WO2001010926A1 - Transparente giessharzmasse für smt-fähige led-anwendungen mit hoher temperatur und hohen helligkeiten oder leuchtstärken - Google Patents
Transparente giessharzmasse für smt-fähige led-anwendungen mit hoher temperatur und hohen helligkeiten oder leuchtstärken Download PDFInfo
- Publication number
- WO2001010926A1 WO2001010926A1 PCT/DE2000/002614 DE0002614W WO0110926A1 WO 2001010926 A1 WO2001010926 A1 WO 2001010926A1 DE 0002614 W DE0002614 W DE 0002614W WO 0110926 A1 WO0110926 A1 WO 0110926A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- weight
- composition according
- epoxy
- component
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 26
- 239000011347 resin Substances 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 title 1
- 239000004593 Epoxy Substances 0.000 claims abstract description 24
- 230000005693 optoelectronics Effects 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000005266 casting Methods 0.000 claims description 18
- 239000011342 resin composition Substances 0.000 claims description 14
- 229920003986 novolac Polymers 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000002318 adhesion promoter Substances 0.000 claims description 5
- 238000007872 degassing Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 4
- 238000004382 potting Methods 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 239000002775 capsule Substances 0.000 claims description 3
- 238000004040 coloring Methods 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 229930003836 cresol Natural products 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 230000001133 acceleration Effects 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 150000003751 zinc Chemical class 0.000 claims 1
- 230000009477 glass transition Effects 0.000 abstract description 10
- 150000008065 acid anhydrides Chemical class 0.000 abstract 1
- 239000012778 molding material Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000041 toxicology testing Toxicity 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Definitions
- the invention relates to a transparent casting resin composition for potting optoelectronic components.
- Casting resin as a capsule and assembly material for potting optoelectronic components based on an acid-anhydride-curable epoxy compound which is produced by mixing an A component consisting of at least one epoxy compound and at least one multifunctional epoxy novolac resin, and optionally others Additives, and a B component consisting of at least one carboxylic anhydride.
- the transparent epoxy cast resin formulations according to the invention can advantageously be processed in established packaging technology and meet the optical, electrical and thermomechanical quality requirements of future product generations in optoelectronics and, above all, have glass transition temperatures above 130 ° C. According to the current state of knowledge, the toxic hazard potential of the starting materials is low, so that health risks can be excluded as far as possible.
- the A component preferably has further additives, such as a reactive thinner, an alcohol, an adhesion promoter, a leveling agent, an agent for degassing, a diffuser paste, and a component for adjusting the color number / coloring.
- additives such as a reactive thinner, an alcohol, an adhesion promoter, a leveling agent, an agent for degassing, a diffuser paste, and a component for adjusting the color number / coloring.
- an epoxy casting resin component according to the invention is preferably composed as follows:
- multifunctional epoxy casting resins ⁇ 80 wt. -%
- Diffuser paste (pigment in epoxy- ⁇ 10 wt.% Casting resin) adhesion promoter: ⁇ 5 wt. - Leveling agents: ⁇ 1 wt. -
- the carboxylic anhydride can be, for example, a hexahydrophthalic anhydride, as in DE 26 42 465.
- the glass transition temperature of a molding material from the aforementioned embodiment with a mixing ratio A: B of 100:90 is 140 ° C. Under manufacturing conditions, 135 ° C was obtained on the component. All functional and component-specific qualifications according to the latest automotive electronics standards have been passed.
- the viscosity of the epoxy resin component at 25 ° C is ⁇ 15,000 mPas.
- the viscosity of the A: B reaction resin mixture at 25 ° C is ⁇ 3,000 Pas.
- the shelf life of the epoxy cast resin component is at least 1 year at temperatures up to 30 ° C.
- the service life of the A: B reaction resin mixture at 25 ° C is at least 6 h.
- the favorable reactive behavior of the A: B reaction resin mixture enables fast curing cycles with reliable component potting in mass production processes with quantities of several 100 million per year.
- the glass transition temperature of the molding materials is> 130 ° C. Water absorption after 2 weeks of water storage at 23 ° C is ⁇ 0.5% by weight
- the transmission of a 1 mm thick molding material in the visible range of light is> 88%.
- the color shift after thermal aging 130 ° C after 6 weeks is ⁇ 10.
- the lenses produced in this way prove to be radiation-resistant in bright LEDs with, for example, 1.4 Im / 50 mA.
- the present molding material development is characterized by exceptional fracture mechanical properties, with K IC 1.34 MPaV and Gic 577 J / m 2 ; the encapsulated products can be used in all SMT processes and are also suitable for applications in the automotive sector (Tg> 130 ° C!)
- the mass reduction up to 300 ° C is ⁇ 2% (thermo balance, 10 K / min, nitrogen).
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001515731A JP4805500B2 (ja) | 1999-08-04 | 2000-08-04 | 高い温度および高い輝度または発光強度を有するsmt能を有するledに使用するための透明な注型樹脂材料 |
US10/048,667 US7009008B1 (en) | 1999-08-04 | 2000-08-04 | Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities |
DE50014391T DE50014391D1 (de) | 1999-08-04 | 2000-08-04 | Transparente giessharzmasse für smt-fähige led-anwendungen mit hoher temperatur und hohen helligkeiten oder leuchtstärken |
EP00963869A EP1216266B1 (de) | 1999-08-04 | 2000-08-04 | Transparente giessharzmasse für smt-fähige led-anwendungen mit hoher temperatur und hohen helligkeiten oder leuchtstärken |
US11/305,402 US7288606B2 (en) | 1999-08-04 | 2005-12-16 | Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19936605.5 | 1999-08-04 | ||
DE19936605A DE19936605A1 (de) | 1999-08-04 | 1999-08-04 | Transparente Gießharzmasse für SMT-fähige LED-Anwendungen mit hoher Temperatur und hohen Helligkeiten oder Leuchtstärken |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10048667 A-371-Of-International | 2000-08-04 | ||
US11/305,402 Continuation US7288606B2 (en) | 1999-08-04 | 2005-12-16 | Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001010926A1 true WO2001010926A1 (de) | 2001-02-15 |
Family
ID=7917094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/002614 WO2001010926A1 (de) | 1999-08-04 | 2000-08-04 | Transparente giessharzmasse für smt-fähige led-anwendungen mit hoher temperatur und hohen helligkeiten oder leuchtstärken |
Country Status (6)
Country | Link |
---|---|
US (2) | US7009008B1 (de) |
EP (1) | EP1216266B1 (de) |
JP (1) | JP4805500B2 (de) |
DE (2) | DE19936605A1 (de) |
TW (1) | TW575595B (de) |
WO (1) | WO2001010926A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6888174B2 (en) | 2002-03-25 | 2005-05-03 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | Opto-electronic semiconductor component |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19936605A1 (de) * | 1999-08-04 | 2001-02-15 | Osram Opto Semiconductors Gmbh | Transparente Gießharzmasse für SMT-fähige LED-Anwendungen mit hoher Temperatur und hohen Helligkeiten oder Leuchtstärken |
JP2008514764A (ja) * | 2004-09-28 | 2008-05-08 | ブルーワー サイエンス アイ エヌ シー. | 光電子用途に用いる硬化性高屈折率樹脂 |
JP2009530798A (ja) | 2006-01-05 | 2009-08-27 | イルミテックス, インコーポレイテッド | Ledから光を導くための独立した光学デバイス |
US8087960B2 (en) | 2006-10-02 | 2012-01-03 | Illumitex, Inc. | LED system and method |
JP2011512037A (ja) | 2008-02-08 | 2011-04-14 | イルミテックス, インコーポレイテッド | エミッタ層成形のためのシステムおよび方法 |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
TWM375225U (en) * | 2009-08-26 | 2010-03-01 | Chunghwa Picture Tubes Ltd | Light bar structure, back-light module and liquid crystal display thereof |
DE102010046122A1 (de) * | 2010-09-21 | 2012-03-22 | Osram Opto Semiconductors Gmbh | Elektronisches Bauelement |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3151540A1 (de) * | 1980-12-29 | 1982-08-19 | Ciba-Geigy GmbH, 7867 Wehr | "verwendung von transparenten anhydridhaertbaren epoxidgiessharzen" |
DE3241767A1 (de) * | 1982-11-11 | 1984-05-17 | Siemens AG, 1000 Berlin und 8000 München | Gefaerbte, transparente vergussmasse |
JPS61152723A (ja) * | 1984-12-27 | 1986-07-11 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
JPH09176282A (ja) * | 1995-12-27 | 1997-07-08 | Hitachi Chem Co Ltd | 光半導体素子封止用エポキシ樹脂組成物、及び該組成物を用いた光半導体装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2642465C3 (de) * | 1976-09-21 | 1981-01-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer VerguBmasse |
DE3016103A1 (de) * | 1980-04-25 | 1981-10-29 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung transparenter geissharze |
GB2090257A (en) | 1980-12-29 | 1982-07-07 | Ciba Geigy Ag | Use of transparent anhydride- curable epoxy casting resins |
JPS61162723A (ja) * | 1985-01-14 | 1986-07-23 | Ishida Scales Mfg Co Ltd | 電子秤 |
US4701481A (en) * | 1985-08-26 | 1987-10-20 | The Dow Chemical Company | Durable epoxy resin |
EP0235077B1 (de) * | 1986-01-17 | 1990-09-19 | Ciba-Geigy Ag | Härtbare Gemische auf Basis von Diglycidylverbindungen und Metallkomplexverbindungen |
DE3706088A1 (de) * | 1987-02-25 | 1988-09-08 | Siemens Ag | Reaktionsbeschleuniger fuer anhydridhaertbare epoxidharze und deren verwendung zur umhuellung und abdeckung von optoelektronischen bauelementen |
KR0169709B1 (ko) * | 1988-12-13 | 1999-03-20 | 하쯔도리 마사미쯔 | 에폭시 수지용 경화제 조성물 및 에폭시 수지 조성물 |
JP2837478B2 (ja) * | 1989-12-28 | 1998-12-16 | 日東電工株式会社 | 光半導体装置 |
GB9224854D0 (en) * | 1992-11-27 | 1993-01-13 | Ciba Geigy Ag | Moulding process |
JPH06233486A (ja) * | 1993-01-29 | 1994-08-19 | Hitachi Ltd | 絶縁電気線輪、回転電機及びその製造方法 |
JPH07288331A (ja) * | 1994-04-18 | 1995-10-31 | Nitto Denko Corp | 光半導体装置の製法およびそれに用いる光半導体封止用エポキシ樹脂組成物 |
JP3714568B2 (ja) * | 1996-08-06 | 2005-11-09 | 住友ベークライト株式会社 | 光半導体封止用エポキシ樹脂組成物 |
JP3851441B2 (ja) * | 1998-04-23 | 2006-11-29 | 日東電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物及び光半導体装置 |
JP3666287B2 (ja) * | 1999-02-16 | 2005-06-29 | 三菱電機株式会社 | 熱硬化性樹脂組成物およびそれを用いた絶縁コイル |
DE19936605A1 (de) * | 1999-08-04 | 2001-02-15 | Osram Opto Semiconductors Gmbh | Transparente Gießharzmasse für SMT-fähige LED-Anwendungen mit hoher Temperatur und hohen Helligkeiten oder Leuchtstärken |
-
1999
- 1999-08-04 DE DE19936605A patent/DE19936605A1/de not_active Ceased
-
2000
- 2000-08-03 TW TW89115581A patent/TW575595B/zh not_active IP Right Cessation
- 2000-08-04 EP EP00963869A patent/EP1216266B1/de not_active Expired - Lifetime
- 2000-08-04 JP JP2001515731A patent/JP4805500B2/ja not_active Expired - Fee Related
- 2000-08-04 WO PCT/DE2000/002614 patent/WO2001010926A1/de active IP Right Grant
- 2000-08-04 DE DE50014391T patent/DE50014391D1/de not_active Expired - Lifetime
- 2000-08-04 US US10/048,667 patent/US7009008B1/en not_active Expired - Lifetime
-
2005
- 2005-12-16 US US11/305,402 patent/US7288606B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3151540A1 (de) * | 1980-12-29 | 1982-08-19 | Ciba-Geigy GmbH, 7867 Wehr | "verwendung von transparenten anhydridhaertbaren epoxidgiessharzen" |
DE3241767A1 (de) * | 1982-11-11 | 1984-05-17 | Siemens AG, 1000 Berlin und 8000 München | Gefaerbte, transparente vergussmasse |
JPS61152723A (ja) * | 1984-12-27 | 1986-07-11 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
JPH09176282A (ja) * | 1995-12-27 | 1997-07-08 | Hitachi Chem Co Ltd | 光半導体素子封止用エポキシ樹脂組成物、及び該組成物を用いた光半導体装置 |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 010, no. 355 (C - 388) 29 November 1986 (1986-11-29) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 11 28 November 1997 (1997-11-28) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6888174B2 (en) | 2002-03-25 | 2005-05-03 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | Opto-electronic semiconductor component |
Also Published As
Publication number | Publication date |
---|---|
TW575595B (en) | 2004-02-11 |
US7009008B1 (en) | 2006-03-07 |
JP4805500B2 (ja) | 2011-11-02 |
US20060100397A1 (en) | 2006-05-11 |
EP1216266B1 (de) | 2007-06-06 |
DE50014391D1 (de) | 2007-07-19 |
EP1216266A1 (de) | 2002-06-26 |
DE19936605A1 (de) | 2001-02-15 |
US7288606B2 (en) | 2007-10-30 |
JP2003506539A (ja) | 2003-02-18 |
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