WO2001077716A2 - Matrice de micro-lentilles a taux de remplissage eleve et son procede de fabrication - Google Patents

Matrice de micro-lentilles a taux de remplissage eleve et son procede de fabrication Download PDF

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Publication number
WO2001077716A2
WO2001077716A2 PCT/US2001/009145 US0109145W WO0177716A2 WO 2001077716 A2 WO2001077716 A2 WO 2001077716A2 US 0109145 W US0109145 W US 0109145W WO 0177716 A2 WO0177716 A2 WO 0177716A2
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WO
WIPO (PCT)
Prior art keywords
photoresist
contour
microlens array
microlens
refractive
Prior art date
Application number
PCT/US2001/009145
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English (en)
Other versions
WO2001077716A3 (fr
Inventor
Haluk O. Sankur
Original Assignee
Rockwell Technologies, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rockwell Technologies, Llc filed Critical Rockwell Technologies, Llc
Priority to JP2001574514A priority Critical patent/JP2003530587A/ja
Publication of WO2001077716A2 publication Critical patent/WO2001077716A2/fr
Publication of WO2001077716A3 publication Critical patent/WO2001077716A3/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method

Definitions

  • This invention relates to integrated optoelectronics in general and more specifically to monolithic microlens arrays for photodetector imagers.
  • Optoelectronic arrays such as photodetector imagers are commonly combined with complementary arrays of microlenses to enhance efficiency by concentrating incident radiation into an active photodetecting region.
  • Various techniques have been employed to fabricate the microlens arrays. In some methods, a microlens array is fabricated separately from the photoelectronic chip then bonded to the chip. This requires that the microlens array be aligned properly with the photoelectronic chip during bonding, and that the alignment be accurately maintained during the life of the device. Because such alignment is difficult in mass-production, monolithic fabrication of microlens arrays integrated with the optoelectronics is preferable.
  • a further problem is the sensitivity of the reflow method to process conditions. Interfacial adhesion and wetting of the photoresist over the planarizing material are process dependent, and it is therefore difficult to achieve reproducible results.
  • Photoresist lenses for visible imagers are typically fabricated on an optically transparent planarizing layer or over color filters. The lens, filter and planarizing materials have similar surface energies, which makes controlling the wetting and spreading of the photoresist during reflow difficult to control. A harrow range of process conditions must be maintained for success.
  • the reflow fabrication method is undesirably limited in its ability to produce "slow" microlenses (with small aperture to focal length ratio) .
  • Such microlenses have only slight curvature over their aperture, and it is difficult to accurately produce such a shape, as the surface tension causes the edges to rise and the center to sag. Any such sag introduces significant aberration.
  • Reworking of imperfect reflow microlenses is expensive as it requires stripping of the lens, the planarization layer and any underlying color filter materials (which are commonly added) .
  • FIG. 1 The failure of reflow lenses to achieve high fill factor can be easily understood by reference to FIG. 1.
  • the figure shows only four pixels, for ease of illustration, although actual image matrices typically would include hundreds, thousands, or even millions of pixels, as is well known.
  • the pixels are typically laid out substantially as shown, in a rectangular or square matrix with rows 10 and columns 12 at right angles.
  • the round regions 14 represent the microlenses, formed by the reflow method, which occupy area within rectangular cells 16 (shown square, within phantom lines 17) .
  • a minimum space 18 is required between the circumference of the microlenses 14 and any adjacent microlenses. If this minimum space is not observed, the lenses 14 will flow together during melting to form larger drops, losing their distinct identities.
  • each microlens is, in area plan, a round object occupying a square cell. Therefore, even neglecting inte lens spacing, full fill-factor can never be achieved, as the area of a circle of diameter d is only ⁇ /4 of the area of the square enclosing the circle.
  • the situation worsens when the requisite inter-lens spacing is considered; and the fill-factor degrades to an abysmal level as the lenslets are scaled down below ten microns, as the inter- lens spacing is not correspondingly scaleable: a minimum spacing is required between the lenses to prevent contact of photoresist islands during reflow, and this spacing is generally limited by the photolithographic resolution.
  • a typical fill factor of less than 65 per cent is achievable for 5 micron square pixel sizes with 1 micron separation.
  • the reflow method cannot fabricate microlenses which have square or otherwise polygonal borders.
  • a pillar of photoresist which is allowed to melt and reflow to accomodate a non-circular aperture (shown as a square, projecting onto abed) as shown in FIG. 2.
  • the resulting microlens 20 is non-spherical (and in fact, not rotationally symmetrical about its central axis L) .
  • the lozenge-like lenslet has been twice cut and a pie-like wedge removed, to clearly show the curvature of the surface in two different planes.
  • the first cutaway 22 is taken parallel to the square side of the lenslet; the second cutaway 24 is in a plane slicing diagonally across the square aperture, corner ' to corner.
  • the surface tension of the reflow droplet will form the microlens surface in a minimum-surface form (constrained by the shape of the square aperture border) .
  • the minimum surface formed by wetting a polygonal aperture is emphatically not a segment of a sphere. This is easily seen in FIG. 2: the arc 28 which bounds section 22 descends from the zenith z to the side of the lozenge 20, with elevation h.
  • the arc 30, makes the same descent, but over a longer run, necessarily longer because the diagonal of a square is always longer than it width.
  • the present invention is a refractive microlens array with improved fill- factor, suitable for integral fabrication on an optoelectronic substrate device, and a method of fabricating the microlens array.
  • an optically transparent, refracting material is disposed atop the opto-electronic substrate device.
  • Such refracting material has formed therein a plurality of microlenses arranged in a regular, tessellated pattern, which is superimposable on a regular tiling pattern of polygonal cells, attached to one another at defining polygonal borders.
  • the contours of the refractive microlens' surface have rotational symmetry within each cell about an axis, with the symmetric contour maintaining its symmetry substantially at every surface point within the cell's closed polygonal border, thereby substantially covering the cell with a usable, symmetric lens surface (most preferably a partial spherical surface) .
  • the method of fabrication for the microlens arrays includes several steps: First, a substrate is coated with a transparent planarizing material. Next, a layer of photoresist is deposited on top of the planarizing material. A thickness contour is then printed into the photoresist by grey-scale photolithography. Preferably, a high-resolution grey-scale mask is used, which can be prepared by writing with a high energy e-beam into High Energy Beam Sensitive glass (HEBS glass) . Finally, the thickness contours of the photoresist are transferred into the planarizing material by ion etching, thereby producing an array of refractive lenses in the planarizing material.
  • HEBS glass High Energy Beam Sensitive glass
  • the method can produce a spherical microlens array in which each microlens in the array maintains its spherical contour substantially across the entire surface, border to border, thus achieving almost unity fill factor, without introducing significant aberrations.
  • FIG. 1 is a plan view of a prior art microlens array pattern
  • FIG. 2 is a perspective view of a microlens fabricated by prior art methods, with a wedge cut away to reveal cross-sections in two different planes;
  • FIG. 3 is a perspective view of a microlens in accordance with the invention, with topographic lines to illustrate surface contour;
  • FIG. 4 is an array of microlenses in accordance with the invention, laid out in an exemplary square tiling pattern
  • FIG. 5 is a plan view of one exemplary alternate tiling pattern which can be used to arrange microlenses into an array in accordance with the invention
  • FIGs. 6a-6e are sequential sectional views of a fabrication sequence in accordance with the method of the invention for fabricating microlens arrays; and FIG. 7a-7b are sequential sectional views of an a variant fabrication sequence, which can be used to rework microlens arrays by the method of the invention.
  • FIG. 2 The geometry of a typical microlens in accordance with the invention is shown in FIG. 2, as it would appear if cut apart from its neighboring microlenses (in an array) .
  • the microlens 40 typically has an approximately spherical surface 42 which substantially covers a polygonal cell (here shown as a square, for example only and not by way of limitation). The dimensions given are typical.
  • the materials and composition of the microlenses are discussed below, in connection with the preferred method of fabrication.
  • the surface of the microlens 40 approximates spherical (or other surface of revolution, discussed below) , substantially across the entire area of a rectangular cell (projecting onto abed, as shown) . This causes the surface 42 to appear to dip deeper into the corners, as at 46, while less dip is apparent at the side mid-points (as at 28) . This of course is a necessary consequence of the fact that the diagonal is always longer than either side of a rectangle. Therefore, the diagonals traverse a longer angle than the sides, including more arc of the spherical surface 42.
  • FIG. 3 shows an array of refractive microlenses in accordance with the invention.
  • a si plistically small array is shown for clarity of illustration
  • a rectangular array is shown, but other regular tiling patterns of substantially polygonal cells can also be used in accordance with the invention. Dimensions shown are typical. Greater or lesser radii of curvature could be fabricated according to the desired focal lengths.
  • the invention is not limited to spherical microlenses, but includes aspherical lenlets, especially those having regular surfaces generated by revolution of a generatrix about a central axis. For example, parabolic or elliptical surfaces of revolution could be fabricated.
  • the polygons which circumscribe the microlenses are not limited to rectangular, but could be any suitable polygon. For example, hexagonal cells can be advantageously fabricated in the familiar honeycomb- like regular grid, as shown in FIG. 5, which produces excellent pixel densities.
  • the microlenses are preferably fabricated directly on top of an integrated optoelectronic circuit (such as a CMOS imaging matrix) by a novel, gray-scale fabrication process. As shown in FIG. 6a, the microlens fabrication preferably starts with a fabricated integrated circuit, shown here and referred to simply as a "substrate" 50.
  • the substrate 50 is first coated with a planarization material 52, which is suitably made of an acrylic polymer material transparent to the radiation of interest.
  • the planarization material 52 may be suitably applied by spin coating to a thickness of 1-2 microns then heating to a temperature of 200 degrees C for a period of 30 minutes to planarize the material.
  • a conventional photoresist 54 is then applied to an approximate thickness of 1-3 microns on top of the planarization material, suitably by spin-coating. As shown in FIG.
  • a grey scale patterned mask 56 is then placed directly atop the photoresist 54 and exposed to ultraviolet light 58 filtered through the grey scale patterned mask.
  • This process step is similar to the more familiar photomasking steps in conventional IC processing, except that it employs grey scale rather than simple black/white masking.
  • the mask 56 discussed in greater detail below, is fabricated with a grey-scale absorption profile, here represented by graduated stippling, according to a profile calculated to produce a desired microlens elevation contour. After exposure the unexposed photoresist is removed by washing. More accurately, the photoresist is removed to a greater or lesser degree ' in relation to the amount of light exposure it received in the preceding exposure step of FIG. 6b. The result, shown in FIG.
  • the remaining photoresist 54 is formed into contoured islands of elevation varying in relation to the light exposure received in the previous step (FIG. 6b) .
  • islands such as 62 are formed with contours approximating a spherical surface.
  • the upper surface 64 is subjected to a milling technique such as reactive ion etching, symbolized by ions 66, which erodes the planarizing layer differentially, in inverse relation to the thickness of the photoresist layer 54 at each point on the surface.
  • a milling technique such as reactive ion etching, symbolized by ions 66, which erodes the planarizing layer differentially, in inverse relation to the thickness of the photoresist layer 54 at each point on the surface.
  • the contours can be suitably transferred, for example, by reactive ion etching for approximately ten minutes in an 0 2 and SF 6 ambient environment at approximately 2Q milliTorr pressure at 20 degrees C.
  • FIG. 6e microlens 68 of the desired contour has been fabricated in a planarizing material 52 on top of a substrate 50 (which preferably includes
  • the method described requires a very finely modulated, grey-scale mask to differentially expose the photoresist according to the lenslet contour desired (in ' contrast to more conventional masking, which uses a simple black/white mask) .
  • Grey-scale masks suitable for use in the method can be fabricated from high energy beam sensitive ("HEBS") glasses. Such glasses have optical density values which vary as a function of e-beam dosage, and can therefore be "written” or spatially modulated as desired by exposure to a modulated e-beam, for example in the 15-30 kV energy range. A grey level mask is thereby obtained with a continuous tone even when observed at the highest level of magnification.
  • HEBS high energy beam sensitive
  • the exposure curves typically have a substantial linear portion which is most conveniently utilized.
  • the glass produces a very continuous grey scale because the coloring elements are specks of silver of approximately 10 nm dimensions. Thus the exposed glass has no discernible graininess and is capable of less than 0.25 micron resolution.
  • HEBS glass photomask blanks are commercially available, for example from Canyon Materials, Inc. in San Diego, California.
  • a typical microlens array in accordance with the invention includes a plurality of microlenses, arranged with a center to center pitch of approximately ten microns or less, with refractive material of between 1 and 3 microns in thickness (before etching) .
  • a further advantage of the method is that the microlenses are fabricated in the same material as the planarization layer, and do not rely on photoresist wetting and interfacial adhesion, as in prior methods. In such prior methods, because the microlens shape was highly dependent upon uniform wetting and interfacial adhesion, inconsistencies in wetting often produced inconsistent microlenses.
  • the grey scale lithographic method of the present invention avoids reliance on such poorly controlled interface variables and achieves more consistent results. In particular, it is impossible for lens droplets to accidentally flow together during fabrication, so they can be laid out without substantial loss of aperture to any minimum spacing requirement.
  • FIG. 7a a flawed microlens (part of a flawed array) is illustrated in FIG. 7a.
  • a flawed microlens 70 has been fabricated in planarizing material on top of a substrate 72.
  • a layer of planarization material 76 is added, suitably by spin coating to a thickness of approximately 1-3 microns. After heating, the old and new planarization essentially flow together, with the added planarizing material filling in any gaps and resulting in a planar surface as shown in FIG. 7b.
  • the microlenses fabricated according to the invention are refractive microlenses, which should not be confused with diffractive optical elements (DOEs) . Refractive optical elements are superior to DOEs in most applications, because they are capable of operation over wide spectral range, and with incoherent light sources. Furthermore, refractive elements typically have higher transmission efficiency than similar diffractive elements.
  • DOEs diffractive optical elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

Une matière réfringente transparente (52) est déposée au sommet d'un dispositif à substrat optoélectronique (50). Ladite matière réfringente comprend une pluralité de micro-lentilles (40) formant un motif en mosaïque régulier pouvant être superposé sur un motif tessellé régulier de cellules polygonales, reliées les unes aux autres au niveau de frontières polygonales déterminantes. Les contours de la surface des micro-lentilles de réfraction présentent une symétrie de révolution autour d'un axe au sein de chaque cellule, le contour symétrique conservant sa symétrie pratiquement en tout point de surface à l'intérieur des frontières de la cellule. On fabrique la surface des micro-lentilles en imprimant un contour dans une photorésine (54) par photolithographie à niveaux de gris puis en transférant ledit contour (42) dans une matière réfringente de planarisation sous-jacente (52), de préférence par attaque ionique. Ledit procédé permet de produire une matrice de micro-lentilles dans laquelle chaque micro-lentille (40) conserve son contour symétrique (42) pratiquement sur toute la surface d'une cellule polygonale, ce qui permet d'obtenir un taux de remplissage unitaire sans aberrations significatives.
PCT/US2001/009145 2000-04-05 2001-03-20 Matrice de micro-lentilles a taux de remplissage eleve et son procede de fabrication WO2001077716A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001574514A JP2003530587A (ja) 2000-04-05 2001-03-20 高フィルファクターマイクロレンズアレイ及び製造方法

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Application Number Priority Date Filing Date Title
US09/543,077 US6301051B1 (en) 2000-04-05 2000-04-05 High fill-factor microlens array and fabrication method
US09/543,077 2000-04-05

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WO2001077716A2 true WO2001077716A2 (fr) 2001-10-18
WO2001077716A3 WO2001077716A3 (fr) 2002-05-02

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