WO2003039223A1 - Transistor pin geometries that are suitable for contacting - Google Patents

Transistor pin geometries that are suitable for contacting Download PDF

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Publication number
WO2003039223A1
WO2003039223A1 PCT/DE2002/003962 DE0203962W WO03039223A1 WO 2003039223 A1 WO2003039223 A1 WO 2003039223A1 DE 0203962 W DE0203962 W DE 0203962W WO 03039223 A1 WO03039223 A1 WO 03039223A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact elements
transistor
housing
contact
grid spacing
Prior art date
Application number
PCT/DE2002/003962
Other languages
German (de)
French (fr)
Inventor
Guenther Weiss
Karl-Heinz Nuebel
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2003039223A1 publication Critical patent/WO2003039223A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2027—Guiding means, e.g. for guiding flexible circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a transistor, consisting of a housing and contact elements spinning out of the housing for the production of electrical connections to a printed circuit board, power cable or the like, the contact elements being arranged next to one another in parallel and thus forming a grid dimension or respectively a contact dend.
  • Transistors of the above type are made in Leiplatxnen DZW. Bonrurgen provided in printed circuit boards inserted and soldered on the puck side of the printed circuit board, the bores m of the printed circuit board corresponding to the pitch of the contact elements.
  • Busbars are elements that are pushed over the individual contact elements of the transistors DZW. Arranged parallel to this, fixing either by crimping, soldering or welding.
  • the object of the invention is to provide a cost-effective solution by means of which transistors, which have a very small pitch, can be welded or soldered in a contact-safe manner on busbars in a simple manner.
  • the solution to the problem is that the grid dimension that oil the contact elements is increased by bending the contact elements to a greater extent, either individually or in correspondence with a contact element, in such a way that a busbar can be pushed on, welded on, or soldered is.
  • the main advantage of the invention is to see that the pastermass of transistors is enlarged in a very simple manner by creating a sufficient spacing between the individual contact elements, so that busbars or widened busbars are also immediately available at free ends of the contact elements are arranged in an oenacho manner and are accordingly welded or solderable.
  • the grid dimension can be expanded independently of the number of individual contact elements, so that transistors of the above type can be monkey-fed in a very delicate and flexible manner depending on the corresponding application areas.
  • busbars are placed on the free ends or arranged directly next to them and are fixed there by means of soldering or welding processes or also a crimping process.
  • Figure 1 is a side view of a transistor with an expanded pitch.
  • FIG. 2 shows a rear view of the transistor according to FIG. 1.
  • Fig. 1 an exemplary embodiment of a transistor with an expanded pitch ⁇ is shown.
  • the transistor 1 is made up of a base 2 and of the housing 2 ner- aus arrangementsen ⁇ en contact elements 3.
  • the contact elements 3 form in their original form a Pasterma ⁇ s - and are each arranged in a contact element level 5, which is parallel to the drawing according to Fig. 1 is aligned.
  • the grid size 4 is on a larger Pastermass 7 on the pump
  • the one or more contact elements 3 m Franchiseelei ⁇ ier-tebene 5 are bent.
  • the welding or soldering points 8 of the busbars 6 and the contact elements 3 come to cover hom ⁇ oH and can be welded or soldered there in a further working step (see FIG. 2).

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

The invention relates to a transistor that is comprised of a housing and of contact elements led out from said housing to establish an electrical connection with a printed circuit, with a conductor rail or the like. The transistor has contact elements (3) that are disposed side by side, aligned in parallel and provided with a grid spacing (4). Said contact elements (3) themselves form different contact element planes (5). In order to make it possible to mount transistors of the above-mentioned type to conductor rails (6), the grid spacing (4) is enlarged by bending individual contact elements (3) in the contact element plane (5) depending on the size of the new grid spacing (7). In this manner, it is possible to dispose conductor rails (6) directly on the free ends, said rails being welded or soldered with the contact elements (3) in a welding area (S).

Description

Kontaktierqerechte Geometrien für TransistoroinsContactable geometries for transistoroins
Die Erfindung bezieht sich auf einen Transistor, Destehend aus einem Gehäuse und aus dem Gehäuse herausfunrenden Kontaktelementen zur Herstellung von elektrischen VerDindungen mit einer Leiterplatte, Stromscniene oder der gleichen, wobei die Kontaktelemente nebeneinander parallel angeordnet sind und so ein Rastermass bzw. jeweils eine KontakteDene bilden.The invention relates to a transistor, consisting of a housing and contact elements spinning out of the housing for the production of electrical connections to a printed circuit board, power cable or the like, the contact elements being arranged next to one another in parallel and thus forming a grid dimension or respectively a contact dend.
Stand der TechnikState of the art
Kontaktelemente von Transistoren, die an sich ein Kunststoffgehause um- fassen, weisen zwischen den einzelnen Kontaktelementen sehr kleine Abstände auf. Transistorer der vorstenenden Art werden in Lei erplatxnen DZW. in Leiterplatten vorgesehene Bonrurgen eingesteckt und auf αer Puckseite der Leiterplatte verlotet, wobei die Bohrungen m der Leiterplatte dem Rastermass der Kontaktelemente entsprechen.Contact elements of transistors, which in themselves comprise a plastic housing, have very small distances between the individual contact elements. Transistors of the above type are made in Leiplatxnen DZW. Bonrurgen provided in printed circuit boards inserted and soldered on the puck side of the printed circuit board, the bores m of the printed circuit board corresponding to the pitch of the contact elements.
Dies ermöglicht πei der Montage, dass αer Transistor mit seinen Kontai.te- lementen gleichzeitig m alle Bonrungen in αer Leiterplatte eingeführt werden kann und auf der Ruckseite die Leiterplatte entweder von Hand, mascnme]! oder in einem Lotbad fixiert bzw. verlötet werαen i.anr . Nachteile des Stands der TechnikDuring assembly, this enables the transistor with its contact elements to be inserted simultaneously into all the holes in the circuit board and the circuit board on the back either by hand, mascnme]! or fixed or soldered in a solder bath i.anr. Disadvantages of the prior art
Aus baulichen Gründen, beispielsweise bei der Anwendung von Transistoren bei Zündspulen, werden Transistoren auf sogenannte Stromscnienen gelotet oder σeschweisst. Stromschienen sind Elemente, die über die einzelnen Kontaktelemente der Transistoren geschoben DZW. Parallel dazu angeorαnet werden, wobei eine Fixierung entweder mittels einer Vercrimpung, einer Verlotung, oder einer Verschweissung erfolgt.For structural reasons, for example when using transistors in ignition coils, transistors are soldered or welded on so-called current rails. Busbars are elements that are pushed over the individual contact elements of the transistors DZW. Arranged parallel to this, fixing either by crimping, soldering or welding.
Insbesondere ergibt sich der Nachteil bei Schweiss- und Lotvorgangen, dass zwischen den einzelnen Kontaktelementen auf Grund von Lot- oder Schweissbrucken Kontakte zu den nebeneinander angeordneten Kontaktelementen entsteht, was zu technischen Schwierigkeiten, oeispielsweise Kurzschlüssen, f hrt.In particular, there is the disadvantage in welding and soldering processes that, due to solder or welding bridges, contacts are made between the individual contact elements to the contact elements arranged next to one another, which leads to technical difficulties, for example short-circuits.
Aufgabe der ErfindungObject of the invention
Aufgabe der Erfindung ist es, eine kostengünstige Losung zu schaffen, mittels der Transistoren, die ein sehr geringes Rastermass aufweisen, auf Stromschienen auf emfacne Art und Weise kontaktsicher verschweisst bzw. verlotet werden können.The object of the invention is to provide a cost-effective solution by means of which transistors, which have a very small pitch, can be welded or soldered in a contact-safe manner on busbars in a simple manner.
Losung der AufgabeSolution to the task
Die Losung der Aufgabe besteht darin, dass das Rastermass, das die Kontaktelemente oilden, vergrcssert wird, indem die Kontaktelemente wahlweise einzeln oder einer Kcntaktele entebene zugehörig auf ein grosseres Mass gebogen werden, derart, dass eine Stromschiene aufschiebbar, an- schweissbar, bzw. verlotbar ist.The solution to the problem is that the grid dimension that oil the contact elements is increased by bending the contact elements to a greater extent, either individually or in correspondence with a contact element, in such a way that a busbar can be pushed on, welded on, or soldered is.
Vorteile der ErfindungAdvantages of the invention
Der wesentlα-cne Vorteil der Erfindung ist αarin zu sehn, dass auf sehr einfache Art und Weise aas Pastermass von Transistoren vergrossert wird, indem αurcn Erweiterung des Rastermasses ein ausreichender Abstand zwischen den einzelnen Konta telementen geschaffen wirα, so dass Stromschienen oαer auch verbreiterte Stromschienen unmittelDar an αen freien Enden der Kontaktelemente oenachoart angeordnet sind und dort entsprechend ver- scnweissoar oder verlotbar sine.The main advantage of the invention is to see that the pastermass of transistors is enlarged in a very simple manner by creating a sufficient spacing between the individual contact elements, so that busbars or widened busbars are also immediately available at free ends of the contact elements are arranged in an oenacho manner and are accordingly welded or solderable.
Dabei kann die Erweiterung des Rastermasses unabhängig von αer Anzahl der einzelnen Kontaktelemente erfolgen, so dass auf sehr emfaene Art und Weise und flexibel in Abhängigkeit von den entsprechenden Anwendungsge- oieten Transistoren der vorstehenden Art αesenaffen werden können.The grid dimension can be expanded independently of the number of individual contact elements, so that transistors of the above type can be monkey-fed in a very delicate and flexible manner depending on the corresponding application areas.
Insbesondere besteht nun die Möglichkeit, verbreiterte Stromschienen auf die freien Enden der Kontaktelemente aufzusetzen, die ein einfacheres Kontaktieren der Transistoren ermöglichen. Dabei werden die Stromschienen auf die freien Enden aufgesetzt bzw. Unmittelbar daneben angeordnet und dort entsprechenα mittels Lot- oder Schweissverfahrεn oder auch einem Crimp-Verfahren fixiert.In particular, there is now the possibility of placing widened busbars on the free ends of the contact elements, which make it easier to contact the transistors. The busbars are placed on the free ends or arranged directly next to them and are fixed there by means of soldering or welding processes or also a crimping process.
Weitere vorteilhafte Ausgestaltungen gehen aus den nachfolgenden Beschreibung, den Ansprüchen, sowie den Zeichnungen hervor.Further advantageous embodiments emerge from the following description, the claims and the drawings.
Zeichnungendrawings
Es zeigtIt shows
Fig. 1 eine Seitenansicht auf einen Transistor mit einem erweiterten Rastermass;Figure 1 is a side view of a transistor with an expanded pitch.
Fig. 2 eine rückwärtige Ansicht auf den Transistor gemass Fig. 1.FIG. 2 shows a rear view of the transistor according to FIG. 1.
Beschreibung eines Ausfuhrun sbeispielsDescription of an exemplary embodiment
In Fig. 1 ist ein Ausfuhrungsoeispiel für eines Transistors mit einem erweiterten Rastermass αargestellt.In Fig. 1, an exemplary embodiment of a transistor with an expanded pitch α is shown.
Der Transistor 1 Desteht aus einem Genause 2 und aus dem Gehäuse 2 ner- ausfuhrenαen Kontaktelementen 3. Die Kontaktelemente 3 bilden in ihrer ursprunqlicnen Form ein Pasterma≤s - und sind jeweils in einer Kontakte- lementebεne 5 angeordnet, die parallel zur Zeicnendarstellung gemass Fig. 1 ausgerichtet ist.The transistor 1 is made up of a base 2 and of the housing 2 ner- ausführungsenαen contact elements 3. The contact elements 3 form in their original form a Pasterma≤s - and are each arranged in a contact element level 5, which is parallel to the drawing according to Fig. 1 is aligned.
Das Rastermass 4 wird auf ein grosseres Pastermass 7 am Pumct derThe grid size 4 is on a larger Pastermass 7 on the pump
Kontaktierung erweitert, m dem ein oder mehrere Kontaktelemente 3 m der Kontakteleiτier-tebene 5 gebogen werden. Dadurch kommen die Schweiss- bzw. Lötpunkte 8 der Stromschienen 6 und der Kontaktelemente 3 zur Deckung homπoH und können in einem weiteren Arbeitsschritt dort verschweisst bzw. verlötet werden (siehe Fig. 2). Contacting expanded, the one or more contact elements 3 m Kontakteleiτier-tebene 5 are bent. As a result, the welding or soldering points 8 of the busbars 6 and the contact elements 3 come to cover homπoH and can be welded or soldered there in a further working step (see FIG. 2).

Claims

A S P R Ü C H E ASPRÜ CHE
1. Transistor, bestehend aus einem Gehäuse und aus dem Gehäuse herausführenden Kontaktelementen (3) zur Herstellung elektrischer Verbindungen mit einer Leiterplatte, Stromschiene oder der gleichen, wobei die Kontaktelemεnte (3) nebeneinander parallel angeordnet sind und ein Rastermass (4) in einer Kontaktelementebene (5) bilden, dadurch, ge enn- ze ≥:ichnet, dass das Rastermass (4), das die Kontaktelemente (3) bilden,1. transistor, consisting of a housing and contact elements (3) leading out of the housing for establishing electrical connections with a printed circuit board, busbar or the like, the contact elements (3) being arranged next to one another in parallel and having a grid dimension (4) in a contact element level ( 5), characterized by ≥: net that the grid dimension (4) that the contact elements (3) form,
V /ξergrössert wird, indem die Kontaktelemente (3) wahlweise einzeln oder einer Kontaktelementebene (5) zugehörig auf ein grösseres Mass (7) ge- bogen werden, derart, dass eine Stromschiene (6) aufschiebbar, an- schweissbar, bzw. verlötbar ist.V / wird is increased by bending the contact elements (3) either individually or belonging to a contact element level (5) to a larger dimension (7) such that a conductor rail (6) can be pushed on, welded on or soldered ,
2. Transistor nach Anspruch 1, dadurch gekennzeichnet, dass die Stromschienen (6) verbreitet ausgebildet sind, die an den freien Enden der Kontaktelemente (3) aufschiebbar sind.2. Transistor according to claim 1, characterized in that the busbars (6) are widespread, which can be pushed on at the free ends of the contact elements (3).
3. Transistor nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Stromschienen (6) schuhartig ausgebildet sind. 3. Transistor according to claim 1 or 2, characterized in that the busbars (6) are shoe-like.
PCT/DE2002/003962 2001-10-23 2002-10-21 Transistor pin geometries that are suitable for contacting WO2003039223A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE20117320U DE20117320U1 (en) 2001-10-23 2001-10-23 Contactable geometries for transistor pins
DE20117320.4 2001-10-23

Publications (1)

Publication Number Publication Date
WO2003039223A1 true WO2003039223A1 (en) 2003-05-08

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Application Number Title Priority Date Filing Date
PCT/DE2002/003962 WO2003039223A1 (en) 2001-10-23 2002-10-21 Transistor pin geometries that are suitable for contacting

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WO (1) WO2003039223A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7527551U (en) * 1975-08-30 1976-02-26 Standard Elektrik Lorenz Ag, 7000 Stuttgart Electrical component, such as amplifier assembly or the like
DE2806683A1 (en) * 1978-02-16 1979-08-30 Siemens Ag Current-carrying wire lead for electronic component - has end bent double to hold component to circuit board prior to soldering
US4739125A (en) * 1985-09-27 1988-04-19 Hitachi, Ltd. Electric component part having lead terminals
US5240422A (en) * 1991-06-28 1993-08-31 Nec Corporation Connector
JPH0621310A (en) * 1992-07-02 1994-01-28 Seiko Epson Corp Surface mounted semiconductor device
JPH08130285A (en) * 1994-11-01 1996-05-21 Sanken Electric Co Ltd Electronic component

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7527551U (en) * 1975-08-30 1976-02-26 Standard Elektrik Lorenz Ag, 7000 Stuttgart Electrical component, such as amplifier assembly or the like
DE2806683A1 (en) * 1978-02-16 1979-08-30 Siemens Ag Current-carrying wire lead for electronic component - has end bent double to hold component to circuit board prior to soldering
US4739125A (en) * 1985-09-27 1988-04-19 Hitachi, Ltd. Electric component part having lead terminals
US5240422A (en) * 1991-06-28 1993-08-31 Nec Corporation Connector
JPH0621310A (en) * 1992-07-02 1994-01-28 Seiko Epson Corp Surface mounted semiconductor device
JPH08130285A (en) * 1994-11-01 1996-05-21 Sanken Electric Co Ltd Electronic component

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 225 (E - 1541) 22 April 1994 (1994-04-22) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 09 30 September 1996 (1996-09-30) *

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Publication number Publication date
DE20117320U1 (en) 2003-02-27

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