, and the probe is bent in the same direction in advance by displacing the middle plate horizontally with respect to the upper and lower plates (for example, see Japanese Patent Application Laid-Open No. H11-12848). Japanese Patent Application Laid-Open No. 7-45, JP-A-Heisei 2022-202337).
  • each probe penetrates the lower plate, the middle plate, and the upper plate so as to be displaceable with respect to the lower plate, the middle plate and the upper plate. Is transmitted to the other, and it is difficult to align the height positions of the needle tips. As a result, in the conventional device, the contact pressure acting between the electrode of the test object and the needle tip does not become constant. Disclosure of the invention
  • An electrical connection device includes a probe support, and a plurality of probes arranged on the probe support.
  • the probe support is a lower plate having a first recess that opens upward, and an upper plate having a second recess that opens downward, and is disposed at a distance above the lower plate.
  • Each probe is inserted into the lower plate, the upper plate, and the middle plate so as to be elastically deformable independently at a portion above and below the middle plate.
  • the lower plate, the middle plate, the upper plate, and the probe can be used as a probe assembly in which the lower end (needle tip) of each probe is pressed against the electrode of the device under test in the state configured as described above.
  • Each probe is elastically deformed in a region above the middle plate when its upper end is pushed downward, and is elastically deformed in a region below the middle plate when its lower end is pushed upward.
  • the pressing force acting on one end or the other end of each probe affects the other. Absent. Further, after the probe is assembled to the probe support, a process of aligning the height positions of the upper end and the lower end of the probe can be performed, so that the height positions of the needle tips can be easily adjusted. As a result, the height position of the needle tip is kept constant, and the contact pressure between the electrode of the test object and the needle tip becomes the same between the probes that are in contact.
  • Each probe penetrates through the middle plate so as not to be displaced vertically when it is elastically deformed, and penetrates the lower plate so as to be vertically displaceable, and is further displaceable vertically. It may be inserted into the upper plate. This ensures that each probe independently and elastically deforms in each of the region above and below the midplate.
  • the lower plate, the upper plate, and the middle plate may be separably connected by a plurality of screw members. By doing so, it becomes easy to assemble the probe to the probe support and to stand the loop support alone.
  • the lower plate may include a lower plate member, and a frame member disposed on the lower plate member and forming the first recess together with the lower plate member.
  • the electrical connection device further includes: a connection plate disposed on the upper plate; and a plurality of wirings inserted into the connection plate downward from above and individually electrically connected to an upper end surface of the probe. And may be included. In this case, by connecting the connection plate and the upper plate in a state where the end of the wiring is assembled to the connection plate, the wiring and the probe are pressed against each other by the end surface of the wiring and the upper end surface of the probe. And are electrically connected.
  • the electrical connection device further includes a substrate having a plurality of tester lands on an upper surface and an opening at a center, wherein the connection plate is assembled on a lower surface, and each wiring passes through the opening and passes through the connection land.
  • each wiring includes a core wire, one end of which is inserted into the connection plate and is in contact with the probe, and the other end of which is electrically connected to the tester land, and an electric insulating layer arranged around the core. Can be included.
  • Each of the wirings may further include an electric shield layer disposed around the electric insulating layer.
  • the electrical connection device of the present invention has, for example, through holes for probes, respectively.
  • Using the lower plate, the middle plate, and the upper plate maintain the lower plate, the middle plate, and the upper plate in a state in which the axes of their through holes are aligned, and then move the probe to the lower plate, the middle plate, and the upper plate. Inserting, then moving the middle plate and the upper plate in the predetermined direction with respect to the lower plate by a predetermined amount, and assembling the lower plate, the middle plate, and the upper plate firmly in that state, assembling the probe It can be easily assembled into an assembly.
  • connection plate and the upper plate may be firmly connected after assembling the probe assembly as described above.
  • connection plate and a substrate are used, the connection plate and the probe assembly may be connected to each other, and then the connection plate may be assembled to the substrate. You can combine it with a solid.
  • FIG. 1 is a plan view showing one embodiment of an electrical connection device according to the present invention, and is a diagram showing most of wirings removed.
  • FIG. 2 is a front view of the electrical connection device shown in FIG.
  • FIG. 3 is a cross-sectional view taken along line 3-3 in FIG.
  • FIG. 4 is an enlarged sectional view of a part of the probe assembly of the electrical connection device shown in FIG.
  • FIG. 5 is a cross-sectional view showing a state where a probe of the electrical connection device shown in FIG. 1 is pressed against an electrode of a device under test.
  • FIG. 6 is a cross-sectional view for explaining a method of assembling the probe assembly of the electrical connection device shown in FIG.
  • FIG. 7 is a cross-sectional view for explaining a method of assembling the probe assembly of the electrical connection device shown in FIG.
  • FIG. 8 is an enlarged sectional view showing another embodiment of the probe assembly. BEST MODE FOR CARRYING OUT THE INVENTION
  • the electrical connection device 10 is configured to test a plurality of (eight in the example shown in FIG. 1) integrated circuits on the semiconductor wafer 12. 1 4 and Then, it is used as a probe card for simultaneously detecting the test objects 14.
  • Each test object 14 has a rectangular shape, and has a plurality of electrodes 16 on each side that are spaced in the direction of the side of the rectangle.
  • the electrical connection device 10 includes a disc-shaped wiring board 20, a connection board 22 assembled on the lower surface of the wiring board 20, and a plurality of wirings 2 extending from the connection board 22 to the wiring board 20. 4 and a probe assembly 26 attached to the lower side of the connection plate 22.
  • the wiring board 20 is manufactured using an electrically insulating material such as glass-containing epoxy or ceramic.
  • the wiring board 20 has an opening 28 at the center that penetrates the central area of the wiring board 20 in the thickness direction, and has a plurality of tester lands 30 that are electrically connected to the tester at the periphery thereof. It has a plurality of connection lands 32 outside two opposing sides of the opening 28.
  • connection lines can be a wiring formed in the wiring board 20 by an appropriate method such as a printed wiring technology.
  • connection plate 22 is made of an electrically insulating material and has a rectangular shape larger than the opening 28 of the wiring board 20.
  • the connection plate 22 has a rectangular shallow upward recess 34 having substantially the same size as the opening 28, and penetrates the connection plate 22 in the thickness direction to form the recess 34. It has a plurality of through holes 36 to reach.
  • each wiring 24 protects a conductive core wire 38 by an electrical insulation layer 40 surrounding the core wire 38.
  • a core wire 38 exposed by peeling off the electric insulating layer 40 is inserted into the through hole 36, and an adhesive 4 is formed at the exposed end of the core wire 38. It is connected to the connection plate 22 by 2.
  • each core wire 38 is maintained substantially at the level of the lower surface of the connection plate 22.
  • the electric insulating layer 40 is peeled off, and the exposed end of the core wire 38 is connected to the connection land 32 by a conductive adhesive such as solder.
  • the probe assembly 26 is formed in a rectangular parallelepiped having a rectangular planar shape substantially the same size as the connection plate 22.
  • the probe assembly 26 has a rectangular lower plate 4 4
  • the plate 46 is placed, and the rectangular upper plate 48 is placed on the middle plate 46.
  • the lower plate 44 has a rectangular frame member 52 disposed on a rectangular lower plate member 50.
  • the middle plate 46 is placed on the frame member 52.
  • the upper plate 48 may also be formed by an upper plate member and a frame member.
  • the lower plate member 50, the frame member 52, the middle plate 46, and the upper plate 48 are connected to each other by a plurality of screw members 54 in a state of being stacked as described above, and a plurality of probes 5 are provided.
  • a probe support 58 supporting the 6 is constituted.
  • the lower plate member 50 and the frame member 52 form a lower plate 44.
  • the screw member 54 passes through the upper plate 48, the middle plate 46, and the frame member 52, and is screwed to the lower plate member 50.
  • the lower plate member 50 has a recess 60 that opens upward in cooperation with the frame member 52, and the upper plate 48 has a recess 62 that opens downward.
  • the middle plate 46 is disposed between the frame member 52 and the upper plate 48 so as to close the recesses 60 and 62.
  • the inner spaces of the recesses 60 and 62 and the frame member 52 have substantially the same size and shape as the opening 28 of the wiring board 20 when viewed in plan.
  • the lower plate member 50 has a plurality of through holes 64 that penetrate the lower plate member 50 in the thickness direction and open to the recesses 60.
  • the upper plate 48 has a plurality of through holes 68 penetrating in the thickness direction and opening to the recesses 62.
  • the through holes 64, 66, 68 correspond to each other and to the through hole 36 of the connection plate 22.
  • Each probe 56 is formed into an elastically deformable needle shape by a conductive thin metal wire such as tungsten, and is passed through through holes 68, 66, and 64.
  • Each probe 56 has a circular cross-sectional shape whose diameter, particularly at the location of the through hole 66, is substantially the same as that of the through hole 66.
  • each probe 56 is inserted into the through hole 68 so that the upper end of the probe 56 can be moved in the up-down direction, and is substantially at the level of the upper surface of the upper plate 48.
  • the lower end of each of the props 56 penetrates through the through hole 64 so as to be movable in the vertical direction, and protrudes downward from the lower plate member 50.
  • the through-holes 68 coincide with the through-holes 36, but the through-holes 64 and 66 are horizontal to each other and to the through-holes 36 and 68. Being displaced . Therefore, the probe 56 is curved in the same direction by the middle plate 46 in the region between the through holes 64 and 68.
  • the amount of displacement of the through holes 64, 66 can be made substantially the same as the arrangement pitch of the through holes 64, 66.
  • the displacement of the through holes 64, 68 can be small.
  • the displacement of the through holes 66, 68 can be larger than the displacement of the through holes 64, 66.
  • Each probe 56 is curved in the same direction by the middle plate 46 in the area between the through holes 64 and 68, and the diameter dimension is almost the same as that of the through hole 66.
  • each of the portions above and below the middle plate 46 is independently and elastically deformable and held by the middle plate 46.
  • each probe 56 is elastically deformed in a region below the middle plate 46 when the lower end is pushed upward, and elastically deformed in a region above the middle plate 46 when the upper end is pushed downward. .
  • the probe assembly 26 and the electrical connection device 10 can be assembled, for example, as follows.
  • the through holes 64, 66, 68 for each probe 56 are aligned vertically (through holes 64, 66).
  • the lower plate 44, the middle plate 46, and the upper plate 48 are maintained while the axes 6 and 68 are aligned.
  • each probe 56 is passed through the through holes 64, 66, 68 with its upper end slightly protruding from the upper plate 48.
  • the middle plate 46 and the upper plate 48 are respectively moved by a predetermined amount in the horizontal direction with respect to the lower plate 44, and in this state, the lower plate 4 is moved. 4.
  • the middle plate 46 and the upper plate 48 are firmly connected by the screw members 54. .
  • the upper plate 48 is firmly connected to the connection plate 22 by a plurality of screw members (not shown).
  • the wiring board 20 and the connection board 22 may be assembled after connecting the connection board 22 and the probe assembly 26, or may be connected after the connection board 22 is assembled to the wiring board 20.
  • the plate 22 and the probe assembly 26 may be connected.
  • each probe 56 Is pushed downward by the core wire 38 of the corresponding wiring 24.
  • each probe 56 is pushed downward at its upper end, and is elastically deformed in the probe region above the middle plate 46. The elastic deformation at this time does not affect the probe area below the middle plate 46.
  • Probe assembly 26 Lower plate member 50, frame member 52, middle plate 46, upper plate 48, and frame member 22 • A multi-positioned pair that is connected to each other and joined by screw members 54 And a plurality of positioning pins 70 (see FIG. 1) inserted through the wiring board 20 and inserted into the probe assembly 26 to maintain a constant relationship.
  • each probe 56 is pressed by the electrode 16 of the device under test 14 as shown in FIG. You.
  • each probe 56 is elastically deformed in the probe region below the middle plate 46, so that the lower end moves slightly in the horizontal direction with respect to the electrode 16 and gives a rubbing action to the electrode 16. The elastic deformation at this time does not affect the probe area above the middle plate 46.
  • each probe 56 is placed above the middle plate 46 so that the pressing force acting on one of the lower end and the upper end of each probe 56 does not affect the other. In each of the area and the lower probe area, it is elastically deformed independently.
  • the probe 56 After assembling the probe 56 to the probe support 58, it is possible to perform processing for aligning the height positions of the upper end and the lower end of the probe 56, and it is possible to easily align the height positions of the needle tips. . As a result, the height position of the needle tip is made uniform, and the contact pressure between the electrode 16 of the test object 14 and the needle tip becomes constant.
  • the probe 56 penetrates through the middle plate 46 and is curved by the middle plate 46 at the center so that the pressing force acting on one end of the probe 56 does not affect the other.
  • a suitable adhesive such as an electrically insulating adhesive
  • the axes of the through holes 64 and 68 are slightly displaced in a plan view so that the upper end and the lower end of the probe 56 are displaced.
  • the probe 56 is stepped by positioning the through holes 64 and 68 on the opposite side of the through hole 66, as shown in Fig. 8.
  • the upper end and the lower end of the probe 56 may be shifted, or the upper end and the lower end of the probe 56 may be aligned without shifting.
  • the present invention is not limited to the above embodiments, and can be variously modified without departing from the gist thereof.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

An electric connector comprising a probe supporter and a plurality of probes disposed on the probe supporter. The probe supporter comprises a lower plate having an first recess opened upwardly, an upper plate having a second recess opened downwardly and disposed above the lower plate with a space therebetween, and a middle plate disposed between the lower plate and the upper plate so as to close the first and second recesses. Each probe is independently inserted in the lower plate, the upper plate, and the middle plate in an elastically deformable manner at portions above and below the middle.

Description

明 細 書 電気的接続装置 技術分野  Description Electrical connection device Technical field
本発明は、 集積回路のような半導体デバイス等、 被検查体の通電試験に用いら れるプローブカードのような電気的接続装置に関する。  The present invention relates to an electrical connection device such as a probe card used for an electrical test of a test object such as a semiconductor device such as an integrated circuit.
本発明においては、 各プローブの伸張方向、 すなわちプローブが取り付けられ ている板部材の厚さ方向を上下方向という。 背景技術  In the present invention, the extension direction of each probe, that is, the thickness direction of the plate member to which the probe is attached is referred to as the vertical direction. Background art
半導体デバイス等の被検査体は、 その内部回路が仕様書通りに動作する力否か の通電試験 （検査） をされる。 そのような通電試験は、 針先を被検査体の電極に 押圧されるプローブのような複数の接触子を絶縁基板の下面に配置したプローブ カードのような電気的接続装置を用いて行われる。  The device under test, such as a semiconductor device, is subjected to a conduction test (inspection) to determine whether or not the internal circuit operates according to specifications. Such an energization test is performed using an electrical connection device such as a probe card in which a plurality of contacts, such as probes, whose needle tips are pressed against electrodes of a device under test, are arranged on the lower surface of an insulating substrate.
この種の電気的接続装置の 1つとして、 金属細線から製作された複数のプロ一 プを基板に垂直に組み付け、 針先 （下端） を被検査体の電極に押圧する縦型の装 置がある （例えば、 特開平 6— 3 0 8 1 6 3号公報） 。  As one type of this type of electrical connection device, there is a vertical device in which a plurality of probes made of thin metal wires are vertically assembled on a substrate, and a needle tip (lower end) is pressed against an electrode of a device under test. (Eg, Japanese Patent Application Laid-Open No. 6-308163).
縦型の装置は、 L字状の屈曲されたプローブを片持ち梁状に基板に組み付けた 従来の一般的な装置に比べ、 プローブの組み付け作業が容易であるから、 廉価で あり、 また針先の配置密度を高めることができるから、 電極数の多い高密度の被 検査体の通電試験に好適である。  The vertical type device is easier to assemble the probe than a conventional general device in which an L-shaped bent probe is mounted on a substrate in a cantilever shape, so it is inexpensive and has a needle tip. Since the arrangement density of the electrodes can be increased, it is suitable for a current test of a high-density test object having a large number of electrodes.
しかし、 この種の縦型の装置では、 針先を被検查体の電極に押圧したとき、 各 プローブが中央領域において湾曲するが、 湾曲する方向が同じ方向にならない。 このため、 上記従来の電気的接続装置では、 隣り合うプローブが接触して電気的 に短絡することがある。  However, in this type of vertical device, when the probe tip is pressed against the electrode of the test subject, each probe bends in the central region, but the bending direction is not the same. For this reason, in the above-mentioned conventional electrical connection device, adjacent probes may come into contact with each other to cause an electrical short circuit.
そのような問題を解決するために、 下板と上板とを上下方向に間隔をおいて配 置し、 上下の板の間に中板を配置してプローブ支持体とし、 上板、 中板及び上板 を貫通した状態にプローブをプローブ支持体に組み付け、 中板を上下の板に対し 水平方向に変位させてプローブを予め同じ方向に湾曲させた装置がある （例えば 、 特開平 1 1一 2 4 8 7 4 5号公報、 特開平 2 0 0 2— 2 0 2 3 3 7号公報） 。 この従来の装置は、 プローブが中板を貫通していると共に予め同じ方向に湾曲 されているから、 針先を被検查体の電極に押圧したとき、 プローブが同じ方向に 湾曲し、 したがって隣り合うプローブの接触が回避される。 In order to solve such a problem, the lower plate and the upper plate are arranged at an interval in the vertical direction, and the middle plate is arranged between the upper and lower plates to serve as a probe support. Board There is a device in which a probe is assembled to a probe support while penetrating the probe, and the probe is bent in the same direction in advance by displacing the middle plate horizontally with respect to the upper and lower plates (for example, see Japanese Patent Application Laid-Open No. H11-12848). Japanese Patent Application Laid-Open No. 7-45, JP-A-Heisei 2022-202337). In this conventional device, since the probe penetrates the middle plate and is curved in the same direction in advance, when the probe tip is pressed against the electrode of the test object, the probe bends in the same direction, and therefore the probe is bent in the next direction. Contact of mating probes is avoided.
しかし、 上記従来の装置では、 各プローブが、 下板、 中板及び上板をこれらに 対し変位可能に貫通して 、るから、 各プローブの一端及び他端のいずれか一方に 作用する押圧力が他方に伝達されてしまうし、 針先の高さ位置を揃えることが難 しい。 その結果、 従来の装置では、 被検査体の電極と針先との間に作用する接触 圧が一定にならない。 発明の開示  However, in the above-described conventional apparatus, each probe penetrates the lower plate, the middle plate, and the upper plate so as to be displaceable with respect to the lower plate, the middle plate and the upper plate. Is transmitted to the other, and it is difficult to align the height positions of the needle tips. As a result, in the conventional device, the contact pressure acting between the electrode of the test object and the needle tip does not become constant. Disclosure of the invention
本発明の目的は、 各プローブの一端又は他端に作用する押圧力が他方に影響を 及ぼすことを防止すると共に、 針先の高さ位置を容易に一定にすることができる ようにすることにある。  It is an object of the present invention to prevent a pressing force acting on one end or the other end of each probe from affecting the other and to make it possible to easily keep the height position of the needle tip constant. is there.
本発明に係る電気的接続装置は、 プローブ支持体と、 該プローブ支持体に配置 された複数のプローブとを含む。 前記プローブ支持体は、 上方に開放する第 1の 凹所を有する下板と、 下方に開放する第 2の凹所を有する上板であって前記下板 の上方に間隔をおいて配置された上板と、 前記第 1及び第 2の凹所を閉鎖するよ うに前記下板及び前記上板の間に配置'された中板とを含む。 各プローブは、 前記 中板より上方の部位及び下方の部位のそれぞれにおいて独立して弾性変形可能に 、 前記下板、 前記上板及び前記中板に揷し込まれている。  An electrical connection device according to the present invention includes a probe support, and a plurality of probes arranged on the probe support. The probe support is a lower plate having a first recess that opens upward, and an upper plate having a second recess that opens downward, and is disposed at a distance above the lower plate. An upper plate; and a middle plate disposed between the lower plate and the upper plate to close the first and second recesses. Each probe is inserted into the lower plate, the upper plate, and the middle plate so as to be elastically deformable independently at a portion above and below the middle plate.
下板、 中板、 上板及びプローブは、 上記のように構成された状態において、 各 プローブの下端 （針先） が被検査体の電極に押圧されるプローブ組立体として用 いることができる。 各プローブは、 その上端が下方へ押されると、 中板より上方 の領域において弾性変形し、 下端が上方へ押されると、 中板より下方の領域にお いて弾性変形する。  The lower plate, the middle plate, the upper plate, and the probe can be used as a probe assembly in which the lower end (needle tip) of each probe is pressed against the electrode of the device under test in the state configured as described above. Each probe is elastically deformed in a region above the middle plate when its upper end is pushed downward, and is elastically deformed in a region below the middle plate when its lower end is pushed upward.
このため、 各プローブの一端又は他端に作用する押圧力が他方に影響を及ぼさ ない。 また、 プローブをプローブ支持体に組み付けた後に、 プローブの上端及び 下端の高さ位置を揃える加工を行うことができるから、 針先の高さ位置を容易に 揃えることができる。 それらの結果、 針先の高さ位置が一定に維持され、 被検查 体の電極と針先との間の接触圧がとなり合うプローブ同士で同じになる。 Therefore, the pressing force acting on one end or the other end of each probe affects the other. Absent. Further, after the probe is assembled to the probe support, a process of aligning the height positions of the upper end and the lower end of the probe can be performed, so that the height positions of the needle tips can be easily adjusted. As a result, the height position of the needle tip is kept constant, and the contact pressure between the electrode of the test object and the needle tip becomes the same between the probes that are in contact.
各プローブは、 これが弾性変形されるとき上下方向へ変位しない状態に前記中 板を貫通していると共に、 上下方向へ変位可能に前記下板を貫通しており、 さら に上下方向へ変位可能に前記上板に挿入されていてもよい。 そのようにすれば、 各プローブは、 中板より上方の領域及び下方の領域のそれぞれにおいて確実に独 立して弾性変形する。  Each probe penetrates through the middle plate so as not to be displaced vertically when it is elastically deformed, and penetrates the lower plate so as to be vertically displaceable, and is further displaceable vertically. It may be inserted into the upper plate. This ensures that each probe independently and elastically deforms in each of the region above and below the midplate.
前記下板、 前記上板及び前記中板は複数のねじ部材により分離可能に結合され ていてもよい。 そのようにすれば、 プローブ支持体へのプローブの組み付け及び プ口ープ支持体の み立てが容易になる。  The lower plate, the upper plate, and the middle plate may be separably connected by a plurality of screw members. By doing so, it becomes easy to assemble the probe to the probe support and to stand the loop support alone.
前記下板は、 下板部材と、 該下板部材の上に配置されて該下板部材と共に前記 第 1の凹所を形成する枠部材とを備えることができる。  The lower plate may include a lower plate member, and a frame member disposed on the lower plate member and forming the first recess together with the lower plate member.
電気的接続装置は、 さらに、 前記上板の上に配置された接続板と、 該接続板を 上方から下方に挿入されて前記プローブの上端面に個々に電気的に接続された複 数の配線とを含むことができる。 そのようにすれば、 配線の端部を接続板に組み 付けた状態で、 接続板及び上板を結合させることにより、 配線とプローブとは、 配線の端面とプローブの上端面とが相互に押圧されて、 電気的に接続される。 電気的接続装置は、 さらに、 複数のテスターランドを上面に有すると共に開口 を中央に有する基板であって前記接続板が下面に組み付けられた基板を含み、 各 配線は前記開口を通って前記接続ランドに電気的に接続されていてもよレ、。 その ようにすれば、 電気的接続装置をプローブカードとして用いることができる。 各配線は、 一端部が前記接続板に挿入されて前記プローブに接触されかつ他端 部が前記テスターランドに電気的に接続された芯線と、 該芯線の周りに配置され た電気絶縁層とを含むことができる。  The electrical connection device further includes: a connection plate disposed on the upper plate; and a plurality of wirings inserted into the connection plate downward from above and individually electrically connected to an upper end surface of the probe. And may be included. In this case, by connecting the connection plate and the upper plate in a state where the end of the wiring is assembled to the connection plate, the wiring and the probe are pressed against each other by the end surface of the wiring and the upper end surface of the probe. And are electrically connected. The electrical connection device further includes a substrate having a plurality of tester lands on an upper surface and an opening at a center, wherein the connection plate is assembled on a lower surface, and each wiring passes through the opening and passes through the connection land. It may be electrically connected to By doing so, the electrical connection device can be used as a probe card. Each wiring includes a core wire, one end of which is inserted into the connection plate and is in contact with the probe, and the other end of which is electrically connected to the tester land, and an electric insulating layer arranged around the core. Can be included.
各配線は、 さらに、 前記電気絶縁層の周りに配置された電気的シールド層を含 むことができる。  Each of the wirings may further include an electric shield layer disposed around the electric insulating layer.
本発明の電気的接続装置は、 例えば、 プローブのための貫通穴をそれぞれ有す る、 下板、 中板及び上板を用い、 下板、 中板及び上板をそれらの貫通穴の軸線が 一致する状態に維持し、 その状態でプローブを下板、 中板及び上板に挿し込み、 次いで中板及び上板を下板に対して所定の方向に所定量移動させ、 その状態に下 板、 中板及び上板を堅固に結合させることにより組み立てることにより、'プロ一 ブ組立体に容易に組み立てることができる。 The electrical connection device of the present invention has, for example, through holes for probes, respectively. Using the lower plate, the middle plate, and the upper plate, maintain the lower plate, the middle plate, and the upper plate in a state in which the axes of their through holes are aligned, and then move the probe to the lower plate, the middle plate, and the upper plate. Inserting, then moving the middle plate and the upper plate in the predetermined direction with respect to the lower plate by a predetermined amount, and assembling the lower plate, the middle plate, and the upper plate firmly in that state, assembling the probe It can be easily assembled into an assembly.
接続板を用いる場合は、 例えば、 上記のようにプローブ組立体を組み立てた後 、 接続板と上板とを堅固に結合させればよい。 また、 接続板及び基板を用いる場 合は、 接続板とプローブ組立体とを結合させた後、 接続板を基板に組み付けても よいし、 接続板を基板に組み付けた後に、 接続板とプローブ組立体とを結合させ てもよレ、。 図面の簡単な説明  When a connecting plate is used, for example, the connecting plate and the upper plate may be firmly connected after assembling the probe assembly as described above. When a connection plate and a substrate are used, the connection plate and the probe assembly may be connected to each other, and then the connection plate may be assembled to the substrate. You can combine it with a solid. BRIEF DESCRIPTION OF THE FIGURES
図 1は、 本発明に係る電気的接続装置の一実施例を示す平面図であって、 配線 の大部分を除去して示す図である。  FIG. 1 is a plan view showing one embodiment of an electrical connection device according to the present invention, and is a diagram showing most of wirings removed.
図 2は、 図 1に示す電気的接続装置の正面図である。  FIG. 2 is a front view of the electrical connection device shown in FIG.
図 3は、 図 1における 3— 3線に沿って得た断面図である。  FIG. 3 is a cross-sectional view taken along line 3-3 in FIG.
図 4は、 図 1に示す電気的接続装置のプローブ組立体の一部の拡大断面図であ る。  FIG. 4 is an enlarged sectional view of a part of the probe assembly of the electrical connection device shown in FIG.
図 5は、 図 1に示す電気的接続装置のプローブを被検査体の電極に押圧した状 態を示す断面図である。  FIG. 5 is a cross-sectional view showing a state where a probe of the electrical connection device shown in FIG. 1 is pressed against an electrode of a device under test.
図 6は、 図 1に示す電気的接続装置のプローブ組立体の組み立て方法を説明す るための断面図である。  FIG. 6 is a cross-sectional view for explaining a method of assembling the probe assembly of the electrical connection device shown in FIG.
図 7は、 図 1に示す電気的接続装置のプローブ組立体の組み立て方法を説明す るための断面図である。  FIG. 7 is a cross-sectional view for explaining a method of assembling the probe assembly of the electrical connection device shown in FIG.
図 8は、 プローブ組立体の他の実施例を示す拡大断面図である。 発明を実施するための最良の形態  FIG. 8 is an enlarged sectional view showing another embodiment of the probe assembly. BEST MODE FOR CARRYING OUT THE INVENTION
図 1〜図 4を参照するに、 電気的接続装置 1 0は、 図 4に示すように、 半導体 ゥエーハ 1 2上の複数 （図 1に示す例では、 8つ） の集積回路を被検査体 1 4と し、 それらの被検查体 1 4を同時に検查するプローブカードとして用いられる。 各被検查体 1 4は、 矩形の形状を有しており、 また矩形の辺の方向に間隔をおい た複数の電極 1 6を各辺に有している。 Referring to FIGS. 1 to 4, as shown in FIG. 4, the electrical connection device 10 is configured to test a plurality of (eight in the example shown in FIG. 1) integrated circuits on the semiconductor wafer 12. 1 4 and Then, it is used as a probe card for simultaneously detecting the test objects 14. Each test object 14 has a rectangular shape, and has a plurality of electrodes 16 on each side that are spaced in the direction of the side of the rectangle.
電気的接続装置 1 0は、 円板状の配線基板 2 0と、 配線基板 2 0の下面に組み 付けられた接続板 2 2と、 接続板 2 2から配線基板 2 0に伸びる複数の配線 2 4 と、 接続板 2 2の下側に組み付けられたプローブ組立体 2 6とを含む。  The electrical connection device 10 includes a disc-shaped wiring board 20, a connection board 22 assembled on the lower surface of the wiring board 20, and a plurality of wirings 2 extending from the connection board 22 to the wiring board 20. 4 and a probe assembly 26 attached to the lower side of the connection plate 22.
配線基板 2 0は、 ガラス入りエポキシやセラミック等の電気絶縁材料を用いて 製作されている。 配線基板 2 0は、 これの中央領域を厚さ方向に貫通する開口 2 8を中央に有しており、 テスターに電気的に接続される複数のテスターランド 3 0を周縁部に多重に有しており、 複数の接続ランド 3 2を開口 2 8の対向する 2 つの辺の外側に有している。  The wiring board 20 is manufactured using an electrically insulating material such as glass-containing epoxy or ceramic. The wiring board 20 has an opening 28 at the center that penetrates the central area of the wiring board 20 in the thickness direction, and has a plurality of tester lands 30 that are electrically connected to the tester at the periphery thereof. It has a plurality of connection lands 32 outside two opposing sides of the opening 28.
開口 2 8は、 同時に検査する集積回路の配置領域よりやや大きい矩形の形状を 有している。 テスターランド 3 0と接続ランド 3 2とは、 図示しない接続線によ り、 一対一の関係に電気的に接続されている。 そのような接続線は、 印刷配線技 術のような適宜の手法により、 配線基板 2 0内に形成された配線とすることがで さる。  The opening 28 has a rectangular shape slightly larger than the arrangement area of the integrated circuit to be inspected at the same time. The tester lands 30 and the connection lands 32 are electrically connected in a one-to-one relationship by connection lines (not shown). Such a connection line can be a wiring formed in the wiring board 20 by an appropriate method such as a printed wiring technology.
接続板 2 2は、 電気絶縁材料により、 配線基板 2 0の開口 2 8より大きい矩形 の形状に製作されている。 接続板 2 2は、 開口 2 8とほぼ同じ大きさを有する矩 形の浅い上向きの凹所 3 4を有しており、 また接続板 2 2を厚さ方向に貫通して 凹所 3 4に達する複数の貫通穴 3 6を有している。  The connection plate 22 is made of an electrically insulating material and has a rectangular shape larger than the opening 28 of the wiring board 20. The connection plate 22 has a rectangular shallow upward recess 34 having substantially the same size as the opening 28, and penetrates the connection plate 22 in the thickness direction to form the recess 34. It has a plurality of through holes 36 to reach.
各配線 2 4は、 図 4に示すように、 導電性の芯線 3 8をその周りを覆う電気絶 縁層 4 0により保護している。 各配線 2 4の一端部は、 電気絶縁層 4 0が剥離さ れて露出された芯線 3 8が貫通穴 3 6に挿入されており、 また芯線 3 8の露出し た端部において接着剤 4 2により接続板 2 2に結合されている。  As shown in FIG. 4, each wiring 24 protects a conductive core wire 38 by an electrical insulation layer 40 surrounding the core wire 38. At one end of each wiring 24, a core wire 38 exposed by peeling off the electric insulating layer 40 is inserted into the through hole 36, and an adhesive 4 is formed at the exposed end of the core wire 38. It is connected to the connection plate 22 by 2.
各芯線 3 8の一端面は、 ほぼ接続板 2 2の下面の高さ位置に維持されている。 各配線 2 4の他端部は、 電気絶縁層 4 0が剥離されて、 芯線 3 8の露出した端部 において半田のような導電性の接着剤により接続ランド 3 2に結合されている。 プローブ組立体 2 6は、 接続板 2 2とほぼ同じ大きさの矩形の平面形状を有す る直方体に形成されている。 プローブ組立体 2 6は、 矩形の下板 4 4に矩形の中 板 4 6を載置し、 中板 4 6に矩形の上板 4 8を載置している。 One end face of each core wire 38 is maintained substantially at the level of the lower surface of the connection plate 22. At the other end of each wiring 24, the electric insulating layer 40 is peeled off, and the exposed end of the core wire 38 is connected to the connection land 32 by a conductive adhesive such as solder. The probe assembly 26 is formed in a rectangular parallelepiped having a rectangular planar shape substantially the same size as the connection plate 22. The probe assembly 26 has a rectangular lower plate 4 4 The plate 46 is placed, and the rectangular upper plate 48 is placed on the middle plate 46.
下板 4 4は、 矩形の下板部材 5 0に矩形の枠部材 5 2を载置している。 中板 4 6は、 枠部材 5 2に載置されている。 上板 4 8も、 上板部材と枠部材とで形成し てもよい。  The lower plate 44 has a rectangular frame member 52 disposed on a rectangular lower plate member 50. The middle plate 46 is placed on the frame member 52. The upper plate 48 may also be formed by an upper plate member and a frame member.
下板部材 5 0、 枠部材 5 2、 中板 4 6及ぴ上板 4 8は、 上記のように重ねられ た状態で、 複数のねじ部材 5 4により相互に結合されて、 複数のプローブ 5 6を 支持するプローブ支持体 5 8を構成している。 下板部材 5 0と枠部材 5 2とは、 下板 4 4を形成している。 ねじ部材 5 4は、 上板 4 8、 中板 4 6及び枠部材 5 2 を貫通して、 下板部材 5 0に螺合されている。  The lower plate member 50, the frame member 52, the middle plate 46, and the upper plate 48 are connected to each other by a plurality of screw members 54 in a state of being stacked as described above, and a plurality of probes 5 are provided. A probe support 58 supporting the 6 is constituted. The lower plate member 50 and the frame member 52 form a lower plate 44. The screw member 54 passes through the upper plate 48, the middle plate 46, and the frame member 52, and is screwed to the lower plate member 50.
下板部材 5 0は上方に開放する凹所 6 0を枠部材 5 2と共同して形成しており 、 上板 4 8は下方に開放する凹所 6 2を有している。 中板 4 6は、 凹所 6 0， 6 2を閉鎖するように、 枠部材 5 2と上板 4 8との間に配置されている。 凹所 6 0 , 6 2及び枠部材 5 2の内側空間は、 平面的に見て、 配線基板 2 0の開口 2 8と ほぼ同じ大きさと形状とを有している。  The lower plate member 50 has a recess 60 that opens upward in cooperation with the frame member 52, and the upper plate 48 has a recess 62 that opens downward. The middle plate 46 is disposed between the frame member 52 and the upper plate 48 so as to close the recesses 60 and 62. The inner spaces of the recesses 60 and 62 and the frame member 52 have substantially the same size and shape as the opening 28 of the wiring board 20 when viewed in plan.
図 4に示すように、 下板部材 5 0はこれを厚さ方向に貫通して凹所 6 0に開口 する複数の貫通穴 6 4を有しており、 中板 4 6はこれを厚さ方向に貫通する複数 の貫通穴 6 6を有しており、 上板 4 8はこれを厚さ方向に貫通して凹所 6 2に開 口する複数の貫通穴 6 8を有している。 貫通穴 6 4， 6 6 , 6 8は、 相互に及び 接続板 2 2の貫通穴 3 6に対応されている。  As shown in FIG. 4, the lower plate member 50 has a plurality of through holes 64 that penetrate the lower plate member 50 in the thickness direction and open to the recesses 60. The upper plate 48 has a plurality of through holes 68 penetrating in the thickness direction and opening to the recesses 62. The through holes 64, 66, 68 correspond to each other and to the through hole 36 of the connection plate 22.
各プローブ 5 6は、 タングステンのような導電性の金属細線により弾性変形可 能の針の形に形成されており、 また貫通穴 6 8 , 6 6， 6 4に通されている。 各 プローブ 5 6は、 直径寸法、 特に貫通穴 6 6の箇所における直径寸法が貫通穴 6 6のそれとほぼ同じ円形の断面形状を有している。  Each probe 56 is formed into an elastically deformable needle shape by a conductive thin metal wire such as tungsten, and is passed through through holes 68, 66, and 64. Each probe 56 has a circular cross-sectional shape whose diameter, particularly at the location of the through hole 66, is substantially the same as that of the through hole 66.
各プローブ 5 6の上端面は、 プローブ 5 6の上端部が貫通穴 6 8に上下方向へ 移動可能に差し込まれて、 ほぼ上板 4 8の上面の高さ位置とされている。 各プロ ープ 5 6の下端部は、 貫通穴 6 4を上下方向へ移動可能に貫通して下板部材 5 0 から下方に突出されている。  The upper end surface of each probe 56 is inserted into the through hole 68 so that the upper end of the probe 56 can be moved in the up-down direction, and is substantially at the level of the upper surface of the upper plate 48. The lower end of each of the props 56 penetrates through the through hole 64 so as to be movable in the vertical direction, and protrudes downward from the lower plate member 50.
平面的に見て、 貫通穴 6 8は貫通穴 3 6と一致しているが、 貫通穴 6 4及び 6 6は、 相互に、 並びに、 貫通穴 3 6及ぴ 6 8に対し、 水平方向へ変位されている 。 このため、 プローブ 5 6は、 貫通穴 6 4， 6 8の間の領域において中板 4 6に より同じ方向に湾曲されている。 In a plan view, the through-holes 68 coincide with the through-holes 36, but the through-holes 64 and 66 are horizontal to each other and to the through-holes 36 and 68. Being displaced . Therefore, the probe 56 is curved in the same direction by the middle plate 46 in the region between the through holes 64 and 68.
貫通穴 6 4， 6 6の変位量は、 貫通穴 6 4， 6 6の配置ピッチとほぼ同じ程度 とすることができる。 貫通穴 6 4， 6 8の変位量は、 わずかとすることができる 。 貫通穴 6 6， 6 8の変位量は、 貫通穴 6 4 , 6 6の変位量より大きくすること ができる。  The amount of displacement of the through holes 64, 66 can be made substantially the same as the arrangement pitch of the through holes 64, 66. The displacement of the through holes 64, 68 can be small. The displacement of the through holes 66, 68 can be larger than the displacement of the through holes 64, 66.
各プローブ 5 6は、 貫通穴 6 4， 6 8の間の領域において中板 4 6により同じ 方向に湾曲されていることと、 直径寸法が貫通穴 6 6のそれとほぼ同じであるこ ととが相まつて、 中板 4 6より上方の部位及び下方の部位のそれぞれにおいて独 立して弾性変形可能に中板 4 6に保持されている。  Each probe 56 is curved in the same direction by the middle plate 46 in the area between the through holes 64 and 68, and the diameter dimension is almost the same as that of the through hole 66. Thus, each of the portions above and below the middle plate 46 is independently and elastically deformable and held by the middle plate 46.
これにより、 各プローブ 5 6は、 下端が上方へ押されると、 中板 4 6より下方 の領域において弾性変形し、 上端が下方へ押されると、 中板 4 6より上方の領域 において弾性変形する。  Accordingly, each probe 56 is elastically deformed in a region below the middle plate 46 when the lower end is pushed upward, and elastically deformed in a region above the middle plate 46 when the upper end is pushed downward. .
プローブ組立体 2 6及び電気的接続装置 1 0は、 例えば、 以下のように組み立 てることができる。  The probe assembly 26 and the electrical connection device 10 can be assembled, for example, as follows.
先ず、 図 6 (A) 及ぴ図 7 (A) に示すように、 各プローブ 5 6のための貫通 穴 6 4， 6 6 , 6 8が上下方向に整列する状態 （貫通穴 6 4， 6 6 , 6 8の軸線 がー致する状態） に、 下板 4 4、 中板 4 6及び上板 4 8が維持される。  First, as shown in FIGS. 6 (A) and 7 (A), the through holes 64, 66, 68 for each probe 56 are aligned vertically (through holes 64, 66). The lower plate 44, the middle plate 46, and the upper plate 48 are maintained while the axes 6 and 68 are aligned.
次いで、 その状態で各プローブ 5 6が、 その上端部を上板 4 8からわずかに突 出させた状態に、 貫通穴 6 4， 6 6 , 6 8に通される。  Next, in this state, each probe 56 is passed through the through holes 64, 66, 68 with its upper end slightly protruding from the upper plate 48.
次いで、 図 6 (B ) 及び図 7 (B ) に示すように、 中板 4 6及び上板 4 8が下 板 4 4に対してそれぞれ水平方向に所定量移動され、 その状態に下板 4 4、 中板 4 6及ぴ上板 4 8がねじ部材 5 4により堅固に結合される。 .  Next, as shown in FIGS. 6 (B) and 7 (B), the middle plate 46 and the upper plate 48 are respectively moved by a predetermined amount in the horizontal direction with respect to the lower plate 44, and in this state, the lower plate 4 is moved. 4. The middle plate 46 and the upper plate 48 are firmly connected by the screw members 54. .
上記のように組み立てられたプローブ組立体 2 6は、 上板 4 8を接続板 2 2に 図示しない複数のねじ部材により堅固に結合される。 配線基板 2 0と接続板 2 2 とは、 接続板 2 2とプローブ組立体 2 6とを結合させた後に、 組み付けてもよい し、 接続板 2 2を配線基板 2 0に組み付けた後に、 接続板 2 2とプローブ組立体 2 6とを結合させてもよい。  In the probe assembly 26 assembled as described above, the upper plate 48 is firmly connected to the connection plate 22 by a plurality of screw members (not shown). The wiring board 20 and the connection board 22 may be assembled after connecting the connection board 22 and the probe assembly 26, or may be connected after the connection board 22 is assembled to the wiring board 20. The plate 22 and the probe assembly 26 may be connected.
接続板 2 2とプローブ組立体 2 6とを結合されるとき、 各プローブ 5 6は、 そ の上端面を対応する配線 2 4の芯線 3 8により下方に押される。 これにより、 各 プローブ 5 6は、 上端を下方に押されて、 中板 4 6より上方のプローブ領域で弾 性変形する。 このときの弾性変形は、 中板 4 6より下方のプローブ領域に影響を 及ぼさない。 When the connecting plate 22 and the probe assembly 26 are connected, each probe 56 Is pushed downward by the core wire 38 of the corresponding wiring 24. As a result, each probe 56 is pushed downward at its upper end, and is elastically deformed in the probe region above the middle plate 46. The elastic deformation at this time does not affect the probe area below the middle plate 46.
下板 4 4 , 中板 4 6及び上板 4 8の水平面内での位置関係、 並びに、 プローブ 組立体 2 6、 接続板 2 2及ぴ配線基板, 2 0の水平面内での位置関係は、 プローブ 組立体 2 6の下板部材 5 0、 枠部材 5 2、 中板 4 6、 上板 4 8及び枠部材 2 2を • 相互に位置決め多情対で、 それらをねじ部材 5 4により結合することにより、 及 び、 配線基板 2 0を貫通してプローブ組立体 2 6に挿入された複数の位置決めピ ン 7 0 (図 1参照） により、 一定の関係に維持される。  The positional relationship of the lower plate 44, the middle plate 46 and the upper plate 48 in the horizontal plane, and the positional relationship of the probe assembly 26, the connecting plate 22 and the wiring board 20 in the horizontal plane are as follows: Probe assembly 26 Lower plate member 50, frame member 52, middle plate 46, upper plate 48, and frame member 22 • A multi-positioned pair that is connected to each other and joined by screw members 54 And a plurality of positioning pins 70 (see FIG. 1) inserted through the wiring board 20 and inserted into the probe assembly 26 to maintain a constant relationship.
' 被検査体 1 4の通電試験時、 電気的接続装置 1 0は、 図 5に示すように、 各プ ローブ 5 6の下端 （針先） を被検査体 1 4の電極 1 6に押圧される。 このとき、 各プローブ 5 6は、 中板 4 6より下方のプローブ領域において弾性変形すること により、 下端が電極 1 6に対しわずかに水平方向へ移動して、 電極 1 6にこすり 作用を与える。 このときの弾性変形は、 中板 4 6より上方のプローブ領域に影響 を及ぼさない。 '' At the time of the current test of the device under test 14, the lower end (needle tip) of each probe 56 is pressed by the electrode 16 of the device under test 14 as shown in FIG. You. At this time, each probe 56 is elastically deformed in the probe region below the middle plate 46, so that the lower end moves slightly in the horizontal direction with respect to the electrode 16 and gives a rubbing action to the electrode 16. The elastic deformation at this time does not affect the probe area above the middle plate 46.
電気的接続装置 1 0においては、 各プローブ 5 6の下端及び上端のいずれか一 方に作用する押圧力が他方に影響を及ぼさないように、 各プローブ 5 6が中板 4 6より上方のプローブ領域及び下方のプローブ領域のそれぞれにおいて確実に独 立して弾性変形する。  In the electrical connection device 10, each probe 56 is placed above the middle plate 46 so that the pressing force acting on one of the lower end and the upper end of each probe 56 does not affect the other. In each of the area and the lower probe area, it is elastically deformed independently.
これにより、 プローブ 5 6をプローブ支持体 5 8に組み付けた後に、 プローブ 5 6の上端及び下端の高さ位置を揃える加工を行うことができ、 針先の高さ位置 を容易に揃えることができる。 その結果、 針先の高さ位置が一定に揃えられ、 被 検查体 1 4の電極 1 6と針先との間の接触圧が一定になる。  Thereby, after assembling the probe 56 to the probe support 58, it is possible to perform processing for aligning the height positions of the upper end and the lower end of the probe 56, and it is possible to easily align the height positions of the needle tips. . As a result, the height position of the needle tip is made uniform, and the contact pressure between the electrode 16 of the test object 14 and the needle tip becomes constant.
上記実施例では、 プローブ 5 6が中板 4 6を貫通して中央において中板 4 6に より湾曲させることにより、 プローブ 5 6の一方の端部に作用する押圧力が他方 に影響しないようにしているが、 プローブ 5 6を電気絶縁性の接着剤のような適 宜な接着剤により中板 4 6に固定することにより、 プロ—ブ 5 6の一方の端部に 作用する押圧力が他方に影響しないようにしてもよレ、。 W In the above embodiment, the probe 56 penetrates through the middle plate 46 and is curved by the middle plate 46 at the center so that the pressing force acting on one end of the probe 56 does not affect the other. However, by fixing the probe 56 to the middle plate 46 with a suitable adhesive such as an electrically insulating adhesive, the pressing force acting on one end of the probe 56 is reduced by the other. You may not affect it. W
9  9
また、 上記の実施例では、 プローブ組立体 2 6に組み立てられた状態において 、 平面的に見て、 貫通穴 6 4， 6 8の軸線をわずかに変位させてプローブ 5 6の 上端部と下端部とをわずかにずらせているが、 図 8に示すように、 貫通穴 6 4と 6 8とを貫通穴 6 6に対して反対側に位置させてプローブ 5 6をステップ状に変 形させることにより、 プローブ 5 6の上端部と下端部とをずらせてもよいし、 プ ローブ 5 6の上端部と下端部とをずらすことなく、 一致させてもよい。  Also, in the above embodiment, in the state where the probe assembly 26 is assembled, the axes of the through holes 64 and 68 are slightly displaced in a plan view so that the upper end and the lower end of the probe 56 are displaced. As shown in Fig. 8, the probe 56 is stepped by positioning the through holes 64 and 68 on the opposite side of the through hole 66, as shown in Fig. 8. The upper end and the lower end of the probe 56 may be shifted, or the upper end and the lower end of the probe 56 may be aligned without shifting.
本発明は、 上記実施例に限定されず、 その趣旨を逸脱しない限り、 種々変更す ることができる。  The present invention is not limited to the above embodiments, and can be variously modified without departing from the gist thereof.

Claims

請 求 の 範 囲 The scope of the claims
1 . プローブ支持体と、 該プローブ支持体に配置された複数のプローブとを含 み、 1. Includes a probe support, and a plurality of probes arranged on the probe support,
前記プローブ支持体は、 上方に開放する第 1の凹所を有する下板と、 下方に開 放する第 2の凹所を有する上板であって前記下板の上方に間隔をおいて配置され た上板と、 前記第 1及び第 2の凹所を閉鎖するように前記下板及び前記上板の間 に配置された中板とを含み、  The probe support is a lower plate having a first concave portion opened upward, and an upper plate having a second concave portion opened downward, and is arranged at a distance above the lower plate. An upper plate, and a middle plate disposed between the lower plate and the upper plate to close the first and second recesses,
各プローブは、 前記中板より上方の部位及び下方の部 のそれぞれにおいて独 立して弾性変形可能に、 前記下板、 前記上板及び前記中板に挿し込まれている、 電気的接続装置。  An electrical connection device, wherein each probe is inserted into the lower plate, the upper plate, and the middle plate so as to be independently elastically deformable in a portion above the middle plate and a portion below the middle plate.
2 . 各プローブは、 これが弾性変形されるとき上下方向へ変位しない状態に前 記中板を貫通していると共に、 上下方向へ変位可能に前記下板を貫通しており、 さらに上下方向へ変位可能に前記上板に挿入されている、 請求項 1に記載の電気 的接続装置。  2. Each probe penetrates the above-mentioned middle plate so as not to be displaced vertically when it is elastically deformed, and penetrates the lower plate so that it can be displaced vertically, and further displaces vertically. 2. The electrical connection device according to claim 1, wherein the electrical connection device is inserted into the upper plate as possible.
3 . 前記下板、 前記上板及び前記中板は複数のねじ部材により分離可能に結合 されている、 請求項 1又は 2に記載の電気的接続装置。  3. The electrical connection device according to claim 1, wherein the lower plate, the upper plate, and the middle plate are separably coupled by a plurality of screw members.
4 . 前記下板は、 下板部材と、 該下板部材の上に配置されて該下板部材と共に 前記第 1の凹所を形成する枠部材とを備える、 請求項 1から 3のいずれか 1項に 記載の電気的接続装置。  4. The lower plate according to any one of claims 1 to 3, wherein the lower plate includes: a lower plate member; and a frame member disposed on the lower plate member and forming the first recess together with the lower plate member. The electrical connection device according to item 1.
5 . さらに、 前記上板の上に配置された接続板と、 該接続板を上方から下方に 揷入されて前記プ口ーブの上端面に個々に電気的に接続された複数の配線とを含 む、 請求項 1から 4のいずれか 1項に記載の電気的接続装置。  5. Further, a connecting plate arranged on the upper plate, and a plurality of wirings which are inserted from the upper side to the lower side and are individually electrically connected to the upper end surface of the probe. The electrical connection device according to any one of claims 1 to 4, comprising:
6 . さらに、 複数のテスターランドを上面に有すると共に開口を中央に有する 基板であって前記接続板が下面に組み付けられた基板を含み、 各配線は前記開口 を通つて前記接続ランドに電気的に接続されている、 請求項 5に記載の電気的接 続装置。  6. A substrate having a plurality of tester lands on an upper surface and an opening at a center, wherein the connection plate is mounted on a lower surface, and each wiring is electrically connected to the connection lands through the opening. The electrical connection device according to claim 5, which is connected.
7 . 各配線は、 一端部が前記接続板に挿入されて前記プローブに接触されかつ 他端部が前記テスターランドに電気的に接続された芯線と、 該芯線の周りに配置 された電気絶縁層とを含む、 請求項 6に記載の電気的接続装置。 7. Each wire is inserted into the connection plate at one end and is brought into contact with the probe. 7. The electrical connection device according to claim 6, wherein the other end portion includes a core wire electrically connected to the tester land, and an electrical insulating layer disposed around the core wire.
8 . 各配線は、 さらに、 前記電気絶縁層の周りに配置された電気的シールド層 を含む、 請求項 7に記載の電気的接続装置。  8. The electrical connection device according to claim 7, wherein each wiring further includes an electrical shield layer disposed around the electrical insulation layer.
PCT/JP2002/010836 2002-10-18 2002-10-18 Electric connector WO2004036232A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2002/010836 WO2004036232A1 (en) 2002-10-18 2002-10-18 Electric connector
AU2002343999A AU2002343999A1 (en) 2002-10-18 2002-10-18 Electric connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/010836 WO2004036232A1 (en) 2002-10-18 2002-10-18 Electric connector

Publications (1)

Publication Number Publication Date
WO2004036232A1 true WO2004036232A1 (en) 2004-04-29

Family

ID=32104837

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/010836 WO2004036232A1 (en) 2002-10-18 2002-10-18 Electric connector

Country Status (2)

Country Link
AU (1) AU2002343999A1 (en)
WO (1) WO2004036232A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2060922A1 (en) * 2007-11-16 2009-05-20 Technoprobe S.p.A Microstructure testing head
CN102854343A (en) * 2011-06-29 2013-01-02 台湾积体电路制造股份有限公司 Test structures and testing methods for semiconductor devices

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1130631A (en) * 1997-07-10 1999-02-02 Tokyo Kasoode Kenkyusho:Kk Probe card
JP2000162239A (en) * 1998-11-27 2000-06-16 Japan Electronic Materials Corp Vertical probe card
JP2001021584A (en) * 1999-07-06 2001-01-26 Tokyo Cathode Laboratory Co Ltd Vertical probe card
JP2001027650A (en) * 1999-07-12 2001-01-30 Takashi Nansai Tool for fine pitch printed-circuit board inspection machine
JP2002231399A (en) * 2001-02-02 2002-08-16 Fujitsu Ltd Semiconductor device testing contact and manufacturing method therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1130631A (en) * 1997-07-10 1999-02-02 Tokyo Kasoode Kenkyusho:Kk Probe card
JP2000162239A (en) * 1998-11-27 2000-06-16 Japan Electronic Materials Corp Vertical probe card
JP2001021584A (en) * 1999-07-06 2001-01-26 Tokyo Cathode Laboratory Co Ltd Vertical probe card
JP2001027650A (en) * 1999-07-12 2001-01-30 Takashi Nansai Tool for fine pitch printed-circuit board inspection machine
JP2002231399A (en) * 2001-02-02 2002-08-16 Fujitsu Ltd Semiconductor device testing contact and manufacturing method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2060922A1 (en) * 2007-11-16 2009-05-20 Technoprobe S.p.A Microstructure testing head
CN102854343A (en) * 2011-06-29 2013-01-02 台湾积体电路制造股份有限公司 Test structures and testing methods for semiconductor devices

Also Published As

Publication number Publication date
AU2002343999A1 (en) 2004-05-04

Similar Documents

Publication Publication Date Title
US7616016B2 (en) Probe card assembly and kit
EP2422205B1 (en) Electrically conductive kelvin contacts for microcircuit tester
US8102184B2 (en) Test contact system for testing integrated circuits with packages having an array of signal and power contacts
US6782614B2 (en) Contact pin assembly, contact pin assembly manufacturing method, contact pin assembling structure, contact pin assembling structure manufacturing method, and socket for electrical parts
US20030067315A1 (en) Probe device
TWI397690B (en) Component for testing device for electronic component and testing method of the electronic component
JPWO2004072661A1 (en) Electrical connection device
KR101826663B1 (en) Bi-directional conductive socket for testing semiconductor device, bi-directional conductive module for testing semiconductor device, and manufacturing method thereof
US7049838B2 (en) Semiconductor device tester with slanted contact ends
JP4209696B2 (en) Electrical connection device
KR20070076539A (en) Test contact system for testing integrated circuits with packages having an array of signal and power contacts
JP2008216060A (en) Electrical connecting device
JP4615057B1 (en) Probe card
US7121860B2 (en) Pinch-style support contact, method of enabling electrical communication with and supporting an IC package, and socket including same
JP4455940B2 (en) Electrical connection device
JP2004138576A (en) Electrical connection device
WO2004036232A1 (en) Electric connector
JP2003232805A (en) Contact and electrical connection device
KR101066551B1 (en) Pin Array Frame Used for Manufacture of Probe Card
JP7374037B2 (en) pogo block
JP3019355U (en) Probe card for testing semiconductor wafers
JP2005127961A (en) Substrate for tests and test equipment with its use
US20150168456A1 (en) Probe card and method for producing a probe card
KR200304113Y1 (en) Probe card for testing semiconductor
JP2993093B2 (en) Test equipment for integrated circuit devices

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP