WO2002069679A3 - Stacked panel processing apparatus and methods - Google Patents

Stacked panel processing apparatus and methods Download PDF

Info

Publication number
WO2002069679A3
WO2002069679A3 PCT/US2002/005387 US0205387W WO02069679A3 WO 2002069679 A3 WO2002069679 A3 WO 2002069679A3 US 0205387 W US0205387 W US 0205387W WO 02069679 A3 WO02069679 A3 WO 02069679A3
Authority
WO
WIPO (PCT)
Prior art keywords
hole
panels
fluid
chemical
desmear
Prior art date
Application number
PCT/US2002/005387
Other languages
French (fr)
Other versions
WO2002069679A2 (en
Inventor
Robert J Spain
Steven P Glassman
Original Assignee
Techquip International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Techquip International Inc filed Critical Techquip International Inc
Priority to AU2002244123A priority Critical patent/AU2002244123A1/en
Publication of WO2002069679A2 publication Critical patent/WO2002069679A2/en
Publication of WO2002069679A3 publication Critical patent/WO2002069679A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method and apparatus (5) for processing a panel stack having one or more panels are provided. The panel stack (10) is provided with at least one through-hole (15). Fluid or gas may be passed through the through-hole (15) via a fluid communication path (18) between the through-holes. By inhibiting the contact of the fluid or gas from the flat surfaces of the panels, processing of the through-holes can be accomplished with reduced resources more quickly. Panel stacks can include one to at least hundreds of panels. Various applications include electroless copper deposition, electroplating of copper for a printed circuit board, chemical etchback or desmear, honing of the through-hole wall using a slurry of pumice as a replacement for chemical etchback or desmear, chemical microetching of a through-hole wall and through-hole blasting with pressurized water or air to clean away any debris.
PCT/US2002/005387 2001-02-23 2002-02-25 Stacked panel processing apparatus and methods WO2002069679A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002244123A AU2002244123A1 (en) 2001-02-23 2002-02-25 Stacked panel processing apparatus and methods

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27101901P 2001-02-23 2001-02-23
US60/271,019 2001-02-23

Publications (2)

Publication Number Publication Date
WO2002069679A2 WO2002069679A2 (en) 2002-09-06
WO2002069679A3 true WO2002069679A3 (en) 2003-03-06

Family

ID=23033843

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/005387 WO2002069679A2 (en) 2001-02-23 2002-02-25 Stacked panel processing apparatus and methods

Country Status (3)

Country Link
US (1) US20030000830A1 (en)
AU (1) AU2002244123A1 (en)
WO (1) WO2002069679A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019495A (en) * 2006-07-14 2008-01-31 Ebara Corp Method for cleaning porous body, and cleaning device therefor
CL2008000156A1 (en) 2008-01-18 2008-08-01 Igloo Zone Chile S A STABLE HYDROPHYLE GEL BASED ON A POLYMER FOR TOPICAL APPLICATION BECAUSE IT INCLUDES DISSOLVED CHITOSANE IN A SOLVENT; PROCESS TO OBTAIN THE GEL FOR TOPICAL USE BEFORE MENTIONED; USE OF THE GEL.
DE102008017690B4 (en) * 2008-04-08 2012-03-29 Rolf Wissner Method for working out objects from plate-shaped starting material
JP5419609B2 (en) * 2009-09-17 2014-02-19 アジア化工機株式会社 Cleaning device and cleaning method
EP2645830B1 (en) * 2012-03-29 2014-10-08 Atotech Deutschland GmbH Method for manufacture of fine line circuitry
TWM491679U (en) * 2014-07-29 2014-12-11 Min Aik Prec Ind Co Ltd Electroplating equipment capable gold-plating on a through hole of a workpiece
IT201700083957A1 (en) * 2017-07-24 2019-01-24 Wise S R L METHOD AND APPARATUS FOR PANEL TREATMENT

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3929592A (en) * 1974-07-22 1975-12-30 Gen Motors Corp Plating apparatus and method for rotary engine housings
USRE29874E (en) * 1968-06-20 1979-01-02 Electroplating of the cut edges of sheet metal panels
US4327126A (en) * 1980-11-10 1982-04-27 Ralph Ogden Method of making printed circuit boards
US4929370A (en) * 1986-10-14 1990-05-29 Lubra Sheet Corporation Dry lubricant drilling of thru-holes in printed circuit boards
US5487824A (en) * 1993-08-31 1996-01-30 Uemura Kogyo Kabushiki Kaisha Electroplating apparatus and electroplating method of small articles
US6036837A (en) * 1998-11-02 2000-03-14 Celex, Incorporated Process and machine for partially plating test probes
US6258220B1 (en) * 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29874E (en) * 1968-06-20 1979-01-02 Electroplating of the cut edges of sheet metal panels
US3929592A (en) * 1974-07-22 1975-12-30 Gen Motors Corp Plating apparatus and method for rotary engine housings
US4327126A (en) * 1980-11-10 1982-04-27 Ralph Ogden Method of making printed circuit boards
US4929370A (en) * 1986-10-14 1990-05-29 Lubra Sheet Corporation Dry lubricant drilling of thru-holes in printed circuit boards
US5487824A (en) * 1993-08-31 1996-01-30 Uemura Kogyo Kabushiki Kaisha Electroplating apparatus and electroplating method of small articles
US6036837A (en) * 1998-11-02 2000-03-14 Celex, Incorporated Process and machine for partially plating test probes
US6258220B1 (en) * 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system

Also Published As

Publication number Publication date
AU2002244123A1 (en) 2002-09-12
WO2002069679A2 (en) 2002-09-06
US20030000830A1 (en) 2003-01-02

Similar Documents

Publication Publication Date Title
EP0926265B1 (en) Method and compositions for producing copper surfaces for improved bonding and articles made therefrom
EP0759482B1 (en) Electroplating process
US5483984A (en) Fluid treatment apparatus and method
MY118585A (en) Copper coating of printed circuit boards
EP1026286A3 (en) Method and apparatus for plating substrate with copper
EP1043408A3 (en) Processes and apparatus for recovery and removal of copper from fluids
AU1966883A (en) Cleaning process for printed circuit boards
WO2002069679A3 (en) Stacked panel processing apparatus and methods
CN103079350A (en) Method for processing patterns in blind slot of printed circuit board
CN102946695A (en) Through hole structure, printed circuit board, and manufacture method of through hole structure
CN104661450B (en) A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN
WO2004054333A3 (en) Cross connect via for multilayer printed circuit boards
CN101754593A (en) Pretreatment technology of flex-rigid multiple-layer printed board hole metallization
CN101896039A (en) Post treatment neutralizer for removing smears from alkaline permanganate in printed circuit board manufacture
JP5676970B2 (en) Production of polymer-containing substrates for metallization.
KR100833104B1 (en) Compositions containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material
EP0610694A1 (en) Methyl chloroform-free desmear process in additive circuitization
EP1083245A2 (en) Fluid delivery systems for electronic device manufacture
WO2003033770A3 (en) System and method for electrolytic plating
DE50110454D1 (en) MANUFACTURING LINE FOR ONE-SIDED AND DOUBLE-SIDED FITTING OF PCB
US6454954B1 (en) Desmear etchant and use thereof
Kreisel New Process Technology for High Tolerance Circuit Boards
CN114765926B (en) PCB cleaning equipment
Pandey et al. Environmental management in semiconductor and printed circuit board industry in India. Part I: Survey results and case studies
CA2317233A1 (en) Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP