WO2003077618A3 - Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive - Google Patents

Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive Download PDF

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Publication number
WO2003077618A3
WO2003077618A3 PCT/US2003/002965 US0302965W WO03077618A3 WO 2003077618 A3 WO2003077618 A3 WO 2003077618A3 US 0302965 W US0302965 W US 0302965W WO 03077618 A3 WO03077618 A3 WO 03077618A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermoplastic adhesive
printed circuit
electronic device
circuit board
surface mount
Prior art date
Application number
PCT/US2003/002965
Other languages
French (fr)
Other versions
WO2003077618A2 (en
Inventor
Steven L Stewart
Carlton E Ash
Original Assignee
Resolution Performance Product
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/091,262 external-priority patent/US20030170450A1/en
Priority claimed from US10/091,086 external-priority patent/US6906425B2/en
Application filed by Resolution Performance Product filed Critical Resolution Performance Product
Priority to AU2003207779A priority Critical patent/AU2003207779A1/en
Publication of WO2003077618A2 publication Critical patent/WO2003077618A2/en
Publication of WO2003077618A3 publication Critical patent/WO2003077618A3/en

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    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A solid or semi-solid thermoplastic adhesive (7) adhered to a surface mount electronic device (1); an assembly made of at least a printed circuit board (2), a surface mount electronic device (1), solder joints (5) providing a connection between the printed circuit board (2) and the device (1), and solid thermoplastic adhesive joints attached to the device (1) and the board (2). The thermoplastic adhesive (7) is at least softened and applied to any available surface on the connecting substrate (3) of the surface mounted electronic device (1), and heated to a temperature sufficient to provide an adhesive joint between the organic surface and the board (2). There is also provided an assembly having a surface mounted electronic device (1) mounted onto a printed circuit board (2) and a thermoplastic adhesive (7) applied to the surface mounted electronic device (1) facing the printed circuit board (2) and providing for a gap between the thermoplastic adhesive (7) and the printed circuit board (2). The assembly is heated to at least soften the thermoplastic adhesive (7) sufficiently to flow across the gap and provide a thermoplastic adhesive joint between the surface mounted electronic device (1) and the printed circuit board (2). There is further provided a thermoplastic adhesive composition having at least (A) from 5 % to 98 % by weight of a functionalized polyolefin, and (B) from 2 % to 95 % by weight of a polyamide compound.
PCT/US2003/002965 2002-03-05 2003-01-31 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive WO2003077618A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003207779A AU2003207779A1 (en) 2002-03-05 2003-01-31 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/091,262 US20030170450A1 (en) 2002-03-05 2002-03-05 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
US10/091,262 2002-03-05
US10/091,086 2002-03-05
US10/091,086 US6906425B2 (en) 2002-03-05 2002-03-05 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive

Publications (2)

Publication Number Publication Date
WO2003077618A2 WO2003077618A2 (en) 2003-09-18
WO2003077618A3 true WO2003077618A3 (en) 2003-11-06

Family

ID=27807215

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/002965 WO2003077618A2 (en) 2002-03-05 2003-01-31 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive

Country Status (2)

Country Link
AU (1) AU2003207779A1 (en)
WO (1) WO2003077618A2 (en)

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CN113299593B (en) * 2021-05-21 2023-01-10 錼创显示科技股份有限公司 Adhesion layer structure and semiconductor structure

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DE602006018329D1 (en) 2005-09-08 2010-12-30 Cardlab A P S DYNAMIC TRANSACTION CARD AND METHOD FOR WRITING INFORMATION
DE102006018275A1 (en) * 2006-04-20 2007-10-31 Conti Temic Microelectronic Gmbh Electronic device e.g. camera module, for use in a motor vehicle electronics, has padding layer adapted to thermal expansions of electronic component and printed circuit board with respect to layer`s thermal expansion-coefficient
US20080176428A1 (en) * 2007-01-24 2008-07-24 Brandenburg Scott D Connector applied underfill
CN101547560B (en) * 2008-03-28 2011-11-02 诺亚电子股份有限公司 Repairing binding method for printed circuit board finished product with multi-plate typesetting
US9324601B1 (en) 2014-11-07 2016-04-26 International Business Machines Corporation Low temperature adhesive resins for wafer bonding
SG11201704445XA (en) 2014-12-19 2017-07-28 Cardlab Aps A method and an assembly for generating a magnetic field and a method of manufacturing an assembly
EP3035230A1 (en) 2014-12-19 2016-06-22 Cardlab ApS A method and an assembly for generating a magnetic field
EP3082071A1 (en) 2015-04-17 2016-10-19 Cardlab ApS Device for and method of outputting a magnetic field
TWI808422B (en) 2021-05-21 2023-07-11 錼創顯示科技股份有限公司 Adhesive-layer structure and semiconductor structure

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Also Published As

Publication number Publication date
AU2003207779A8 (en) 2003-09-22
AU2003207779A1 (en) 2003-09-22
WO2003077618A2 (en) 2003-09-18

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