WO2003028942A1 - Dispositif projetant de la lumiere et procede de projection de lumiere - Google Patents
Dispositif projetant de la lumiere et procede de projection de lumiere Download PDFInfo
- Publication number
- WO2003028942A1 WO2003028942A1 PCT/JP2002/009928 JP0209928W WO03028942A1 WO 2003028942 A1 WO2003028942 A1 WO 2003028942A1 JP 0209928 W JP0209928 W JP 0209928W WO 03028942 A1 WO03028942 A1 WO 03028942A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser beam
- light projecting
- intensity
- intensity distribution
- machining
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-7007071A KR100491558B1 (ko) | 2001-09-28 | 2002-09-26 | 광 조사 장치와 광 조사 방법 |
US10/606,805 US7005605B2 (en) | 2001-09-28 | 2003-06-27 | Laser irradiation apparatus and method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001301713A JP3666435B2 (ja) | 2001-09-28 | 2001-09-28 | 光照射装置と光加工装置およびその加工方法 |
JP2001-301713 | 2001-09-28 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/606,805 Continuation-In-Part US7005605B2 (en) | 2001-09-28 | 2003-06-27 | Laser irradiation apparatus and method |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003028942A1 true WO2003028942A1 (fr) | 2003-04-10 |
Family
ID=19122078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/009928 WO2003028942A1 (fr) | 2001-09-28 | 2002-09-26 | Dispositif projetant de la lumiere et procede de projection de lumiere |
Country Status (6)
Country | Link |
---|---|
US (1) | US7005605B2 (ja) |
JP (1) | JP3666435B2 (ja) |
KR (1) | KR100491558B1 (ja) |
CN (1) | CN1227092C (ja) |
TW (1) | TW550137B (ja) |
WO (1) | WO2003028942A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4782510B2 (ja) * | 2004-10-05 | 2011-09-28 | 日立ビアメカニクス株式会社 | レーザービーム送出システムの安定性のためにビーム整形を用いる補償器光学系、及び横方向ビームドリフトによるエネルギー分布形状歪みを補正するための径方向非対称ビーム形成素子 |
JP2006317508A (ja) * | 2005-05-10 | 2006-11-24 | Yokogawa Electric Corp | 光強度分布補正光学系およびそれを用いた光学顕微鏡 |
US8417700B2 (en) * | 2005-12-01 | 2013-04-09 | Northrop Grumman Systems Corporation | Interactive tool for constructing and editing process diagrams |
US7996019B2 (en) * | 2006-12-26 | 2011-08-09 | Motorola Mobilty, Inc. | Intelligent location-based services |
JP4818958B2 (ja) * | 2007-03-02 | 2011-11-16 | 住友重機械工業株式会社 | ビーム照射装置、及び、ビーム照射方法 |
WO2009081577A1 (ja) | 2007-12-26 | 2009-07-02 | Panasonic Corporation | レーザ光源、それを用いた画像表示装置及び加工装置 |
KR100863187B1 (ko) * | 2008-01-10 | 2008-10-13 | (주)다사로봇 | 지능형 로봇 장치의 제어시스템 및 그 제어방법 |
US20120104284A1 (en) * | 2009-07-07 | 2012-05-03 | Koninklijke Philips Electronics N.V. | Patterning device for generating a pattern in and/or on a layer |
US8435437B2 (en) * | 2009-09-04 | 2013-05-07 | Abbott Cardiovascular Systems Inc. | Setting laser power for laser machining stents from polymer tubing |
JP5848877B2 (ja) * | 2011-02-14 | 2016-01-27 | 浜松ホトニクス株式会社 | レーザ光整形及び波面制御用光学系 |
US9291825B2 (en) * | 2013-03-22 | 2016-03-22 | Applied Materials Israel, Ltd. | Calibratable beam shaping system and method |
WO2016002036A1 (ja) * | 2014-07-03 | 2016-01-07 | 新日鐵住金株式会社 | レーザ加工装置 |
DE102014224182A1 (de) * | 2014-11-26 | 2016-06-02 | Robert Bosch Gmbh | Vorrichtung und Verfahren zur Lasermaterialbearbeitung |
CN104914584B (zh) * | 2015-07-02 | 2018-04-03 | 中国科学院光电技术研究所 | 一种基于波前校正器的激光束三维整形*** |
CN105328331B (zh) * | 2015-11-10 | 2017-08-04 | 哈尔滨工程大学 | 用于激光车削和磨削复合加工的强聚焦光学***及加工方法 |
CN107309556A (zh) * | 2016-04-14 | 2017-11-03 | 大族激光科技产业集团股份有限公司 | 一种激光钻孔装置及方法 |
EP4331768A3 (en) * | 2016-07-27 | 2024-04-24 | TRUMPF Laser GmbH | Laser line illumination |
CN106908956A (zh) * | 2017-03-22 | 2017-06-30 | 中国工程物理研究院激光聚变研究中心 | 对靶面光强分布进行匀滑的方法及其装置 |
JP6598833B2 (ja) * | 2017-09-11 | 2019-10-30 | キヤノン株式会社 | 照明光学系、露光装置、および物品の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5442487A (en) * | 1990-04-12 | 1995-08-15 | Nidek Co., Ltd. | Ophthalmic photocoagulating apparatus using a laser diode and a lens system for the apparatus |
JP2001121282A (ja) * | 1999-10-21 | 2001-05-08 | Matsushita Electric Ind Co Ltd | レーザ加工装置及びレーザ加工方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3476463A (en) * | 1965-05-11 | 1969-11-04 | Perkin Elmer Corp | Coherent light optical system yielding an output beam of desired intensity distribution at a desired equiphase surface |
JPH082511B2 (ja) | 1989-05-08 | 1996-01-17 | 松下電器産業株式会社 | レーザ加工装置 |
JP3555179B2 (ja) | 1994-06-20 | 2004-08-18 | 凸版印刷株式会社 | 液体用カートン開口部シール部の加熱方法及び加熱装置 |
US5994006A (en) * | 1996-06-04 | 1999-11-30 | Nikon Corporation | Projection exposure methods |
TW436357B (en) * | 1997-12-12 | 2001-05-28 | Matsushita Electric Ind Co Ltd | Laser drilling equipment and control method |
US6392742B1 (en) * | 1999-06-01 | 2002-05-21 | Canon Kabushiki Kaisha | Illumination system and projection exposure apparatus |
JP3407715B2 (ja) * | 2000-06-06 | 2003-05-19 | 松下電器産業株式会社 | レーザ加工装置 |
-
2001
- 2001-09-28 JP JP2001301713A patent/JP3666435B2/ja not_active Expired - Fee Related
-
2002
- 2002-09-25 TW TW091121974A patent/TW550137B/zh active
- 2002-09-26 CN CNB028033299A patent/CN1227092C/zh not_active Expired - Fee Related
- 2002-09-26 KR KR10-2003-7007071A patent/KR100491558B1/ko not_active IP Right Cessation
- 2002-09-26 WO PCT/JP2002/009928 patent/WO2003028942A1/ja active IP Right Grant
-
2003
- 2003-06-27 US US10/606,805 patent/US7005605B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5442487A (en) * | 1990-04-12 | 1995-08-15 | Nidek Co., Ltd. | Ophthalmic photocoagulating apparatus using a laser diode and a lens system for the apparatus |
JP2001121282A (ja) * | 1999-10-21 | 2001-05-08 | Matsushita Electric Ind Co Ltd | レーザ加工装置及びレーザ加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1481289A (zh) | 2004-03-10 |
TW550137B (en) | 2003-09-01 |
CN1227092C (zh) | 2005-11-16 |
US7005605B2 (en) | 2006-02-28 |
KR20030063397A (ko) | 2003-07-28 |
JP3666435B2 (ja) | 2005-06-29 |
KR100491558B1 (ko) | 2005-05-27 |
US20040084607A1 (en) | 2004-05-06 |
JP2003112280A (ja) | 2003-04-15 |
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