WO2004023765A1 - Appareil electronique portable dote d'une structure etanche a l'eau et procede associe d'etancheification a l'eau - Google Patents

Appareil electronique portable dote d'une structure etanche a l'eau et procede associe d'etancheification a l'eau Download PDF

Info

Publication number
WO2004023765A1
WO2004023765A1 PCT/KR2003/001831 KR0301831W WO2004023765A1 WO 2004023765 A1 WO2004023765 A1 WO 2004023765A1 KR 0301831 W KR0301831 W KR 0301831W WO 2004023765 A1 WO2004023765 A1 WO 2004023765A1
Authority
WO
WIPO (PCT)
Prior art keywords
core frame
built
component assembly
molded article
resin molded
Prior art date
Application number
PCT/KR2003/001831
Other languages
English (en)
Inventor
Yong Jhee
Sang-Choon Lee
Original Assignee
Watercom Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020030060543A external-priority patent/KR100547602B1/ko
Application filed by Watercom Co., Ltd. filed Critical Watercom Co., Ltd.
Priority to AU2003258881A priority Critical patent/AU2003258881A1/en
Publication of WO2004023765A1 publication Critical patent/WO2004023765A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones

Definitions

  • the present invention relates to a portable electronic product having a waterproof structure and a waterproofing method thereof, and more particularly, to a portable electronic product having a waterproof structure by which the device can operate normally even after it is exposed to water, and a waterproofing method of the portable electronic product.
  • a portable electronic product for example, a mobile phone, a personal digital assistant (PDA), a notebook computer, a liquid crystal display (LCD) TV, a portable wireless apparatus, a compact disc (CD) player, and an MPEG1 audio layer-3 (MP3) player, can be freely used while moving, without regard to a place.
  • the portable electronic product may happen to be exposed to water on carrying. For example, the portable electronic product may happen to be dropped into water, or get wet in the rain. Since most of the devices do not adopt a waterproof design, water may infiltrate into circuit components provided within their casings. Accordingly, the portable electronic products may lose their functions by the circuit components exposed to water or moisture, so that they are liable to malfunction. In this regard, it is necessary to prevent these problems.
  • portable electronic products that can be conveniently used without regard to place, even at a wet place, e.g., beach or a bath, are preferred. Therefore, there is increasing demand for a portable electronic product having a waterproof structure by which their circuit components can be protected against water or moisture by preventing water or moisture from infiltrating into the circuit components even after the portable electronic product is exposed to water or moisture.
  • a hermetic seal is generally established in gaps of a casing, the gaps through which moisture may infiltrate into the electronic product.
  • the hermetical seal of all the gaps may give rise to an increase in the size of a portable electronic product, causing many limitations in external design of portable electronic products and increasing development cost and manufacturing cost, which is not desirable in view of cost efficiency and marketability.
  • the present invention provides a portable electronic product having a waterproof structure and a waterproofing method thereof, which can prevent water or moisture from infiltrating into a built-in circuit component assembly even after being exposed to water, without a considerable increase in manufacturing cost nor an adverse effect on designing of a casing.
  • a portable electronic product having a waterproof structure having a casing defining an accommodating space inside, and a built-in component assembly having a waterproofing portion to be avoided from contacting with water or moisture, and accommodated in and combined with the casing
  • the portable electronic product comprising: a core frame combined with the built-in component assembly along the outer periphery of the built-in component assembly so as to enclose the waterproofing portion of the built-in component assembly; and a resin molded article contacting and connected with the core frame on the outer surface of the core frame so as to prevent external water or moisture from infiltrating into the waterproofing portion.
  • the resin molded article may be injection molded to a predetermined thickness using the built-in component assembly to which the core frame is coupled, as an insert, and may be combined with the core frame during injection molding.
  • the portable electronic product may further comprise a heat-insulating and shock-absorbing member installed between the core frame and the built-in component assembly, for insulating heat and absorbing shocks from the built-in component assembly; and an electromagnetic shielding sheet installed between the heat-insulating and shock-absorbing member and the core frame, for shielding electromagnetic interference.
  • the heat-insulating and shock-absorbing member is preferably an ethylene vinyl acetate (EVA) sponge.
  • the resin molded article is an elastomer mold, which is because elastomer is fused well into a plastic surface during injection molding, thereby maintaining high adhesiveness and airtightness.
  • Shock-absorbing protrusions protruding outward from the outer surface of the resin molded article are preferably provided on some regions of the outer surface of the resin molded article, for the purpose of protecting built-in circuit components by absorbing external shocks that may be applied after the built-in component assembly is installed in the casing.
  • a cutting line for cutting the resin molded article may be formed on the outer surface of the resin molded article. The reason of forming the cutting line is to facilitate removal of the resin molded article in a case where a repairing work can be performed by removing the resin molded article, rather than by replacing the overall built-in component assembly in an event of malfunctioning.
  • a flow channel inwardly recessed to a predetermined depth may be formed on the outer surface of the core frame for the purpose of facilitating smooth flow of the resin during injection molding, and reinforcing ribs for reinforcing the strength of the core frame may be prepared on some regions of the internal surface of the core frame.
  • the resin molded article is vacuum-molded so as to have an internal shape corresponding to an external shape of the built-in component assembly and is then combined with the core frame.
  • the resin molded article is preferably combined with the core frame by ultrasonic fusion, which is advantageous in view of working efficiency.
  • the portable electronic product may further comprise a rubber-painted layer coated on at least some regions of the outer surface of the resin molded article, thereby ensuring waterproofing performance.
  • the core frame may comprise an upper core frame and a lower core frame facing and coupled to each other, and the resin molded article may comprise an upper resin molded article and a lower resin molded article that are combined with the upper core frame and the lower core frame by ultrasonic fusion, respectively.
  • An engagement protrusion may be formed along the periphery of the peripheral portion of one of the upper and lower core frames, and an engagement groove corresponding to the engagement protrusion may be formed along the periphery of the peripheral portion of the other of the upper and lower core frames of the lower core frame.
  • At least one of the upper and lower core frames may have at its distal end a sloping portion whose external side is inclined such that the thickness thereof is thinner outward. In such a manner, a wedge-shaped groove is formed at a connecting portion of the upper and lower core frames.
  • a waterproofing method of a portable electronic product having a casing defining an accommodating space inside, and a built-in component assembly having a waterproofing portion to be avoided from contacting with water or moisture, and accommodated in and combined with the casing
  • the waterproofing method comprising: combining a core frame with the built-in component assembly along the outer periphery of the built-in component assembly so as to enclose the waterproofing portion of the built-in component assembly; and performing injection molding of a resin molded article to a predetermined thickness on the outer surface of the core frame and at least some regions of the outer surface of the built-in component assembly using the built-in component assembly combined with the core frame as an insert to prevent water or moisture from infiltrating into the waterproofing portion of the built-in component assembly.
  • the built-in component assembly may further comprise a protection portion to be avoided from contacting with an injection mold during injection molding
  • the waterproofing method may further comprise installing a protection member configured to contact with the injection mold during injection molding, on the protection portion of the built-in component assembly before the resin molded article is integrally injection-molded with the core frame and the built-in component assembly, and removing the protection member after the injection molding is completed.
  • the combining of the core frame with the built-in component assembly is preceded by installing an electromagnetic shielding sheet in the core frame so as to prevent electromagnetic interference, and installing a heat-insulating and shock-absorbing member on the core frame so as to contact with the outer surface of the electromagnetic shielding sheet.
  • a waterproofing method of a portable electronic product having a casing defining an accommodating space inside, and a built-in component assembly having a waterproofing portion to be avoided from contacting with water or moisture, and accommodated in and combined with the casing, the waterproofing method comprising: preparing a core frame combined with the built-in component assembly along the outer periphery of the built-in component assembly so as to enclose the waterproofing portion of the built-in component assembly; preparing a resin molded article having an internal shape corresponding to an external shape of the core frame to a predetermined thickness by vacuum molding; combining the resin molded article with the core frame; and combining the built-in component assembly with the core frame combined with the resin molded article.
  • the waterproofing method may further comprise forming a rubber-painted layer on at least some regions of the outer surface of the resin molded article after the combining of the built-in component assembly with the core frame.
  • the resin mode is preferably made of a transparent polyester resin, which is advantageous in that a display screen is not obstructed even when the resin molded article is arranged on a LCD portion of the portable electronic product, such as a mobile phone.
  • the resin molded article is preferably combined with the core frame by ultrasonic fusion.
  • the core frame may comprise an upper core frame and a lower core frame facing each other, and the resin molded article comprises an upper resin molded article and a lower resin molded article that are combined with the upper core frame and the lower core frame by ultrasonic fusion, respectively.
  • the core frame may be configured such that an engagement protrusion is formed along the periphery of the peripheral portion of one of the upper and lower core frames, and an engagement groove corresponding to the engagement protrusion is formed along the periphery of the peripheral portion of the other of the upper and lower core frames of the lower core frame.
  • FIG. 1 is a partly cut-away perspective view of a mobile phone according to an embodiment of the present invention
  • FIG. 2 is a plan view of a built-in component assembly shown in FIG. 1 ;
  • FIG. 3 is a right side view of a body built-in component assembly shown in FIG. 2;
  • FIG. 4 is a right side view of a flip built-in component assembly shown in FIG. 2;
  • FIG. 5 is a detailed diagram of a flexible connector shown in FIG. 2;
  • FIG. 6 is a plan view of a built-in component assembly of a mobile phone according to another embodiment of the present invention.
  • FIG. 7 is a right side view of a body built-in component assembly shown in FIG. 6;
  • FIG. 8 is a right side view of a flip built-in component assembly shown in FIG. 6;
  • FIG. 9 is a plan view of an upper resin molded article combined with the flip built-in component assembly shown in FIG. 8;
  • FIG. 10 is a left side view of the upper resin molded article shown in FIG. 9;
  • FIG. 11 is a plan view of a lower resin molded article combined with the flip built-in component assembly shown in FIG. 8;
  • FIG. 12 is a left side view of the lower resin molded article shown in FIG. 11.
  • the present invention can be applied to various portable electronic products such as a mobile phone, PDA, a notebook computer, an LCD TV, a portable wireless apparatus, a CD player, and an MP3 player, specifically portable electronic products having a casing defining an accommodating space inside, and a built-in component assembly having a waterproofing portion, which must avoid contacting with water or moisture, and accommodated in and combined with the casing.
  • a mobile phone adopted in the present invention will now be described in detail by way of example.
  • FIG. 1 is a partly cut-away perspective view of a mobile phone according to an embodiment of the present invention
  • FIG. 2 is a plan view of a built-in component assembly shown in FIG. 1.
  • a mobile phone 1 according to an embodiment of the present invention includes a casing 10, a built-in component assembly 20, a core frame 30, an ethylene vinyl acetate (EVA) sponge 50, an electromagnetic shielding sheet 60, and an elastomer 40.
  • the casing 10 has an accommodating space defined therein, and the built-in component assembly 20 has a waterproofing portion, which must avoid contacting with water or moisture, and is accommodated in and combined with the casing 10.
  • the core frame 30 is combined with the built-in component assembly 20 so as to enclose the waterproofing portion of the built-in component assembly 20.
  • the EVA sponge 50 is installed between the core frame 30 and the built-in component assembly 20 as a heat-insulating and shock-absorbing member.
  • the electromagnetic shielding sheet 60 is installed between the EVA sponge 50 and the core frame 30.
  • the elastomer 40 is a resin molded article that is integrally injection-molded with the core frame 30 and the built-in component assembly 20 and installed on the outer surface of the core frame 30.
  • the casing 10 has a body casing 1 1 , in which a plurality of signal input buttons 23a are installed as a user's data input device, and a flip casing 15, in which an LCD is installed.
  • a body built-in component assembly 21 which has built-in components incorporated in the body casing 1 1 and will be described later, is accommodated in and combined with the body casing 11
  • a flip built-in component assembly 25 which has built-in components incorporated in the flip casing 15 and will be described later, is accommodated in and combined with the flip casing 15.
  • the body casing 11 includes button holes 12 formed at positions of the plurality of signal input buttons 23a so that the plurality of signal input buttons 23a can be exposed outside, and a connecting portion 13 hinged to the flip casing 15.
  • the flip casing 15 includes a display portion 16 hollowed out such that an LCD 26 can be exposed outside, and a hinge connector 17 hinged to the body casing 1 1 .
  • the flip casing 15 is opened or closed by rotating relative to the body casing 11 about a lengthwise axis corresponding to the centerline of the hinge connector 17.
  • FIG. 3 is a right side view of the body built-in component assembly shown in FIG. 2
  • FIG. 4 is a right side view of the flip built-in component assembly shown in FIG. 2
  • FIG. 5 is a detailed diagram of a flexible connector shown in FIG. 2, respectively.
  • the built-in component assembly 20, which are illustrated in FIGS. 2 through 5, generally includes a printed circuit board (PCB) 22, 28, and functional components electrically connected to and combined with the PCB 22, 28, such as, an internal antenna jack 22a, an earphone jack 22b, an external antenna jack 22c, a contact point 22d, a speaker 27 and so on.
  • PCB printed circuit board
  • the term "built-in component assembly” used throughout the specification means a finished component assembly, all components of which have been inspected whether they operate normally or not after being assembled.
  • the mobile phone according to an embodiment of the present invention employs a new waterproof structure in which a portion of the built-in component assembly 20, excluding portions to be exposed outside, e.g., portions connected to external devices, is enclosed by an injection-mold resin, e.g., a material such as the elastomer 40 so that water can be prevented from infiltrating into built-in circuit components of the built-in component assembly 20.
  • an injection-mold resin e.g., a material such as the elastomer 40 so that water can be prevented from infiltrating into built-in circuit components of the built-in component assembly 20.
  • the built-in component assembly 20 is largely divided into a built-in component assembly 21 incorporated in the body casing 11 , and a built-in component assembly 25 incorporated in the flip casing 15, which will be separately defined as the body built-in component assembly 21 and the flip built-in component assembly 25, respectively, for clarity.
  • the respective built-in component assemblies which are both finished built-in component assemblies whose components are all inspected whether they operate normally or not after being assembled, correspond to the built-in component assembly 20 defined above.
  • a portable electronic product such as a flip-type mobile phone
  • a built-in component assembly designated by reference numeral 20 in the present invention, having a body built-in component assembly and a flip built-in component assembly integrally formed therein, each designated by reference numeral 21 , 25 in the present invention, and an elastomer injection mold can be applied thereto.
  • the body built-in component assembly 21 includes a body PCB 22 and a keypad unit 23 provided in front of and electrically connected to the body PCB 22.
  • the keypad unit 23 is a part where the signal input buttons 23a are installed for user's data input.
  • the core frame 30 and the elastomer 40 are not necessary to arrange the core frame 30 and the elastomer 40 as a resin molded article on the outer surface of the keypad unit 23.
  • an edge of the contact point 22d and an edge of the external antenna 22c, which are connected to external devices, are excluded from portions to be waterproofed, so that the elastomer 40 is not formed thereat.
  • a waterproof contact point as disclosed in the Korean Utility Model No. 198490 titled "Terminal Structure with Waterproof Structure” owned by the present applicant, is used as the contact point 22d.
  • the insides of the external antenna 22c and the earphone jack 22b are treated using well-known waterproofing technology.
  • the speaker 27 and the LCD 26 are electrically connected to the LCD PCB 28.
  • the elastomer 40 is not formed thereat.
  • the core frame 30 is combined with the built-in component assembly 20 so as to enclose the waterproofing portion of the built-in component assembly 20.
  • the core frame 30 is made of a plastic frame consisting of PBT and 20% glass fiber, and includes two thin portions consisting of an upper core frame and a lower core frame.
  • the upper core frame 30 and the lower core frame 30 are coupled to each other and combined with the built-in component assembly 20 so as to enclose the waterproofing portion of the built-in component assembly 20.
  • the core frame 30 is largely divided into a core frame installed on the outer surface of the body built-in component assembly 21 and another core frame installed on the outer surface of the flip built-in component assembly 25, which are separately defined as a body core frame and a flip core frame, respectively, but designated by the same reference numeral.
  • a lattice-type flow channel 31 On the outer surface of the core frame 30 is formed a lattice-type flow channel 31 inwardly recessed to a predetermined depth, for the purpose of facilitating smooth flow of the resin during injection molding. Since the core frame 30 is thin, reinforcing ribs (not shown) for reinforcing the strength of the core frame 30 are prepared on some regions of the internal surface of the core frame 30.
  • the EVA sponge 50 which is a heat-insulating and shock-absorbing member, is installed between the core frame 30 and the built-in component assembly 20.
  • the electromagnetic shielding sheet 60 is installed between the EVA sponge 50 and the core frame 30.
  • the electromagnetic shielding sheet 60 for shielding electromagnetic interference (EMI) is made by coating a thin copper plate or a thin aluminum plate with a PVC sheet. In consideration of shape of the core frame 30 and arrangement of circuit components, moldings are used as the electromagnetic shielding sheet 60.
  • the EVA sponge 50 which is a heat-insulating and shock-absorbing member, fills spaces between each of the circuit components mounted on the PCB 22, 28 and covers the circuit components.
  • the core frame side surface of the EVA sponge 50 is flattened.
  • the electromagnetic shielding sheet 60 is placed on the flattened surface.
  • the EVA sponge 50 serves to protect various circuit components of the PCB 22, 28, such as ICs, chip resistors or chip condensers, from heat and pressure during injection molding.
  • the elastomer 40 as a resin molded article is arranged on the outer surface of the core frame 30 and is integrally injection-molded with the core frame 30 and the built-in component assembly 20.
  • shock-absorbing protrusions 41 protruding outward from the outer surface of the core frame 30 are provided on some regions of the outer surface of the core frame 30, specifically eight corners of the core frame 30 and other necessary portions.
  • the shock-absorbing protrusions 41 serve to protect built-in circuit components from external impacts.
  • elastomer is used as a material of the resin molded article. This is because elastomer is fused well into a plastic surface, that is, the surface of the core frame 30, during injection molding, thereby maintaining high adhesiveness and airtightness.
  • the EVA sponge 50 is installed on the opposite side of the keypad unit 23 of the body PCB in the body built-in component assembly 21 , and the electromagnetic shielding sheet 60 is installed in contact with the outer surface of the EVA sponge 50.
  • the body core frame 30 is coupled to the body built-in component assembly 21 so as to enclose the waterproofing portion of the body built-in component assembly 21.
  • the elastomer 40 as a resin molded article for plugging gaps formed in the body core frame 30 and spacing between the body core frame 30 and the keypad unit 23, is injection-molded on the outer surface of the body core frame 30.
  • the body core frame 30 is not installed thereon.
  • the keypad unit 23 may be damaged due to a direct contact between the keypad unit 23 and an injection mold.
  • a plastic case that is, the protection member 39, is attached to the keypad unit 23 during injection molding, and is then removed after the injection molding is completed.
  • the elastomer 40 is bent inward so as to form a hole tightly contacting with the outer surface of the external antenna 22c and having a diameter slightly smaller than that of the external antenna 22c in the neighborhood of an outer edge of the external antenna 22c, thereby filling gaps through which water or moisture may infiltrate.
  • a connection structure between the core frame 30 and the elastomer 40 in the flip built-in component assembly 25, is similar to that in the body built-in component assembly 21.
  • the EVA sponge 50 is installed on the rear surface of the PCB 28 of the LCD 26 of the flip built-in component assembly 25, and the electromagnetic shielding sheet 60 is installed on the outer surface of the EVA sponge 50.
  • the flip core frame 30 is installed so as to enclose the waterproofing portion of the flip built-in component assembly 25.
  • the elastomer 40 as a resin molded article for plugging gaps formed in the flip core frame 30 and spacing between the flip core frame 30 and the LCD 26, is injection-molded on the outer surface of the flip core frame 30.
  • the LCD 26 may be damaged if the LCD 26 directly contacts an injection mold during injection molding. Therefore, in order to prevent the LCD 26 from directly contacting with the injection mold, the protection member 39 consisting of a plastic case and a heat-dissipating shock-absorbing member, is attached to the surface of the LCD 28, followed by performing injection molding, and is then sequentially removed after the injection molding is completed.
  • the elastomer 40 is bent inward so as to form a hole having a diameter slightly smaller than that of the flexible connector 29, so that the elastomer 40 tightly contacts with the flexible connector 29, thereby filling gaps through which water or moisture may infiltrate.
  • FIG. 5 is a detailed diagram of the flexible connector 29 shown in FIG. 2, including a connector plug 29a and a flexible PCB 29b.
  • the flexible connector 29 is formed by performing insertion molding of the elastomer 40 on the outer surface of the flexible PCB 29b rather than installing the core frame 30.
  • All circuit components are first inspected whether they operate normally or not after being assembled, providing the built-in component assembly 20.
  • the electromagnetic shielding sheet 60 is mounted inside the core frame 30, and the EVA sponge 50 is installed in contact with the outer surface of the electromagnetic shielding sheet 60.
  • the core frame 30 having the electromagnetic shielding sheet 60 and the EVA sponge 50 is installed so as to enclose the waterproofing portion of the built-in component assembly 20.
  • a plastic case as the protection member 39 is attached to the surface of the keypad unit 23 in the body built-in component assembly 21
  • a plastic case and a heat-dissipating shock-absorbing member as the protection member 39 are attached to the surface of the LCD 26.
  • the built-in component assembly 20 is inserted into a specially designed insertion mold and then the elastomer 40 is injection- molded, thereby perfectly sealing the waterproofing portion of the built-in component assembly 20.
  • the elastomer 40 is formed at some portions, such as various connectors for connecting the respective components with external devices, the earphone jack 22b, or the external antenna 22a, like at the 'A' portion shown in FIG .3 or at the 'B' portion shown in FIG .4.
  • a mold is configured such that molding and separation of the elastomer 40 can be simultaneously performed by forming a cutting line (not shown) on the outer surface of the resin molded article.
  • the thus-formed built-in component assembly 20 into which the elastomer 40 is integrally molded has not only characteristic functions exerted by all circuit components but also a perfect waterproofing function.
  • the waterproofing function can be performed by preventing circuit components of the PCB 22, 28 from contacting with water or moisture. Then, the built-in component assembly 20 is accommodated in and combined with the casing 10, thereby completing an assembling work of the mobile phone 1.
  • FIG. 6 is a plan view of a built-in component assembly of a mobile phone according to another embodiment of the present invention
  • FIG. 7 is a right side view of a body built-in component assembly shown in FIG. 6
  • FIG. 8 is a right side view of a flip built-in component assembly shown in FIG. 6.
  • the same reference numbers as those in the foregoing embodiment are used to denote the same elements, and numbers obtained by adding 100 to the reference numbers used to denote the elements of the foregoing embodiment are used to denote modified elements thereof.
  • an upper resin molded article 140 and a lower resin molded article 140 are vacuum-molded separately so as to have an internal shape corresponding to an external shape of the built-in component assembly 120 combined with the upper core frame 130 and the lower core frame 130.
  • each resin molded article 140 is combined with each core frame 130 by ultrasonic fusion, and the upper and lower core frames 130 with which the upper and lower resin molded articles 140 are combined by ultrasonic fusion, are coupled to each other so as to accommodate the built-in component assembly 120 therein, followed by further forming a rubber printing layer 170 on the outer surface of the resin molded article 140.
  • the casing 10 and the built-in component assembly that is not subjected to waterproofing treatment are the same as those of the foregoing embodiment, and an explanation thereof will not given. Only elements different from those of the foregoing embodiment will now be described.
  • a core frame 130 includes an upper core frame and a lower core frame, both being designated by the same reference number 130, which are coupled to and face each other, like in the foregoing embodiment.
  • an engagement protrusion 131 is formed along the periphery of the peripheral portion.
  • an engagement groove 132 corresponding to the engagement protrusion 131 of the upper core frame 130 is formed.
  • each of the upper and lower core frames 130 has at its distal end a sloping portion 133 whose external side is inclined such that the thickness thereof is thinner outward.
  • a wedge-shaped groove 134 is formed on a surface where they face each other, that is, on a coupling surface.
  • the overall built-in component assembly 120 is generally replaced.
  • the wedge-shaped groove 134 can be easily detached from the built-in component assembly 120 by cutting away only the resin molded article 140 along the groove 134.
  • a plurality of protrusions 135 for ultrasonic fusion are formed on the outer surfaces of the upper and lower core frames 130, thereby facilitating ultrasonic fusion with the resin molded article 140.
  • the resin molded article 140 according to the present embodiment is shaped in a desired manner by vacuum molding, separately from the core frame 130.
  • FIG. 9 is a plan view of an upper resin molded article combined with the flip built-in component assembly
  • FIG. 10 is a left side view of FIG. 9
  • FIG. 11 is a plan view of a lower resin molded article combined with the flip built-in component assembly
  • FIG. 12 is a left side view of FIG. 11.
  • the upper and lower resin molded articles 140a and 140b of the flip built-in component assembly 125 are formed as shown in the drawings
  • the upper and lower resin molded articles 140 of the body built-in component assembly 121 are also shaped in a desired manner. That is, the resin molded article 140 is molded so as to have an internal shape corresponding to an external shape of the built-in component assembly 120 having the core frame 130 combined therewith.
  • Vacuum molding which is a kind of plastic molding processing methods, is performed such that an edge of a plastic plate is compressed on a lower mold with a clamp, an upper portion of the plastic plate is heated and air is then exhausted from the mold when the plastic plate is sufficiently softened.
  • a transparent synthetic resin plate such as polyester, polycarbonate or an acrylonitrile butadiene styrene (ABS) copolymer resin, is installed on a mold for vacuum molding, and heating, vacuum molding and cutting are sequentially performed, thereby finally manufacturing a resin molded article having a desired shape, as shown in FIGS. 9 through 12.
  • the resin molded article 140 may be shaped such that it can cover a surface of an LCD without cutting a display portion facing the surface of the LCD.
  • the resin molded article 140 manufactured for connection with the core frame 130 coupled to a side of a keypad unit 123 of the body built-in component assembly 121 may be integrally molded with the keypad unit 123 if the keypad unit 123 is injection-molded using the manufactured resin mold article 140 as an insert.
  • the molten upper and lower resin molded article 140 are combined with the corresponding upper and lower core frames 130 by ultrasonic fusion, respectively, and the upper and lower core frames 130 having the respective resin molded articles 140 combined therewith by ultrasonic fusion, are coupled to each other so as to accommodate the built-in component assembly 120 therein.
  • gaps formed at the coupled portion are sealed by engagement between the engagement protrusion 131 of the upper core frame 130 and the engagement groove 132 of the lower core frame 130.
  • the resin molded articles 140 are formed on the outer surfaces of the upper and lower core frames 130 in a close contact type. Therefore, a waterproof structure can be primarily attained.
  • the rubber-painted layer 170 is formed on the outer surface of the resin molded article 140.
  • the rubber-painted layer 170 which is a paint for spraying and is composed of rubber, has a surface strength strong enough to be used for interior construction, although the surface strength thereof is slightly poor compared to the elastomer described in the foregoing embodiment, and has good workability and adhesiveness, exhibiting excellent waterproofing capability. That is, the primary waterproof structure attained by the resin molded article 140 can be secondarily enhanced by the rubber-painted layer 170, thereby achieving waterproofing in a more secured manner.
  • a waterproofing method of the above-described portable electronic product having a waterproof structure according to another embodiment of the present invention will now be described.
  • All circuit components are first inspected whether they operate normally or not after being assembled, providing the built-in component assembly 120.
  • the upper core frame 130 and the lower core frame 130 each having a shape corresponding to that of the built-in component assembly 120, are provided by injection molding.
  • the upper resin molded article 140 and the lower resin molded article 140 having internal shapes corresponding to external shapes of the upper core frame 130 and the lower core frame 130 are provided by vacuum molding.
  • a transparent synthetic resin plate such as polyester, polycarbonate or an ABS copolymer resin
  • the upper resin molded article 140 connected with the upper core frame 130 of the body built-in component assembly 121 may be integrally molded with the keypad unit 123 if the keypad unit 123 is injection-molded using the manufactured resin molded article 140 as an insert.
  • the upper core frame 130 and the lower core frame 130 are arranged inside the upper resin molded article 140 and the lower resin molded article 140, respectively, and then are combined therewith by ultrasonic fusion.
  • the upper core frame 130 and the lower core frame 130 are coupled to each other so as to accommodate the built-in component assembly 120 in the core frame 130 having the resin molded article 140 combined therewith by ultrasonic fusion.
  • an engagement protrusion 131 and an engagement groove 132 are formed along the peripheries of the peripheral portions.
  • the built-in component assembly 120 having the core frame 130 and the resin molded article 140 combined with each other, is first installed in an automatic jig, and painting is performed on the outer surface of the resin molded article 140 by a spraying method to form the rubber-painted layer 170, followed by drying and performing a waterproofing pressure test.
  • the thus-completed built-in component assembly 120 has not only characteristic functions exerted by all circuit components but also a perfect waterproofing function.
  • the waterproofing function can be performed by preventing the circuit components of a PCB from contacting with water or moisture.
  • the built-in component assembly 120 is accommodated in and combined with the casing 10, thereby completing an assembling work of the mobile phone 1.
  • the resin molded article 40 is injection-molded with a material, e.g., elastomer, using the built-in component assembly 20 combined with the core frame 30, as an insert, or a separately provided material, e.g., polycarbonate, by vacuum molding.
  • the waterproofing portions 20, 120 accommodated in the casing 10 are enclosed by the resin molded article 140 combined with the core frame 30, 130.
  • the waterproof structure according to the present invention can be applied to any type of portable electronic products including a flip type mobile phone, that have a built-in component assembly while having a casing and a waterproofing portion, the built-in components being accommodated in and combined with the casing.
  • the present invention can be applied to various portable electronic products, such as a PDA, a notebook type computer, an LCD TV, a portable wireless apparatus, a CD player, an MP3 player and so on, by combining a core frame with a built-in component assembly and forming a resin molded article contacting with and coupled to the core frame outside the core frame, thereby achieving ensured waterproofing capability function.
  • an EVA sponge is used as a heat-insulating and shock-absorbing member
  • other kinds of materials such as a non-woven fabric, may also be used as long as they are capable of insulating heat and absorbing external shocks.
  • a heat-insulating and shock-absorbing member and an electromagnetic shielding sheet are separately provided, a single substance serving as the heat-insulating and shock-absorbing member and the electromagnetic shielding sheet, can be used, if available.
  • a portable electronic product having ensured waterproofing capability, and a waterproofing method thereof, the ensured waterproofing capability by which water or moisture can be prevented from infiltrating into built-in circuit components even after being exposed to water, without a considerable increase in manufacturing cost nor an adverse effect on designing of a casing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un appareil électronique portable doté d'une structure étanche à l'eau et un procédé associé d'étanchéification à l'eau. Cet appareil présente une structure étanche à l'eau dotée d'un boîtier formant un espace de logement interne et un assemblage de composants intégrés possédant une partie étanche à l'eau qui doit éviter de rentrer en contact avec l'eau ou l'humidité, et logé dans le boîtier ou combiné à celui-ci se trouve un cadre central associé à l'assemblage de composants intégrés le long de la périphérie externe dudit assemblage, afin d'envelopper la partie d'étanchéification dudit assemblage. Ledit appareil comporte aussi un article moulé de résine rentrant en contact et relié au cadre central sur la surface externe dudit cadre, de manière à empêcher l'eau ou l'humidité extérieure de s'infiltrer dans la partie étanche à l'eau. De ce fait, l'appareil électronique portable doté d'une capacité d'étanchéité garantie empêche l'eau ou l'humidité de s'infiltrer dans des composants de circuit intégrés, même après une exposition à l'eau, sans entraîner une augmentation considérable des coûts de fabrication ou un effet adverse sur la conception d'un boîtier.
PCT/KR2003/001831 2002-09-06 2003-09-05 Appareil electronique portable dote d'une structure etanche a l'eau et procede associe d'etancheification a l'eau WO2004023765A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003258881A AU2003258881A1 (en) 2002-09-06 2003-09-05 Portable electronic product with waterproof structure and waterproofing method thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2002-0053760 2002-09-06
KR1020020053760 2002-09-06
KR10-2003-0060543 2003-08-30
KR1020030060543A KR100547602B1 (ko) 2002-09-06 2003-08-30 방수구조를 갖는 휴대용 전자제품 및 그 방수방법

Publications (1)

Publication Number Publication Date
WO2004023765A1 true WO2004023765A1 (fr) 2004-03-18

Family

ID=31980690

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2003/001831 WO2004023765A1 (fr) 2002-09-06 2003-09-05 Appareil electronique portable dote d'une structure etanche a l'eau et procede associe d'etancheification a l'eau

Country Status (2)

Country Link
AU (1) AU2003258881A1 (fr)
WO (1) WO2004023765A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005053288A1 (de) * 2005-11-08 2007-05-10 Benq Mobile Gmbh & Co. Ohg Mobilfunkgerät
WO2008075139A1 (fr) * 2006-12-21 2008-06-26 Nokia Corporation Montage de composants dans des dispositifs électroniques
CN102922668A (zh) * 2012-11-01 2013-02-13 东莞劲胜精密组件股份有限公司 一种防水硅胶注塑模具结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000049978A (ko) * 2000-05-09 2000-08-05 신동원 방수, 방습, 단열 및 탄성부재가 설치된 폴더형핸드폰케이스
KR20020036882A (ko) * 2000-11-11 2002-05-17 은성균 방수 구조를 갖는 단자 조립체
JP2002176481A (ja) * 2000-12-06 2002-06-21 Nec Corp 携帯電話機

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000049978A (ko) * 2000-05-09 2000-08-05 신동원 방수, 방습, 단열 및 탄성부재가 설치된 폴더형핸드폰케이스
KR20020036882A (ko) * 2000-11-11 2002-05-17 은성균 방수 구조를 갖는 단자 조립체
JP2002176481A (ja) * 2000-12-06 2002-06-21 Nec Corp 携帯電話機

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005053288A1 (de) * 2005-11-08 2007-05-10 Benq Mobile Gmbh & Co. Ohg Mobilfunkgerät
DE102005053288B4 (de) * 2005-11-08 2010-09-30 Palm, Inc. (n.d.Ges. d. Staates Delaware), Sunnyvale Mobilfunkgerät
WO2008075139A1 (fr) * 2006-12-21 2008-06-26 Nokia Corporation Montage de composants dans des dispositifs électroniques
US9294600B2 (en) 2006-12-21 2016-03-22 Nokia Corporation Mounting components in electronic devices
CN102922668A (zh) * 2012-11-01 2013-02-13 东莞劲胜精密组件股份有限公司 一种防水硅胶注塑模具结构

Also Published As

Publication number Publication date
AU2003258881A1 (en) 2004-03-29

Similar Documents

Publication Publication Date Title
CN103681049B (zh) 用于按钮的三维密封
EP2548266B1 (fr) Connecteurs scellés destinés à des dispositifs électroniques portables
US5432676A (en) Electronic apparatus case with wiring member embedded in a molded plastic hinge
US7697269B2 (en) Housing mechanism for electronic device
KR102042727B1 (ko) 방수 이어 잭 및 이의 제조방법
WO2010134261A1 (fr) Dispositif de terminal portable et équipement électronique
US9294600B2 (en) Mounting components in electronic devices
US20090159412A1 (en) Side key assembly and portable electronic device using the same
KR101662322B1 (ko) 휴대용 단말기의 방수 구조
EP2369905B1 (fr) Boîtier et dispositif électronique l'utilisant
JP5146286B2 (ja) 装置筐体及び携帯端末装置
WO2009019031A1 (fr) Améliorations d'un appareil électronique ou qui y sont liées et procédés associés
US20070152466A1 (en) Cover for a mobile device, and method for making the cover
KR20160133272A (ko) 접속 장치, 그의 제작 방법 및 그를 포함하는 전자 장치
US20160254835A1 (en) Integrated screen and perimeter protector for an electronic device
US20090207570A1 (en) Cover part for electronic equipment and electronic equipment having the same
WO2004023765A1 (fr) Appareil electronique portable dote d'une structure etanche a l'eau et procede associe d'etancheification a l'eau
WO2006080748A1 (fr) Produits electroniques portables a structure impermeable et procede d'impermeabilisation
CN108924281B (zh) 中框、移动终端及中框的制作方法
KR100547602B1 (ko) 방수구조를 갖는 휴대용 전자제품 및 그 방수방법
CN114786398A (zh) 密封结构和电子设备
KR200296276Y1 (ko) 방수구조를 갖는 휴대용 전자제품
CN113382569A (zh) 壳体组件以及电子设备
CN108712547B (zh) 一种电子装置及前壳组件
KR100635337B1 (ko) 방수구조를 갖는 휴대용 전자제품 및 그 방수방법

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established
32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 69(1) EPC OF 290605, FORM 1205A

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP