WO2002069679A3 - Stacked panel processing apparatus and methods - Google Patents
Stacked panel processing apparatus and methods Download PDFInfo
- Publication number
- WO2002069679A3 WO2002069679A3 PCT/US2002/005387 US0205387W WO02069679A3 WO 2002069679 A3 WO2002069679 A3 WO 2002069679A3 US 0205387 W US0205387 W US 0205387W WO 02069679 A3 WO02069679 A3 WO 02069679A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hole
- panels
- fluid
- chemical
- desmear
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002244123A AU2002244123A1 (en) | 2001-02-23 | 2002-02-25 | Stacked panel processing apparatus and methods |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27101901P | 2001-02-23 | 2001-02-23 | |
US60/271,019 | 2001-02-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002069679A2 WO2002069679A2 (en) | 2002-09-06 |
WO2002069679A3 true WO2002069679A3 (en) | 2003-03-06 |
Family
ID=23033843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/005387 WO2002069679A2 (en) | 2001-02-23 | 2002-02-25 | Stacked panel processing apparatus and methods |
Country Status (3)
Country | Link |
---|---|
US (1) | US20030000830A1 (en) |
AU (1) | AU2002244123A1 (en) |
WO (1) | WO2002069679A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008019495A (en) * | 2006-07-14 | 2008-01-31 | Ebara Corp | Method for cleaning porous body, and cleaning device therefor |
CL2008000156A1 (en) | 2008-01-18 | 2008-08-01 | Igloo Zone Chile S A | STABLE HYDROPHYLE GEL BASED ON A POLYMER FOR TOPICAL APPLICATION BECAUSE IT INCLUDES DISSOLVED CHITOSANE IN A SOLVENT; PROCESS TO OBTAIN THE GEL FOR TOPICAL USE BEFORE MENTIONED; USE OF THE GEL. |
DE102008017690B4 (en) * | 2008-04-08 | 2012-03-29 | Rolf Wissner | Method for working out objects from plate-shaped starting material |
JP5419609B2 (en) * | 2009-09-17 | 2014-02-19 | アジア化工機株式会社 | Cleaning device and cleaning method |
EP2645830B1 (en) * | 2012-03-29 | 2014-10-08 | Atotech Deutschland GmbH | Method for manufacture of fine line circuitry |
TWM491679U (en) * | 2014-07-29 | 2014-12-11 | Min Aik Prec Ind Co Ltd | Electroplating equipment capable gold-plating on a through hole of a workpiece |
IT201700083957A1 (en) * | 2017-07-24 | 2019-01-24 | Wise S R L | METHOD AND APPARATUS FOR PANEL TREATMENT |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3929592A (en) * | 1974-07-22 | 1975-12-30 | Gen Motors Corp | Plating apparatus and method for rotary engine housings |
USRE29874E (en) * | 1968-06-20 | 1979-01-02 | Electroplating of the cut edges of sheet metal panels | |
US4327126A (en) * | 1980-11-10 | 1982-04-27 | Ralph Ogden | Method of making printed circuit boards |
US4929370A (en) * | 1986-10-14 | 1990-05-29 | Lubra Sheet Corporation | Dry lubricant drilling of thru-holes in printed circuit boards |
US5487824A (en) * | 1993-08-31 | 1996-01-30 | Uemura Kogyo Kabushiki Kaisha | Electroplating apparatus and electroplating method of small articles |
US6036837A (en) * | 1998-11-02 | 2000-03-14 | Celex, Incorporated | Process and machine for partially plating test probes |
US6258220B1 (en) * | 1998-11-30 | 2001-07-10 | Applied Materials, Inc. | Electro-chemical deposition system |
-
2002
- 2002-02-25 US US10/082,581 patent/US20030000830A1/en not_active Abandoned
- 2002-02-25 WO PCT/US2002/005387 patent/WO2002069679A2/en not_active Application Discontinuation
- 2002-02-25 AU AU2002244123A patent/AU2002244123A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE29874E (en) * | 1968-06-20 | 1979-01-02 | Electroplating of the cut edges of sheet metal panels | |
US3929592A (en) * | 1974-07-22 | 1975-12-30 | Gen Motors Corp | Plating apparatus and method for rotary engine housings |
US4327126A (en) * | 1980-11-10 | 1982-04-27 | Ralph Ogden | Method of making printed circuit boards |
US4929370A (en) * | 1986-10-14 | 1990-05-29 | Lubra Sheet Corporation | Dry lubricant drilling of thru-holes in printed circuit boards |
US5487824A (en) * | 1993-08-31 | 1996-01-30 | Uemura Kogyo Kabushiki Kaisha | Electroplating apparatus and electroplating method of small articles |
US6036837A (en) * | 1998-11-02 | 2000-03-14 | Celex, Incorporated | Process and machine for partially plating test probes |
US6258220B1 (en) * | 1998-11-30 | 2001-07-10 | Applied Materials, Inc. | Electro-chemical deposition system |
Also Published As
Publication number | Publication date |
---|---|
AU2002244123A1 (en) | 2002-09-12 |
WO2002069679A2 (en) | 2002-09-06 |
US20030000830A1 (en) | 2003-01-02 |
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