WO2003083770A1 - Dispositif de communication et son boitier - Google Patents
Dispositif de communication et son boitier Download PDFInfo
- Publication number
- WO2003083770A1 WO2003083770A1 PCT/JP2003/003790 JP0303790W WO03083770A1 WO 2003083770 A1 WO2003083770 A1 WO 2003083770A1 JP 0303790 W JP0303790 W JP 0303790W WO 03083770 A1 WO03083770 A1 WO 03083770A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- communication device
- antenna
- rfid component
- insulating substrate
- chip antenna
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
- G06K19/041—Constructional details
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
- H01Q7/08—Ferrite rod or like elongated core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Definitions
- the present invention relates to a communication device using an RF ID component and a package thereof, and the communication device is particularly mounted on an electronic device.
- the communication device is not limited to a function as a substitute for the conventional barcode, but has a large amount of information that can be stored (recorded), and a simple and relatively long distance non-contact with the information reading device called a scanner. Since it is possible to read information in a state and also to write information to RFID components, it is expected to be applied to various uses.
- the above applications include, for example, facilitating tracking of package delivery by attaching it to courier parcels, and individual management of a large variety of products at music CDs and book stores.
- the attachment work is usually performed by attaching a resin film to which the RF ID component is fixed.
- a first communication device of the present invention is characterized in that an RFID component 1 is fixed to an insulating substrate 2, and the insulating substrate 2 can be surface-mounted on a circuit board.
- the communication device of the present invention is based on the premise that various electronic components are mounted on a product having a circuit board on which surface mounting is performed. Examples of such products are mobile phones
- the first communication device which is a small electronic device such as a portable personal computer and a headphone stereo, is, for example, as shown in FIG. 1 and has almost the same appearance as existing chip components.
- the RFID component 1 can be attached to the product by the mounting technology and mounting device. Then, the mounting work load is significantly reduced, and the problem to be solved by the present invention can be solved.
- a cream solder, an adhesive, or the like is used as a fixing material for fixing the communication device of the present invention to a circuit board using the above-described general-purpose mounting technology.
- the cream solder is supplied onto the circuit board by a screen printing method using a metal mask in the same manner as the material for fixing other electronic components to the circuit board, and thereafter, Each electronic component (including the communication device of the present invention) is mounted on a general-purpose mounting device so as to match the cream solder position. Then, for example, by passing through a known reflow oven, the cream solder is melted and solidified to fix the communication device of the present invention and the circuit board.
- an adhesive such as an epoxy resin
- a screen printing technique or the use of a dispenser capable of supplying a certain amount of paste-like substance is used.
- the communication device of the present invention is arranged on the same circuit board surface together with other electronic components, and is then subjected to the above-described one step of the riff opening.
- the application of the screen printing technique becomes difficult after the mounting of other components due to the presence of the other components. This is because it is considered that it is difficult to obtain a good printing state due to the contact between the screen and the printing surface projections of the other parts.
- the adhesive for the communication device of the present invention can be supplied to the circuit board together with the adhesive for other parts by the screen printing.
- the adhesive is cured by the heat (200 to 300 ° C.) of the molten solder at the time of immersion in the molten solder bath.
- the terminals 11 shown in FIGS. 1, 2, 3, and 6 are not necessarily required. This is because the terminal 11 mainly considers increasing the affinity with the above-mentioned solder and increasing the area of the high affinity portion.
- the second communication device of the present invention comprises an RFID component 1 fixed on a surface-mounted chip antenna 5, and an antenna terminal 13 of the RFID component 1 and a terminal of the surface-mounted chip antenna 5. And are electrically connected. It goes without saying that even with this configuration, the problem to be solved by the present invention can be solved.
- the second communication device of the present invention has an advantage that the communicable distance of the 10 component 1 can be increased. This is because an effect almost equal to the effect of extending the antenna can be obtained.
- the terminal of the chip antenna 5 (antenna terminal 13) and the terminal 11 described above are not necessarily the same. This is because if the electrical connection between the antenna terminal 13 of the RFID component 1 and the conducting wire 3 is made, the terminal 11 is not necessarily required on the side surface of the chip antenna 5 or the like.
- the surface-mounted chip antenna 5 in the second communication device is a coil antenna in which, for example, a helical conductor is arranged on the surface layer of the front and back surfaces of the chip (FIG. 2).
- Another example is a stacked chip antenna 5 manufactured by screen printing or the like using, for example, a dielectric paste and a conductor paste.
- Such a multilayer chip antenna has an advantage of being excellent in high heat resistance.
- the “fixation” in the first or second communication device is based on, for example, a resin molding technique.
- This resin is, for example, an epoxy resin. If a black resin is used for this resin, the resin Characters and symbols can be clearly displayed (printed) on the surface.
- the display can be made by using a screen printing technique or an ink jet technique.
- the first or second communication device is wrapped in a so-called taping material or wrapped in a so-called bulk case. It is preferable that the information is provided in a state where it is provided. This is because there is an advantage that the communication device can be continuously and automatically supplied to the mounting device. That is, there is an advantage that the burden of mounting the communication device can be further reduced.
- the components in which the RFID parts 1 are fixed to the insulating substrate 2 are in a state of collision or rubbing each other in the packaging container. . Then, it may be difficult to maintain the fixation. Further, when the terminal of the chip antenna 5 and the antenna terminal 13 of the RFID component 1 are electrically connected, it is considered that the connection may be damaged.
- the fixing means based on the molding technique, it is considered that the impact at the time of collision is absorbed by the molding material (usually resin), and the communication device of the present invention is less likely to be damaged.
- the electrical connection state of the electrical connection portion can be favorably maintained.
- the wire when a wire-bonding technique is employed for the electrical connection, the wire can be prevented from being cut, which is usually very thin and easily cut.
- the insulating substrate 2 or the surface-mounted chip antenna 5 has a recess 6, and the RFID component 1 is disposed in the recess 6.
- the outer shape of the communication device of the present invention can be approximated to a rectangular parallelepiped. If the external shape is close to a rectangular parallelepiped shape, the handleability will be excellent. In particular, it is easy to handle when mounting with a general-purpose automatic mounting device. This is because mounting with an automatic mounting device involves a process of sucking one surface of a rectangular parallelepiped and moving it while holding the communication device with the suction force. In addition, this allows the position of the RFID component 1 to be fixed to the insulating substrate 2 or the surface-mounted chip antenna 5 within a certain range (recessed area). There is an advantage that various characteristics and shape variations can be reduced.
- the formation of the recess 6 may be, for example, excavation processing on the insulating substrate 2.
- the insulating substrate 2 according to the present invention is obtained by laminating two or more insulating substrates, a frame-shaped insulating substrate having a hole corresponding to six recessed portions is formed on the surface insulating substrate. Means to be used. Further, when the insulating substrate 2 is made of ceramic, a means for press-molding the ceramic constituent powder before firing is used.
- the manufacturing process history of the electronic device or the like can be stored in the RFID component 1 of the communication device.
- process history information includes information such as the date and time when each process was provided, its conditions (eg, the maximum temperature in the case of a heating process), and the name of an operator.
- the communication device can perform various management items such as whether or not the product is a product to be shipped and whether or not the shipment date is correct. Furthermore, in the unlikely event that a product defect occurs after shipment, the cause of the defect can be quickly investigated by confirming the management items with a scanner or the like, and the secondary occurrence of the defect Also contributes to the early prevention.
- all the communication devices based on the first and second communication devices of the present invention are communication devices to be mounted on electronic devices and other products completed through multiple processes, Is preferably stored.
- FIG. 1 is a diagram showing an outline of an embodiment of a communication device of the present invention.
- FIG. 2 is a diagram showing an outline of an embodiment of the communication device of the present invention.
- FIG. 3 shows the communication device of the present invention.
- FIG. 1 is a diagram illustrating an outline of an embodiment.
- FIG. 4 is a diagram showing an outline of an electrical connection state between the RFID component and the antenna in the communication device according to the present invention.
- FIG. 5 is a diagram showing an outline of an embodiment of the communication device of the present invention.
- FIG. 6 is a diagram showing another example of the outline of the embodiment of the communication device of the present invention ( ⁇ an example.
- FIG. 7 is a diagram showing still another example of the outline of the embodiment of the communication device of the present invention. is there.
- the reference numerals attached to these drawings are 1 to RFID parts, 2 ... insulating substrate, 3 ... lead wire, 5 ... chip antenna, 6 ... dent, 7 ... mold resin, 8 ... bonding wire, 9 ... bump, 10 ... Anisotropic conductive material, 1 1 ... Terminal, 1 2 ... Coiled part, 1 3—Antenna terminal, 1 5... Land, 16 to 1st layer, 17... 2nd layer, 18... 3rd layer, 1 9: adhesive, 20: compressed part.
- the RFID component 1 has a chip-type shape having outer dimensions of about 1 mm, that is, vertical, horizontal, and height, and has two antenna terminals 13.
- the insulating substrate 2 an alumina molded body having a purity of 91% or more was used.
- the insulating substrate 2 has sufficient strength so as not to be broken even when sandwiched by a general-purpose mounting device. Also, the insulating properties are sufficient.
- the insulating substrate 2 is a straight-1 rectangular parallelepiped shape. Surface of the front and back sides, RFI 'D over that constitute chip antenna 5 by winding the conductive wire 3 to immediately ground surface The component 1 is placed, and the conductive wire 3 is electrically connected to the antenna terminal 13 of the RFID component 1 by a wire bonding technique using a gold wire (not shown). Further, the entire RFID component 1 including the electrical connection portion and the insulating substrate 2 are fixed with epoxy resin (FIG. 1) '. For the fixing, a known resin molding technique was employed.
- the communication device of the present invention can be manufactured.
- the shape of the insulating substrate 2 is a rectangular parallelepiped as shown in FIG. 2A, but the shape is not limited to this.
- the insulating substrate 2 has a U-shaped side. May be.
- the bottom surface of the insulating substrate 2 is used as the terminal (antenna terminal 13) of the chip antenna 5, the high-frequency electromagnetic wave transmitted from the scanner is absorbed from the terminal 11 to the ground, and the coil formed by the conductor 3
- the generated magnetic field is received by the chip antenna 5 and rectified by the IC high-frequency rectifier circuit in the RFID component 1 to obtain power.
- the power supply drives the IC microcomputer, modulates the I / ⁇ data stored in the internal memory into an input wave, and returns the IZO data to the scanner.
- the RFID component 1 can be operated without mounting a power supply as a separate member.
- a gap is formed at the lower part.
- the RFID component 1 can be pre-arranged in the gap.
- the upper surface of the communication device of the present invention can be smoothed. Then, there is an advantage that when the communication device is held and moved by suction using a general-purpose mounting device, the suction is easy and reliable.
- the chip antenna 5 was formed by winding the conductive wire 3 over substantially the entire surface layer on the front and back side surfaces of the insulating substrate 2 (FIGS. 2 (a) and 3 (a)).
- FIGS. 2 (b) and 3 (b) by moving the conductor 3 to one side of the insulating substrate 2, there is an advantage that the work of mounting and fixing the RFID component 1 becomes easy. ing.
- the reason is that it is somewhat difficult to mount and fix the RFID component 1 on the surface of the insulating substrate 2 which has become substantially uneven due to the presence of the conductor 3. In other words, it is possible to place and fix the RFID component 1 while avoiding the conductor 3.
- FIG. 4 shows the electrical connection between the RFID component 1 and the conductor 3 in the communication device of the present invention shown in FIGS. It can be seen that the conductor 3 is looped.
- the coiled portion 12 that is, being a coil antenna
- high-frequency electromagnetic waves can be received by the coiled portion 12 and rectified by the RFID component 1 to obtain power as described above. it can.
- FIG. 5 is a longitudinal sectional view of the communication device.
- the insulating substrate 2 has the first to third layers (16 to It is composed of three layers of 18). No holes are formed in the first layer 16. Holes are formed in the second layer 17 and the third layer 18, and by laminating them, the recess 6 is formed by the holes.
- the holes in the third layer 18 are slightly larger than the holes in the second layer 17.
- a terminal portion is formed around the hole of the second layer, and the terminal portion ′ is electrically connected to the antenna terminal 13 of the RFID component 1 by a bonding wire 8.
- an epoxy resin paste is used and used as a mold resin 7 to fill the recess 6.
- a first layer 16 and a second layer 17 made of an epoxy resin plate mixed with glass fibers are laminated and integrated. This integration is realized by thermocompression bonding of both.
- a chip-shaped RFID component 1 is inserted into a portion corresponding to the recess 6 of the second layer 17.
- the antenna terminal 13 of the RFID component 1 is positioned on the upper surface.
- the upper surface of the first layer 16 and the lower surface of the RFID component 1 are temporarily fixed with an adhesive (not shown).
- the land 15 on the upper surface of the second layer 17 and the antenna terminal 13 are electrically connected to each other by using a bonding wire 8 made of gold by a known wire bonding technique.
- the electrical connection with the antenna is shown in Fig.4.
- the land 15 and the antenna terminal 13 are located at substantially the same height as shown in the drawing. This is because the general-purpose wire bonding technology can be used almost as it is, and the operation of the wire bonding equipment is eliminated.
- the third layer 18 and the insulating substrate 2 of the second layer 17 are laminated and integrated.
- the third layer 18 is also made of the same material as the first layer 16 and the second layer 17, and the lamination / integration is the same as the lamination / integration of the first layer 16 and the second layer 16. Conduct the same. At this time, care is taken so that the third layer 18 does not damage the bonding wire 8.
- an epoxy resin paste (mold resin 7) is filled in the recess 6, and is cured by heating.
- the communication device of the present invention can be obtained.
- FIG. 6 shows a communication device according to another embodiment of the present invention. This is similar to the figure. The difference is that the configuration in Fig. 1 covers the entire RFID component 1 with mold resin 7 and fixes it, whereas the configuration in Fig. 6
- the tenth embodiment is characterized in that the upper surface of the tener 5 is fixed by, for example, an adhesive 19 of the same material as the mold resin 7 used in FIG.
- the communication device of the present invention can also be obtained by such means.
- Fig. 7 (a) shows an example of this state.
- a bump 9 is formed or arranged on the lower surface of the RFID component 1 and / or the upper surface of the chip antenna 5, and the bump 9 itself is melted and solidified, or the solder as a separate member is melted and solidified to form the RFID component 1. This realizes the electrical connection with the chip antenna 5 and the fixation of both.
- FIG. 7 (b) similar to FIG. 7 (a), bumps 9 are formed or arranged on the lower surface of the RFID component 1 or the upper surface of the chip antenna 5, and the paste-like anisotropic conductive material 10 (for example, Toshiba Chemical Co., Ltd.)
- the figure shows a state in which the RFID component 1 and the chip antenna 5 are fixed to each other using a company-made “TAP / TNP series”. After the paste is set in a semi-cured state by heating or the like, the base portion between the RFID component 1 and the chip antenna 5 is pressurized and compressed to form a portion caused by the shape of the protrusion of the bump 9. Is particularly compressed, and becomes a good conductive region, and the other portion becomes a region having relatively poor conductivity (FIG.
- the paste-like anisotropic conductive material 10 can function as an adhesive. This is because it does not have the poor handling property that a solid does not flow unless it is heated and melted like solder. Mounting by using anisotropic conductive material 10 In this case, the distance between the adjacent bumps 9 can be reduced as compared with the mounting using solder. This is because there is no portion (eg, cream solder) that is likely to conduct the adjacent bumps 9. Industrial applicability
- a communication device capable of eliminating the complexity of the work of attaching RFID components to products such as electronic devices. Further, in an electronic device equipped with the communication device of the present invention, a process history of the electronic device after the mounting can be stored in the communication device.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Details Of Aerials (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/509,705 US20060086804A1 (en) | 2002-04-01 | 2003-03-27 | Communication device and package thereof |
EP03715472A EP1498842A4 (en) | 2002-04-01 | 2003-03-27 | COMMUNICATION DEVICE AND ITS HOUSING |
JP2003581117A JPWO2003083770A1 (ja) | 2002-04-01 | 2003-03-27 | 通信装置及びその包装体 |
AU2003227246A AU2003227246A1 (en) | 2002-04-01 | 2003-03-27 | Communication device and package thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002098909 | 2002-04-01 | ||
JP2002-98909 | 2002-04-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003083770A1 true WO2003083770A1 (fr) | 2003-10-09 |
Family
ID=28671962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/003790 WO2003083770A1 (fr) | 2002-04-01 | 2003-03-27 | Dispositif de communication et son boitier |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060086804A1 (ja) |
EP (1) | EP1498842A4 (ja) |
JP (1) | JPWO2003083770A1 (ja) |
AU (1) | AU2003227246A1 (ja) |
WO (1) | WO2003083770A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1460715A1 (en) * | 2003-03-20 | 2004-09-22 | Hitachi Metals, Ltd. | Surface mount type chip antenna and communication equipment using the same |
EP1638040A1 (en) * | 2004-09-21 | 2006-03-22 | Topseed Technology Corp. | Method of building electronic label for electronic device |
EP1626364A3 (en) * | 2004-08-13 | 2007-03-07 | Fujitsu Limited | Radio frequency identification (RFID) tag and manufacturing method thereof |
US11699057B2 (en) | 2018-06-15 | 2023-07-11 | Murata Manufacturing Co., Ltd. | RFID tag and method for producing the same |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4536552B2 (ja) * | 2005-02-28 | 2010-09-01 | ケイ・アール・ディコーポレーション株式会社 | Icタグ |
US7615836B2 (en) | 2005-03-07 | 2009-11-10 | Sensormatic Electronics Corporation | Magnetic self-assembly for integrated circuit packages |
DE202005011948U1 (de) * | 2005-07-29 | 2005-10-27 | Ilfa Industrieelektronik Und Leiterplattenfertigung Aller Art Gmbh | Anlage zur Fertigung elektronischer Baugruppen und/oder Leiterplatten sowie Anlage zur Fertigung elektronischer Baugruppen und/oder Leiterplatten, welche RFID-Chips oder mit Temperatursensoren ausgestattet oder verbundene RFID-Chips umfassen |
KR100758991B1 (ko) * | 2006-02-03 | 2007-09-17 | 삼성전자주식회사 | Rfid 시스템을 구비한 이동통신 단말기 |
JP5034371B2 (ja) | 2006-02-10 | 2012-09-26 | 富士通株式会社 | Rfidタグの製造方法およびrfidタグ |
WO2008000848A1 (es) * | 2006-06-23 | 2008-01-03 | Hispano Ferritas S.A. | Dispositivo de identificación por radiofrecuencia de alta frecuencia |
JP2008009881A (ja) | 2006-06-30 | 2008-01-17 | Fujitsu Ltd | Rfidタグ製造方法およびrfidタグ |
DE102009005307B4 (de) * | 2009-01-16 | 2011-06-01 | Waldemar Knittel Glasbearbeitungs Gmbh | Objektträger |
WO2012014005A1 (en) * | 2010-07-26 | 2012-02-02 | Fci | Rfid tag and method for manufacturing such a rfid tag |
JP5975280B2 (ja) * | 2012-09-06 | 2016-08-23 | 三菱マテリアル株式会社 | アンテナ装置 |
WO2017159436A1 (ja) * | 2016-03-18 | 2017-09-21 | 株式会社村田製作所 | コイルモジュール |
JP6701907B2 (ja) * | 2016-04-13 | 2020-05-27 | スミダコーポレーション株式会社 | アンテナ装置およびアンテナ装置の製造方法 |
CN107689487A (zh) * | 2016-08-05 | 2018-02-13 | 佳邦科技股份有限公司 | 天线模块及其制作方法、以及可携式电子装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001143039A (ja) * | 1999-11-17 | 2001-05-25 | Hitachi Maxell Ltd | 半導体装置及びその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19523521A1 (de) * | 1995-06-30 | 1997-01-02 | Licentia Gmbh | Transponder-Drahtspule |
DE19730166A1 (de) * | 1997-07-14 | 1999-01-21 | Aeg Identifikationssys Gmbh | Transponderanordnung und Verfahren zu deren Herstellung |
US6268796B1 (en) * | 1997-12-12 | 2001-07-31 | Alfred Gnadinger | Radio frequency identification transponder having integrated antenna |
US6100804A (en) * | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
EP1119047A1 (de) * | 2000-01-18 | 2001-07-25 | Infineon Technologies AG | Flächiger Träger für ein Chipmodul und Herstellungsverfahren für ein Chipmodul |
JP2002016419A (ja) * | 2000-06-30 | 2002-01-18 | Matsushita Electric Ind Co Ltd | チップアンテナ及び無線端末装置 |
-
2003
- 2003-03-27 AU AU2003227246A patent/AU2003227246A1/en not_active Abandoned
- 2003-03-27 US US10/509,705 patent/US20060086804A1/en not_active Abandoned
- 2003-03-27 JP JP2003581117A patent/JPWO2003083770A1/ja active Pending
- 2003-03-27 WO PCT/JP2003/003790 patent/WO2003083770A1/ja not_active Application Discontinuation
- 2003-03-27 EP EP03715472A patent/EP1498842A4/en not_active Withdrawn
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001143039A (ja) * | 1999-11-17 | 2001-05-25 | Hitachi Maxell Ltd | 半導体装置及びその製造方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1460715A1 (en) * | 2003-03-20 | 2004-09-22 | Hitachi Metals, Ltd. | Surface mount type chip antenna and communication equipment using the same |
EP1626364A3 (en) * | 2004-08-13 | 2007-03-07 | Fujitsu Limited | Radio frequency identification (RFID) tag and manufacturing method thereof |
KR100799140B1 (ko) * | 2004-08-13 | 2008-01-29 | 후지쯔 가부시끼가이샤 | Rfid 태그 및 그 제조 방법 |
US7342498B2 (en) | 2004-08-13 | 2008-03-11 | Fujitsu Limited | Radio frequency identification (RFID) tag and manufacturing method thereof |
EP1947733A1 (en) | 2004-08-13 | 2008-07-23 | Fujitsu Ltd. | Radio frequency identification (RFID) tag and manufacturing method thereof |
EP2190060A2 (en) * | 2004-08-13 | 2010-05-26 | Fujitsu Limited | Radio frequency identification (RFID) tag and manufacturing method thereof |
US7916032B2 (en) | 2004-08-13 | 2011-03-29 | Fujitsu Limited | Radio frequency identification (RFID) tag and manufacturing method thereof |
EP1638040A1 (en) * | 2004-09-21 | 2006-03-22 | Topseed Technology Corp. | Method of building electronic label for electronic device |
US11699057B2 (en) | 2018-06-15 | 2023-07-11 | Murata Manufacturing Co., Ltd. | RFID tag and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
EP1498842A4 (en) | 2006-02-15 |
US20060086804A1 (en) | 2006-04-27 |
JPWO2003083770A1 (ja) | 2005-08-04 |
AU2003227246A1 (en) | 2003-10-13 |
EP1498842A1 (en) | 2005-01-19 |
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