WO2003054630A8 - Vorrichtung und verfahren zum modifizieren einer werkstück-oberfläche mit hilfe von photonen-strahlung - Google Patents

Vorrichtung und verfahren zum modifizieren einer werkstück-oberfläche mit hilfe von photonen-strahlung

Info

Publication number
WO2003054630A8
WO2003054630A8 PCT/AT2002/000354 AT0200354W WO03054630A8 WO 2003054630 A8 WO2003054630 A8 WO 2003054630A8 AT 0200354 W AT0200354 W AT 0200354W WO 03054630 A8 WO03054630 A8 WO 03054630A8
Authority
WO
WIPO (PCT)
Prior art keywords
radiation
workpiece
modifying
photonic radiation
lens elements
Prior art date
Application number
PCT/AT2002/000354
Other languages
English (en)
French (fr)
Other versions
WO2003054630A2 (de
WO2003054630A3 (de
Inventor
Dieter Baeuerle
Klaus Piglmayer
Original Assignee
Dieter Baeuerle
Innovationsagentur Gmbh
Klaus Piglmayer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dieter Baeuerle, Innovationsagentur Gmbh, Klaus Piglmayer filed Critical Dieter Baeuerle
Priority to AU2002361370A priority Critical patent/AU2002361370A1/en
Publication of WO2003054630A2 publication Critical patent/WO2003054630A2/de
Publication of WO2003054630A3 publication Critical patent/WO2003054630A3/de
Publication of WO2003054630A8 publication Critical patent/WO2003054630A8/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laser Beam Processing (AREA)

Abstract

Vorrichtung und Verfahren zum Modifizieren einer Werkstück-Oberfläche (1') mit Hilfe von Photonen-Strahlung (2), insbesondere Laser-Strahlung, mit einer Strahlungsquelle (3) und einer Maskeneinrichtung für die Strahlung, wobei die Maskeneinrichtung durch auf einem für die Strahlung (2) durchlässigen Träger (7), auf dessen dem Werkstück (1) zugewandter Seite haftend angebrachte Einzellinsenelemente (9) gebildet ist und die Strahlung (2) durch die Einzellinsenelemen te (9) in Teilstrahlen (10) gebündelt wird.
PCT/AT2002/000354 2001-12-21 2002-12-18 Vorrichtung und verfahren zum modifizieren einer werkstück-oberfläche mit hilfe von photonen-strahlung WO2003054630A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002361370A AU2002361370A1 (en) 2001-12-21 2002-12-18 Device and method for modifying the surface of a workpiece using photonic radiation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0201901A AT411755B (de) 2001-12-21 2001-12-21 Vorrichtung und verfahren zum modifizieren einer werkstück-oberfläche mit hilfe von photonen-strahlung
ATA2019/2001 2001-12-21

Publications (3)

Publication Number Publication Date
WO2003054630A2 WO2003054630A2 (de) 2003-07-03
WO2003054630A3 WO2003054630A3 (de) 2003-11-06
WO2003054630A8 true WO2003054630A8 (de) 2004-01-15

Family

ID=3689631

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2002/000354 WO2003054630A2 (de) 2001-12-21 2002-12-18 Vorrichtung und verfahren zum modifizieren einer werkstück-oberfläche mit hilfe von photonen-strahlung

Country Status (3)

Country Link
AT (1) AT411755B (de)
AU (1) AU2002361370A1 (de)
WO (1) WO2003054630A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2731126A1 (de) 2012-11-09 2014-05-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Verfahren zum Binden von Chipfarbstoffen
FR3014177B1 (fr) * 2013-12-04 2019-05-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Structure de surface pour les absorbeurs solaires thermiques et leur procede de realisation.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3321194B2 (ja) * 1992-02-10 2002-09-03 株式会社クラレ フォトマスク
US5723264A (en) * 1996-03-14 1998-03-03 Eastman Kodak Company Pattern transfer techniques for fabrication of lenslet arrays using specialized polyesters
WO1997034171A2 (en) * 1996-02-28 1997-09-18 Johnson Kenneth C Microlens scanner for microlithography and wide-field confocal microscopy
JP2000180605A (ja) * 1998-12-17 2000-06-30 Nippon Telegr & Teleph Corp <Ntt> 屈折型マイクロレンズの作製方法およびその装置
US6107011A (en) * 1999-01-06 2000-08-22 Creo Srl Method of high resolution optical scanning utilizing primary and secondary masks

Also Published As

Publication number Publication date
AU2002361370A8 (en) 2003-07-09
AU2002361370A1 (en) 2003-07-09
WO2003054630A2 (de) 2003-07-03
WO2003054630A3 (de) 2003-11-06
ATA20192001A (de) 2003-10-15
AT411755B (de) 2004-05-25

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