WO2003015976A1 - Brittle material substrate chamfering method and chamfering device - Google Patents

Brittle material substrate chamfering method and chamfering device Download PDF

Info

Publication number
WO2003015976A1
WO2003015976A1 PCT/JP2002/008203 JP0208203W WO03015976A1 WO 2003015976 A1 WO2003015976 A1 WO 2003015976A1 JP 0208203 W JP0208203 W JP 0208203W WO 03015976 A1 WO03015976 A1 WO 03015976A1
Authority
WO
WIPO (PCT)
Prior art keywords
edge
laser spot
chamfered
glass substrate
chamfering
Prior art date
Application number
PCT/JP2002/008203
Other languages
French (fr)
Japanese (ja)
Inventor
Haruo Wakayama
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Priority to JP2003520519A priority Critical patent/JP3823108B2/en
Priority to KR1020037008580A priority patent/KR100820689B1/en
Publication of WO2003015976A1 publication Critical patent/WO2003015976A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/04—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way
    • C03B29/06—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way with horizontal displacement of the products
    • C03B29/08—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • C03B29/025—Glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/02—Annealing glass products in a discontinuous way
    • C03B25/025—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)

Abstract

A first laser spot (LS1) in elliptic shape having one end positioned on an edge (51) to be chamfered included in the side edges of a glass substrate (50). The major axis of the first laser spot (LS1) is inclined by an angle θ with respect to the edge, and the other end is positioned on the portion in vicinity of the edge (51). The heat energy intensity of the first laser spot (LS1) is low at the end positioned on the portion in the vicinity of the edge (51) and highest at the end positioned on the edge (51) to be chamfered. When the glass substrate (50) is moved in the X-direction, the first laser spot (LS1), after preheating the portion of the glass substrate (50) in the vicinity of the edge (51), melts and chamfers the edge (51). Further, after the edge (51) has been melted and chamfered, the substrate is heated by a second laser spot and then annealed, thereby making it possible to mitigate the residual stress and prevent the occurrence of fine cracks. Thereby, the edge (51) of the glass substrate can be reliably chamfered without producing cracks.
PCT/JP2002/008203 2001-08-10 2002-08-09 Brittle material substrate chamfering method and chamfering device WO2003015976A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003520519A JP3823108B2 (en) 2001-08-10 2002-08-09 Chamfering method for brittle material substrate
KR1020037008580A KR100820689B1 (en) 2001-08-10 2002-08-09 Brittle material substrate chamfering method and chamfering device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001244748 2001-08-10
JP2001-244748 2001-08-10

Publications (1)

Publication Number Publication Date
WO2003015976A1 true WO2003015976A1 (en) 2003-02-27

Family

ID=19074633

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008203 WO2003015976A1 (en) 2001-08-10 2002-08-09 Brittle material substrate chamfering method and chamfering device

Country Status (5)

Country Link
JP (1) JP3823108B2 (en)
KR (1) KR100820689B1 (en)
CN (1) CN1283409C (en)
TW (1) TWI252788B (en)
WO (1) WO2003015976A1 (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006125306A1 (en) * 2005-05-23 2006-11-30 Quality Craft Ltd. Flooring connection
US7217640B2 (en) 2003-05-16 2007-05-15 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
WO2007094160A1 (en) * 2006-02-15 2007-08-23 Asahi Glass Company, Limited Method and apparatus for chamfering glass substrate
JP2007253181A (en) * 2006-03-22 2007-10-04 Tokyu Car Corp Laser beam welding method
WO2008024262A1 (en) * 2006-08-21 2008-02-28 Corning Incorporated Process and apparatus for thermal edge finishing a glass sheet with reduced residual stress
JP2009234856A (en) * 2008-03-27 2009-10-15 Hoya Corp Glass base material and method for manufacturing the same
JP2011522769A (en) * 2008-05-27 2011-08-04 コーニング インコーポレイテッド Non-flat material scribing
JP2012236764A (en) * 2012-07-23 2012-12-06 Hoya Corp Glass base material for cover glass for portable equipment
WO2013007504A1 (en) * 2011-07-14 2013-01-17 Saint-Gobain Glass France Method for smoothing the edges of a glass pane
EP2734480B1 (en) 2012-07-17 2016-03-09 LISEC Austria GmbH Method and apparatus for chamfering a glassplate
JP2016534012A (en) * 2013-08-23 2016-11-04 ラスコム・リミテッド How to blunt the sharp edges of glassware
WO2017175813A1 (en) * 2016-04-07 2017-10-12 川崎重工業株式会社 Heating device
WO2017187675A1 (en) * 2016-04-28 2017-11-02 日本電気硝子株式会社 Circular glass plate and production method for same
JP2019043799A (en) * 2017-08-31 2019-03-22 三星ダイヤモンド工業株式会社 End face treatment method of glass substrate and end face treatment device of glass substrate
JP2019043801A (en) * 2017-08-31 2019-03-22 三星ダイヤモンド工業株式会社 Residual stress reduction method of glass substrate and residual stress reduction device of glass substrate
JP2019043823A (en) * 2017-09-06 2019-03-22 三星ダイヤモンド工業株式会社 Residual stress reduction method of glass substrate and residual stress reduction device of glass substrate
JP2019043824A (en) * 2017-09-06 2019-03-22 三星ダイヤモンド工業株式会社 Method and apparatus for reducing residual stress of glass substrate
WO2021065440A1 (en) * 2019-09-30 2021-04-08 三星ダイヤモンド工業株式会社 Method for processing end surface of glass substrate and device for processing end surface of glass substrate

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4730740B2 (en) * 2006-01-30 2011-07-20 本田技研工業株式会社 Solar cell and method for manufacturing the same
JP5113462B2 (en) * 2007-09-12 2013-01-09 三星ダイヤモンド工業株式会社 Method for chamfering a brittle material substrate
EP2239085A4 (en) * 2007-12-19 2016-12-14 Mitsuboshi Diamond Ind Co Ltd Method for chamfering/machining brittle material substrate and chamfering/machining apparatus
CN101497150B (en) * 2008-02-01 2012-10-10 鸿富锦精密工业（深圳）有限公司 Laser device for cutting
TWI414383B (en) * 2008-06-25 2013-11-11 Mitsuboshi Diamond Ind Co Ltd Angle processing device
CN101700957B (en) * 2009-10-30 2012-06-27 武汉理工大学 Method for removing microcrack at glass edge and improving glass strength
KR101264263B1 (en) * 2010-05-31 2013-05-22 주식회사 라미넥스 A method for grinding egdgs of a thin glass plate
RU2459691C2 (en) * 2010-11-29 2012-08-27 Юрий Георгиевич Шретер Method of separating surface layer of semiconductor chip (versions)
KR20140062427A (en) * 2011-09-15 2014-05-23 니폰 덴키 가라스 가부시키가이샤 Method for cutting glass sheet
WO2013039230A1 (en) 2011-09-15 2013-03-21 日本電気硝子株式会社 Method for cutting glass sheet
CN103539344A (en) * 2012-07-16 2014-01-29 深圳市木森科技有限公司 Glass edge chamfering method and device
TWI457309B (en) * 2012-09-17 2014-10-21 Wistron Corp Strengthened structure of glass and manufacturing method thereof
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
CN102992601B (en) * 2012-12-04 2015-05-13 张立国 Method for annealing stress of prestressed glass laser
EP2754524B1 (en) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
KR101399838B1 (en) * 2013-10-08 2014-05-29 주식회사 고려반도체시스템 Method of finishing side surfaces of transparent substrate for display device and finishing apparatus using same
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
CN105322905A (en) * 2014-05-30 2016-02-10 珠海东精大电子科技有限公司 Method for preparing high-frequency 49S quartz crystal resonator
CN105207637A (en) * 2014-05-30 2015-12-30 珠海东精大电子科技有限公司 Preparation method of low-aged-rate 49S quartz crystal resonator
KR102445217B1 (en) 2014-07-08 2022-09-20 코닝 인코포레이티드 Methods and apparatuses for laser processing materials
CN107073642B (en) 2014-07-14 2020-07-28 康宁股份有限公司 System and method for processing transparent materials using laser beam focal lines with adjustable length and diameter
CN107073641B (en) 2014-07-14 2020-11-10 康宁股份有限公司 An interface block; system and method for cutting substrates transparent in the wavelength range using such an interface block
EP3169635B1 (en) 2014-07-14 2022-11-23 Corning Incorporated Method and system for forming perforations
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
CN107406293A (en) 2015-01-12 2017-11-28 康宁股份有限公司 The substrate through heat tempering is cut by laser using Multiphoton Absorbtion method
EP3274306B1 (en) 2015-03-24 2021-04-14 Corning Incorporated Laser cutting and processing of display glass compositions
EP3274313A1 (en) 2015-03-27 2018-01-31 Corning Incorporated Gas permeable window and method of fabricating the same
JP6654813B2 (en) * 2015-06-02 2020-02-26 川崎重工業株式会社 Chamfering apparatus and chamfering method
KR102499697B1 (en) 2015-07-10 2023-02-14 코닝 인코포레이티드 Method for continuously manufacturing holes in a flexible substrate sheet and articles related thereto
CN109311725B (en) 2016-05-06 2022-04-26 康宁股份有限公司 Laser cutting and removing profile shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
CN110121398B (en) 2016-08-30 2022-02-08 康宁股份有限公司 Laser machining of transparent materials
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
JP7066701B2 (en) 2016-10-24 2022-05-13 コーニング インコーポレイテッド Substrate processing station for laser-based processing of sheet glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
DE102017100961A1 (en) * 2017-01-19 2018-07-19 GEDIA Gebrüder Dingerkus GmbH Method of preparing sheet metal for a coating
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7285067B2 (en) * 2018-10-30 2023-06-01 浜松ホトニクス株式会社 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
WO2020090894A1 (en) 2018-10-30 2020-05-07 浜松ホトニクス株式会社 Laser processing device and laser processing method
WO2021162109A1 (en) * 2020-02-14 2021-08-19 日昌株式会社 Glass and glass processing method
CN112038229A (en) * 2020-07-14 2020-12-04 联立(徐州)半导体有限公司 Improved process after laser clamping groove processing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02241684A (en) * 1989-03-13 1990-09-26 Tokai Rika Co Ltd Method for chamfering glass member
JPH1167700A (en) * 1997-08-22 1999-03-09 Hamamatsu Photonics Kk Manufacture of semiconductor wafer
JP2000247671A (en) * 1999-03-04 2000-09-12 Takatori Corp Method for cutting glass
JP2000344551A (en) * 1999-03-03 2000-12-12 Shin Meiwa Ind Co Ltd Production of glass plate and glass plate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167700A (en) * 1987-12-23 1989-07-03 Fuji Electric Co Ltd Radioactive liquid waste treatment equipment for nuclear reactor facility

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02241684A (en) * 1989-03-13 1990-09-26 Tokai Rika Co Ltd Method for chamfering glass member
JPH1167700A (en) * 1997-08-22 1999-03-09 Hamamatsu Photonics Kk Manufacture of semiconductor wafer
JP2000344551A (en) * 1999-03-03 2000-12-12 Shin Meiwa Ind Co Ltd Production of glass plate and glass plate
JP2000247671A (en) * 1999-03-04 2000-09-12 Takatori Corp Method for cutting glass

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7638858B2 (en) 2003-05-16 2009-12-29 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
US7217640B2 (en) 2003-05-16 2007-05-15 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
WO2006125306A1 (en) * 2005-05-23 2006-11-30 Quality Craft Ltd. Flooring connection
WO2007094160A1 (en) * 2006-02-15 2007-08-23 Asahi Glass Company, Limited Method and apparatus for chamfering glass substrate
JP5245819B2 (en) * 2006-02-15 2013-07-24 旭硝子株式会社 Method and apparatus for chamfering glass substrate
JP2007253181A (en) * 2006-03-22 2007-10-04 Tokyu Car Corp Laser beam welding method
JP2010501456A (en) * 2006-08-21 2010-01-21 コーニング インコーポレイテッド Process and equipment for thermal edge finishing with reduced residual stress on glass plate
WO2008024262A1 (en) * 2006-08-21 2008-02-28 Corning Incorporated Process and apparatus for thermal edge finishing a glass sheet with reduced residual stress
JP2009234856A (en) * 2008-03-27 2009-10-15 Hoya Corp Glass base material and method for manufacturing the same
JP2011522769A (en) * 2008-05-27 2011-08-04 コーニング インコーポレイテッド Non-flat material scribing
WO2013007504A1 (en) * 2011-07-14 2013-01-17 Saint-Gobain Glass France Method for smoothing the edges of a glass pane
EP2734480B1 (en) 2012-07-17 2016-03-09 LISEC Austria GmbH Method and apparatus for chamfering a glassplate
JP2012236764A (en) * 2012-07-23 2012-12-06 Hoya Corp Glass base material for cover glass for portable equipment
JP2016534012A (en) * 2013-08-23 2016-11-04 ラスコム・リミテッド How to blunt the sharp edges of glassware
WO2017175813A1 (en) * 2016-04-07 2017-10-12 川崎重工業株式会社 Heating device
KR102154419B1 (en) 2016-04-07 2020-09-09 카와사키 주코교 카부시키가이샤 Heating device
KR20180117126A (en) * 2016-04-07 2018-10-26 카와사키 주코교 카부시키가이샤 Heating device
JP2017186202A (en) * 2016-04-07 2017-10-12 川崎重工業株式会社 Heater
WO2017187675A1 (en) * 2016-04-28 2017-11-02 日本電気硝子株式会社 Circular glass plate and production method for same
JP2017197414A (en) * 2016-04-28 2017-11-02 日本電気硝子株式会社 Circular glass sheet and production metho thereof
JP2019043799A (en) * 2017-08-31 2019-03-22 三星ダイヤモンド工業株式会社 End face treatment method of glass substrate and end face treatment device of glass substrate
JP2019043801A (en) * 2017-08-31 2019-03-22 三星ダイヤモンド工業株式会社 Residual stress reduction method of glass substrate and residual stress reduction device of glass substrate
JP2019043823A (en) * 2017-09-06 2019-03-22 三星ダイヤモンド工業株式会社 Residual stress reduction method of glass substrate and residual stress reduction device of glass substrate
JP2019043824A (en) * 2017-09-06 2019-03-22 三星ダイヤモンド工業株式会社 Method and apparatus for reducing residual stress of glass substrate
JP7037167B2 (en) 2017-09-06 2022-03-16 三星ダイヤモンド工業株式会社 Residual stress reduction method for glass substrate and residual stress reduction device for glass substrate
JP7037168B2 (en) 2017-09-06 2022-03-16 三星ダイヤモンド工業株式会社 Residual stress reduction method for glass substrate and residual stress reduction device for glass substrate
TWI772476B (en) * 2017-09-06 2022-08-01 日商三星鑽石工業股份有限公司 Method for reducing residual stress of glass substrate and device for reducing residual stress of glass substrate
WO2021065440A1 (en) * 2019-09-30 2021-04-08 三星ダイヤモンド工業株式会社 Method for processing end surface of glass substrate and device for processing end surface of glass substrate

Also Published As

Publication number Publication date
TWI252788B (en) 2006-04-11
KR20040024537A (en) 2004-03-20
JPWO2003015976A1 (en) 2004-12-02
KR100820689B1 (en) 2008-04-10
CN1491144A (en) 2004-04-21
CN1283409C (en) 2006-11-08
JP3823108B2 (en) 2006-09-20

Similar Documents

Publication Publication Date Title
WO2003015976A1 (en) Brittle material substrate chamfering method and chamfering device
US20230141696A1 (en) Method and device for laser-assisted separation of a portion from a sheet glass element
TWI430351B (en) Method and apparatus for processing substrates and use thereof
CN104741793B (en) The chamfering method and laser processing device of glass substrate
JP4880852B2 (en) Manufacturing method of small glass plate and large glass plate as semi-finished product for manufacturing small glass plate
JP5525491B2 (en) Control of crack depth in laser scoring.
TWI573186B (en) Methods and apparatus for machining strengthened glass and articles produced thereby
CN109759727A (en) A kind of laser cutting method and system of frosted glass
WO2003075322A3 (en) Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough
WO2007094160A1 (en) Method and apparatus for chamfering glass substrate
JP2015502898A (en) Method for cutting thin glass with specially formed edges
EP1413384A3 (en) Method of repairing a crack in a component utilizing stir welding
Kind et al. Laser glass frit sealing for encapsulation of vacuum insulation glasses
JP2011063499A (en) Method for fixing glass layer
EP2246146A1 (en) Laser machining method and laser machining apparatus
TW201119779A (en) Glass welding method and glass layer fixing method
EP0402875A3 (en) Glass repair method and apparatus
US9114467B2 (en) Method of smoothing and/or bevelling an edge of a substrate
EP1238748A3 (en) Method and device for laser welding of two or more overlapped metal sheets, and sheet clamping device therefor
WO2015026267A1 (en) Method for blunting sharp edges of glass objects
CN106186656B (en) A kind of laser cutting method of tempered glass
CN202022849U (en) Short-pulse laser toughened-glass abnormal cutting device
EP1313139A4 (en) Device and method for forming bump
JP2007160920A (en) Wafer and fabrication method of wafer
EP3467159B1 (en) Substrate manufacturing method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG US UZ VC VN YU ZA ZM

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE BG CH CY CZ DK EE ES FI FR GB GR IE IT LU MC PT SE SK TR BF BJ CF CG CI GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2003520519

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020037008580

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 02804763X

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 1020037008580

Country of ref document: KR

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase