WO2002032636A2 - Method for making micromolds - Google Patents
Method for making micromolds Download PDFInfo
- Publication number
- WO2002032636A2 WO2002032636A2 PCT/IB2001/001900 IB0101900W WO0232636A2 WO 2002032636 A2 WO2002032636 A2 WO 2002032636A2 IB 0101900 W IB0101900 W IB 0101900W WO 0232636 A2 WO0232636 A2 WO 0232636A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- micromold
- mems
- micromolds
- set forth
- components
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 229920001169 thermoplastic Polymers 0.000 claims description 27
- 239000004416 thermosoftening plastic Substances 0.000 claims description 27
- 150000001875 compounds Chemical class 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000005245 sintering Methods 0.000 claims description 15
- 238000013461 design Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 239000011236 particulate material Substances 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000012815 thermoplastic material Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000004615 ingredient Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 239000001993 wax Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 239000002210 silicon-based material Substances 0.000 claims 1
- 239000011230 binding agent Substances 0.000 abstract description 22
- 238000000605 extraction Methods 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- 239000000843 powder Substances 0.000 description 17
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 12
- 238000003754 machining Methods 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 10
- 238000000465 moulding Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000001812 pycnometry Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000005459 micromachining Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 238000010420 art technique Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000001053 micromoulding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011858 nanopowder Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000010525 oxidative degradation reaction Methods 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000007514 turning Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000012356 Product development Methods 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000003421 catalytic decomposition reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000004836 empirical method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001033 granulometry Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229940087654 iron carbonyl Drugs 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/007—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/34—Moulds, cores, or mandrels of special material, e.g. destructible materials
- B28B7/346—Manufacture of moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to the fabrication of micromolds and micromold components. More specifically, the present invention relates to the miniaturization of parts beyond the capability limits of current manufacturing technologies.
- Each type of machining process has its particular range of IT grades it can achieve. For instance lapping and honing usually cover the IT4 through IT5 grades whilst milling, drilling and punching operations generally cannot do better than an IT 10 grade. Developments in modern machine tools have been mainly driven by efforts to increase productivity and reduce reliance on the human operator. In addition to being very costly capital items, these machines are often designed and programmed for specific tasks - like robotic welders in car assembly operations - and are difficult to reprogram for different tasks than those for which they were conceived. They also usually are not suitable for mass-production of parts with design features at or below the millimeter. For instance, even using today's most advanced micromachining technologies, the drilling of precise holes of say 0.050mm in diameter or less to a depth of several mm, would be an extremely difficult if not altogether impossible challenge.
- micromolds uses a laser to machine patterned relief microstructures onto a polymer substrate.
- the machined polymer substrate is then electroplated and the metal inverse used as a micromold.
- the limitations in design are those of laser machining, i.e. limited definition, poor surface finish at the micrometer level, shallow depth of penetration, high capital investment, high operating cost, etc.
- Another way in which the prior art has attempted to make micromolds is by first making oversized versions of these items by powder injection molding technology. After extraction of the organic binder, the green parts are sintered to their final density while undergoing volume shrinkage.
- each cycle consists of making a first green part in a first mold cavity. After sintering, during which the green part shrinks about 20% linearly, the product is used as a mold core in a second mold cavity and a second green part is produced and sintered in turn, upon which, it too, shrinks about 20% linearly to become a miniature of the first mold cavity.
- the cycle can, in principle, be repeated to produce smaller and smaller molds, each new mold being reduced in size with reference to the previous mold by an amount corresponding to the total shrinkage resulting from the inevitable double sintering step during each cycle.
- MEMS Micro-Electro-Mechanical Systems
- the most basic method used to fabricate MEMS micromolds is to successively deposit and etch thin films of sacrificial polycrystallme silicon dioxide or and structural polycrystalline silicon layers, each about 2-4 ⁇ m thick. With each deposition/etch cycle protrusions are created.
- Other processes use silicon carbide as the structural material.
- the use of thin films, about 2-4 ⁇ m thick, has been cited as the major limitation to the development of MEMS micromolds. Also the deposition/etch cycles restrict design complexity.
- Another object of this invention is to provide a method to fabricate extremely small parts, micromolds and micromolded parts without the prior art's trial and error methods and iterations to arrive at the correct final dimensions.
- An additional object of this invention is to provide a method to fabricate extremely small parts, micromolds and micromolded parts without the material and energy wastage inherent to the prior art.
- Still another object of this invention is to provide a method to fabricate extremely small parts, micromolds and micromolded parts without the material limitations faced by the prior art.
- thermoplastic mixture also called green mixture or green compound
- a discrete phase made up of fine particulate matter
- organic continuous phase generally termed the organic binder or simply the binder.
- the discrete phase of the thermoplastic compound is made up of at least one finely divided particulate material, such as a ceramic or a metallic powder, however it is often made up of powders of different ceramic or metallic materials, either in elemental or prealloyed form, or even mixtures of these.
- the main directive in selecting the type of ingredients for the discrete phase will be the desired composition of the end product. For instance if the AISI 316L stainless steel composition is intended it will generally be advantageous to use a commercially available prealloyed atomized fine-grained stainless steel powder in which each of the powder particles is already of the AISI 316L composition.
- Such a fine prealloyed powder is the MIM grade 316L stainless steel powder from the Swedish firm Anval Nyby Powder AB which has a granulometry of 80% smaller than 22 micrometers.
- various elemental and prealloyed powders may be blended in the proper proportions so that, upon sintering, the desired end composition will be achieved.
- the low CTE (coefficient of thermal expansion) alloy INVAR 36 it may be advantageous to mix 64% by weight of iron carbonyl powder Grade E of the International Specialty Products (ISP) company, which has an average particle size of about 4-6 micrometers, with 36% of nickel carbonyl powder type 123 of the Inco Limited company, which has an average particle size of about 7-8 micrometers.
- ISP International Specialty Products
- a typical formula for the organic binder mixture would be approximately one-third by weight of polyethylene, one-third by weight of paraffin wax, one-third by weight of beeswax with perhaps 0.1 through 0.2 percent of stearic acid and 0.05% of an antioxidant added.
- thermoplastic or green compound is formulated in such way that it is a solid at or below the normal room temperatures prevailing in temperate climates, i.e. usually below 25 degrees Celsius. At such temperatures the green compound can be machined by well-known conventional machining techniques such as milling, drilling, turning, reaming, punching, blanking, sawing, cutting, filing and the like.
- the thermoplastic compound in accordance with the present invention is totally recyclable.
- thermoplastic mixture For cold-forming machining operations such as milling, turning or blanking the thermoplastic mixture can be conveniently shaped into bar stock, billet or plate form at the time of formulation. If required, the feedstock's machinability can be increased by cooling it first.
- the organic binder is formulated so as to be extractable from the thermoplastic or green compound using well-known techniques such as aqueous or organic solvent extraction, oxidative degradation, catalytic decomposition, vacuum distillation, wicking and the like, leaving behind a framework that is substantially devoid of organic material.
- This binder-free structure can now be sintered to its final dense end configuration in accordance with prior art techniques. During sintering the open porosity, inevitably generated as a result of binder elimination, is gradually eliminated.
- volumetric ratio of discrete phase to that of the thermoplastic compound be established with the greatest possible accuracy.
- This ratio also termed the volumetric loading or simply the loading of the thermoplastic compound, often designated by ⁇ , can be expressed as:
- Nd N d / N g (1)
- N g is the total green volume
- the conventional way to determine actual shrinkage upon sintering of thermoplastic compounds of the type described above is to make a test specimen of the green mixture, and to measure its dimensions before and after binder extraction and sintering.
- the ratio of the green to the corresponding sintered dimension constitutes the shrinkage factor, often designated by the letter K, thus:
- Equation (2) can be rewritten as:
- N s is the volume of a sintered cube of side L s and
- Ng is the volume of the corresponding green cube of side L g
- the present invention can also be used to correct an oversized MEMS micromold.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Micromachines (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU1079002A AU1079002A (en) | 2000-10-16 | 2001-10-11 | Method for making micromolds |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24063200P | 2000-10-16 | 2000-10-16 | |
US60/240,632 | 2000-10-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002032636A2 true WO2002032636A2 (en) | 2002-04-25 |
WO2002032636A3 WO2002032636A3 (en) | 2002-07-04 |
Family
ID=22907305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2001/001900 WO2002032636A2 (en) | 2000-10-16 | 2001-10-11 | Method for making micromolds |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU1079002A (en) |
WO (1) | WO2002032636A2 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5234655A (en) * | 1980-08-04 | 1993-08-10 | Witec Cayman Patents, Ltd. | Method of forming a mold |
EP0676381A1 (en) * | 1994-04-11 | 1995-10-11 | Georg Dr.-Ing. Kalawrytinos | Process for the production of an implant |
US5735985A (en) * | 1996-11-15 | 1998-04-07 | Eastman Kodak Company | Method for micromolding ceramic structures |
US5824250A (en) * | 1996-06-28 | 1998-10-20 | Alliedsignal Inc. | Gel cast molding with fugitive molds |
DE19858531C1 (en) * | 1998-12-18 | 2000-03-23 | Inst Mikrotechnik Mainz Gmbh | High precision ceramic and/or metallic components, especially microstructured components of complicated shape, are produced by powder or ceramic precursor polymer molding about thermally shape-stable inserts |
US6063314A (en) * | 1996-11-14 | 2000-05-16 | Den-Mat Corporation | Method for accurate replication of shaped articles using sinterable powders |
-
2001
- 2001-10-11 AU AU1079002A patent/AU1079002A/en active Pending
- 2001-10-11 WO PCT/IB2001/001900 patent/WO2002032636A2/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5234655A (en) * | 1980-08-04 | 1993-08-10 | Witec Cayman Patents, Ltd. | Method of forming a mold |
EP0676381A1 (en) * | 1994-04-11 | 1995-10-11 | Georg Dr.-Ing. Kalawrytinos | Process for the production of an implant |
US5824250A (en) * | 1996-06-28 | 1998-10-20 | Alliedsignal Inc. | Gel cast molding with fugitive molds |
US6063314A (en) * | 1996-11-14 | 2000-05-16 | Den-Mat Corporation | Method for accurate replication of shaped articles using sinterable powders |
US5735985A (en) * | 1996-11-15 | 1998-04-07 | Eastman Kodak Company | Method for micromolding ceramic structures |
DE19858531C1 (en) * | 1998-12-18 | 2000-03-23 | Inst Mikrotechnik Mainz Gmbh | High precision ceramic and/or metallic components, especially microstructured components of complicated shape, are produced by powder or ceramic precursor polymer molding about thermally shape-stable inserts |
Also Published As
Publication number | Publication date |
---|---|
WO2002032636A3 (en) | 2002-07-04 |
AU1079002A (en) | 2002-04-29 |
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