WO2002027057A3 - Sputtering target and method of making same - Google Patents

Sputtering target and method of making same Download PDF

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Publication number
WO2002027057A3
WO2002027057A3 PCT/US2001/029897 US0129897W WO0227057A3 WO 2002027057 A3 WO2002027057 A3 WO 2002027057A3 US 0129897 W US0129897 W US 0129897W WO 0227057 A3 WO0227057 A3 WO 0227057A3
Authority
WO
WIPO (PCT)
Prior art keywords
zinc
metal
target
backing
sputterable material
Prior art date
Application number
PCT/US2001/029897
Other languages
French (fr)
Other versions
WO2002027057A2 (en
Inventor
Klaus Hartig
Johan Vanderstraeten
Original Assignee
Cardinal Cg Co
Klaus Hartig
Johan Vanderstraeten
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cardinal Cg Co, Klaus Hartig, Johan Vanderstraeten filed Critical Cardinal Cg Co
Priority to AU9304201A priority Critical patent/AU9304201A/en
Publication of WO2002027057A2 publication Critical patent/WO2002027057A2/en
Publication of WO2002027057A3 publication Critical patent/WO2002027057A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06—Metallic material
    • C23C4/08—Metallic material containing only metal elements

Abstract

A target (30) for use in sputtering may include a backing (22) adapted to be operatively connected to a sputtering power source and an outer layer (10) of a sputterable material carried by the backing. The sputterable material comprises a mixture of zinc and a second metal having a melting point less than that of the zinc. The zinc and the second metal are present in the sputterable material in metallic form and are arranged as discrete volumes of the second metal in a matrix of zinc. This target may be manufactured by simultaneously plasma spraying zinc metal and the second metal onto a backing to create an outer layer of a sputterable material carried by the backing. The target may be used by placing the target and a substrate in a sputtering chamber and applying power to the target while maintaining in the sputtering chamber a reactive atmosphere comprising oxygen, thereby depositing on a surface of the substrate a film comprising oxides of zinc and the second metal.
PCT/US2001/029897 2000-09-25 2001-09-25 Sputtering target and method of making same WO2002027057A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU9304201A AU9304201A (en) 2000-09-25 2001-09-25 Improved sputtering target and methods of making and using same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23510500P 2000-09-25 2000-09-25
US60/235,105 2000-09-25

Publications (2)

Publication Number Publication Date
WO2002027057A2 WO2002027057A2 (en) 2002-04-04
WO2002027057A3 true WO2002027057A3 (en) 2002-06-20

Family

ID=22884120

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/029897 WO2002027057A2 (en) 2000-09-25 2001-09-25 Sputtering target and method of making same

Country Status (2)

Country Link
AU (1) AU9304201A (en)
WO (1) WO2002027057A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7118726B2 (en) 2002-12-13 2006-10-10 Clark Manufacturing, Llc Method for making oxide compounds
US6878242B2 (en) 2003-04-08 2005-04-12 Guardian Industries Corp. Segmented sputtering target and method/apparatus for using same
DE102005020250B4 (en) * 2005-04-28 2007-07-19 W.C. Heraeus Gmbh sputtering Target
US20060289304A1 (en) 2005-06-22 2006-12-28 Guardian Industries Corp. Sputtering target with slow-sputter layer under target material
US7842355B2 (en) 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
DE102006017455A1 (en) * 2006-04-13 2007-10-25 Applied Materials Gmbh & Co. Kg Tubular cathode for coating materials in a coating process comprises openings provided between a target carrier tube and a target for contacting the target with coolant
CN111441021A (en) * 2020-05-25 2020-07-24 先导薄膜材料（广东）有限公司 Preparation method of rotary target and spraying equipment thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3318828A1 (en) * 1983-05-24 1984-11-29 Interpane Entwicklungs- und Beratungsgesellschaft mbH & Co. KG, 3471 Lauenförde Method of bonding target material to cathode bases for use in cathode sputtering coating methods
WO1992020832A1 (en) * 1991-05-21 1992-11-26 The Boc Group, Inc. Zinc alloy rotating sputter target
DE19626732A1 (en) * 1996-07-03 1998-01-08 Leybold Materials Gmbh Sputtering target production and recycling
WO1999058736A2 (en) * 1998-05-08 1999-11-18 Ppg Industries Ohio, Inc. Zinc-tin alloy sputtering target
WO2001042522A2 (en) * 1999-12-03 2001-06-14 N.V. Bekaert S.A. Sputtering target and methods of making same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3318828A1 (en) * 1983-05-24 1984-11-29 Interpane Entwicklungs- und Beratungsgesellschaft mbH & Co. KG, 3471 Lauenförde Method of bonding target material to cathode bases for use in cathode sputtering coating methods
WO1992020832A1 (en) * 1991-05-21 1992-11-26 The Boc Group, Inc. Zinc alloy rotating sputter target
DE19626732A1 (en) * 1996-07-03 1998-01-08 Leybold Materials Gmbh Sputtering target production and recycling
WO1999058736A2 (en) * 1998-05-08 1999-11-18 Ppg Industries Ohio, Inc. Zinc-tin alloy sputtering target
WO2001042522A2 (en) * 1999-12-03 2001-06-14 N.V. Bekaert S.A. Sputtering target and methods of making same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
BERGMAN A ET AL: "THE EFFECT OF GRAVITY AND TEMPERATURE GRADIENTS ON PRECIPITATION INIMMISCIBLE ALLOYS", JOURNAL OF MATERIALS SCIENCE, CHAPMAN AND HALL LTD. LONDON, GB, vol. 23, no. 5, 1988, pages 1573 - 1579, XP000651932, ISSN: 0022-2461 *

Also Published As

Publication number Publication date
AU9304201A (en) 2002-04-08
WO2002027057A2 (en) 2002-04-04

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