WO2002020686A3 - Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same - Google Patents

Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same Download PDF

Info

Publication number
WO2002020686A3
WO2002020686A3 PCT/US2001/028141 US0128141W WO0220686A3 WO 2002020686 A3 WO2002020686 A3 WO 2002020686A3 US 0128141 W US0128141 W US 0128141W WO 0220686 A3 WO0220686 A3 WO 0220686A3
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
same
electroconductive adhesive
connection
connection structure
Prior art date
Application number
PCT/US2001/028141
Other languages
French (fr)
Other versions
WO2002020686A2 (en
Inventor
Koichiro Kawate
Yuji Hirasawa
Original Assignee
3M Innovative Properties Co
Koichiro Kawate
Yuji Hirasawa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co, Koichiro Kawate, Yuji Hirasawa filed Critical 3M Innovative Properties Co
Priority to AU2001288925A priority Critical patent/AU2001288925A1/en
Priority to EP01968695A priority patent/EP1315780A2/en
Priority to KR1020037003369A priority patent/KR100617410B1/en
Publication of WO2002020686A2 publication Critical patent/WO2002020686A2/en
Publication of WO2002020686A3 publication Critical patent/WO2002020686A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulating Bodies (AREA)

Abstract

A thermocurable electroconductive adhesive sheet which is able to make an electric connection having mechanical, thermal and electric stability, and low resistance, produced by a simple and easy process is provided.
PCT/US2001/028141 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same WO2002020686A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2001288925A AU2001288925A1 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
EP01968695A EP1315780A2 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
KR1020037003369A KR100617410B1 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-273119 2000-09-08
JP2000273119A JP2002097424A (en) 2000-09-08 2000-09-08 Thermosetting conductive adhesive sheet, and adhesion structure and adhesion method using the same

Publications (2)

Publication Number Publication Date
WO2002020686A2 WO2002020686A2 (en) 2002-03-14
WO2002020686A3 true WO2002020686A3 (en) 2002-06-06

Family

ID=18759125

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/028141 WO2002020686A2 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same

Country Status (6)

Country Link
EP (1) EP1315780A2 (en)
JP (1) JP2002097424A (en)
KR (1) KR100617410B1 (en)
CN (1) CN100469851C (en)
AU (1) AU2001288925A1 (en)
WO (1) WO2002020686A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624187B1 (en) 2000-06-12 2003-09-23 Health Research, Inc. Long wave length absorbing bacteriochlorin alkyl ether analogs
JP2007005640A (en) 2005-06-24 2007-01-11 Three M Innovative Properties Co Interconnecting method for circuit board
KR101101464B1 (en) * 2007-05-09 2012-01-03 히다치 가세고교 가부시끼가이샤 Conductor connection member, connection structure, and solar cell module
US20100288328A1 (en) * 2007-09-26 2010-11-18 Hitachi Chemical Company, Ltd. Conductor-connecting member, method for producing the same, connection structure, and solar cell module
EP2200093A1 (en) * 2007-09-26 2010-06-23 Hitachi Chemical Company, Ltd. Member for conductor connection, method for manufacturing the same, connection structure, and solar cell module
EP2255406A2 (en) * 2008-03-19 2010-12-01 Philips Intellectual Property & Standards GmbH Connector for establishing an electrical connection with conductive tape
DE102011100457A1 (en) * 2011-05-04 2012-11-08 Osram Opto Semiconductors Gmbh Electronic part, has connection structure comprising foil with front and back surfaces, where front/back surface is formed such that front/back surface contacts chip/carrier element and is spaced from chip/carrier element, respectively
JP5952078B2 (en) * 2011-06-23 2016-07-13 日東電工株式会社 Conductive thermosetting adhesive tape
JP2013116929A (en) * 2011-12-01 2013-06-13 Nitto Denko Corp Conductive adhesive sheet, method for producing the same, collector electrode, and solar cell module
US9238760B2 (en) 2012-03-30 2016-01-19 Adhesives Research, Inc. Charge collection side adhesive tape
JP6920412B2 (en) 2016-07-28 2021-08-18 スリーエム イノベイティブ プロパティズ カンパニー Electric cable
WO2018147426A1 (en) * 2017-02-13 2018-08-16 タツタ電線株式会社 Shield film, shielded printed circuit board, and method for manufacturing shielded printed circuit board
KR20210094195A (en) * 2020-01-20 2021-07-29 삼성디스플레이 주식회사 Adhesive member and display device comprising adhesive member and method for manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1247016A (en) * 1967-08-22 1971-09-22 Minnesota Mining & Mfg Electrically conductive adhesive tape
EP0223464A2 (en) * 1985-11-06 1987-05-27 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0237176A2 (en) * 1986-02-07 1987-09-16 Minnesota Mining And Manufacturing Company Connector with fine-pitched conductive passages
JPS62227986A (en) * 1986-03-31 1987-10-06 Fujikura Rubber Ltd Conductive double-face self-adhesive tape
WO1994024704A1 (en) * 1993-04-12 1994-10-27 Bolger Justin C Area bonding conductive adhesive preforms

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1247016A (en) * 1967-08-22 1971-09-22 Minnesota Mining & Mfg Electrically conductive adhesive tape
EP0223464A2 (en) * 1985-11-06 1987-05-27 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0237176A2 (en) * 1986-02-07 1987-09-16 Minnesota Mining And Manufacturing Company Connector with fine-pitched conductive passages
JPS62227986A (en) * 1986-03-31 1987-10-06 Fujikura Rubber Ltd Conductive double-face self-adhesive tape
WO1994024704A1 (en) * 1993-04-12 1994-10-27 Bolger Justin C Area bonding conductive adhesive preforms

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 096 (C - 484) 29 March 1988 (1988-03-29) *

Also Published As

Publication number Publication date
KR100617410B1 (en) 2006-09-01
AU2001288925A1 (en) 2002-03-22
KR20040030406A (en) 2004-04-09
CN1639290A (en) 2005-07-13
CN100469851C (en) 2009-03-18
EP1315780A2 (en) 2003-06-04
WO2002020686A2 (en) 2002-03-14
JP2002097424A (en) 2002-04-02

Similar Documents

Publication Publication Date Title
WO2002020686A3 (en) Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
WO2006100682A3 (en) Method and system for digital pen assembly
AU4167600A (en) Electrically conductive, freestanding microporous polymer sheet
AU2001295067A1 (en) Jar with electrical conductor
AU2001278880A1 (en) A power generation assembly
AU2001281780A1 (en) Concentrating solar energy system
AU2002333780A1 (en) Wind turbine with current conducting means, which are pre-assembled in the tower thereof
WO2001085917A3 (en) A device
EP1548884A4 (en) Anisotropic conductive sheet, its manufacturing method, and its application
EP1315241A4 (en) Anisotropic conductive sheet
AU2002345758A1 (en) Renewable, carbohydrate based co2-philes
AU2003292473A1 (en) Network and terminal for forming an adhoc network by responsive to an inquiry forwarded by a slave terminal, setting up by the master unit a connection with the terminal to be incorporated into the network
AU2001247438A1 (en) Thermally conductive sheet
AU2001242207A1 (en) Method for fabricating electrical connecting element, and electrical connecting element
AU4961100A (en) Method for using renewable energy sources, variants and powerplant module of up to one megawatt for realising the same
AU2003220945A1 (en) Anisotropic conductive sheet and its manufacturing method
AU2003221190A1 (en) Anisotropic conductive sheet and its manufacturing method
AU2001264171A1 (en) An assembly comprising an electrical element
AU2001280973A1 (en) Electrical connector assembly
AU6922201A (en) Elastic electrical contact with axial pressure, comprising adjustable connection terminal
AU2003283089A1 (en) A process for obtaining a cellulosic wet sheet and a membrane the equipment used to obtain the membrane and the membrane obtained.
AU2002216965A1 (en) Membrane electrode arrangement with an optimised electrode structure
AU2002241692A1 (en) Electrical power generation
AU2001273038A1 (en) Electrical connector with switch-actuating sleeve
AU2002210724A1 (en) Polarisation dependent loss generators

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ CZ DE DE DK DK DM DZ EC EE EE ES FI FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ CZ DE DE DK DK DM DZ EC EE EE ES FI FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1020037003369

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2001968695

Country of ref document: EP

Ref document number: 018154077

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2001968695

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWW Wipo information: withdrawn in national office

Ref document number: 2001968695

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020037003369

Country of ref document: KR

WWG Wipo information: grant in national office

Ref document number: 1020037003369

Country of ref document: KR