WO2002073819A2 - Sim card socket and manufacturing method therefor - Google Patents
Sim card socket and manufacturing method therefor Download PDFInfo
- Publication number
- WO2002073819A2 WO2002073819A2 PCT/US2002/007717 US0207717W WO02073819A2 WO 2002073819 A2 WO2002073819 A2 WO 2002073819A2 US 0207717 W US0207717 W US 0207717W WO 02073819 A2 WO02073819 A2 WO 02073819A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- socket
- sim card
- plate portion
- free end
- engaging free
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
- G06K7/0021—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers for reading/sensing record carriers having surface contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
Definitions
- the present invention relates to a Subscriber Identity Module (SIM) card socket and its manufacturing method, in which the SIM card socket is mounted in a mobile communication device and receives a SIM card, so as to enable the mobile communication device to be used in making or receiving a phone call.
- SIM Subscriber Identity Module
- SIM Subscriber Identity Module
- a SLM card socket is disposed within a mobile communication device, so that the SLM card can be assembled in the SIM card socket, thereby enabling the owner to use the mobile communication device. Fees for the use of the mobile communication device are ascribed to the owner of the SIM card on the basis of the information in the SIM card.
- the SIM card socket in which the SLM card is seated, has a corresponding tendency toward a reduced size and a higher quality.
- FIG 1 is a perspective view of a conventional SIM card socket
- Figure 2 is a perspective view of a conventional SIM card socket and a conventional SIM card
- Figure 3 is an exploded perspective view of a mobile communication device in which a conventional SLM card socket is disposed.
- a conventional SIM card socket 20 includes a socket housing 22, a card-receiving surface 24, and a plurality of connector pin contacts 26.
- Socket housing 22 defines the external appearance of the conventional SLM card socket 20.
- the card- receiving surface 24 is defined by the upper surface of socket housing 22, and a SIM card 30 is mounted on this surface 24.
- Pin contacts 26 are supported at surface 24 of socket housing 22.
- each of pin contact 26 forms a solder end 26a adapted to be soldered to a connection node of a printed circuit board (not shown), while the other end of each of pin contact 26 forms a contact end 26b to be electrically connected to a corresponding contact 32 of SIM card 30.
- Contact ends 26b of pin contacts 26 are adapted to be elastically deformed.
- Conventional SLM card socket 20 having the construction as described above is received in the mobile communication device, in such a manner as shown in Figures 2 and 3.
- a socket seating recess 14 dimensioned to accommodate SIM card socket 20 is formed on a surface of mobile communication device 10, for example, on a battery seat 12 on which a battery 16 is assembled, and SIM card socket 20 is assembled in socket seating recess 14.
- Solder ends 26a of pin contacts 26 are soldered to corresponding connection nodes of the printed circuit board, which is exposed in socket seating recess 14 of mobile communication device 10, so that the SIM card socket is fixed in socket seating recess 14.
- SIM card 30 is inserted from above and placed on SIM card socket 20 fixed within socket seating recess 14.
- SIM card 30 placed on SIM card socket 20 in socket seating recess 14 is supported by contact ends 26b of pin contacts 26, which are adapted to be elastically deformed. That is, SIM card 30 is not completely assembled, but is held at an elevated position by contact ends 26b of pin contacts 26.
- battery 16 is then assembled on battery seat 12, so that SIM card 30 is completely seated on SIM card socket 20 in socket seating recess 14 and contacts 32 of SIM card 30 are electrically connected to pin contacts 26 of SIM card socket 20.
- solder ends 26a for fixing SIM card socket 20 to the printed circuit board protrudes outside of the dimensions of socket housing 22, the presence of solder end 26a is a main factor in making it difficult to reduce the overall dimension of the mobile communication device. Further, in the conventional SIM card socket 20 described above, since solder ends 26a for fixing SIM card socket 20 to the printed circuit board protrudes outside of the dimensions of socket housing 22, the presence of solder end 26a is a main factor in making it difficult to reduce the overall dimension of the mobile communication device. Further, in the conventional SIM card socket 20 described above, since solder ends
- an object of the present invention is to provide a SIM card socket and its manufacturing method, in which the board-engaging free ends and the card-engaging free ends of the pin contacts of the SIM card socket, which electrically connect to corresponding contacts of the SIM card and the printed circuit board in a mobile communication device, are located inside the dimensions defined by the SIM card socket, so as to reduce the dimensions of elements of the mobile communication device, thereby reducing the entire dimension of the mobile communication device.
- a SIM card socket which is adapted to be mounted in a mobile communication device, so that a SIM card can be mounted on the SIM card socket and the mobile communication device can be used in making or receiving a phone call
- the SIM card socket comprises: a plurality of pin contacts, each of the pin contacts having a bight portion, a board-engaging free end and a card- engaging free end, the pin contacts being arranged in two mirror image rows in such a manner as that the pin contacts arranged in one row are opposed to the pin contacts arranged in the other row, wherein the board-engaging free end and the card-engaging free end extend in the same general direction away from the bight portion and define an acute angle therebetween; and a generally rectangular socket housing having through holes windows formed therethrough, the bight portion of the pin contacts being mounted generally along two side edges of the socket housing, wherein the board-engaging free end and the card-engaging free end of each of the pin contacts are positioned within the through hole windows of the socket housing
- the socket housing comprises an upper plate portion and a lower plate portion, and the bight portion of each of the pin contacts is insert-molded between the upper plate portion and the lower plate portion of the socket housing.
- the socket housing may further comprise a metal reinforcement insert-molded between the upper plate portion and the lower plate portion in two longitudinal side portions and a central transverse portion of the socket housing, so as to reinforce a strength of the socket housing. It is preferred that the socket housing further comprises partitions disposed in the through hole windows of the socket housing spaced in regular intervals to separate adjacent pin contacts from each other.
- the socket housing may further include an alignment protuberance formed on a lower surface of the lower plate portion of the socket housing, so that the SIM card socket can be mounted at a predetermined location on the printed circuit board of the mobile communication device.
- a method of manufacturing a SIM card socket comprising the steps of: stamping and forming a metal plate portion to produce a pin contact frame, the pin contact frame including an H-shaped metal reinforcement and a plurality of pin contacts connected integrally through the metal reinforcement, each of the pin contacts having a bight portion, a board-engaging free end and a card-engaging free end, the board-engaging free end and the card-engaging free end extending from the bight portion in the same general direction and defining an acute angle therebetween, wherein the metal reinforcement includes two side longitudinal extensions and a central transverse extension and the board-engaging free ends and card-engaging free ends of the pin contacts are arranged in two rows on opposite sides of the central transverse extension; molding a socket
- a SIM card socket according to the above invention may further comprise engagement protuberances formed on longer side portions of the socket housing; alignment protuberances formed on the longer side portions of the socket housing, wherein the alignment protuberances have different dimensions to facilitate mounting the socket in the mobile communication device, wherein the alignment protuberances are adapted to engage alignment grooves of the mobile communication device and the engagement protuberances are adapted to engage engagement thresholds of mobile communication device.
- the engagement protuberances of the socket housing and the engagement thresholds of the socket seat may comprise a chamfered surface, so as to enable the SIM card socket to be easily assembled on the mobile communications device.
- FIGURE 1 is a perspective view of a conventional SLM card socket
- FIGURE 2 is a perspective view of a conventional SLM card socket and a conventional SLM card
- FIGURE 3 is an exploded perspective view of a mobile communication device in which a conventional SIM card socket is disposed;
- FIGURE 4 is a perspective view of a SIM card socket according to an embodiment of the present invention.
- FIGURE 5 is a front view of the SLM card socket shown in FIG. 4;
- FIGURE 6 is a sectional view taken along line A-A in FIG. 5;
- FIGURE 7 is an exploded perspective view of a mobile communication device employing the SIM card socket shown in FIG. 4;
- FIGURE 8 is a partial sectional view of a mobile communication device, in which the SIM card socket shown in FIG. 4 is assembled;
- FIGURE 9 is a perspective view of a pin contact frame employed in the SLM card socket shown in FIG. 4;
- FIGURE 10 is an exploded perspective view of the pin contact frame shown in FIG. 9 and a socket housing shown in FIG. 4, for showing an assembly between them;
- FIGURE 11 is a perspective view of the SIM card socket of FIG. 4 in states just before and when it is completely manufactured;
- FIGURE 12 is a perspective view of a SIM card socket according to another embodiment of the present invention.
- FIGURE 13 is a front view of the SIM card socket shown in FIG. 12;
- FIGURE 14 is a rear view of the SIM card socket shown in FIG. 12;
- FIGURE 15 is a front perspective view of a SIM card socket of FIG. 12 assembled with a rear case of a mobile communication device;
- FIGURE 16 is an exploded perspective view of a mobile communication device employing the SLM card socket shown in FIG. 12;
- FIGURE 17 is a rear perspective view of a SIM card socket of FIG. 12 assembled with a rear case of a mobile communication device;
- FIGURE 18 is a partial rear view of a rear case of a mobile communication device, with which the SLM card socket shown in FIG. 12 is assembled;
- FIGURE 19 is a sectional view taken along line A-A in FIG. 18;
- FIGURE 20 is a sectional view taken along line B-B in FIG. 18;
- FIGURE 21 is a sectional view taken along line C-C in FIG. 18;
- FIGURE 22 is an exploded perspective view of a pin contact frame and a socket housing employed in the SLM card socket shown in FIG. 12, for showing an assembly between them; and FIGURE 23 is a perspective view of the SLM card socket of FIG. 12 in states just before and when it is completely manufactured.
- FIG 4 is a perspective view of a SIM card socket according to an embodiment of the present invention
- Figure 5 is a front view of the SIM card socket shown in Figure 4
- Figure 6 is a sectional view taken along line A-A in Figure 5
- Figure 7 is an exploded perspective view of a mobile communication device employing the SIM card socket shown in Figure 4
- Figure 8 is a partial sectional view of a mobile communication device, in which the SIM card socket shown in Figure 4 is assembled.
- a SIM card socket 100 includes a socket housing 120 and a plurality of pin contacts 110.
- Each pin contact 110 is generally U-shaped and includes a board-engaging free end 110a and a card- engaging free end 110b extending from a bight portion 110c.
- Socket housing 120 is generally rectangular in shape and includes an upper plate portion 120a and a lower plate portion 120b.
- Board-engaging free end 110a and card-engaging free end 110b of each pin contact 110 extend in the same generally direction away from bight portion 110c and define an acute angle therebetween (see Figure 8).
- SLM card socket 100 has an improved construction, in which board-engaging free ends 110a and card-engaging free ends 110b of pin contacts 110 are electrically connected with contacts 312 of a printed circuit board 310 and contacts 210 of a SLM card 200, are located inside the dimensions defined by the rectangular shape of socket housing 120.
- solder ends 26a of pin contacts 26 are electrically connected with contacts of the printed circuit board by soldering
- board-engaging free ends 110a of pin contact 110 can be electrically connected with contacts 312 of printed circuit board 310 by simply mounting SIM card socket 100 on printed circuit board 310 in the invention shown in Figures 4 to 8.
- board-engaging free end 110a and card-engaging free end 110b of pin contact 110 are located inside the dimensions of socket housing 120, and are electrically connected to contacts 312 of printed circuit board 310 and contacts 210 of SIM card 200 by simply mounting SIM card socket 100 on printed circuit board 310, that is, no secondary attachment steps such as soldering or welding are necessary (although soldering could be performed to further reinforce the connection if and when desired). Therefore, the height and the entire dimension of SIM card socket 100, which is an element of a mobile communication device 300, can be reduced. As a result, the dimension of mobile communication device 300 employing SLM card socket 100 can also be reduced.
- pin contacts 110 are electrically conductive elements for electrically connecting SIM card 200 and printed circuit board 310 of mobile communication device 300 with each other, and each pin contact 110 includes board-engaging free end 110a extending generally downwardly to electrically connect to a corresponding contact 312 of printed circuit board 310 and card- engaging free end 110b extending generally downwardly to electrically connect to a corresponding contact 210 of SIM card 200.
- board-engaging free end 110a and card-engaging free end 110b of pin contact 110 are connected integrally with each other and extend in the same general direction away from bight portion 110c.
- board-engaging free end 110a and card-engaging free end 110b of pin contact 110 which form the free ends of the pin contact 110, extend from bight portion 110c of pin contact 110 with a predetermined acute angle between them. That is, since card-engaging free end 110b of pin contact 110 extends in a direction inclined upward and board-engaging free end 110a of pin contact 110 extends in a direction inclined downward from bight portion 110c of pin contact 110, board-engaging free end 110a and card-engaging free end 110b define a predetermined acute angle therebetween.
- board-engaging free end 110a and card-engaging free end 110b of pin contact 110 extend with the acute angle therebetween, board-engaging free end 110a and card-engaging free end 110b are designed to form a secure connection with contacts 312 of printed circuit board 310 and contacts 210 of SLM card 200 when SLM card socket 100 is mounted on printed circuit board 310 and when SIM card 200 is mounted on SIM card socket 100.
- board-engaging free end 110a and card-engaging free end 110b of pin contact 110 are elastically deformed, board-engaging free end 110a and card- engaging free end 110b come into tight contact with contact 312 ofprinted circuit board 310 and contact 210 of SIM card 200 by means of the restoring force of board-engaging free end 110a and card-engaging free end 110b.
- Pin contacts 110 are arranged in two parallel mirror image rows within SIM card socket 100, and pin contacts 110 arranged along one row are opposed to those arranged along the opposite row. That is, the bight portion of pin contacts 110 are fixedly mounted generally along two opposite outside edges of SIM card socket 100, and board-engaging free ends 110a and card-engaging free ends 110b of pin contacts 110 extend toward each other away from the fixed bight portion of the pin contact. Bight portion 110c of pin contacts 110 are fixed to socket housing 120 and along with the rectangular shape of socket housing form the external appearance of SIM card socket 100.
- Socket housing 120 has a pair of through holes 122 formed in two sides thereof, so that board-engaging free ends 110a and card-engaging free ends 110b of pin contacts 110 are exposed in through holes 122.
- the bight portion pin contacts 110 are fixed between upper plate portion 120a and lower plate portion 120b of socket housing 120 by insert molding the pin contacts between the two plate portions.
- Socket housing 120 is formed by upper plate portion 120a and lower plate portion 120b respectively having a rectangular shape with a central transverse portion therebetween as shown in Figures 4 and 5. Bight portions 110c of pin contacts 110 are fixed between outside edges of upper plate portion 120a and lower plate portion 120b by insert molding, and board-engaging free end 110a and card-engaging free end 110b are exposed in through holes
- partitions 124 are disposed in regular intervals in through holes 122 of socket housing 120. Each partition 124 extends in a longitudinal direction of SIM card socket 100 and separates two adjacent pin contact 110.
- a metal reinforcement 130 is used to reinforce the strength of socket housing 120. Specifically, between upper plate portion
- the metal reinforcement is fixed, such as by insert molding or the like.
- an alignment protuberance 126 may be formed on a lower surface of lower plate portion 120b of socket housing 120, so that when SIM card socket 100 is mounted on printed circuit board 310 of mobile communication device 300, SIM card socket 100 can be placed at a predeteraiined location by inserting the alignment protuberance 126 in a corresponding alignment groove 314 formed in the printed circuit board.
- SIM card socket 100 having the construction shown in Figures 4 to 6 is assembled as shown in Figures 7 and 8.
- a SIM card seating recess 322 for seating the SIM card 200 is foraied in a predetermined portion of a battery seat 320 over which a battery 330 is subsequently assembled.
- printed circuit board 310 is exposed within SIM card seating recess 322.
- SIM card seating recess 322 is mounted in SIM card seating recess 322 while alignment protuberance 126 of socket housing 120 is inserted in alignment groove 314 of printed circuit board 310, SIM card 200 is inserted in SIM card seating recess 322 and mounted on SIM card socket 100, so that SIM card 200 is electrically connected with printed circuit board 310 of mobile communication device 300.
- SIM card 200 is mounted in SIM card seating recess 322 in the way described above, battery 330 is assembled on battery seat 320, so as to fix SIM card socket 100 and SIM card 200 to each other. Then, mobile communication device 300 can be used in making and receiving a phone call.
- SIM card 200 when it is necessary to disassemble and replace SIM card 200, after battery 330 is separated from battery seat 320, SIM card 200 can be detached from SIM card seating recess 322.
- SIM card socket 100 according to the present invention as described above does not require a solder portion, but is mounted by inserting alignment protuberance 126 of SIM card socket 100 into corresponding alignment groove 314 of printed circuit board 310, so that board-engaging free end 110a of pin contact 110 is mechanically and electrically in contact with contact 312 of printed circuit board 310. That is, SIM card socket 100 according to an embodiment of the present invention can be easily assembled and disassembled in and from a mobile communication device.
- SIM card socket 100 does not have a solder construction but has a contacting construction, so as to reduce the thickness or the height of SIM card socket 100 and the mobile communication device.
- board-engaging free end 110a and card-engaging free end 110b of pin contact 110 are not located outside the dimensions of socket housing 120 but are located within the dimensions defined by the rectangular socket housing 120, so as to reduce the overall outside dimension of socket housing 120, thereby reducing the entire dimension of SIM card socket 100.
- Figure 9 is a perspective view of a pin contact frame employed in the SIM card socket shown in Figure 4
- Figure 10 is an exploded perspective view of the pin contact frame shown in Figure 9 and a socket housing shown in Figure 4, for showing an assembly between them
- Figure 11 is a perspective view of the SIM card socket of Figure 4 in states just before and after it is completely fabricated.
- SIM card socket 100 shown in Figures 9 to 11 the same reference numerals as those in Figures 4 to 8 are used, but elements not provided with reference numerals in Figures 9 to 11 may be referred to by the reference numerals in Figures 4 to 8.
- Figures 9 to 11 show a process of manufacturing SIM card socket 100 according to the present embodiment, which includes the steps of: stamping and foraied a pin contact frame 140; molding the socket housing 120; insert-molding the pin contact frame 140 between the upper plate portion 120a and the lower plate portion 120b of the socket housing 120; and cutting portions of the pin contact frame 140 to mechanically and electrically isolate the pin contacts from each other.
- a metal plate portion is stamped and foraied to produce an integral pin contact frame 140 as shown in Figure 9, in which board-engaging free ends 110a and card-engaging free ends 110b of the pin contacts 110 are integrally connected to metal reinforcement 130.
- pin contact frame 140 has the shape as shown in Figures 9 and 10, in which pin contacts 110 are arranged at two sides of pin contact frame 140 and pin contacts 110 on one side pin contact frame 140 are opposed to those on the other end of pin contact frame 140.
- upper plate portion 120a and lower plate portion 120b each have planar transverse and central insert molding portions 150, between which pin contacts 110 and metal reinforcement 130 are placed.
- the pin contact frame is insert-molded between upper plate portion 120a and lower plate portion 120b.
- each of the insert molding portions 150 has through hole windows 122 formed therethrough, so that insert molding portions 150 has the shape as shown in Figure 10.
- Insert molding portion 150 has a longitudinal length smaller than that of pin contact frame 140, so that parts of bight portions 110c of pin contacts 110 may protrude out of the front and rear ends of upper plate portion 120a and lower plate portion 120b.
- pin contact frame 140 is insert-molded between upper plate portion 120a and lower plate portion 120b of socket housing 120.
- the insert molding is carried out after the pin contact frame 140 is positioned between the upper and lower plate portions of the socket housingl20. Specifically, the insert molding is carried out such that portions of the bight portions 110c of pin contacts 110 of pin contact frame 140 partially protrude out from the side edges of socket housing 120.
- portions of bight portions 110c of pin contacts 110 protruding out of the side edges of socket housing 120 are cut, so that pin contacts 110 and metal reinforcement 130 are mechanically and electrically isolated from each other. Then, the process of manufacturing SIM card socket 100 according to the present embodiment is completed.
- Figure 12 is a perspective view of a SLM card socket according to another embodiment of the present invention
- Figure 13 is a front view of the SIM card socket shown in Figure 12
- Figure 14 is a rear view of the SIM card socket shown in Figure 12
- Figure 15 is a front perspective view of a SLM card socket of Figure 12 assembled with a rear case of a mobile communication device
- Figure 16 is an exploded perspective view of a mobile communication device employing the SIM card socket shown in Figure 12
- Figure 17 is a rear perspective view of a SIM card socket of Figure 12 assembled with a rear case of a mobile communication device
- Figure 18 is a partial rear view of a rear case of a mobile communication device, with which the SLM card socket shown in Figure 12 is assembled
- Figure 19 is a sectional view taken along line A-A in Figure 18
- Figure 20 is a sectional view taken along line B-B in Figure 18
- Figure 21 is a sectional view taken along line C-C in Figure 18.
- SIM card socket 400 shown in Figures 12 to 16 has the same construction as that of SIM card socket 100 shown in Figures 4 to 11, in which SIM card socket 400 includes a socket housing 410 having a rectangular shape.
- Socket housing 410 includes an upper plate portion 410a and a lower plate portion 410b and a plurality of pin contacts 420, each having a bight portion 420c, a board-engaging free end 420a and a card-engaging free end 420b.
- SLM card socket 400 includes an additional construction for enabling SIM card socket 400 to be mounted on an inner surface of a rear case 602 of .a mobile communication device 600.
- SIM card socket 400 As in SIM card socket 100 shown in Figures 4 to 11, in SIM card socket 400, board- engaging free end 420a and card-engaging free end 420b of pin contact 420 positioned within the dimensions of socket housing 410.
- SIM card socket 400 is assembled on a socket seat 622 formed at a peripheral surface of a socket receiving hole 620 formed through rear case 602 of mobile communication device 600, so that board-engaging free end 420a of pin contact 420 comes into contact and is electrically connected with the contact of the printed circuit board as soon as rear case 602 is assembled with a front case 604.
- SIM card socket 400 board-engaging free end 420a and card- . engaging free end 420b of pin contact 420 are located within the dimensions of socket housing 410, and SIM card socket 400 is assembled on socket seat 622 of mobile communication device 600, so that board-engaging free ends 420a of pin contacts 420 can be electrically connected to corresponding contacts of the printed circuit board when rear case 602 is assembled to front case 604.
- the height and the dimension of SIM card socket 400 which is an element of mobile communication device 600, can be reduced, so that the entire dimension of mobile communication device 600 employing SIM card socket 400 can also be reduced.
- socket housing 410 along with the exposed portions of pin contacts 420 form the external appearance of SIM card socket 400.
- Socket housing 410 includes upper plate portion 410a on one side and lower plate portion 410b on the other side. Upper plate portion 410a may be longer and narrower than lower plate portion 410b, as shown in Figure 12.
- two through holes 412 are formed through predete ⁇ ned portions of each of upper plate portion 410a and lower plate portion 410b, and through holes 412 formed through upper plate portion 410a are aligned with through holes 412 formed through lower plate portion 410b.
- Upper plate portion 410a and lower plate portion 410b are placed over each other and molded together while through holes 412 formed through upper plate portion 410a are aligned with through holes 412 formed through lower plate portion 410b, to complete socket housing 410.
- upper plate portion 410a is placed atop of lower plate portion 410b and through holes 412 of upper plate portion 410a are aligned with through holes 412 formed through lower plate portion 410b, longer side portions of lower plate portion 410b partially protrude out from longer side portions of upper plate portion 410a.
- a pair of alignment grooves 414b are formed on the longer side portions of lower plate portion 410b of socket housing 410.
- engagement protuberances 414a may be formed on the longer side portions of upper plate portion 410a, and engagement protuberances 414a are located on both sides of aligmnent grooves 414b of lower plate portion 410b.
- Front upper comers of engagement protuberances 414a may be chamfered to form first chamfered surfaces 416a which facilitate the engagement between engagement protuberances 414a with engagement thresholds 626 formed on socket seat 622.
- SLM card socket 400 having the construction shown in Figures 12 to 21 according to the present embodiment is assembled as shown in Figures 15 to 21.
- socket receiving hole 620 is formed through a portion of rear case 602 of mobile communication device 600, which has a battery seat 630 for seating a battery 632, and socket seat 622 on which SIM card socket 400 is mounted is foraied at a boundary surface forming socket receiving hole 620.
- Socket receiving hole 620 and socket seat 622 are formed to correspond to the dimension and shape of SIM card socket 400.
- Alignment protuberances 624 which are adapted to engage with corresponding alignment grooves 414b of lower plate portion 410b of socket housing 410, are formed at along the longer sides of socket seat 622, and engagement thresholds 626, which are adapted to engage with corresponding engagement protuberances 414a of upper plate portion 410a of socket housing 410, are formed at corresponding locations on the longer sides of socket seat 622.
- rear corners of engagement thresholds 626 are chamfered to forai second chamfered surfaces 626a.
- SIM card socket 400 When SIM card socket 400 is mounted on socket seat 622, alignment grooves 414b formed at lower plate portion 410b of socket housing 410 are located on alignment protuberances 624 of socket seat 622. SLM card socket 400 is then pressed in toward the socket, so that engagement protuberances 414a formed on upper plate portion 410a engage with engagement thresholds 626 of socket seat 622. At this point SIM card socket 400 is completely mounted on socket seat 622, and upper surface of SIM card socket 400 is exposed to a space above battery seat 630 formed on rear case 602 of mobile communication device 600.
- rear case 602 is assembled with front case 604 of mobile communication device 600, so that board-engaging free end 420a of pin contacts 420 come into contact and electrically connect to co ⁇ esponding contacts of the printed circuit board.
- the SIM card is mounted in a SIM card seating hole 640 formed at battery seat 630, and subsequently battery 632 is mounted on battery seat 630, so that card- engaging free end 420b of pin contacts 420 come into contact and are electrically connected with corresponding contacts of the SLM card.
- Figure 22 is an exploded perspective view of a pin contact frame and a socket housing employed in the SLM card socket shown in Figure 12, for showing an assembly between them
- Figure 23 is a perspective view of the SIM card socket of Figure 12 in states before and after being fabricated.
- Figures 22 and 23 show a process of manufacturing the SLM card socket 400 according to the present embodiment, which is the same as the process of manufacturing SIM card socket 100 shown in Figures 4 to 11, except for the alignment grooves 414b formed at lower plate portion 410b and the engagement protuberances 414a formed at upper plate portion 410a of socket housing 410.
- reference numerals 440 and 450 not described above respectively designate a pin contact frame and an insert molding portion.
- the board-engaging free ends and the card-engaging free ends of the pin contacts of the SIM card socket which electrically connect with corresponding contacts of the SIM card and the printed circuit board in a mobile communication device, are disposed within the dimensions defined by the rectangular shape and extend inward of the SIM card socket, so as to reduce the dimensions of elements of the mobile coimriunication device.
- the board-engaging free ends and the card-engaging free ends of the pin contacts of the SLM card socket do not necessitate a solder construction but can effect an electrical and mechanical contact by simply putting the free ends of the pin contacts in contact with corresponding contacts of a printed circuit board and SIM card respectively. Accordingly, this design reduces the thickness or the height of the SIM card socket.
- a SIM card socket and its manufacturing method according to the present invention enables the entire dimension of the mobile communication device to be reduced, since the dimensions of elements of the mobile communication device can be reduced in the way as described above.
- the SIM card socket can be easily mounted, since the board-engaging free ends and the card-engaging free ends of the pin contacts of the SIM card socket do not have a solder construction but have a contacting construction.
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02723432A EP1368903A2 (en) | 2001-03-12 | 2002-03-12 | Sim card socket and manufacturing method therefor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2001/12542 | 2001-03-12 | ||
KR10-2001-0012542A KR100383744B1 (en) | 2001-03-12 | 2001-03-12 | Subscriber identity module card socket and thereof manufacturing method |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2002073819A2 true WO2002073819A2 (en) | 2002-09-19 |
WO2002073819A3 WO2002073819A3 (en) | 2002-12-19 |
WO2002073819B1 WO2002073819B1 (en) | 2003-03-06 |
Family
ID=19706757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/007717 WO2002073819A2 (en) | 2001-03-12 | 2002-03-12 | Sim card socket and manufacturing method therefor |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1368903A2 (en) |
KR (1) | KR100383744B1 (en) |
WO (1) | WO2002073819A2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8695881B2 (en) | 2004-06-30 | 2014-04-15 | Nxp B.V. | Chip card for insertion into a holder |
CN104505623A (en) * | 2014-07-01 | 2015-04-08 | 富士康(昆山)电脑接插件有限公司 | Card connector |
US11637391B2 (en) | 2020-03-13 | 2023-04-25 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Card edge connector with strength member, and circuit board assembly |
US11710923B2 (en) | 2020-07-31 | 2023-07-25 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Compact, reliable card edge connector |
US11817639B2 (en) | 2020-08-31 | 2023-11-14 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Miniaturized electrical connector for compact electronic system |
US11973286B2 (en) | 2020-06-01 | 2024-04-30 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Electrical connector and manufacturing method thereof |
US12051867B2 (en) | 2020-12-04 | 2024-07-30 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Card edge connector with a locking system |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100698542B1 (en) * | 2005-12-16 | 2007-03-21 | 한국몰렉스 주식회사 | Terminal's manufacturing method of dual card type connector of mobile phone |
KR101418284B1 (en) * | 2007-07-25 | 2014-07-10 | 엘지전자 주식회사 | Terminal unit for sim-card socket and mobile terminal having the same |
KR100849034B1 (en) | 2008-06-09 | 2008-07-29 | 주식회사 시무텍 | Apparatus inserting contact of socket of ic card reader |
US9366348B2 (en) | 2008-09-30 | 2016-06-14 | Trw Automotive Us Llc | Pressure relief valve |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10187896A (en) * | 1996-12-24 | 1998-07-21 | Smk Corp | Connector for ic card |
DE29815072U1 (en) * | 1998-08-21 | 1998-11-05 | Karl Lumberg GmbH & Co, 58579 Schalksmühle | Card reader for a mobile device |
EP0883855A1 (en) * | 1996-02-29 | 1998-12-16 | The Whitaker Corporation | Apparatus for the electrical connection of a chip card to a printed circuit board |
FR2783947A1 (en) * | 1998-09-29 | 2000-03-31 | Framatome Connectors Int | Connector for microcircuit in mini-card format for use in mobile telephones |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US5257414A (en) * | 1990-11-26 | 1993-10-26 | Motorola, Inc. | Apparatus for accepting and retaining a memory card |
US5883786A (en) * | 1996-12-31 | 1999-03-16 | Ericsson, Inc. | SIM card containment assembly for an electronic apparatus |
KR200171949Y1 (en) * | 1997-01-07 | 2000-03-02 | 정진택 | A socket for sim - card |
EP0965937B1 (en) * | 1998-06-15 | 2006-08-09 | Molex Incorporated | IC card connector |
KR100360901B1 (en) * | 1999-12-18 | 2002-11-18 | 엘지전자 주식회사 | Mobile station having cassette type memory |
-
2001
- 2001-03-12 KR KR10-2001-0012542A patent/KR100383744B1/en not_active IP Right Cessation
-
2002
- 2002-03-12 WO PCT/US2002/007717 patent/WO2002073819A2/en active Search and Examination
- 2002-03-12 EP EP02723432A patent/EP1368903A2/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0883855A1 (en) * | 1996-02-29 | 1998-12-16 | The Whitaker Corporation | Apparatus for the electrical connection of a chip card to a printed circuit board |
JPH10187896A (en) * | 1996-12-24 | 1998-07-21 | Smk Corp | Connector for ic card |
DE29815072U1 (en) * | 1998-08-21 | 1998-11-05 | Karl Lumberg GmbH & Co, 58579 Schalksmühle | Card reader for a mobile device |
FR2783947A1 (en) * | 1998-09-29 | 2000-03-31 | Framatome Connectors Int | Connector for microcircuit in mini-card format for use in mobile telephones |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 12, 31 October 1998 (1998-10-31) & JP 10 187896 A (SMK CORP), 21 July 1998 (1998-07-21) * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8695881B2 (en) | 2004-06-30 | 2014-04-15 | Nxp B.V. | Chip card for insertion into a holder |
CN104505623A (en) * | 2014-07-01 | 2015-04-08 | 富士康(昆山)电脑接插件有限公司 | Card connector |
US9490557B2 (en) | 2014-07-01 | 2016-11-08 | Foxconn Interconnect Technology Limited | Electronic card connector having improved terminals |
US11637391B2 (en) | 2020-03-13 | 2023-04-25 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Card edge connector with strength member, and circuit board assembly |
US11973286B2 (en) | 2020-06-01 | 2024-04-30 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Electrical connector and manufacturing method thereof |
US11710923B2 (en) | 2020-07-31 | 2023-07-25 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Compact, reliable card edge connector |
US11817639B2 (en) | 2020-08-31 | 2023-11-14 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Miniaturized electrical connector for compact electronic system |
US12051867B2 (en) | 2020-12-04 | 2024-07-30 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Card edge connector with a locking system |
Also Published As
Publication number | Publication date |
---|---|
EP1368903A2 (en) | 2003-12-10 |
KR100383744B1 (en) | 2003-05-14 |
WO2002073819B1 (en) | 2003-03-06 |
KR20020084846A (en) | 2002-11-13 |
WO2002073819A3 (en) | 2002-12-19 |
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