WO2001097583A3 - Molded electronic assembly - Google Patents

Molded electronic assembly Download PDF

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Publication number
WO2001097583A3
WO2001097583A3 PCT/US2001/018765 US0118765W WO0197583A3 WO 2001097583 A3 WO2001097583 A3 WO 2001097583A3 US 0118765 W US0118765 W US 0118765W WO 0197583 A3 WO0197583 A3 WO 0197583A3
Authority
WO
WIPO (PCT)
Prior art keywords
molded plastic
plastic portion
molded
electronic assembly
battery
Prior art date
Application number
PCT/US2001/018765
Other languages
French (fr)
Other versions
WO2001097583A2 (en
Inventor
John Sheehan
Philippe Gallon
Katherine Murphy
Ray Burke
Sean P O'sullivan
Maurice O'brien
Original Assignee
Bourns Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bourns Inc filed Critical Bourns Inc
Priority to AU2001266835A priority Critical patent/AU2001266835A1/en
Publication of WO2001097583A2 publication Critical patent/WO2001097583A2/en
Publication of WO2001097583A3 publication Critical patent/WO2001097583A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/572—Means for preventing undesired use or discharge
    • H01M50/574—Devices or arrangements for the interruption of current
    • H01M50/581—Devices or arrangements for the interruption of current in response to temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H2011/0081—Apparatus or processes specially adapted for the manufacture of electric switches using double shot moulding, e.g. for forming elastomeric sealing elements on form stable casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
    • H01H2011/065—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier by plating metal or conductive rubber on insulating substrate, e.g. Molded Interconnect Devices [MID]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

A molded electronic assembly is formed from a first molded plastic portion including a component mounting plane and a plurality of non-coplanar surfaces, and a second molded plastic portion molded around the first molded plastic portion and including openings therein defining selected regions of the first molded plastic portion. Metallization is applied to the selected regions of the first molded plastic portion defining a network of electrically conductive traces and conductive regions providing electrical continuity over at least two of the non-coplanar surfaces. A battery is supported above the component mounting plane by stand-offs formed in the second molded plastic portion, and a circuit protection device is mounted in substantial contact with the battery. A method for assembling an electronic module is also described.
PCT/US2001/018765 2000-06-12 2001-06-11 Molded electronic assembly WO2001097583A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001266835A AU2001266835A1 (en) 2000-06-12 2001-06-11 Molded electronic assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59252600A 2000-06-12 2000-06-12
US09/592,526 2000-06-12

Publications (2)

Publication Number Publication Date
WO2001097583A2 WO2001097583A2 (en) 2001-12-20
WO2001097583A3 true WO2001097583A3 (en) 2002-03-28

Family

ID=24371029

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/018765 WO2001097583A2 (en) 2000-06-12 2001-06-11 Molded electronic assembly

Country Status (3)

Country Link
AU (1) AU2001266835A1 (en)
TW (1) TW526689B (en)
WO (1) WO2001097583A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002313927A1 (en) 2002-04-24 2003-11-10 Sk Telecom Co., Ltd Mobile terminal with user identification card including personal finance-related information and method of using a value-added mobile service through said mobile terminal
EP1383360B1 (en) * 2002-07-18 2007-01-03 FESTO AG & Co Injection moulded lead carrier and method of producing the same
DE10239395A1 (en) * 2002-08-28 2004-03-11 Zf Friedrichshafen Ag Connections to an electrical component such as a motor are made by fixed points that are resistant to vibration
EP1544917A1 (en) * 2003-12-15 2005-06-22 Dialog Semiconductor GmbH Integrated battery pack with lead frame connection
DE102005019116A1 (en) * 2005-04-25 2006-10-26 Siemens Ag Battery for an electronic unit, e.g. a motor vehicle control system, is combined in a single unit with a direct voltage converter on a circuit board
US7358921B2 (en) 2005-12-01 2008-04-15 Harris Corporation Dual polarization antenna and associated methods
KR100870363B1 (en) 2007-03-15 2008-11-25 삼성에스디아이 주식회사 Protection circuit board for secondary battery and secondary battery using the same
DE102007026614A1 (en) * 2007-06-08 2008-12-18 Deutsches Zentrum für Luft- und Raumfahrt e.V. Power supply device for operating accumulator or battery-operated electrical equipment, has energy storage and boosting transducer for changing output voltage of energy storage into required higher operating voltage
US7804450B2 (en) 2007-07-20 2010-09-28 Laird Technologies, Inc. Hybrid antenna structure
JP5228076B2 (en) * 2010-09-03 2013-07-03 日立ビークルエナジー株式会社 In-vehicle power storage device
DE102012221751A1 (en) * 2012-11-28 2014-05-28 Robert Bosch Gmbh Battery module with battery module cover and a method for making a battery module cover of a battery module
FR3057683B1 (en) * 2016-10-14 2020-11-06 Renault Sas CAPACITIVE DETECTION ELECTRONIC INTERFACE
KR102517953B1 (en) * 2017-10-26 2023-04-03 주식회사 엘지화학 Lead tab and pouch type battery including the same
US20220320657A1 (en) * 2021-03-31 2022-10-06 Ford Global Technologies, Llc Traction battery pack enclosure patch and enclosure patching method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812353A (en) * 1986-12-27 1989-03-14 Sankyo Kasei Kabushiki Kaisha Process for the production of circuit board and the like
US4812275A (en) * 1986-11-18 1989-03-14 Sankyo Kasei Kabushiki Kaisha Process for the production of molded articles having partial metal plating
GB2266410A (en) * 1992-04-20 1993-10-27 Taiko Denki Co Ltd Circuit parts including conductor patterns on moulded bases
JPH11283589A (en) * 1998-03-31 1999-10-15 Sanyo Electric Co Ltd Pack battery
EP0952760A1 (en) * 1998-04-02 1999-10-27 Motorola, Inc. Flexible circuit
JP2000021372A (en) * 1998-06-30 2000-01-21 Matsushita Electric Ind Co Ltd Battery pack

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812275A (en) * 1986-11-18 1989-03-14 Sankyo Kasei Kabushiki Kaisha Process for the production of molded articles having partial metal plating
US4812353A (en) * 1986-12-27 1989-03-14 Sankyo Kasei Kabushiki Kaisha Process for the production of circuit board and the like
GB2266410A (en) * 1992-04-20 1993-10-27 Taiko Denki Co Ltd Circuit parts including conductor patterns on moulded bases
JPH11283589A (en) * 1998-03-31 1999-10-15 Sanyo Electric Co Ltd Pack battery
EP0952760A1 (en) * 1998-04-02 1999-10-27 Motorola, Inc. Flexible circuit
JP2000021372A (en) * 1998-06-30 2000-01-21 Matsushita Electric Ind Co Ltd Battery pack

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 01 31 January 2000 (2000-01-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) *

Also Published As

Publication number Publication date
AU2001266835A1 (en) 2001-12-24
TW526689B (en) 2003-04-01
WO2001097583A2 (en) 2001-12-20

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