WO2002007492A3 - Overhead cooling system with selectively positioned paths of airflow - Google Patents
Overhead cooling system with selectively positioned paths of airflow Download PDFInfo
- Publication number
- WO2002007492A3 WO2002007492A3 PCT/US2001/022419 US0122419W WO0207492A3 WO 2002007492 A3 WO2002007492 A3 WO 2002007492A3 US 0122419 W US0122419 W US 0122419W WO 0207492 A3 WO0207492 A3 WO 0207492A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- airflow
- cooling system
- selectively positioned
- overhead cooling
- paths
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/206—Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001273519A AU2001273519A1 (en) | 2000-07-17 | 2001-07-17 | Overhead cooling system with selectively positioned paths of airflow |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/617,391 | 2000-07-17 | ||
US09/617,391 US6705389B1 (en) | 2000-07-17 | 2000-07-17 | Reconfigurable system and method for cooling heat generating objects |
US09/617,213 | 2000-07-17 | ||
US09/617,213 US6564858B1 (en) | 2000-07-17 | 2000-07-17 | Overhead cooling system with selectively positioned paths of airflow |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002007492A2 WO2002007492A2 (en) | 2002-01-24 |
WO2002007492A3 true WO2002007492A3 (en) | 2002-04-25 |
Family
ID=27087974
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/022398 WO2002006645A2 (en) | 2000-07-17 | 2001-07-17 | Reconfigurable system and method for cooling heat generating objects |
PCT/US2001/022419 WO2002007492A2 (en) | 2000-07-17 | 2001-07-17 | Overhead cooling system with selectively positioned paths of airflow |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/022398 WO2002006645A2 (en) | 2000-07-17 | 2001-07-17 | Reconfigurable system and method for cooling heat generating objects |
Country Status (2)
Country | Link |
---|---|
AU (2) | AU2001276944A1 (en) |
WO (2) | WO2002006645A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2135495A1 (en) * | 2007-03-09 | 2009-12-23 | Ul Tech Ag | Method and device for heat removal at computer workstations |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0458770A1 (en) * | 1990-05-21 | 1991-11-27 | Telefonaktiebolaget L M Ericsson | An arrangement for convection cooling of apparatus rooms |
EP0774628A2 (en) * | 1995-11-20 | 1997-05-21 | Mitsubishi Denki Kabushiki Kaisha | Blowoff orifice |
US5669229A (en) * | 1995-05-30 | 1997-09-23 | Mitsubishi Jukogyo Kabushiki Kaisha | Ceiling-mounted type air conditioner |
EP0834704A2 (en) * | 1996-10-03 | 1998-04-08 | Kabushiki Kaisha Toshiba | Indoor unit of air-conditioner |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000046360A (en) * | 1998-07-29 | 2000-02-18 | Hitachi Ltd | Ceiling recessed indoor machine |
-
2001
- 2001-07-17 AU AU2001276944A patent/AU2001276944A1/en not_active Abandoned
- 2001-07-17 WO PCT/US2001/022398 patent/WO2002006645A2/en active Application Filing
- 2001-07-17 AU AU2001273519A patent/AU2001273519A1/en not_active Abandoned
- 2001-07-17 WO PCT/US2001/022419 patent/WO2002007492A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0458770A1 (en) * | 1990-05-21 | 1991-11-27 | Telefonaktiebolaget L M Ericsson | An arrangement for convection cooling of apparatus rooms |
US5669229A (en) * | 1995-05-30 | 1997-09-23 | Mitsubishi Jukogyo Kabushiki Kaisha | Ceiling-mounted type air conditioner |
EP0774628A2 (en) * | 1995-11-20 | 1997-05-21 | Mitsubishi Denki Kabushiki Kaisha | Blowoff orifice |
EP0834704A2 (en) * | 1996-10-03 | 1998-04-08 | Kabushiki Kaisha Toshiba | Indoor unit of air-conditioner |
Also Published As
Publication number | Publication date |
---|---|
AU2001276944A1 (en) | 2002-01-30 |
WO2002007492A2 (en) | 2002-01-24 |
WO2002006645A2 (en) | 2002-01-24 |
AU2001273519A1 (en) | 2002-01-30 |
WO2002006645A3 (en) | 2002-05-02 |
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