WO2002082536A3 - Laminated heat transfer device and method of producing thereof - Google Patents

Laminated heat transfer device and method of producing thereof Download PDF

Info

Publication number
WO2002082536A3
WO2002082536A3 PCT/GB2002/001657 GB0201657W WO02082536A3 WO 2002082536 A3 WO2002082536 A3 WO 2002082536A3 GB 0201657 W GB0201657 W GB 0201657W WO 02082536 A3 WO02082536 A3 WO 02082536A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat transfer
transfer device
laminated heat
producing
laminae
Prior art date
Application number
PCT/GB2002/001657
Other languages
French (fr)
Other versions
WO2002082536A2 (en
Inventor
Wing Ming Siu
Original Assignee
Convergence Technologies Ltd
Wing Ming Siu
Piesold Alexander James
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Convergence Technologies Ltd, Wing Ming Siu, Piesold Alexander James filed Critical Convergence Technologies Ltd
Priority to US10/219,255 priority Critical patent/US20020195231A1/en
Publication of WO2002082536A2 publication Critical patent/WO2002082536A2/en
Publication of WO2002082536A3 publication Critical patent/WO2002082536A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/12—Laminated parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

A laminated heat transfer device for cooling or thermal energy transport applications and a method of manufacture thereof. In various implementations, the laminated heat transfer device provides complex duct channels for efficient cooling. The various implementations are compatible and integrateable with each other. The method of producing a laminated heat transfer device includes specifying a three-dimensional structure as a plurality of laminae, producing the laminae from sheets of working material, stacking the laminae according to a predetermined sequence with a guiding structure, and connecting the laminae.
PCT/GB2002/001657 2001-04-09 2002-04-09 Laminated heat transfer device and method of producing thereof WO2002082536A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/219,255 US20020195231A1 (en) 2001-04-09 2002-08-16 Laminated heat transfer device and method of producing thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28217001P 2001-04-09 2001-04-09
US60/282,170 2001-04-09

Publications (2)

Publication Number Publication Date
WO2002082536A2 WO2002082536A2 (en) 2002-10-17
WO2002082536A3 true WO2002082536A3 (en) 2003-08-07

Family

ID=23080377

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/001657 WO2002082536A2 (en) 2001-04-09 2002-04-09 Laminated heat transfer device and method of producing thereof

Country Status (3)

Country Link
US (1) US20020144809A1 (en)
TW (1) TW531632B (en)
WO (1) WO2002082536A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
TWI274539B (en) * 2005-04-01 2007-02-21 Delta Electronics Inc Heat dissipating assembly with composite heat dissipating structure
US7800904B2 (en) * 2008-01-15 2010-09-21 Mcgough William L Electronic assembly and heat sink
US7914182B2 (en) * 2008-09-30 2011-03-29 GE Lighting Soutions, LLC Decorative light fixture including cooling system
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
CN102798103B (en) * 2011-05-24 2016-06-01 奥斯兰姆有限公司 Module radiator for LED
US9275931B2 (en) * 2012-01-12 2016-03-01 Huang-Han Chen Heat dissipating module
CN104053337A (en) * 2013-03-15 2014-09-17 君瞻科技股份有限公司 Electronic device with heat radiating function and radiating module thereof
WO2014173419A1 (en) * 2013-04-23 2014-10-30 Alexiou & Tryde Holding Aps Heat sink having a cooling structure with decreasing structure density
DE102013223461A1 (en) * 2013-11-18 2015-05-21 Rohde & Schwarz Gmbh & Co. Kg Heat sink to remove heat
KR101414290B1 (en) * 2014-01-14 2014-07-01 공관식 Laminating structure
US10030916B2 (en) * 2014-07-29 2018-07-24 Intel Corporation Fluid flow channel for enhanced heat transfer efficiency
US10378836B2 (en) * 2016-09-26 2019-08-13 Asia Vital Components Co., Ltd. Water-cooling radiator assembly
US10004159B2 (en) * 2016-09-26 2018-06-19 Asia Vital Components Co., Ltd. Water-cooling radiator unit and device thereof
US10004156B2 (en) * 2016-09-26 2018-06-19 Asia Vital Components Co., Ltd. Heat radiation fin structure
US9986661B2 (en) * 2016-09-26 2018-05-29 Asia Vital Components Co., Ltd. Water cooling heat radiation device and module thereof
US11587798B2 (en) * 2020-01-03 2023-02-21 Rolls-Royce North American Technologies Inc. High heat flux power electronics cooling design

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218056A (en) * 1985-07-17 1987-01-27 Hitachi Ltd Semiconductor cooling device
JPH03138968A (en) * 1989-10-24 1991-06-13 Sumitomo Metal Ind Ltd Heat radiating fin ic package, and its manufacture
US5051814A (en) * 1987-04-15 1991-09-24 The Board Of Trustees Of The Leland Stanford Junior University Method of providing stress-free thermally-conducting attachment of two bodies
US5437328A (en) * 1994-04-21 1995-08-01 International Business Machines Corporation Multi-stage heat sink
US5583746A (en) * 1994-12-12 1996-12-10 Tennmax Trading Corp. Heat sink assembly for a central processing unit of a computer
WO1997044993A1 (en) * 1996-05-20 1997-11-27 Hi-Z Technology, Inc. Thermoelectric module with gapless eggcrate
JPH10126075A (en) * 1996-10-24 1998-05-15 Matsushita Electric Ind Co Ltd Heat sink and its manufacturing method
JPH1147960A (en) * 1997-08-04 1999-02-23 Showa Alum Corp Heat exchanger
US6152215A (en) * 1998-12-23 2000-11-28 Sundstrand Corporation High intensity cooler

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218056A (en) * 1985-07-17 1987-01-27 Hitachi Ltd Semiconductor cooling device
US5051814A (en) * 1987-04-15 1991-09-24 The Board Of Trustees Of The Leland Stanford Junior University Method of providing stress-free thermally-conducting attachment of two bodies
JPH03138968A (en) * 1989-10-24 1991-06-13 Sumitomo Metal Ind Ltd Heat radiating fin ic package, and its manufacture
US5437328A (en) * 1994-04-21 1995-08-01 International Business Machines Corporation Multi-stage heat sink
US5583746A (en) * 1994-12-12 1996-12-10 Tennmax Trading Corp. Heat sink assembly for a central processing unit of a computer
WO1997044993A1 (en) * 1996-05-20 1997-11-27 Hi-Z Technology, Inc. Thermoelectric module with gapless eggcrate
JPH10126075A (en) * 1996-10-24 1998-05-15 Matsushita Electric Ind Co Ltd Heat sink and its manufacturing method
JPH1147960A (en) * 1997-08-04 1999-02-23 Showa Alum Corp Heat exchanger
US6152215A (en) * 1998-12-23 2000-11-28 Sundstrand Corporation High intensity cooler

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 011, no. 187 (E - 516) 16 June 1987 (1987-06-16) *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 355 (E - 1109) 9 September 1991 (1991-09-09) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 10 31 August 1998 (1998-08-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31) *

Also Published As

Publication number Publication date
TW531632B (en) 2003-05-11
WO2002082536A2 (en) 2002-10-17
US20020144809A1 (en) 2002-10-10

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