WO2002102547A1 - Ponceuse a fenetre - Google Patents

Ponceuse a fenetre Download PDF

Info

Publication number
WO2002102547A1
WO2002102547A1 PCT/US2002/015405 US0215405W WO02102547A1 WO 2002102547 A1 WO2002102547 A1 WO 2002102547A1 US 0215405 W US0215405 W US 0215405W WO 02102547 A1 WO02102547 A1 WO 02102547A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing pad
underlay
polishing
window
opening
Prior art date
Application number
PCT/US2002/015405
Other languages
English (en)
Inventor
Stephen P. Carter
Arthur Richard Baker, Iii
Jon D. Jacobs, Jr.
George F. Feeley
Original Assignee
Rodel Holdings, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rodel Holdings, Inc. filed Critical Rodel Holdings, Inc.
Publication of WO2002102547A1 publication Critical patent/WO2002102547A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Definitions

  • the invention relates to a polishing pad apparatus that provides a window in a polishing pad.
  • US 6,045,439 discloses a polishing pad apparatus including, a polishing pad mounted on a polishing platen of a polishing machine.
  • An adhesive such as, a pressure sensitive adhesive, adheres the polishing pad to the polishing platen.
  • Successive layers of the polishing pad such as, a polishing layer of the polishing pad and one or more sublayers of the polishing pad, adhere to one another by additional adhesive.
  • the machine revolves the polishing platen and the polishing pad, and dispenses a polishing fluid onto the polishing pad.
  • the polishing pad and the polishing fluid polish a semiconductor substrate, which removes material from the semiconductor substrate, and which provides a smooth, planar polished surface on the semiconductor substrate.
  • the polishing pad of the apparatus is adapted with a transparent window.
  • the window is framed by an opening through the polishing pad.
  • An optical beam is transmitted from an optical detector apparatus, through a rear of the window, to reflect from the surface of the semiconductor substrate.
  • the optical beam monitors the surface of the semiconductor substrate, as the substrate is being polished.
  • the optical beam is reflected, and transmits through the window for detection by the optical detector apparatus.
  • polishing fluid seeps behind the polishing pad, and obstructs a rear surface of the window, which contributes to undesired attenuation of the optical beam.
  • adhesion strength of the adhesive is reduced when the adhesive becomes wet by leaking polishing fluid, which weakens the adhesion of the polishing pad to the polishing platen, and which weakens the adhesion of successive layers of the polishing pad.
  • polishing fluid will seep through a polishing pad that is designed to be wetted with the polishing fluid. Further, the polishing fluid will seep through an unsealed peripheral edge of the polishing pad. Further, the polishing fluid will seep through a leaking seam between the window and the opening. Manufacturing processes have been required to cut and fit the window to the opening, and to apply a sealant material in the seam, or alternatively, to mold both the window and the polishing pad simultaneously to join them together at the seam.
  • a fluid impermeable layer is provided to span across a polishing layer and a window in an opening through the polishing layer.
  • the fluid impermeable layer is provided with an adhesive forming a bond seal with the polishing layer and a rear surface of the window.
  • the bond seal is a source for fluid seepage.
  • the optical beam transmits through a first interface at the bond layer and the fluid impermeable layer, and successively through a second interface at the bond layer and a rear surface of the window. Such interfaces tend to attenuate the optical beam. It would be advantageous to eliminate such interfaces.
  • the invention provides a polishing pad apparatus having, a polishing pad, an optically transmissive window framed by an opening through the polishing pad, the window being part of an underlay that is unitary with the window, and the underlay having a perimeter that extends substantially beyond the perimeter of the window to form a fluid impermeable layer that isolates a rear surface of the window from obstruction by polishing fluid and from obstruction by the underlay.
  • Figure 1 is a top view of a polishing pad, reduced in size.
  • Figure 1 A is an isometric view of a polishing pad in the form of a continuous belt that is adapted to be mounted on a polishing platen of belt configuration.
  • Figure 2 is a fragmentary, enlarged side view of a polishing pad apparatus, for example, as disclosed by Fig. 1 or by Fig. 1A, with parts of the apparatus broken away to disclose, a polishing pad having an opening, an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is part of the polishing platen, and the polishing pad is removable from the underlay for replacement by another, duplicate polishing pad
  • Figure 2A is a view similar to Fig. 2, and disclosing a polishing pad apparatus, for example, as disclosed by Fig. 1 or by Fig. 1A, with parts of the apparatus broken away to disclose, a polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is a part of the polishing platen, and the sublayer and a remainder of the polishing pad are removable from the underlay for replacement by another polishing pad.
  • Figure 2B is a fragmentary, enlarged side view of an underlay of a polishing pad apparatus, for example, as disclosed by Fig. 1 or by Fig. 1 A, adapted for mounting on a polishing platen, with parts of the apparatus broken away to disclose, a window of solid structure.
  • Figure 2C is a view similar to Fig. 2B, and disclosing an underlay of a polishing pad apparatus, for example, as disclosed by Fig. 1 or by Fig. 1A, adapted for mounting on a polishing platen, with parts of the apparatus broken away to disclose, a window substantially coplanar with the thickness of the underlay.
  • Figure 3 is a fragmentary, enlarged side view of a polishing pad apparatus, for example, as disclosed by Fig. 1 or by Fig. 1 A, with parts of the apparatus broken away to disclose, a polishing pad, an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
  • Figure 3A is a view similar to Fig. 3, and disclosing a polishing pad apparatus, for example, as disclosed by Fig. 1 or by Fig. 1 A, with parts of the apparatus broken away to disclose, a polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is a part of the polishing pad, and, the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
  • Figure 3B is a view similar to Fig. 3, and disclosing a polishing pad apparatus, for example, as disclosed by Fig. 1 or by Fig. 1A, with parts of the apparatus broken away to disclose, a polishing pad having a sublayer that is part of the polishing pad, and an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is a part of the polishing pad, and a protruding lip on the underlay provides a seal at an edge of the sublayer.
  • Figure 3C is a view similar to Fig. 3, and disclosing a polishing pad apparatus, for example, as disclosed by Fig. 1 or by Fig. 1A, with parts of the apparatus broken away to disclose an underlay adapted for mounting on a polishing platen, and further wherein, the underlay has a window that is substantially coplanar with the thickness of a remainder of the underlay.
  • Figure 4 is a fragmentary enlarged side view of an underlay having a window that is fabricated as a hollow structure.
  • Figure 4A is a fragmentary enlarged side view of an underlay having a window that is fabricated as a solid structure.
  • Figure 4B is a fragmentary enlarged side view of an underlay having a window, and further disclosing the window as a nonprojecting structure that is coplanar with the thickness of a remainder of the underlay.
  • FIG. 4C is a fragmentary enlarged side view of an underlay having a window, and further disclosing underlay having a projecting lip that forms a seal.
  • Figs. 1 and 1A discloses a polishing pad 2 having at least a top layer 4 for polishing a semiconductor substrate, an opening 5 through the top layer 4, and an optically transmissive window 6 framed by the opening 5. The size of the opening 5 is limited, to occupy a small portion of the top layer 4, which minimizes any difference in the entirety of the polishing activity provided by the polishing layer 4.
  • Each polishing pad 2 has a perimeter 2a, with the polishing pad 2 of belt configuration having a perimeter 2a along each of the continuous edges of the belt configuration.
  • a polishing pad apparatus 1 that includes, a polishing pad 2 adapted to be mounted on a polishing platen 3 of a known polishing machine.
  • the known polishing machine performs a known polishing operation, according to which, the polishing pad 2 is revolved by the known polishing machine.
  • the polishing pad is accompanied by a polishing fluid to polish a semiconductor substrate that is held by the known polishing machine.
  • the semiconductor substrate includes, and is not limited to, for example, a wafer of silicon, a magnetic storage disk, an optical storage disk, and a semiconductor wafer patterned with conducting circuit interconnects.
  • each corresponding embodiment includes a polishing pad 2 having a top layer 4 that projects beyond the window 6.
  • the top layer 4 polishes a semiconductor substrate, and is known as a polishing layer of the polishing pad 2.
  • polishing fluid Prior to the invention, polishing fluid would seep behind the top layer 4, to obstruct a rear surface 6a of the window 6, which contributed to attenuation of an optical beam.
  • the polishing fluid would seep through the top layer 4, when the top layer 4 is designed to be wetted with the polishing fluid. Further, the polishing fluid would seep through an unsealed peripheral edge 2a of the polishing pad 2.
  • the polishing pad 2 included a sublayer 7, as disclosed by Figs. 2A, 3A and 3B, beneath the polishing layer 4, fluid would seep through an unsealed edge 7b of the sublayer 7.
  • manufacturing processes Prior to the invention, manufacturing processes have been required to cut and fit the window 6 to the opening 5, and to apply a sealant material in a seam 5a that is between the window 6 and the opening 5.
  • manufacturing processes have been required to mold both the window 6 and the polishing pad 2 simultaneously to join them together at the seam 5a.
  • polishing fluid would seep through leaks that would develop in the sealed seam 5a.
  • Each embodiment of the invention provides a polishing pad apparatus 1 having an optically transmissive window 6 framed by an opening 5 through a polishing pad 2, which apparatus 1 isolates the rear surface 6a of the window 6 from obstruction by polishing fluid.
  • the window 6 is part of an underlay 8.
  • the underlay 8 is unitary with a perimeter 6b of the window 6.
  • the unitary underlay 8 and window 6 eliminate the need for an adhesive bond seal between the underlay 8 and the window 6, which bond seal would be a source for fluid seepage. Further, because the underlay 8 joins the perimeter 6b of the window 6, the rear surface of the window 6 is free of an interface with the underlay 8.
  • the underlay 8 has a perimeter 8a that extends substantially beyond the perimeter 6b of the window 6 to encompass a large area within its perimeter 8a.
  • the perimeter 8a extends to the perimeter 2a of the pad 2 disclosed by Fig. 1.
  • the perimeter 8a extends to at least one perimeter 8a of the pad 2 of belt configuration disclosed by Fig. 1A.
  • the perimeter 8a extends to each perimeter 8a of the pad 2 of belt configuration disclosed by Fig. 1A.
  • the underlay 8 is fabricated and combined with the polishing pad apparatus 1 in a manner to form a fluid impermeable layer that isolates the rear surface 6a of the window 6 from obstruction by polishing fluid that would otherwise seep behind the polishing pad 2.
  • An adhesive layer 10 or an adhesive layer 12 attaches to the underlayer 8.
  • Another adhesive layer 9 attaches to a rear surface of the underlayer 8. Either one or more than one of the adhesive layers 9, 10 and 12 against the underlayer 8 provides a corresponding seal extending substantially beyond the perimeter 6b of the window, which isolates the rear surface 6a of the window 6 from obstruction by the polishing fluid.
  • Figs. 2, 2A, 2B and 2C discloses a corresponding embodiment of a polishing pad apparatus 1 wherein, the underlay 8 is part of the polishing platen 3.
  • the polishing platen 3 is circular for mounting the circular polishing pad 2 disclosed by Fig. 1 , or the polishing platen 3 is of belt configuration for mounting the polishing pad 2 of belt configuration disclosed by Fig. 1A.
  • the underlay 8 has an adhesive layer 9 on a rear surface of the underlay 8.
  • the adhesive layer 9 has an opening 9a adapted to be in alignment with an opening 3a through the polishing platen 3.
  • the adhesive layer 9 is an adhesive tape with adhesive on opposite sides of the tape.
  • a rear surface of the polishing pad 2 has an adhesive layer 10 with an opening 10a adapted to be in alignment with the opening 5.
  • a rear surface of the adhesive layer 10 is covered by a removable covering film 11 that initially adheres to and covers the adhesive layer 10, and is peeled from the adhesive layer 10, as depicted by the arrow, which exposes the adhesive layer 10 for attachment removably to the underlay 8.
  • the adhesive layer 10 is provided with hollow air transmitting pathways, which pathways allow escape of air that would tend to be entrapped under the adhesive layer 10.
  • the adhesive layer 10, as well as other adhesive layers described herein, have such air transmitting pathways as further disclosed in detail by US Patent Application Number 09/660,798.
  • Each of the other adhesive layers 9 and 12, is provided with corresponding, hollow air transmitting pathways.
  • the pad 2 and the adhesive layer 10 are removable from the underlay 8 for replacement by another, duplicate polishing pad 2
  • the underlay 8 remains as part of the polishing platen 3, and is easily cleaned in preparation for assembly of a replacement pad 2.
  • the underlay 8 itself is removable, together with the adhesive layer 9, for replacement by a duplicate underlay 8.
  • the polishing pad 2 is expected to be replaced more frequently than the underlay 8.
  • the adhesive layer 10 is advantageously soluble in a solvent that assists in removal and cleaning of the adhesive layer 10 from the underlay 8.
  • the adhesive layer 9 is advantageously insoluble in such a solvent, which promotes retention of the underlay 8 on the polishing platen 3.
  • the embodiment disclosed by Fig. 2A further includes, the polishing pad 2 having the top layer 4 assembled over and on a sublayer 7.
  • the sublayer 7 has an opening 7a in alignment with the opening 5. Together, the opening 7a and the opening 5 combine to provide a composite opening through the polishing pad 2.
  • the adhesive layer 10 attaches the top layer 4 to the sublayer 7.
  • a rear surface of the sublayer 7 has an adhesive layer 12 with an opening 12a in alignment with the opening 5.
  • the adhesive layer 12 is covered by the removable covering film 11 that is peeled from the adhesive layer 12, as depicted by the arrow, which exposes the adhesive layer 12 for attachment removably to the underlay 8.
  • the window 6 has a projecting height sufficient to project into both the opening 7a and the opening 5.
  • a seal 7b is provided at a peripheral edge of the sublayer 7.
  • the seal 7b includes, but is not limited to, for example, a heat seal, a pressure embossed seal, and a waterproof coating.
  • the seal 7b resists seepage of polishing fluid into the peripheral edge 7b that is a part of the peripheral edge 2a of the polishing pad 2. Further details of the seal 7b are disclosed by U.S. Patent Application serial number 09/635,877, incorporated herein by reference.
  • the pad 2 and the adhesive layer 12 are removable from the underlay 8 for replacement by another, duplicate polishing pad 2.
  • the underlay 8 remains as part of the polishing platen 3, and is easily cleaned in preparation for assembly of a replacement pad 2.
  • the underlay 8 itself is removable, together with the adhesive layer 9, for replacement by a duplicate underlay 8.
  • the polishing pad 2 is expected to be replaced more frequently than the underlay 8.
  • the adhesive layer 12 is advantageously soluble in a solvent that assists in removal and cleaning of the adhesive layer 12 from the underlay 8.
  • the adhesive layer 9 is advantageously insoluble in such a solvent, which promotes retention of the underlay 8 on the polishing platen 3.
  • FIG. 2A includes an embodiment of an underlay 8 wherein, the window 6 is a hollow structure that projects into the opening, as well as being framed by the opening indicated by the numeral 5, or by the composite of numerals 5 and 7a.
  • Fig. 2B discloses a portion of a polishing pad apparatus 1 having an alternative embodiment of the underlay 8 wherein, the window 6 is a solid structure that projects into the opening, as well as being framed by the opening indicated by the numeral 5, or by the composite of numerals 5 and 7a.
  • Fig. 2B discloses a portion of a polishing pad apparatus 1 having an alternative embodiment of the underlay 8 wherein, the window 6 is a solid structure that projects into the opening, as well as being framed by the opening indicated by the numeral 5, or by the composite of numerals 5 and 7a.
  • FIG. 2C discloses a portion of a polishing pad apparatus 1 having an alternative embodiment of the underlay 8 wherein, the window 6 has a thickness that is substantially coplanar with a thickness of a remainder of the underlay 8, as well as, the window 6 being framed by the opening, as indicated by the numeral 5, or as indicated by the composite of numerals 5 and 7a.
  • the perimeter 6b of the window 6 is indicated by a broken line through the thickness of the underlay 8.
  • FIG. 3, 3A, 3B and 3C discloses a corresponding embodiment wherein, the underlay 8 is part of the polishing pad 2, such that, the underlay 8 and a remainder of the polishing pad 2 are removable from the polishing platen 3 for replacement by another, duplicate polishing pad 2.
  • the polishing pad 2 has an adhesive layer 10 with an opening 10a adapted to be in alignment with the opening 5.
  • the adhesive layer 10 attaches the top layer 4 of the polishing pad 2 to the underlay 8.
  • the rear surface of the underlay has attached thereto an adhesive layer 9.
  • the adhesive layer 9 has an opening 9a adapted to be in alignment with both the opening 5 and an opening 3a through the polishing platen 3.
  • the adhesive layer 9 is an adhesive tape with adhesive on opposite sides of the tape.
  • FIG. 3 and 3C discloses a corresponding embodiment wherein, the adhesive layer 9 is covered by the removable covering film 11 that is peeled from the adhesive layer 9, as depicted by the arrow, which exposes the adhesive layer 9 for attachment of the underlay 8 to the polishing platen 3.
  • the embodiment disclosed by Fig. 3 includes the same underlay 8 with a window 6 of hollow structure, as disclosed by Fig. 2.
  • the embodiment disclosed by Fig. 3C includes the same underlay 8 with a window 6 of substantially the same thickness as a remainder of the underlay 8, as disclosed by Fig. 2C.
  • FIGs. 3A and 3B discloses a corresponding embodiment wherein, the polishing pad 2 has both the top layer 4 and the underlay 8 assembled on a sublayer 7.
  • the sublayer 7 has an opening 7a through its thickness.
  • the opening 7a is in alignment with the opening 5.
  • the adhesive layer 9 attaches to the sublayer 7.
  • a rear surface of the sublayer 7 has an adhesive layer 12 with an opening 12a adapted to be in alignment with the opening 5.
  • the adhesive layer 12 is covered by the removable covering film 11 that is peeled from the adhesive layer 12, as depicted by the arrow, which exposes the adhesive layer 12 for attachment removably to the underlay 8.
  • a seal 7b is provided at a peripheral edge of the sublayer 7.
  • the seal 7b is a unitary projecting lip on the perimeter 8a on the underlay 8.
  • the projecting lip extends at and over the peripheral edge of the sublayer 7.
  • the window 6 has a projecting height sufficient to project into both the opening 7a and the opening 5.
  • the embodiment disclosed by Fig. 3A includes an underlay 8 having a window 6 of hollow structure, similar to that disclosed by Fig. 2.
  • the embodiment disclosed by Fig. 3B includes an underlay 8 having a window 6 of solid structure the same as in the embodiment disclosed by Fig. 2B.
  • each of Figs. 4, 4A, 4B and 4C discloses a corresponding embodiment of the underlay 8 and the window 6 fabricated as a unitary structure.
  • the underlay 8 and the window 6 are fabricated by shaping a fluent material, and solidifying the fluent material to a solid phase that is optically transparent.
  • the fluent material is shaped in a cavity 13 defined between two, opposed shaping dies 14, 14a of a known molding apparatus, or alternatively, a known sintering apparatus.
  • the dies 14, 14a meet along a parting line 14b.
  • the dies 14, 14a fabricate the fluent material into the underlay 8 as a thin layer.
  • the dies 14, 14a fabricate the window 6 in a window shaped recess 14c defined between the dies 14, 14a.
  • the window 6 is vacuum formed, by drawing a reduced atmosphere through an exhaust vent 14d provided in the shaping die 14 to communicate with the window shaped recess 14c.
  • the dies 14, 14a are opened along the parting line 14b, which allows removal of the underlay 8 and unitary window 6.
  • the fluent material is a melt that is shaped and solidified between the dies 14, 14a that are molding dies of a known molding apparatus.
  • the fluent material is a powder mixed with a sintering binder that is shaped between the dies 14, 14a serving as sintering preforms. During a known heat sintering operation the powder binds to itself, and the binder is driven off by heat.
  • the fluent material is solidified as a sintered material that is optically transparent in the solid phase.
  • Fig. 4 discloses an embodiment of the underlay 8 having the window 6 fabricated as a thin and hollow structure.
  • the recess 14c is narrowly spaced from the opposed die 14a, which defines a relatively thin space in the cavity 13 within which the dies 14, 14a fabricate the hollow window 6.
  • Figure 4A discloses an embodiment of the underlay 8 having the window 6 fabricated as a thick and solid structure.
  • the recess 14c is substantially spaced from the opposed die 14a, defining a relatively wide space in the cavity 13 within which the dies 14, 14a fabricate the solid window 6 from the solidified fluent material.
  • Figure 4B discloses an embodiment of the underlay 8 having the window 6 as a nonprojecting structure.
  • the cavity 13 is spaced from the opposed die 14a the same distance as is a remainder of the cavity 13 within which the dies 14, 14a fabricate the window 6 from the solidified fluent material.
  • the dies 14, 14a fabricate the window 6 with a thickness that is substantially coplanar with the remainder of the underlay 8.
  • Figure 4C discloses an embodiment of the underlay 8 having a projecting lip 7b, according to Fig. 3A
  • the following materials are suitable for being transmissive of the optical beam of the known optical detector; PET, polyethyleneterapthalate, PE, polyethylene, PP, polypropylene, PU, polyurethane and PVC, polyvinylchloride, could be used in varying thickness of thin sheets.
  • the invention further attains a reduced cost of production by eliminating the need for die cutting the shape of the window to interfit with the opening in the pad.
  • the invention eliminates the disadvantage of a leaking seal between the window and the opening through the polishing layer 4 of the polishing pad 2.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention porte sur une ponceuse dont le tampon à polir (2) comporte une fenêtre (6) de transmission optique cadrée dans une ouverture (5) traversant le tampon (2) et une sous-couche (8) dont le périmètre (8a) s'étend substantiellement au delà du périmètre (6b) de la fenêtre (6) et constituant une couche imperméable au fluide de polissage isolant la surface arrière (6a) de la fenêtre pour en empêcher l'obstruction par ledit fluide.
PCT/US2002/015405 2001-06-15 2002-05-16 Ponceuse a fenetre WO2002102547A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29859901P 2001-06-15 2001-06-15
US60/298,599 2001-06-15

Publications (1)

Publication Number Publication Date
WO2002102547A1 true WO2002102547A1 (fr) 2002-12-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/015405 WO2002102547A1 (fr) 2001-06-15 2002-05-16 Ponceuse a fenetre

Country Status (2)

Country Link
US (1) US20020193058A1 (fr)
WO (1) WO2002102547A1 (fr)

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
DE102013203116A1 (de) * 2013-02-26 2014-08-28 Robert Bosch Gmbh Schleifmittelvorrichtung

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US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6123609A (en) * 1997-08-22 2000-09-26 Nec Corporation Polishing machine with improved polishing pad structure
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same

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US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6108091A (en) * 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6464576B1 (en) * 1999-08-31 2002-10-15 Rodel Holdings Inc. Stacked polishing pad having sealed edge
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
WO2001023141A1 (fr) * 1999-09-29 2001-04-05 Rodel Holdings, Inc. Tampon de polissage

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Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6123609A (en) * 1997-08-22 2000-09-26 Nec Corporation Polishing machine with improved polishing pad structure
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window

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