WO2004003935A3 - Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps - Google Patents

Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps Download PDF

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Publication number
WO2004003935A3
WO2004003935A3 PCT/US2003/020044 US0320044W WO2004003935A3 WO 2004003935 A3 WO2004003935 A3 WO 2004003935A3 US 0320044 W US0320044 W US 0320044W WO 2004003935 A3 WO2004003935 A3 WO 2004003935A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
plating
fill
treatment step
ecp
Prior art date
Application number
PCT/US2003/020044
Other languages
French (fr)
Other versions
WO2004003935A2 (en
Inventor
Michael X Yang
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2004003935A2 publication Critical patent/WO2004003935A2/en
Publication of WO2004003935A3 publication Critical patent/WO2004003935A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Abstract

The method generally includes filling features in a substrate by plating metal ions from a gap fill solution onto the substrate, reducing plating activity in the features in a polymer treatment step by conditioning the substrate surface with a conditioning solution, and plating the substrate surface to a desired thickness by plating metal ions from a bulk fill solution onto the substrate surface. The method may also include treating the substrate with a conditioning solution comprising suppressors after a seed layer deposition to substantially eliminate conformal deposition in features of the substrate and plating metal ions from a plating solution onto the substrate.
PCT/US2003/020044 2002-06-28 2003-06-25 Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps WO2004003935A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/186,056 2002-06-28
US10/186,056 US20040000488A1 (en) 2002-06-28 2002-06-28 CU ECP planarization by insertion of polymer treatment step between gap fill and bulk fill steps

Publications (2)

Publication Number Publication Date
WO2004003935A2 WO2004003935A2 (en) 2004-01-08
WO2004003935A3 true WO2004003935A3 (en) 2004-04-01

Family

ID=29779805

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/020044 WO2004003935A2 (en) 2002-06-28 2003-06-25 Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps

Country Status (3)

Country Link
US (2) US20040000488A1 (en)
TW (1) TW200402483A (en)
WO (1) WO2004003935A2 (en)

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US20030210041A1 (en) * 2000-04-07 2003-11-13 Le Cuong Duy Eddy current measuring system for monitoring and controlling a chemical vapor deposition (CVD) process
US20050145499A1 (en) * 2000-06-05 2005-07-07 Applied Materials, Inc. Plating of a thin metal seed layer
US20050284751A1 (en) * 2004-06-28 2005-12-29 Nicolay Kovarsky Electrochemical plating cell with a counter electrode in an isolated anolyte compartment
US7198705B2 (en) * 2002-12-19 2007-04-03 Texas Instruments Incorporated Plating-rinse-plating process for fabricating copper interconnects
US7879218B1 (en) 2003-12-18 2011-02-01 Novellus Systems, Inc. Deposit morphology of electroplated copper
US8418830B2 (en) * 2005-11-10 2013-04-16 Mi Robotic Solutions (Mirs) Robot system and method for removing sticks and/or foreign elements from conveyor belts
US20070267043A1 (en) * 2005-11-10 2007-11-22 Hugo Salamanca Robot system and method for washing and unclogging procedures of machines under maintenance
US20090101179A1 (en) * 2005-11-10 2009-04-23 Hugo Salamanca Robot system and method for molybdenum roasting furnaces cleaning procedures
US20070180678A1 (en) * 2005-11-10 2007-08-09 Hugo Salamanca Robot system and method for bolt removal from SAG and/or ball mills in ore concentration processes
US20090121061A1 (en) * 2005-11-10 2009-05-14 Hugo Salamanca Robot system and method for unblocking the primary crusher
US20070299556A1 (en) * 2005-11-10 2007-12-27 Hugo Salamanca Robot system and method for scrap bundling in metal smelting and refining processes
US20100057254A1 (en) * 2006-11-13 2010-03-04 Salamanca Hugo P Methods for using robotics in mining and post-mining processing
US20090099688A1 (en) * 2005-11-10 2009-04-16 Hugo Salamanca Integral robot system and method for the dislodging process and/or anode handling from casting wheels
US20070144894A1 (en) * 2005-11-10 2007-06-28 Hugo Salamanca Robot system and method for cathode stripping in electrometallurgical and industrial processes
US20070152616A1 (en) * 2005-11-10 2007-07-05 Hugo Salamanca Robot system and method for cathode selection and handling procedures after the harvest
US7746018B2 (en) * 2005-11-10 2010-06-29 MI Robotic Solutions Robot system and method for reposition and/or removal of base plates from cathode stripping machines in electrometallurgical processes
US20090177324A1 (en) * 2005-11-10 2009-07-09 Hugo Salamanca Robot system and method for maxibags sampling in ore concentration processes
US20070185610A1 (en) * 2005-11-10 2007-08-09 Hugo Salamanca Robot system and method for the application of dislodging material and pin positioning in casting wheels
US20070170066A1 (en) * 2006-01-06 2007-07-26 Beaudry Christopher L Method for planarization during plating
US9865501B2 (en) 2013-03-06 2018-01-09 Lam Research Corporation Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US9070750B2 (en) 2013-03-06 2015-06-30 Novellus Systems, Inc. Methods for reducing metal oxide surfaces to modified metal surfaces using a gaseous reducing environment
US9469912B2 (en) 2014-04-21 2016-10-18 Lam Research Corporation Pretreatment method for photoresist wafer processing
US9472377B2 (en) 2014-10-17 2016-10-18 Lam Research Corporation Method and apparatus for characterizing metal oxide reduction
US10443146B2 (en) 2017-03-30 2019-10-15 Lam Research Corporation Monitoring surface oxide on seed layers during electroplating

Citations (2)

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US4374709A (en) * 1980-05-01 1983-02-22 Occidental Chemical Corporation Process for plating polymeric substrates
EP1069210A1 (en) * 1999-07-12 2001-01-17 Applied Materials, Inc. Process for electrochemical deposition of high aspect ratio structures

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US6555170B2 (en) * 1998-01-30 2003-04-29 Duratech Industries, Inc. Pre-plate treating system
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
DE69929967T2 (en) * 1998-04-21 2007-05-24 Applied Materials, Inc., Santa Clara ELECTROPLATING SYSTEM AND METHOD FOR ELECTROPLATING ON SUBSTRATES
US6793796B2 (en) * 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US6534116B2 (en) * 2000-08-10 2003-03-18 Nutool, Inc. Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
KR100665745B1 (en) * 1999-01-26 2007-01-09 가부시키가이샤 에바라 세이사꾸쇼 A method of copper plating and an apparatus therefor
US6319831B1 (en) * 1999-03-18 2001-11-20 Taiwan Semiconductor Manufacturing Company Gap filling by two-step plating
US6346479B1 (en) * 2000-06-14 2002-02-12 Advanced Micro Devices, Inc. Method of manufacturing a semiconductor device having copper interconnects
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US6824665B2 (en) * 2000-10-25 2004-11-30 Shipley Company, L.L.C. Seed layer deposition
US7195700B2 (en) * 2003-01-30 2007-03-27 Novellus Systems, Inc. Method of electroplating copper layers with flat topography

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374709A (en) * 1980-05-01 1983-02-22 Occidental Chemical Corporation Process for plating polymeric substrates
EP1069210A1 (en) * 1999-07-12 2001-01-17 Applied Materials, Inc. Process for electrochemical deposition of high aspect ratio structures

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KELLY J J ET AL: "COPPER DEPOSITION IN THE PRESENCE OF POLYETHYLENE GLYCOL II. ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, ELECTROCHEMICAL SOCIETY. MANCHESTER, NEW HAMPSHIRE, US, vol. 145, no. 10, October 1998 (1998-10-01), pages 3477 - 3481, XP001053625, ISSN: 0013-4651 *

Also Published As

Publication number Publication date
WO2004003935A2 (en) 2004-01-08
US20060237325A1 (en) 2006-10-26
US20040000488A1 (en) 2004-01-01
TW200402483A (en) 2004-02-16

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