WO2002003322A1 - Procede de realisation d'un support de donnees en forme de carte, et dispositif servant a mettre en oeuvre le procede - Google Patents

Procede de realisation d'un support de donnees en forme de carte, et dispositif servant a mettre en oeuvre le procede Download PDF

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Publication number
WO2002003322A1
WO2002003322A1 PCT/EP2001/007603 EP0107603W WO0203322A1 WO 2002003322 A1 WO2002003322 A1 WO 2002003322A1 EP 0107603 W EP0107603 W EP 0107603W WO 0203322 A1 WO0203322 A1 WO 0203322A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier layer
dispersion
card
head
tracks
Prior art date
Application number
PCT/EP2001/007603
Other languages
German (de)
English (en)
Inventor
Han Salemink
Original Assignee
Isa Conductive Microsystems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2000131329 external-priority patent/DE10031329C1/de
Application filed by Isa Conductive Microsystems Gmbh filed Critical Isa Conductive Microsystems Gmbh
Publication of WO2002003322A1 publication Critical patent/WO2002003322A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Definitions

  • the invention relates to a method for producing a card-shaped data carrier according to the preamble of patent claim 1.
  • Card-shaped data carriers have meanwhile found their way into numerous areas of application. It is known, for example, as a means of payment for cashless payments in the form of telephone, EC and credit cards, and as an electronic key for regulating access authorization to premises and electronic devices. The need for card-shaped data carriers for such and other applications is increasing rapidly, so that such data carriers are becoming increasingly important.
  • Card-shaped data carriers generally have at least one electronic component, for example a chip, which is responsible for data processing and which is connected to other components via conductor tracks.
  • the use of certain parts and components and their specific arrangement on a card is also referred to as card architecture.
  • the card has freely accessible contact points on its surface, which are connected to the connection areas of the chip by means of conductor tracks.
  • the data is exchanged by inserting the card into a reader that picks up the contact points.
  • the disadvantage of these contact cards is that the contact points are subject to constant mechanical wear due to the mechanical establishment of the contact between the card and the reader, which increases over time deterioration of the contact leads to the reliability of these cards.
  • Other factors that impair the functionality of a card are environmental. Dust and moisture as well as corrosion on the contact surfaces lead to contact problems, which increase the maintenance of the reading devices.
  • contactless cards are often preferred, in which the data between the electronic component and an emitter are inductive or capacitive.
  • such cards have a transmission element in the form of a coil or electrically conductive layers for data exchange.
  • the coil acts like a transmitting and receiving antenna.
  • it is sufficient to come close to a reading or transmitting unit that generates an electromagnetic field, which enables communication between the card and the reading unit.
  • Both DE 44 31 605 AI and DE 197 28 993 Cl require winding methods for the production of coils for copper wire coils as known.
  • the copper wire is twisted into several placed and fixed on the surface of a support layer.
  • the abovementioned documents disclose additive processes for producing coils, such as, for example, the screen printing process, in which a conductive layer is applied to a carrier layer outside the areas covered by a stencil, or etching processes, in which a conductive flat coating is removed in unprotected partial areas.
  • DE 44 31 605 also names galvanically waxed coils.
  • the methods described are also suitable for producing conductor tracks which connect the coils to the electronic components and which are advantageously produced simultaneously with the coil.
  • a major disadvantage of the above-described methods for producing a card-shaped data carrier is first of all to be seen in the fact that several method steps are required until a card is functional.
  • the coil In a first process step, the coil must first be produced, possibly with the associated conductor tracks, before the connections to an electronic component can be made in a further process step. This makes the manufacturing process cumbersome and expensive, which is not least reflected in the manufacturing costs.
  • a further disadvantage of the known methods lies in the rigid operational sequence due to the method.
  • the object of the invention is to develop a method which, on the one hand, process is simplified and, on the other hand, the greatest possible flexibility is guaranteed.
  • the basic idea of the invention is to produce conductor tracks, coils, conductive surfaces and connections by successively and continuously applying a conductive dispersion along predetermined tracks to a carrier layer.
  • the dispersion has a viscosity which is suitable for being applied to the carrier layer in a controlled manner by means of an auxiliary.
  • a dispensing head with a dispensing needle from which the dispersion flows in a controlled manner onto the carrier layer is suitable for this purpose. This creates conductive tracks whose width can be reduced to, for example, 100 ⁇ m with a corresponding thickness.
  • the method according to the invention thus enables the design of a map architecture on the computer (CAD / CAM), ie the exact position of the conductor tracks, transmission elements te and electronic components and their connection surfaces.
  • This data flows directly into the manufacturing process, where it is used to control the tools for applying the conductive dispersion.
  • the map architecture can be changed at any time and as often as required without significant loss of time, without having to make any changes to the means of production.
  • the method according to the invention therefore enables the user to carry out a rapid prototype.
  • the great flexibility and the wide range of applications of the method according to the invention enable a much greater vertical range of manufacture on the part of the card manufacturers.
  • the card manufacturers have mainly relied on third-party companies who have pre-fabricated and antenna, conductor tracks and electronic components such as. B. chip, provided support layers, so-called inlets. Thanks to the invention, this intermediate step is now eliminated.
  • the card manufacturers manufacture transmission elements and conductor tracks themselves and thus enjoy the entire value chain. In addition, they remain independent of the supplies from third parties, which increases production reliability.
  • Another advantage of the method according to the invention lies in the possibility of realizing highly complex map architectures. On the one hand, this is possible due to the possibility to apply the dispersion to the carrier layer in a microprocessor-controlled manner with regard to position, quantity and consistency. On the other hand, differences in height that result from crossing points of conductor tracks or connections to chips, batteries or other electronic components can be bridged, which allows the design of three-dimensional map architectures.
  • the conductivity of the previously applied dispersion is checked. This can be done, for example, with the aid of an ultrasound examination, the conductivity being inferred from the geometry of the conductor track and the properties of the dispersion. This check is advantageously carried out during the liquid phase of the dispersion. In the case of a poorly manufactured conductor track, the defect can be repaired immediately or later, which can significantly reduce the number of defective cards.
  • a negative pressure and temperature are applied to the carrier layer during the hardening phase of the dispersion. This leads to an acceleration of the
  • the substance applied with the dispensing system is designed in such a way that it has very small conductive particles which if encapsulated, so that the substance in the liquid state has little or no conductivity and can be charged statically.
  • the reaction process of curing and activation of the conductive particles is then preferably carried out by UV light, visible light or by heat.
  • This embodiment of the invention is particularly advantageous if the conductive substance is applied with the aid of an air brush head or with the aid of an inkjet head and the substance mist is regulated or adjusted in terms of its beam width and focal point, for example by an electrostatic lens. is set.
  • a card produced by the method according to the invention already has its full functionality with regard to the requirements. Checking the functionality at this early stage of production enables defective cards to be sorted out very early, so that they can be further processed in subsequent process steps, such as the application of further security features, e.g. Holograms, marking foil etc. and personalization no longer take place and therefore no longer incur any costs.
  • further security features e.g. Holograms, marking foil etc. and personalization no longer take place and therefore no longer incur any costs.
  • the invention is not only limited to a method for producing card-shaped data carriers, but also goes beyond and generally comprises the production of a conductive web or surface by successively and continuously applying a conductive dispersion to a base substrate.
  • Fig. 3 is a detailed view of one end of a dispensing needle when
  • Fig. 4 is a plan view of a distribution system for applying the dispersion.
  • Fig. 6 shows another embodiment of the invention for applying this substance.
  • an inkjet head or an inkjet unit as well as a bubblejet head or a bubblejet unit are used, as are known in particular from printer technology.
  • the method according to the invention is carried out in various stations, which are identified by A, B, C and D in the present example.
  • the arrows 1, 2 and 3 indicate the direction of production.
  • the carrier layers 4 are held in the form of sheets stacked one above the other and, if necessary, transferred to station B.
  • the arches exist in the present example made of PVC, but other plastics such as ABS or cardboard are equally suitable.
  • An arch of a carrier layer 4 is suitable for producing a multiplicity of data-shaped card carriers by simultaneously accommodating 3x8 or 3x7 cards (see also FIG. 4).
  • the support layer sheets 4 stacked in station A are already equipped with the necessary electronic components, so that only the transmission elements, conductor tracks and connections to the electronic components have to be made further on.
  • a carrier sheet 4 is transferred to station B.
  • the dispersion is applied via a dispensing system with three parallel production lines 5, 5 ', 5 ".
  • Each of the production lines 5, 5', 5" is connected via a supply line 6, 6 ', 6 "to one with the conductive dispersion filled storage container 7, 7 ', 7 "connected.
  • the application of the dispersion takes place via the schematically represented dispensing heads 8, 8 ', 8 "with integrated control unit, which combine both a dispensing needle and, for example, an ultrasonic measuring device for checking.
  • the arrows 9, 9 ', 9 “and 10, 10', 10” symbolize a photoelectronic adjustment device which ensures an exact adjustment of the support layer sheet 4 within the station B and thus relative to the dispensing heads 8, 8 'and 8 " Aufb ⁇ ngens the dispersion is explained in more detail in FIGS. 2, 3 and 4.
  • the curing phase takes place there, which is still in a liquid state dispersion. If necessary, the carrier layer sheet 4 is exposed to a negative pressure and a temperature increase during this time, which leads to a shortening of the hardening phase and a densification of the dispersion.
  • the subsequent station D stands for all subsequent processing steps. This includes optionally checking the functionality of the later cards and otherwise joining further layers into a card book and laminating it and then punching out the finished cards from the laminated sheets.
  • FIG. 2 shows a device, broken down into its functional components, for applying a conductive dispersion to a carrier layer 4.
  • a device comprises a data processing unit 11, on which the card architecture is first designed. The resulting data are forwarded via an interface 12 to a dispensing device 13, where they trigger the exact microprocessor-controlled control of the individual components, which essentially consist of a vacuum table (not shown in FIG. 2) on which the carrier sheet 4 is adjusted and fixed and one Dispensing head 8.
  • the vacuum table and thus the support layer 4 are displaceably mounted in a horizontal plane in two mutually orthogonal axes (X, Y) and are moved with the aid of a controlled drive in accordance with the card architecture.
  • a movement in the direction perpendicular thereto (Z axis) is only provided as an option and is carried out either by raising and lowering the vacuum table or else the dispensing head 8.
  • the dispensing unit 13 initially comprises a container 14 in which the conductive dispersion is stored. During operation, the dispersion reaches a unit 15 in which the viscosity and temperature of the dispersion are brought to the required target size. Includes in the direction of flow of the dispersion Buffer 16 for the dispersion before it reaches a pump element 17, which is also equipped with a storage volume.
  • the dispersion passes a further module 18 for checking the viscosity and a further module 19 for checking the temperature. This ensures that the dispersion is applied to the carrier layer 4 in an optimal state.
  • a further module 34 is provided which checks and confirms the presence of the dispersion 21.
  • the lower end of the dispensing head 8 facing the carrier layer sheet 4 has a dispensing needle through which the dispersion leaves the dispensing device 13.
  • FIG. 3 The process of applying the dispersion to the carrier layer 4 is illustrated in FIG. 3.
  • the mouth 20 can be seen at the free end of a dispensing needle 32, from which the conductive liquid dispersion 21 emerges and is continuously applied to a carrier layer 4.
  • the distance between the mouth 20 and the carrier layer 4 is matched to the component which extends furthest over the carrier layer plane in accordance with the respective card architecture.
  • approx. 500 ⁇ m would be a suitable distance.
  • Large height offsets in the map architecture can also be taken into account by appropriate height adjustment of the dispensing head 8 or the vacuum table.
  • a track produced in this way from the dispersion 21 can serve as a conductor track 33 for connecting various electronic components on a card.
  • the connections to the connection surfaces of the components can be carried out in a simple manner in that the dispensing needle 32 moves with its mouth 20 directly over the connection point. The contacting thus takes place in the course of the production of the conductor tracks 33.
  • tracks 33 can also be used directly to form a coil as a transmission element, by carrying out corresponding relative movements of the dispensing needle 32 with respect to the carrier layer 4.
  • Electrically conductive surfaces are produced by laying the tracks directly next to one another. Since the dispersion 21 is still in the liquid state, a closed conductive surface is produced in this way.
  • FIG. 4 shows a top view of an embodiment of the invention for producing card-shaped data carriers 31, 31 ', 31 "in large numbers.
  • a vacuum table 22 which is movable in the plane of representation and on which a support layer sheet 4 is fixed in a planar manner. The adjustment takes place via photoelectric sensors, which are designated with 23 and 24.
  • the system for applying the dispersion is shown only schematically. It comprises three parallel supply lines 25, 25 'and 25 ", which are connected to the storage containers 26, 26', 26" for the dispersion and are guided at a close distance over the support sheet 4. From each supply line 25, 25 ', 25 ", eight dispensing heads 27, 27', 27", which are each arranged in a row, branch off above the support sheet 4, to which a control unit 28, 28 ', 28 "is assigned. For application of the dispersion, only the vacuum table 22 moves in the display plane, while the dispensing heads 27, 27 ', 27 "and control units 28, 28', 28" are fixed in place.
  • the support layer sheet 4 is already equipped with a chip 29, 29 ', 29 "in the area of each card to be produced, in accordance with the card architecture.
  • the dispensing heads 27, 27', 27" currently each provide a coil 30 , 30 ', 30 ", which is then connected directly to the connection areas of the chip 29, 29' 29".
  • the dispensing principle of these systems is based on a screw conveyor valve (rotating screw principle).
  • the material to be dispensed (conductive substance) is subjected to a low pressure in the cartridge and fed to a precision screw conveyor.
  • the dispensing system consists of a dispensing unit and control. The following parameters can be set and varied on this device:
  • Viscosity range 100. 000-200. 000 mPas (determined on the rheometer) Fullstoff fanteil (wt.%): 75
  • Metal particles e.g. silver brought in as filler touch and create conductive paths through metallic contacts through which an electrical current can flow.
  • Subsrick thickness 100-150 ⁇ m
  • UV curing device Arccure BK200 UV system e.g. UV curing device Arccure BK200 UV system
  • Curing took place in the UV-B range eg thermal curing device: Binder circulating air dryer or
  • FIG. 5 shows a dispensing head which is based on the principle of the known inkjet method.
  • the conductive substance 103 flows through a nozzle and is dissolved into individual drops.
  • the drops are electrically charged by the electrode 116 with its voltage source 108.
  • the drop 119 is deflected onto the substrate 115 from the direction of flow.
  • Undeflected drops 120 are collected by a small funnel 121 and returned to the substrate container 123 by a pump 122.
  • the conductive substance is continuously pumped through the system by the pump 122. This prevents sedimentation of the substance.
  • a splash guard 110 can additionally be attached directly above the substrate 115. Here they may be from the substrate 115 splashing back substance particles to prevent uncontrolled contamination.
  • the activation energy By applying the activation energy to the substrate 115, e.g. B. by lighting or heating during the production process, care can be taken to ensure that the applied layers can be built one on top of the other in order to increase the conductor cross-section as required.
  • the process is controlled by turning the deflection voltage 117 on or off by a computer.
  • the desired structures 112, 113 are produced on the substrate for connection to components 114 by optionally moving the head above the substrate or moving the substrate below the dispensing head.
  • FIG. 6 shows a dispensing head 202 which is based on the principle of the air brush method.
  • the dispensing head is activated by controlling valve 201.
  • the substance 203 is electrically charged 208 by applying charge particles to the conductive substance droplets 204 of the substance mist 205.
  • the substance beam is then focused by an electrode 207, which in the illustration is designed as a ring electrode 207, for example. In this way, very fine conductive structures 212 can be produced.
  • the conductor track width 213 can be adjusted or modulated by changing the voltage 209 of the focus electrode 207. As a result, the focal point can also be shifted in the Z direction, so that differences in height of the components 214 can be compensated for.
  • a splash guard 210 can additionally be attached directly above the substrate 215.
  • the substance particles possibly splashing back from the substrate 215 are captured in order to To prevent controlled contamination.
  • the activation energy e.g. B. by lighting or heating during the production process, care can be taken to ensure that the applied layers can be built up one above the other so as to increase the conductor cross-section as required.
  • Valve 201, voltage source 208 and 209 can be controlled by a computer, so that the process is automated.
  • the desired structures are produced on the substrate by optionally moving the head over the substrate or moving the substrate under the dispensing head.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention a pour objet la réalisation de supports de données en forme de carte sur lesquels se trouvent des composants électroniques ainsi que des impressions conductrices et que des éléments de transmission. A cet effet, les impressions conductrices et/ou les éléments de transmission sont formés par application en continu de manière successive d'une substance ou dispersion conductrice le long de trajectoires prédéterminées sur la couche de support au moyen d'une aiguille de dispersion, d'un système d'aérographe ou d'un système de jet d'encre. Il est ainsi possible d'éviter les différences de hauteur entre les composants.
PCT/EP2001/007603 2000-07-03 2001-07-03 Procede de realisation d'un support de donnees en forme de carte, et dispositif servant a mettre en oeuvre le procede WO2002003322A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE10031329.9 2000-07-03
DE2000131329 DE10031329C1 (de) 2000-07-03 2000-07-03 Verfahren zum Herstellen eines kartenförmigen Datenträgers und Vorrichtung zur Durchführung des Verfahrens
DE10111418 2001-03-09
DE10111418.4 2001-03-09
DE10116472.6 2001-04-03
DE10116472 2001-04-03

Publications (1)

Publication Number Publication Date
WO2002003322A1 true WO2002003322A1 (fr) 2002-01-10

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Application Number Title Priority Date Filing Date
PCT/EP2001/007603 WO2002003322A1 (fr) 2000-07-03 2001-07-03 Procede de realisation d'un support de donnees en forme de carte, et dispositif servant a mettre en oeuvre le procede

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1392091A2 (fr) * 2002-08-20 2004-02-25 Xerox Corporation Procédé et système pour imprimer des motifs de circuit intégré
EP1411466A1 (fr) * 2002-10-17 2004-04-21 Giesecke & Devrient GmbH Couche avec modules fonctionels pour intégration dans une carte multifonctionelle
WO2005022969A2 (fr) 2003-09-02 2005-03-10 Pixdro Ltd. Procede et systeme de creation de lignes fines suivant une technique par jet d'encre
WO2007051438A1 (fr) * 2005-11-02 2007-05-10 Bundesdruckerei Gmbh Support de données et procédé de métallisation
DE102011109411A1 (de) * 2011-08-04 2013-02-07 Mtu Aero Engines Gmbh Spritzschutzeinrichtung
EP3851228A1 (fr) * 2020-01-17 2021-07-21 Hamilton Sundstrand Corporation Protection contre les projections de fabrication additive

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US5437727A (en) * 1991-07-24 1995-08-01 Hitachi Techno Engineering Co., Ltd. Apparatus for drawing paste pattern on substrate
US5449407A (en) * 1993-06-01 1995-09-12 Sophia Systems Co., Ltd. Expansion compensated precision extrusion apparatus
DE4410732A1 (de) * 1994-03-28 1995-10-05 Amatech Gmbh & Co Kg Verfahren zur Herstellung einer Chipkarte sowie Chipkarte
WO1999019900A2 (fr) * 1997-10-14 1999-04-22 Patterning Technologies Limited Procede de formation d'un dispositif electronique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437727A (en) * 1991-07-24 1995-08-01 Hitachi Techno Engineering Co., Ltd. Apparatus for drawing paste pattern on substrate
US5449407A (en) * 1993-06-01 1995-09-12 Sophia Systems Co., Ltd. Expansion compensated precision extrusion apparatus
DE4410732A1 (de) * 1994-03-28 1995-10-05 Amatech Gmbh & Co Kg Verfahren zur Herstellung einer Chipkarte sowie Chipkarte
WO1999019900A2 (fr) * 1997-10-14 1999-04-22 Patterning Technologies Limited Procede de formation d'un dispositif electronique

Cited By (20)

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WO2005022969A2 (fr) 2003-09-02 2005-03-10 Pixdro Ltd. Procede et systeme de creation de lignes fines suivant une technique par jet d'encre
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