WO2000073855A1 - Dispositif et procede de fabrication pour circuits imprimes, circuit imprime lui-meme - Google Patents
Dispositif et procede de fabrication pour circuits imprimes, circuit imprime lui-meme Download PDFInfo
- Publication number
- WO2000073855A1 WO2000073855A1 PCT/JP2000/002519 JP0002519W WO0073855A1 WO 2000073855 A1 WO2000073855 A1 WO 2000073855A1 JP 0002519 W JP0002519 W JP 0002519W WO 0073855 A1 WO0073855 A1 WO 0073855A1
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- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- printed circuit
- mask
- wiring pattern
- exposure
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70066—Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Definitions
- the present invention relates to a printed wiring board manufacturing apparatus, a printed wiring board manufacturing method, and a printed wiring board manufactured by the method, in which a divided exposure is performed in a printed wiring board manufacturing process.
- printed board a printing method using ink and a photographic method by exposure are generally known, but a small-quantity product, Accuracy ⁇ Photographic methods are often used in the manufacture of printed circuit boards with high density patterns.
- a photoresist pattern (hereinafter abbreviated as “wiring pattern”) is projected onto the surface of a photosensitive material through an original photomask using an exposure apparatus, and photolithography technology is used.
- the conductive film pattern of the printed circuit board is formed by utilizing the method described above.
- the base material that forms the printed circuit board has a conductive film integrally formed on the surface of the insulating substrate, and a liquid photosensitive agent is applied and dried on the surface of the conductive film, or a thin photosensitive film is attached. Thus, a photoresist layer is formed.
- the wiring pattern of the original photomask formed on glass or film is projected and exposed on the surface of the photoresist on the printed circuit board using a projection exposure apparatus, and the exposed photoresist is developed to develop the photoresist.
- a wiring pattern identical to (or enlarged or reduced to) the wiring pattern of the mask is formed.
- the conductive film is etched or the like using this wiring pattern as a mask, whereby a printed substrate of the desired conductive film pattern can be obtained.
- the wiring pattern is projected by using the largest possible work size such as the base material forming the printed board from the viewpoint of productivity, and using the original photo mask in accordance with the size of the printed board. It is desirable to expose a plurality of wiring patterns and the like at once by using a large wiring pattern.
- the original photomask made of a printed substrate, glass or film, etc. expands and contracts under the influence of temperature and humidity, it is desirable that the work size be as small as possible for more precise exposure.
- step exposure in which a small original photomask is scanned over a large work size and divided exposure is sequentially performed has been attempted.
- the wiring pattern spacing should be as narrow as possible, i.e., adjacent wiring patterns and wiring patterns should be exposed with a narrow space. Is desirable from the viewpoint of improving the yield.
- identification marks such as a user name and a product number are formed around the wiring pattern on the small original photomask to identify the wiring pattern.
- the present invention has been made in order to solve the above-mentioned problems, and a printed circuit board manufacturing apparatus capable of performing exposure of an original photomask with a high yield while performing step exposure in consideration of identification marking.
- An object of the present invention is to provide a method for manufacturing a printed wiring board and a printed wiring board manufactured by the method. Disclosure of the invention The present invention has the following configuration to solve the above problem.
- a first gist of the present invention is that, in an exposure step on a printed board, an original mask having a wiring pattern area and an identification mark area around the wiring pattern area is sequentially moved to an exposure position on the print board.
- An apparatus for manufacturing a printed circuit board that performs multiple exposures while providing an original mask on the exposed surface side of the printed circuit board, and an opaque shielding member on the opposite side of the original mask from the printed circuit board. And a shielding member for selectively shielding the identification mark area of the original mask.
- the shielding member is a shielding plate capable of selectively shielding the identification mark area of the original mask in accordance with the exposure position of the printed circuit board. It is in the substrate manufacturing equipment.
- a third aspect of the present invention is the liquid crystal panel according to the first aspect, wherein the shielding member is a liquid crystal panel capable of selectively shielding the identification mark area of the original mask in accordance with the exposure position of the printed circuit board.
- This is a printed circuit board manufacturing apparatus.
- a fourth gist of the present invention is that, in an exposure step on a printed board, an original mask having a wiring pattern area and an identification mark area around the wiring pattern area is sequentially moved to an exposure position on the print board.
- a method for manufacturing a printed circuit board that performs multiple exposures while exposing the identification mark areas between adjacently exposed wiring pattern areas so that the identification mark areas are not exposed. It is in the manufacturing method of the printed circuit board.
- a fifth aspect of the present invention resides in a printed circuit board manufactured by the method for manufacturing a printed circuit board described in the fourth aspect.
- the first gist of the present invention by providing an original mask on the surface to be exposed of a printed circuit board, a wiring pattern in the wiring pattern area of the original mask and an identification mark in an identification mark area are provided on the printed circuit board. Exposure becomes possible, and the pre-mask By providing an opaque shielding member on the side opposite to the printed circuit board, the opaque shielding member blocks the irradiation light and prevents exposure of the original mask only to that part.
- the shielding member selectively shields the identification mark area of the original mask, so that the wiring pattern can be exposed adjacent to the printed circuit board at a small interval, and can be exposed within a predetermined size.
- the number of wiring patterns is increased, so that yield can be improved and productivity can be improved.
- identification marks are used for parts around the wiring patterns that do not improve the yield, for example, parts that are close to the periphery of the printed circuit board, and between adjacent wiring patterns that do not improve the yield even if the width of the adjacent wiring patterns is reduced.
- By selectively exposing the area it is possible to make identification marks necessary for production process management.
- the plating lead space of the printed circuit board can be secured and the plating processing can be performed more efficiently.
- a shielding member is configured with a simple device so that the shielding plate can selectively shield the identification mark area of the original mask in accordance with the exposure position of the printed circuit board. Can be.
- the shielding member is a liquid crystal panel
- the black and white area of the liquid crystal panel is selectively changed to selectively shield the identification mark area of the original mask. Since there is no mechanically fluctuating portion and the liquid crystal panel has a thin and lightweight external configuration, a compact printed circuit board manufacturing apparatus can be provided.
- a plurality of exposures are performed while shielding the identification mark area so that the identification mark area is not exposed between the adjacently exposed wiring pattern areas. Therefore, it is possible to adjust the interval between adjacently exposed wiring pattern areas, and it is possible to expose an optimal and maximum wiring pattern in a printed circuit board of a predetermined size.
- the part where the wiring pattern area is not exposed adjacently that is, the printed circuit board Is exposed to the identification mark area.
- the yield and productivity can be improved for a printed circuit board of a predetermined size, and an identification mark required for production process management can be provided.
- the fifth aspect of the present invention since each wiring pattern on the printed circuit board is sequentially performed by step exposure, the influence of heat shrinkage or the like of the printed circuit board or the original mask is minimized, and a high-precision wiring pattern is formed. Formation is possible.
- the identification mark area can be exposed in the peripheral area of the printed circuit board, and the identification mark required for production process management can be provided.
- a wide margin can be provided in the peripheral area of the printed circuit board or the like, a plating lead base of the printed circuit board can be secured, and the efficiency of the plating process can be improved.
- FIG. 1 is a schematic explanatory diagram partially showing a print substrate manufacturing apparatus for performing divided exposure according to a first embodiment of the present invention in a block diagram
- FIG. 2 is an enlarged functional explanatory view of a part of a printed circuit board manufacturing apparatus for performing divided exposure according to the first embodiment of the present invention
- FIG. 3 is a front view (a, b) of the area mask and the pattern mask according to the first embodiment of the present invention and an operational explanatory view of a relative positional relationship (c) at the time of exposure;
- FIG. 4 is an explanatory view operatively showing the area mask according to the first embodiment of the present invention
- FIG. 5 is an explanatory diagram showing an arrangement relationship for printing wiring patterns at four locations on a printed board of a predetermined size according to the first embodiment of the present invention
- Fig. 6 shows each area when printing the wiring pattern at each position described in Fig. 5. It is an explanatory view showing a relative positional relationship between the mask and the pattern mask,
- FIG. 7 is an operational schematic front view of an area mask according to a second embodiment of the present invention.
- FIG. 8 is an explanatory diagram of a printed board and a wiring pattern exposure position according to a second embodiment of the present invention.
- FIG. 9 is an operational explanatory diagram of the step exposure according to the second embodiment of the present invention
- FIG. 10 is an operational explanatory diagram of the step exposure according to the second embodiment of the present invention.
- FIG. 11 is an operational explanatory view of step exposure according to the second embodiment of the present invention.
- FIGS. 1 to 6 show a first embodiment of the present invention.
- FIG. 1 is a schematic front view of an exposure apparatus for a printed circuit board
- FIG. 3 is a schematic side view of a manufacturing apparatus (exposure process) of the present invention, and is a functional explanatory view moving up and down.
- FIG. 3 shows a front view (a, b) of the area mask 4 and the pattern mask 3 and the exposure time
- FIG. 4 is an explanatory view of the relative positional relationship (c)
- FIG. 4 is an explanatory view of the area mask 4 operatively
- FIG. 6 is an explanatory view showing a layout relationship for exposing and printing a line pattern.
- FIG. 6 shows a relative position of each area mask 4 and a pattern mask 3 when exposing and printing a wiring pattern 3a at each position shown in FIG. It is explanatory drawing which shows a relationship.
- a shown in Fig. 1, 1 is a table 1 that can be moved in a two-dimensional direction, 2 is a printed circuit board 2 to be processed, and 3 is a printed circuit board.
- a glass mask 3 for forming a wiring pattern on the substrate 2 4 is an area mask 4 for masking the glass mask 3, and 5 is a support for the glass mask 3.
- Reference numeral 6 denotes a light source 6
- reference numeral 6 denotes a light source for positioning
- reference numeral 8 denotes a control device for controlling the table 1
- reference numeral 9 denotes a data source.
- 1 shows an input / output device for performing input / output.
- the glass mask 3, the area mask 4 and the mask holder 5 can be moved up and down on the printed circuit board 2 by a supporting means (not shown) as shown by solid lines and chain lines (imaginary diagram). After the substrate 2 and the glass mask 3 are positioned at predetermined positions, the light is exposed from above by the light source 6.
- the table 1 is a flat top surface table which can be controlled to be able to move forward and backward, move left and right, and rotate freely in a two-dimensional direction (the same plane), and on which a printed circuit board 2 can be placed.
- the printed circuit board 2 is obtained by forming a conductive material layer on the surface of an insulating substrate material by electrolysis or rolling.
- the insulating substrate material paper, cloth, glass cloth, glass nonwoven fabric, or synthetic fiber cloth is used. Copper foil or the like is used as the conductive material layer.
- a photoresist layer is formed by applying a liquid photosensitive agent on the conductive material layer and drying it, or by attaching a thin photosensitive film.
- the glass mask 3 is printed with a negative (or positive) wiring pattern 3a (indicated by an area) on a substantially central portion of a rectangular glass plate having a predetermined size, and is transparent around the periphery.
- a margin 3b is formed.
- identification marks 3c1, 3c2, 3c3 (shown in the area) such as the user name, product number, and lot number of the wiring pattern are printed on the left, right, and lower margins. ing. In the case of a post pattern, the surrounding area is (black) and white identification markings are applied.
- the glass mask 3 is supported by the mask holder 5 at the transparent margin 3b, is opposed to the conductive material layer of the printed circuit board 2, and can be freely moved close to and away from the printed circuit board 2. Is provided.
- the area mask 4 is a substantially frame-shaped, opaque plate-shaped body with a rectangular hollow at the center as shown in FIG. 3 (b), and the hollow shape is as shown in FIG. 3 (c).
- the glass mask 3 is formed larger than the wiring pattern area 3a.
- the area mask 4 is disposed opposite to the glass substrate 3 on the side opposite to the printed circuit board 2 with a predetermined gap. As a result, the area mask 4, the glass mask 3, and the printed circuit board 3 are formed. 2 are arranged in layers.
- the area mask 4 is supported by the motors MX and MY and the support arms AX and AY so that the relative position of the area mask 4 with respect to the glass mask 3 can be moved in the XY directions. I'm done.
- the light source 6 is provided at a predetermined interval from the area mask 4, emits visible light, ultraviolet light, an electron beam, or the like, passes through the wiring pattern portion of the glass mask 3, and forms a wiring pattern on the photoresist layer of the print substrate 2. Is exposed.
- the camera 7 is a camera used to position the wiring pattern 3a of the glass mask 3 or the like at an arbitrary position with respect to the printed circuit board 2, for example, a CCD camera as a photoelectric conversion element, and is connected to the control unit 8. Have been.
- the control unit 8 controls the entire exposure apparatus A, and enables the exposure of the area mask 4 to an arbitrary position on the printed circuit board 2 based on the data of the camera 7 and the input / output device described later. is there.
- the input / output device 9 includes a keyboard, a data storage medium, for example, a reading device such as a floppy disk hard disk, various sensors (not shown), a communication medium, and the like, and serves as a positioning control data source by the control unit 8.
- a wiring pattern 3a is printed on four portions of a printed circuit board 2 having a predetermined size by exposure.
- the step exposure sequence is the order of (1) to (4) in FIG. 5, the interval between adjacent print substrates 2 is a predetermined width S, and the four wiring patterns 3 a are substantially at the center of the printed substrate 2. Step exposure is performed so as to be evenly arranged at the positions.
- the predetermined width S is a margin width formed up to the periphery of the wiring pattern 3a, and the predetermined width S is arbitrarily determined in consideration of cutting at the outer shape finishing stage, etc. Then, it may be automatically determined.
- the controller 8 controls the table 1 based on the data of the camera 7 and the input / output device 9 in order to expose the printed circuit board 2 to the portion (1) in FIG.
- the position of the printed circuit board 2 is determined in accordance with (FIG. 1) and the glass mask 3, and the relative positional relationship between the glass mask 3 and the area mask 4 is also controlled.
- the relative positioning between the glass mask 3 and the area mask 4 is performed such that the width S1 is provided for the margin in the adjacent wiring pattern 3a direction as shown in FIG. 6 (1), and as a result, The portion other than the wiring pattern 3a direction adjacent to the wiring pattern 3a is formed with a large margin portion of the width W.
- the glass mask 3 and the area mask 4 are controlled to descend so that the glass mask 3 is placed on or close to the printed circuit board 2 as shown in FIGS. 2 (a) and 2 (b). Then, light is irradiated from the light source 6 onto the glass mask 3 to expose the wiring pattern 3 a to the surface of the print substrate 2.
- the glass mask 3 and the area mask 4 are raised to perform exposure in (2) in FIG. Position 3 and area mask 4.
- positioning is also performed so that a width S1 is provided for a margin in the direction of the adjacent wiring pattern 3a as shown in FIG. 6 (2), and a portion other than the direction of the adjacent wiring pattern 3a is provided. It is made to form a large width margin.
- (3) and (4) in FIG. 5 are performed in the same manner as shown in (6) and (4) in FIG.
- the adjacent wiring patterns 3a are evenly exposed at a narrow interval S on the printed circuit board 2 by the four step exposures described above, and the surrounding margins are formed.
- the identification markings 3c1, 3c2, and 3c3 are printed on (widths Wl, W2).
- Each wiring pattern 3a on the printed circuit board 2 exposed by the exposure apparatus A described above is sequentially performed by step exposure, so that the influence of heat shrinkage of the printed circuit board 2 and the area mask 4 and the like is minimized to achieve high precision. It is possible to form a maximum number of wiring patterns on a single printed circuit board because the adjacent wiring patterns are exposed at a narrow interval S, thereby improving the yield. Became possible.
- identification markings 3c1, 3c2, and 3c3, such as a user name, a product number, and a lot number, necessary for identifying the wiring pattern could be formed on the printed circuit board 2.
- the margins (widths Wl and W2) can be appropriately secured, the plating lead space of the printed circuit board 2 (the holding portion at the time of plating) can be secured, and the efficiency of plating can be improved.
- the wiring pattern 3a is required because it is necessary to have a portion of the holding member S wiring pattern 3a in the plating process. There will be a portion that is not plated inside.
- the area mask has a simpler configuration, and more identification markings are provided.
- the description has been made with a substantially forehead shape.
- the identification marking so that exposure can be performed. Therefore, in the second embodiment, a more general-purpose wiring pattern exposure unit will be described.
- FIGS. 7 to 11 a case will be described with reference to FIGS. 7 to 11 in which a single printed circuit board is subjected to step exposure of a wiring pattern at six places.
- the structure of the area mask is the same as that of the first embodiment except for the size of the printed circuit board. Since the configuration is the same, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted. The description will focus on features of the present embodiment.
- FIG. 7 is a schematic front view of the operation of the area mask 10
- FIG. 8 is an explanatory view of the exposure position of the printed circuit board 16 and the wiring pattern
- An area mask 10 shown in FIG. 7 includes a rectangular annular base 11, support arms 12 X, 12 Y provided on a peripheral portion of the annular base 11 so as to be orthogonal to each other, An arm support member 13 for supporting the ends of the arms 12 X and 12 Y at a predetermined height from the annular base 11, and the parallel support arms 12 X and 12 X, and a support arm
- the moving masks 14 X, 14 Y having a width W 3 slidably mounted on both ends between the 1 2 Y _ 1 2 Y and the moving masks 14 X, 14 Y can be moved forward and backward. It is roughly composed of controllable air cylinders 15X and 15Y. The positions of the air cylinders 15 X and 15 Y are controlled by the control device 8.
- the pair of support arms 12 provided in parallel are rods of the same diameter supported at the same height on the annular base 11 by arm support members 13, and a pair of parallel support arms 1 2 Y
- the support arm 1 2 X and the support arm 1 2 Y are perpendicular to each other, and the support height from the annular base 11 is higher for the support arm 12 Y than for the support arm 12. Is also supported at a higher position.
- Both ends of the pair of moving masks 14 X are slidably engaged with the pair of supporting arms 12 Y, and similarly, both ends of the pair of moving masks 14 Y are also slid on the pair of supporting arms 12 X. It is movably engaged, and as a result, the moving masks 14 X and 14 Y are assembled in a cross-girder form from the front, and by moving each moving mask 14 X and 14 Y respectively, it is surrounded by them Both the size and the position of the opening ⁇ P formed by being formed can be changed.
- the area mask 10 having the above configuration, since the moving masks 14 X and 14 Y have a predetermined width W 3, the area mask 10 is provided between the glass mask 3 and the light source 6. , Acts as a mask member for the light emitted from the light source 6 and The size and position of the opening ⁇ P can be adjusted by controlling the advance and retreat of the air cylinders 15X and 15Y that can be controlled, making it a more general-purpose mask member.
- the air cylinders 15X and 15Y are not limited to this, and may be any drive member that can control the forward and backward movements, and may be, for example, a pulse motor, a servomotor, or the like.
- FIG. 8 shows a case where the wiring patterns 3a (FIG. 3) at six places are exposed on one printed circuit board 16, and the area mask 10 ( FIG. 7) and the relative operation of the printed circuit board 16 are schematically shown in FIG. 9 to FIG.
- the adjacent margin of each wiring pattern 3 a is set to the interval S, and a wide margin is provided in the peripheral direction of the print substrate 16.
- the opening OP The air cylinders 15X and 15Y are controlled under the same conditions as those of the area mask 4 in the first embodiment with respect to the size and the relative positional relationship with the glass mask 3 (see FIG. 9).
- the width S1 is provided in the portion where the three sides are adjacent to the adjacent wiring pattern 3a, and the other side has a large width W in the margin.
- the size of the opening ⁇ P and the relative position with respect to the glass mask 3 are controlled so as to form (FIG. 9 (b)).
- the exposure shown in Fig. 8 (5) allows the identification marking 3c2 to be displayed in the lower margin.
- the area mass in which the size and position of the opening OP can be adjusted is in addition to the effects of the first embodiment, a general-purpose type capable of coping with the main types of conditions such as the size of the wiring pattern, the layout relationship of the wiring pattern, the position of the identification marking, etc. It is possible to provide a simple mask. In addition, since a wide margin can be provided in the peripheral direction of the printed circuit board 16, the plating space (holding portion during the plating process) force of the printed circuit board 16 can be secured, and the efficiency of the plating process can be improved.
- the preferred embodiment of the present invention has been described in the above embodiment, it goes without saying that the present invention is not limited to this.
- the area mask 4 is used, and in the second embodiment, the moving masks 14 X and 14 Y are used to block the irradiation of the light from the light source 6 onto the glass mask 3 in an arbitrary area.
- the moving masks 14 X and 14 Y are used to block the irradiation of the light from the light source 6 onto the glass mask 3 in an arbitrary area.
- the irradiation light region can be arbitrarily controlled, and the same operation and effect as in the above embodiment can be obtained.
- liquid crystal panel having a size equal to that of a printed circuit board, it is not necessary to move each time step exposure is performed, so that the apparatus can be simplified and costs can be reduced.
- the yield is improved by preventing the identification marking from being exposed between the adjacent wiring patterns, and the yield is improved.
- the optimal number of wiring patterns by the shape of the printed circuit board or the wiring pattern, etc. It is needless to say that if there is a space between adjacent wiring patterns where the identification mark can be exposed, the exposure may be performed selectively or regularly according to the arrangement relationship.
- the shielding member selectively shields the identification mark area of the original mask, so that the wiring pattern is exposed adjacent to the printed circuit board at a narrow interval.
- the number of wiring patterns that can be exposed within a predetermined size has increased, and the yield and productivity have been improved.
- the identification marks required for production process management could be applied.
- a wide margin can be provided in a portion close to the periphery of the printed circuit board, a plating lead space of the printed circuit board can be secured, and the efficiency of the plating process can be improved.
- a shielding member is configured with a simple device so that the shielding plate can selectively shield the identification mark area of the original mask in accordance with the exposure position of the printed circuit board.
- the liquid crystal panel is a shielding member, the black and white area of the liquid crystal panel is selectively changed to selectively shield the identification mark area of the original mask. Since there is no mechanically fluctuating part and the liquid crystal panel has a thin and lightweight external configuration, it can be a compact printed circuit board manufacturing device.
- a plurality of exposures are performed between the adjacently exposed wiring pattern areas while shielding the identification mark area so that the identification mark area is not exposed.
- the distance between the wiring pattern areas exposed during exposure can be adjusted, and the optimum and maximum wiring patterns can be exposed in a printed circuit board of a predetermined size.
- the identification mark area is exposed to the adjacent wiring pattern area, that is, the peripheral area of the printed circuit board.
- each wiring pattern on a printed circuit board is sequentially performed by step exposure, the influence of heat shrinkage or the like of a printed substrate or an original mask is minimized, and a high-precision wiring pattern is formed. Can be formed.
- the identification mark area can be exposed in the peripheral area of the printed circuit board, and the identification mark required for production process management can be provided. Also, the peripheral area of the printed circuit board A wide margin can be provided in the area, etc., so that the plating lead base of the printed circuit board can be secured and the efficiency of plating processing can be improved.
- a printed circuit board manufacturing apparatus that performs a divided exposure (step exposure) in which a small original photomask is scanned over a large work size and is sequentially divided and exposed a plurality of times. It is suitable for a printed circuit board manufacturing method and a printed circuit board manufactured by the manufacturing method.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20000919134 EP1189111A4 (en) | 1999-05-27 | 2000-04-18 | DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUITS, PRINTED CIRCUIT HIMSELF |
US09/989,892 US20020051915A1 (en) | 1999-05-27 | 2001-11-20 | Manufacturing apparatus for printed boards, manufacturing method of printed boards and the printed board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14857999A JP3035297B1 (ja) | 1999-05-27 | 1999-05-27 | プリント基板の製造装置および製造方法 |
JP11/148579 | 1999-05-27 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/989,892 Continuation US20020051915A1 (en) | 1999-05-27 | 2001-11-20 | Manufacturing apparatus for printed boards, manufacturing method of printed boards and the printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000073855A1 true WO2000073855A1 (fr) | 2000-12-07 |
Family
ID=15455908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2000/002519 WO2000073855A1 (fr) | 1999-05-27 | 2000-04-18 | Dispositif et procede de fabrication pour circuits imprimes, circuit imprime lui-meme |
Country Status (4)
Country | Link |
---|---|
US (1) | US20020051915A1 (ja) |
EP (1) | EP1189111A4 (ja) |
JP (1) | JP3035297B1 (ja) |
WO (1) | WO2000073855A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5007538B2 (ja) * | 2006-08-30 | 2012-08-22 | 株式会社ニコン | 露光装置、デバイスの製造方法及び露光方法 |
FR2968097B1 (fr) * | 2010-11-30 | 2013-08-16 | Altix | Machine d'exposition de panneaux. |
JP5770014B2 (ja) * | 2011-05-19 | 2015-08-26 | 株式会社ブイ・テクノロジー | フォトマスク及び露光装置 |
CN105629679B (zh) * | 2016-03-22 | 2017-11-10 | 武汉华星光电技术有限公司 | 边缘曝光机及边缘曝光区域打码方法 |
CN105572975B (zh) * | 2016-03-24 | 2017-10-13 | 京东方科技集团股份有限公司 | 掩模板及光配向方法 |
CN107450271B (zh) * | 2016-05-31 | 2019-10-25 | 上海微电子装备(集团)股份有限公司 | 光刻机刀口组、大视场光刻机和曝光方法 |
CN111619108A (zh) * | 2019-02-28 | 2020-09-04 | 宁波市石生科技有限公司 | 一种新型光固化3d打印设备 |
CN113689767B (zh) * | 2021-10-26 | 2021-12-28 | 江苏乐驾胜飞新能源科技有限公司 | 一种加速腐蚀的电路板腐蚀装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01125440U (ja) * | 1988-02-18 | 1989-08-28 | ||
JPH0394257A (ja) * | 1989-09-07 | 1991-04-19 | Yoshio Shimada | 密着焼付機の原画ホルダーにおける自動マスク装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5226902A (en) * | 1975-08-25 | 1977-02-28 | Hitachi Ltd | Method of making photomask pattern |
JPS6058576B2 (ja) * | 1976-09-22 | 1985-12-20 | 株式会社日立製作所 | 露光方法及びそれに使用する露光装置 |
JPS55129333A (en) * | 1979-03-28 | 1980-10-07 | Hitachi Ltd | Scale-down projection aligner and mask used for this |
JPS57124732A (en) * | 1981-01-27 | 1982-08-03 | Nec Corp | Manufacture of mask for automatic registering |
JPS5814137A (ja) * | 1981-07-16 | 1983-01-26 | Fujitsu Ltd | 縮小投影露光方法 |
EP0614124A3 (en) * | 1993-02-01 | 1994-12-14 | Nippon Kogaku Kk | Exposure device. |
JP3313628B2 (ja) * | 1997-10-20 | 2002-08-12 | 富士通株式会社 | 半導体装置の製造方法 |
-
1999
- 1999-05-27 JP JP14857999A patent/JP3035297B1/ja not_active Expired - Lifetime
-
2000
- 2000-04-18 WO PCT/JP2000/002519 patent/WO2000073855A1/ja not_active Application Discontinuation
- 2000-04-18 EP EP20000919134 patent/EP1189111A4/en not_active Withdrawn
-
2001
- 2001-11-20 US US09/989,892 patent/US20020051915A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01125440U (ja) * | 1988-02-18 | 1989-08-28 | ||
JPH0394257A (ja) * | 1989-09-07 | 1991-04-19 | Yoshio Shimada | 密着焼付機の原画ホルダーにおける自動マスク装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1189111A4 * |
Also Published As
Publication number | Publication date |
---|---|
JP2000338649A (ja) | 2000-12-08 |
EP1189111A1 (en) | 2002-03-20 |
EP1189111A4 (en) | 2002-11-06 |
JP3035297B1 (ja) | 2000-04-24 |
US20020051915A1 (en) | 2002-05-02 |
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