WO2003094586A1 - Circuit board with smd component and cooling body - Google Patents

Circuit board with smd component and cooling body Download PDF

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Publication number
WO2003094586A1
WO2003094586A1 PCT/DE2003/000133 DE0300133W WO03094586A1 WO 2003094586 A1 WO2003094586 A1 WO 2003094586A1 DE 0300133 W DE0300133 W DE 0300133W WO 03094586 A1 WO03094586 A1 WO 03094586A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
heat sink
printed circuit
metallic
conductor tracks
Prior art date
Application number
PCT/DE2003/000133
Other languages
German (de)
French (fr)
Inventor
Gert MÜLLER
Thomas SCHÜPPLER
Wolfgang Daubitz
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2003094586A1 publication Critical patent/WO2003094586A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the invention relates to a printed circuit board with printed conductors running on a surface of the printed circuit board, at least one electronic component in an SMD version mounted thereon and at least one metallic heat sink mounted on the surface of the printed circuit board in the immediate vicinity of the electronic component to be cooled in the region of the printed conductors.
  • Such a circuit board is known, for example, from German published patent application DE 43 32 115 AI.
  • Electronic components in SMD design and metallic heat sinks for cooling the electronic components are applied to the surface of the known printed circuit board.
  • the heat sinks are applied over a number of conductor tracks running on the surface of the known printed circuit board, regardless of their respective potential.
  • the heat sinks on the underside with which they are mounted on the surface of the known circuit board are provided with an electrically insulating film.
  • This film can also be designed as an adhesive film, so that the heat sink can be connected to the surface of the known printed circuit board via the adhesive film.
  • the heat sinks designed in this way can be assembled immediately after the known printed circuit board has been fitted with the electronic SMD components.
  • the invention has for its object a circuit board with electronic To further simplify components in the SMD version and metallic heat sinks for the electronic components with regard to their structure.
  • the heat dissipation from the electronic component to be cooled takes place here by means of heat conduction from the electronic component through the metallic fastening surface which is thermally connected to it into the heat sink, where further heat is emitted by convection and radiation.
  • the lack of an electrically insulating layer on the underside of the heat sink further reduces the thermal resistance.
  • the metallic fastening surface can advantageously be a metallic cooling surface next to the conductor tracks.
  • Such an additional metallic fastening surface can be easily positioned in the vicinity of a component to be cooled. With a correspondingly large design of such a cooling surface, the thermal resistance can still can be further reduced. Furthermore, the cooling surface can be easily adapted to the shape of the heat sink,
  • the metallic fastening surface can advantageously also be part of one of the conductor tracks. In this way, the design of a circuit board according to the invention can be carried out in a particularly space-saving manner, since no separate areas have to be reserved for mounting the heat sink on the circuit board.
  • An advantageous embodiment of the printed circuit board according to the invention further provides that the heat sink consists of copper with an at least partially tinned surface and is soldered onto the metallic fastening surface.
  • the production of the heat sink from copper ensures extremely good thermal conductivity within the heat sink. By tinning the surface of the heat sink, it can be easily soldered onto the metal mounting surface.
  • the heat sink is also essentially in the form of a U-profile, only little effort and low costs are incurred for the production of the heat sink.
  • the heat sink has two mutually opposite parallel cooling plates which are connected to one another on one side by a web which is narrower than the width of the cooling plates.
  • the heat sink according to the invention essentially a U-profile with enlarged cooling plates. Only a small amount of production is required, while the enlarged cooling plates improve the heat transfer to the environment compared to a simple U-profile. If the heat sink with its narrow web on the
  • Printed circuit board is applied, there is also only a small space requirement on the circuit board. If necessary, the space next to the web (i.e. under the cooling plates) can also be used for other electronic components. Due to the wide cooling plates of the heat sink according to the invention, a relatively low overall height of the heat sink can also be achieved, so that an automatic assembly can take place simultaneously with the electronic components.
  • Figure 1 is a plan view of a circuit board according to the invention, in
  • Figure 2 is a side view of the circuit board of Figure 1 according to the invention, in
  • Figure 3 shows an embodiment of a heat sink for the circuit board according to the invention.
  • Figure 4 shows another embodiment of a heat sink of the circuit board according to the invention
  • Components 2, 3, 4a and 4b run on the printed circuit board 1 metallic conductor tracks 5. To cool the electronic components 4a and 4b are also on the surface la
  • Circuit board 1 heat sink 6a and 6b on metallic
  • Mounting surfaces 7a and 7b are in thermal
  • FIG. 1 The reference numerals already used in FIG. 1 serve to designate the individual components. It can be seen here in particular in the case of heat sinks 6b that the simplest possible construction (here shown a U-profile construction) is used for the heat sinks. In this way, manufacturing effort and costs can be minimized.
  • FIG. 4 show two different embodiments of heat sinks for the circuit board. While the heat sink 11 is designed as a simple U-profile, the heat sink 12 according to FIG. 4 consists of two cooling plates 13a and 13b which are located opposite one another in parallel and which on one side have a comparison with the cooling plates 13a and 13b narrower web 14 are interconnected.
  • the heat sink 11 is designed as a simple U-profile
  • the heat sink 12 according to FIG. 4 consists of two cooling plates 13a and 13b which are located opposite one another in parallel and which on one side have a comparison with the cooling plates 13a and 13b narrower web 14 are interconnected.
  • U-profile also has the advantage of a low height and a possibly reduced space requirement if the heat sink with its narrow web 14 on the metallic
  • the heat sinks 11 and 12 consist of copper with a surface tinned at least on their underside 11a and 12a.

Abstract

The invention relates to a circuit board (1) with conductor tracks (5) running on a surface (1a) of the circuit board, at least one electronic component of the SMD type (4a, 4b), mounted thereon and at least one metallic cooling body (6a, 6b), mounted on the surface (1a) of the circuit board (1) in direct proximity to the electronic component (4a, 4b) for cooling in the vicinity of the conductor tracks (5). According to the invention, such a circuit board may be further simplified with respect to the construction thereof, whereby the cooling body (6a, 6b) is mounted on a single metallic fixing surface (7a, 7b) which is in thermal contact with the electronic component (4a, 4b). The invention further relates to a cooling body (12) for SMD components (4a, 4b) for direct assembly on a circuit board (1) with the simplest possible construction whilst guaranteeing good heat transfer to the surroundings.

Description

Beschreibungdescription
Leiterplatte mit SMD-Bauelement und KühlkörperPrinted circuit board with SMD component and heat sink
Die Erfindung betrifft eine Leiterplatte mit auf einer Oberfläche der Leiterplatte verlaufenden Leiterbahnen, mindestens einem darauf aufgebrachten elektronischen Bauelement in SMD-Ausführung und mindestens einem auf die Oberfläche der Leiterplatte in unmittelbarer Nähe des zu kühlenden elektronischen Bauelementes im Bereich der Leiterbahnen montierten metallischen Kühlkörper.The invention relates to a printed circuit board with printed conductors running on a surface of the printed circuit board, at least one electronic component in an SMD version mounted thereon and at least one metallic heat sink mounted on the surface of the printed circuit board in the immediate vicinity of the electronic component to be cooled in the region of the printed conductors.
Eine solche Leiterplatte ist beispielsweise aus der deutschen Offenlegungsschrift DE 43 32 115 AI bekannt. Auf die Oberfläche der bekannten Leiterplatte sind elektronische Bauteile in SMD-Ausführung und metallische Kühlkörper zur Entwärmung der elektronischen Bauteile aufgebracht. Die Kühlkörper sind dabei über mehrere auf der Oberfläche der bekannten Leiterplatte verlaufende Leiterbahnen ungeachtet ihres jeweiligen Potentials aufgebracht. Um dabei zwischen den jeweiligen Leiterbahnen keine elektrischen Brücken zu erzeugen, sind die Kühlkörper an ihrer Unterseite, mit der sie auf die Oberfläche der bekannten Leiterplatte montiert werden, mit einer elektrisch isolierenden Folie versehen. Diese Folie kann ferner als Klebefolie ausgestaltet werden, so dass eine Verbindung der Kühlkörper mit der Oberfläche der bekannten Leiterplatte über die Klebefolie erfolgen kann. Eine Montage der solchermaßen gestalteten Kühlkörper kann unmittelbar nach der Bestückung der bekannten Leiterplatte mit den elektronischen SMD-Bauteilen erfolgen.Such a circuit board is known, for example, from German published patent application DE 43 32 115 AI. Electronic components in SMD design and metallic heat sinks for cooling the electronic components are applied to the surface of the known printed circuit board. The heat sinks are applied over a number of conductor tracks running on the surface of the known printed circuit board, regardless of their respective potential. In order not to produce any electrical bridges between the respective conductor tracks, the heat sinks on the underside with which they are mounted on the surface of the known circuit board are provided with an electrically insulating film. This film can also be designed as an adhesive film, so that the heat sink can be connected to the surface of the known printed circuit board via the adhesive film. The heat sinks designed in this way can be assembled immediately after the known printed circuit board has been fitted with the electronic SMD components.
Ausgehend von der bekannten Leiterplatte liegt der Erfindung die Aufgabe zugrunde, eine Leiterplatte mit elektronischen Bauteilen in SMD-Ausführung und metallischen Kühlkörpern für die elektronischen Bauteile hinsichtlich ihres Aufbaus weiter zu vereinfachen.Starting from the known circuit board, the invention has for its object a circuit board with electronic To further simplify components in the SMD version and metallic heat sinks for the electronic components with regard to their structure.
Diese Aufgabe wird bei einer Leiterplatte der eingangs genannten Art erfindungsgemäß dadurch gelöst, dass der Kühlkörper unmittelbar auf einer einzigen metallischen Befestigungsfläche aufgebracht ist, die in thermischer Verbindung mit dem elektronischen Bauteil steht. Da der metallische Kühlkörper hierbei unmittelbar und auf einer einzigen metallischen Befestigungsfläche aufgebracht ist, entfällt die Notwendigkeit einer elektrischen Isolierungsschicht an der Unterseite des Kühlkörpers. Der Kühlkörper besitzt somit einen vereinfachten Aufbau und kann in ein und demselben Bestuckungsprozess gleichzeitig mit den SMD-Bauteilen nach an sich bekannten Verfahren, z.B. Löten, auf der Oberfläche der Leiterplatte aufgebracht werden. Die Wärmeabfuhr von dem zu kühlenden elektronischen Bauelement erfolgt hierbei mittels Wärmeleitung von dem elektronischen Bauelement durch die mit diesem in thermischer Verbindung stehende metallische Befestigungsfläche in den Kühlkörper hinein, wo eine weitere Wärmeabgabe durch Konvektion und Strahlung erfolgt. Durch das Fehlen einer elektrisch isolierenden Schicht an der Unterseite des Kühlkörpers wird der Wärmedurchgangswiderstand zudem weiter verringert.This object is achieved according to the invention in the case of a printed circuit board of the type mentioned at the outset by the heat sink being applied directly to a single metallic fastening surface which is in thermal connection with the electronic component. Since the metal heat sink is applied directly and on a single metal fastening surface, there is no need for an electrical insulation layer on the underside of the heat sink. The heat sink thus has a simplified structure and can be used in the same assembly process at the same time as the SMD components using methods known per se, e.g. Solder to be applied to the surface of the circuit board. The heat dissipation from the electronic component to be cooled takes place here by means of heat conduction from the electronic component through the metallic fastening surface which is thermally connected to it into the heat sink, where further heat is emitted by convection and radiation. The lack of an electrically insulating layer on the underside of the heat sink further reduces the thermal resistance.
Vorteilhafterweise kann die metallische Befestigungsfläche eine metallische Kühlfläche neben den Leiterbahnen sein. Eine solche zusätzliche metallische Befestigungsfläche kann in einfacher Weise in der Nähe eines zu kühlenden Bauteils positioniert werden. Bei entsprechend großer Auslegung einer solchen Kühlfläche kann der Wärmedurchgangswiderstand noch weiter reduziert werden. Ferner kann die Kühlfläche in einfacher Weise an die Form des Kühlkörpers angepasst werden,The metallic fastening surface can advantageously be a metallic cooling surface next to the conductor tracks. Such an additional metallic fastening surface can be easily positioned in the vicinity of a component to be cooled. With a correspondingly large design of such a cooling surface, the thermal resistance can still can be further reduced. Furthermore, the cooling surface can be easily adapted to the shape of the heat sink,
Vorteilhafterweise kann die metallische Befestigungsfläche auch Teil einer der Leiterbahnen sein. Auf diese Weise kann die Ausführung einer erfindungsgemäßen Leiterplatte auf besonders platzsparende Weise vorgenommen werden, da zur Montage der Kühlkörper auf der Leiterplatte keine gesonderten Flächen reserviert werden müssen.The metallic fastening surface can advantageously also be part of one of the conductor tracks. In this way, the design of a circuit board according to the invention can be carried out in a particularly space-saving manner, since no separate areas have to be reserved for mounting the heat sink on the circuit board.
Eine vorteilhafte Ausgestaltung der erfindungsgemäßen Leiterplatte sieht ferner vor, dass der Kühlkörper aus Kupfer mit einer zumindest teilweise verzinnten Oberfläche besteht und auf die metallische Befestigungsfläche aufgelötet ist. Die Herstellung des Kühlkörpers aus Kupfer gewährleistet hierbei ausgesprochen gute Wärmeleitfähigkeit innerhalb des Kühlkörpers . Durch die Verzinnung der Oberfläche des Kühlkörpers kann dieser sehr leicht auf der metallischen Befestigungsfläche aufgelötet werden.An advantageous embodiment of the printed circuit board according to the invention further provides that the heat sink consists of copper with an at least partially tinned surface and is soldered onto the metallic fastening surface. The production of the heat sink from copper ensures extremely good thermal conductivity within the heat sink. By tinning the surface of the heat sink, it can be easily soldered onto the metal mounting surface.
Wenn der Kühlkörper ferner im Wesentlichen in Form eines U- Profils ausgebildet ist, fallen zur Herstellung des Kühlkörpers nur ein geringer Aufwand und niedrige Kosten an.If the heat sink is also essentially in the form of a U-profile, only little effort and low costs are incurred for the production of the heat sink.
Die Erfindung betrifft ferner einen Kühlkörper für SMD-The invention further relates to a heat sink for SMD
Baulemente zur unmittelbaren Montage auf einer Leiterplatte. Um einen solchen Kühlkörper bei Erzielung eines guten Wärmeübergangskoeffizienten möglichst einfach fertigen zu können, ist erfindungsgemäß vorgesehen, dass der Kühlkörper zwei einander gegenüberliegende parallele Kühlplatten aufweist, die durch einen im Vergleich zur Breite der Kühlplatten schmaleren Steg auf einer Seite miteinander verbunden sind. Somit stellt der erfindungsgemäße Kühlkörper im Wesentlichen ein U-Profil mit vergrößerten Kühlplatten dar. Hierfür fällt nur ein geringer Fertigungsaufwand an, während durch die vergrößerten Kühlplatten der Wärmeübergang an die Umgebung gegenüber einem einfachen U-Profil verbessert ist. Wenn der Kühlkörper mit seinem schmalen Steg auf dieComponents for direct mounting on a circuit board. In order to be able to manufacture such a heat sink as simply as possible while achieving a good heat transfer coefficient, it is provided according to the invention that the heat sink has two mutually opposite parallel cooling plates which are connected to one another on one side by a web which is narrower than the width of the cooling plates. Thus, the heat sink according to the invention essentially a U-profile with enlarged cooling plates. Only a small amount of production is required, while the enlarged cooling plates improve the heat transfer to the environment compared to a simple U-profile. If the heat sink with its narrow web on the
Leiterplatte aufgebracht wird, entsteht außerdem nur ein geringer Platzbedarf auf der Leiterplatte. Gegebenenfalls kann der Raum neben dem Steg (also unter den Kühlplatten) zusätzlich für weitere elektronische Bauteile verwendet werden. Aufgrund der breiten Kühlplatten des erfindungsgemäßen Kühlkörpers kann ferner eine relativ niedrige Bauhöhe des Kühlkörpers erreicht werden, so dass eine automatische Bestückung gleichzeitig mit den elektronischen Bauteilen erfolgen kann.Printed circuit board is applied, there is also only a small space requirement on the circuit board. If necessary, the space next to the web (i.e. under the cooling plates) can also be used for other electronic components. Due to the wide cooling plates of the heat sink according to the invention, a relatively low overall height of the heat sink can also be achieved, so that an automatic assembly can take place simultaneously with the electronic components.
Zur weiteren Erläuterung der Erfindung sind inTo further explain the invention are in
Figur 1 eine Draufsicht auf eine erfindungsgemäße Leiterplatte, inFigure 1 is a plan view of a circuit board according to the invention, in
Figur 2 eine Seitenansicht der erfindungsgemäßen Leiterplatte nach Figur 1, inFigure 2 is a side view of the circuit board of Figure 1 according to the invention, in
Figur 3 ein Ausführungsbeispiels eines Kühlkörpers für die erfindungsgemäße Leiterplatte und inFigure 3 shows an embodiment of a heat sink for the circuit board according to the invention and in
Figur 4 ein weiteres Ausführungsbeispiel für ein Kühlkörper der erfindungsgemäßen LeiterplatteFigure 4 shows another embodiment of a heat sink of the circuit board according to the invention
dargestellt.shown.
Gemäß Figur 1 sind auf der Oberfläche la einer Leiterplatte 1 mehrere elektronische Bauteile 2, 3, 4a, 4b aufgebracht. Davon sind zumindest die elektronischen Bauteile 4a und 4b inAccording to FIG. 1, a plurality of electronic components 2, 3, 4a, 4b are applied to the surface 1a of a printed circuit board 1. At least the electronic components 4a and 4b thereof are shown in
SMD-Bauweise ausgeführt. Zwischen den elektronischenSMD design. Between the electronic
Bauteilen 2, 3, 4a und 4b verlaufen auf der Leiterplatte 1 metallische Leiterbahnen 5. Zur Kühlung der elektronischen Bauteile 4a und 4b sind außerdem auf die Oberfläche la derComponents 2, 3, 4a and 4b run on the printed circuit board 1 metallic conductor tracks 5. To cool the electronic components 4a and 4b are also on the surface la
Leiterplatte 1 Kühlkörper 6a und 6b auf metallischenCircuit board 1 heat sink 6a and 6b on metallic
Befestigungsflächen 7a und 7b aufgebracht. DieAttachment surfaces 7a and 7b applied. The
Befestigungsflächen 7a und 7b stehen in thermischerMounting surfaces 7a and 7b are in thermal
Verbindung mit den zu kühlenden Bauteilen 4a und 4b. Diese thermische Verbindung ist über eine durchgängige metallische Beschichtung analog zu den Leiterbahnen 5 erreicht. Der eine Kühlkörper βb ist auf einer zusätzlich von einer der Leiterbahnen 5 abgehenden Befestigungsfläche 7b aufgebracht, während der weitere Kühlkörper 6a auf einer in eine Leiterbahn integrierten Befestigungsfläche 7a aufgebracht ist .Connection with the components to be cooled 4a and 4b. This thermal connection is achieved via a continuous metallic coating analogous to the conductor tracks 5. The one heat sink βb is applied to an additional attachment surface 7b extending from one of the conductor tracks 5, while the further heat sink 6a is applied to an attachment surface 7a integrated in a conductor track.
In Figur 2 ist die in Figur 1 dargestellte Leiterplatte mit den darauf montierten elektronischen Bauteilen und Kühlkörpern in einer Seitenansicht dargestellt. ZurIn Figure 2, the circuit board shown in Figure 1 is shown with the electronic components and heat sinks mounted thereon in a side view. to
Bezeichnung der einzelnen Komponenten dienen die bereits in Figur 1 entsprechend verwendeten Bezugszeichen. Erkennbar ist hier insbesondere bei Kühlkörper 6b, dass für die Kühlkörper eine möglichst einfache Bauweise (hier dargestellt eine U- Profil-Bauweise) verwendet wird. Auf diese Weise können Fertigungsaufwand und Kosten minimiert werden.The reference numerals already used in FIG. 1 serve to designate the individual components. It can be seen here in particular in the case of heat sinks 6b that the simplest possible construction (here shown a U-profile construction) is used for the heat sinks. In this way, manufacturing effort and costs can be minimized.
Die Figuren 3 und 4 zeigen zwei verschiedene Ausführungsformen von Kühlkörpern für die Leiterplatte. Während der Kühlkörper 11 als einfaches U-Profil ausgebildet ist, besteht der Kühlkörper 12 gemäß Figur 4 aus zwei sich parallel gegenüberliegenden Kühlplatten 13a und 13b, die an einer Seite über einen im Vergleich zu den Kühlplatten 13a und 13b schmaleren Steg 14 miteinander verbunden sind. DerFigures 3 and 4 show two different embodiments of heat sinks for the circuit board. While the heat sink 11 is designed as a simple U-profile, the heat sink 12 according to FIG. 4 consists of two cooling plates 13a and 13b which are located opposite one another in parallel and which on one side have a comparison with the cooling plates 13a and 13b narrower web 14 are interconnected. The
Kühlkörper 12 gemäß Figur 4 besitzt gegenüber einem einfachen4 has a heat sink 12 compared to a simple one
U-Profil zusätzlich den Vorteil einer niedrigen Bauhöhe und einen gegebenenfalls verringerten Platzbedarf, wenn der Kühlkörper mit seinem schmalen Steg 14 auf die metallischeU-profile also has the advantage of a low height and a possibly reduced space requirement if the heat sink with its narrow web 14 on the metallic
Befestigungsfläche aufgebracht wird.Mounting surface is applied.
Um bei einer guten Wärmeleitfähigkeit gleichzeitig einfach durch Löten auf den Befestigungsflächen 7a und 7b (vgl. Figur 1) der Leiterplatte 1 aufgebracht werden zu können, bestehen die Kühlkörper 11 und 12 aus Kupfer mit einer zumindest an ihrer Unterseite 11a und 12a verzinnten Oberfläche. In order to be able to be applied to the mounting surfaces 7a and 7b (see FIG. 1) of the printed circuit board 1 with good thermal conductivity at the same time simply by soldering, the heat sinks 11 and 12 consist of copper with a surface tinned at least on their underside 11a and 12a.

Claims

Patentansprüche claims
1. Leiterplatte (1) mit auf einer Oberfläche (la) der Leiterplatte (1) verlaufenden Leiterbahnen (5) , mindestens einem darauf aufgebrachten elektronischen Bauelement in SMD-Ausführung (4a, 4b) und mindestens einem auf die Oberfläche (la) der Leiterplatte (1) in unmittelbarer Nähe des zu kühlenden elektronischen Bauelementes (4a, 4b) im Bereich der Leiterbahnen (5) montierten metallischen Kühlkörper (6a, 6b) , d a d u r c h g e k e n n z e i c h n e t, dass der Kühlkörper (6a, 6b) unmittelbar auf einer einzigen metallischen Befestigungsfläche (7a, 7b) aufgebracht ist, die in thermischer Verbindung mit dem elektronischen Bauteil (4a, 4b) steht.1. Printed circuit board (1) with conductor tracks (5) running on a surface (la) of the printed circuit board (1), at least one electronic component in SMD design (4a, 4b) and at least one on the surface (la) of the printed circuit board (1) in the immediate vicinity of the electronic component (4a, 4b) to be cooled, in the region of the conductor tracks (5), metallic heat sinks (6a, 6b), characterized in that the heat sink (6a, 6b) directly on a single metal fastening surface (7a , 7b) is applied, which is in thermal connection with the electronic component (4a, 4b).
2. Leiterplatte (1) nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, dass die metallische Befestigungsfläche (7b) eine metallische Kühlfläche neben den Leiterbahnen (5) ist.2. Printed circuit board (1) according to claim 1, so that the metallic fastening surface (7b) is a metallic cooling surface next to the conductor tracks (5).
3. Leiterplatte (1) nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, dass die metallische Befestigungsfläche (7b) Teil einer der Leiterbahnen (5) ist.3. Printed circuit board (1) according to claim 1, so that the metallic fastening surface (7b) is part of one of the conductor tracks (5).
4. Leiterplatte (1) nach einem der vorangehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass der Kühlkörper (6a, 6b) aus Kupfer mit einer zumindest teilweise verzinnten Oberfläche besteht und auf die metallische Befestigungsfläche (7a, 7b) aufgelötet ist. 4. Printed circuit board (1) according to one of the preceding claims, characterized in that the cooling body (6a, 6b) consists of copper with an at least partially tinned surface and is soldered onto the metallic fastening surface (7a, 7b).
5. Leiterplatte (1) nach einem der vorangehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass der Kühlkörper (6a, 6b) im Wesentlichen in Form eines U- Profiles ausgebildet ist.5. Printed circuit board (1) according to one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t that the heat sink (6a, 6b) is substantially in the form of a U-profile.
6. Kühlkörper (12) für SMD-Baulemente (4a, 4b) zur unmittelbaren Montage auf einer Leiterplatte (1) , d a d u r c h g e k e n n z e i c h n e t, dass der Kühlkörper (12) zwei einander gegenüberliegende parallele Kühlplatten (13a, 13b) aufweist, die durch einen im Vergleich zur Breite der Kühlplatten (13a, 13b) schmaleren Steg (14) auf einer Seite miteinander verbunden sind. 6. heat sink (12) for SMD components (4a, 4b) for direct mounting on a circuit board (1), characterized in that the heat sink (12) has two mutually opposite parallel cooling plates (13a, 13b), by a comparison to the width of the cooling plates (13a, 13b) narrower web (14) are interconnected on one side.
PCT/DE2003/000133 2002-04-29 2003-01-14 Circuit board with smd component and cooling body WO2003094586A1 (en)

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007039800B3 (en) * 2007-08-23 2008-12-11 Festo Ag & Co. Kg Cooling device for electronic component, has interconnected device with end-sided connection section and carrying section of electronic component, and two sections are connected together by narrow bridge-shaped section
EP2323465A1 (en) 2009-11-10 2011-05-18 OSRAM Gesellschaft mit beschränkter Haftung Electrical circuit with heat sink
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WO2014204982A2 (en) * 2013-06-19 2014-12-24 SMART Storage Systems, Inc. Electronic system with heat extraction and method of manufacture thereof
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US10013033B2 (en) 2013-06-19 2018-07-03 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US9898056B2 (en) 2013-06-19 2018-02-20 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US9158349B2 (en) 2013-10-04 2015-10-13 Sandisk Enterprise Ip Llc System and method for heat dissipation
US9549457B2 (en) 2014-02-12 2017-01-17 Sandisk Technologies Llc System and method for redirecting airflow across an electronic assembly
US9848512B2 (en) 2014-02-27 2017-12-19 Sandisk Technologies Llc Heat dissipation for substrate assemblies
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