WO2000055808A1 - Procede de fabrication pour dispositif electronique du type carte sans contact - Google Patents
Procede de fabrication pour dispositif electronique du type carte sans contact Download PDFInfo
- Publication number
- WO2000055808A1 WO2000055808A1 PCT/FR2000/000555 FR0000555W WO0055808A1 WO 2000055808 A1 WO2000055808 A1 WO 2000055808A1 FR 0000555 W FR0000555 W FR 0000555W WO 0055808 A1 WO0055808 A1 WO 0055808A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- antenna
- manufacturing
- produced
- insulating
- Prior art date
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Definitions
- the present invention relates to the manufacture of electronic devices, comprising at least one circuit chip embedded in the support and electrically connected to interface elements by connection pads.
- These electronic devices constitute for example portable devices such as smart cards, and more particularly cards capable of operating without contact using an antenna integrated in the card, or even electronic labels or electronic modules comprising a antenna.
- Such cards are intended to carry out various operations such as, for example, banking operations, telephone communications, identification operations, debit operations or recharging of unit of account, and all kinds of operations which may be carried out remotely by high frequency electromagnetic coupling between a transmit-receive terminal and a card placed in the action area of this terminal.
- Labels and electronic modules allow all kinds of identification operations.
- a known solution of the prior art, described in the PCT document WO 96/07985, for making the connection between the antenna and the integrated circuit chip, consists in forming metal bosses on two contact pads of the chip, then to connect these bosses to the ends of an antenna wire.
- the antenna wire is a copper wire formed on a substrate and the bosses are applied to this antenna wire by hot compression.
- the interconnection block thus obtained presents problems of mechanical strength and brittleness in traction of the connection.
- the bosses undergo deterioration affecting the quality of the electrical connection.
- the mechanical stresses can even go so far as to cause the bosses to rupture and, consequently, the chip to be torn off.
- Contactless smart cards produced according to this prior method therefore have a relatively short lifespan.
- connection between the antenna and the chip is carried out by means of conductive adhesive applied between the antenna and metal bosses formed on two contact pads of the chip.
- conductive adhesive applied between the antenna and metal bosses formed on two contact pads of the chip.
- a significant excess thickness appears due to the presence of the glue and the bosses.
- manufacture of the card requires an additional step of distributing glue points.
- the bosses, and where appropriate the points of conductive adhesive have a significant thickness which is added to that of the antenna and that of the chip, which increases the size of the interconnection block obtained.
- ISO 7810 corresponds to a standard format card 85 mm long, 54 mm wide and 0.76 mm thick.
- the use of conductive glue when connecting the chip to the antenna can, in certain cases, lead to electrical malfunctions of the chip if the glue is poured on the flanks of the chip.
- the object of the present invention is to overcome the drawbacks of the prior art.
- the present invention proposes to manufacture an electronic device such as a contactless smart card, a label or an electronic module in which at least one chip is directly connected to an antenna by means of metallized bosses embedded in the thickness of the antenna, when the chip is transferred to the antenna.
- the method according to the present invention proposes to transfer the chip onto an insulating substrate and to package it so as to isolate its sides while leaving its contacts flush.
- the present invention more particularly relates to a method of manufacturing an electronic device comprising at least one circuit chip integrated connected to an antenna, characterized in that it comprises the following steps: transfer of a chip into an imprint formed in a support made of insulating material; connection of the chip to an antenna by hot lamination of an insulating sheet carrying the antenna, the connection pads of the antenna being placed opposite the connection pads of the chip.
- the imprint is constituted by a perforated insulating sheet, laminated or glued on a second insulating sheet, the perforation having dimensions greater than those of the chip.
- the impression is machined in the insulating material.
- the method according to the invention further comprises a step of isolating the sides of the chip.
- the flanks of the chip are insulated by distributing an insulating material filling the gap between the edges of the imprint and the flanks of the chip.
- flanks of the chip are insulated by spraying an insulating material.
- flanks of the chip are insulated by hot lamination of the material of the insulating support so as to form a flow in the interval between the edges of the imprint and the flanks of the chip.
- the step of protecting the flanks of the chip and the step of Connection of the chip to the antenna is carried out during a single lamination.
- the chip includes metal bosses made on each contact pad, the antenna being made of a material capable of being softened by thermocompression.
- the metallized bosses have a substantially conical shape.
- the insulating sheets have dimensions greater than or equal to the format of the electronic devices to be produced, the insulating sheets being cut out, after the step of connecting a plurality of chips to a plurality of antennas, to release a plurality of electronic devices.
- the insulating sheets have dimensions equal to the format of the electronic device to be produced, a chip being connected to an antenna.
- the electronic device to be produced is a smart card.
- the electronic device to be produced is an electronic label.
- the manufacturing method according to the invention has the advantage of protecting the sides of the chip during the interconnection step.
- the method according to the present invention makes it possible to interconnect an array of chips on a plurality of antennas in a single operation. Indeed, it is possible to position a plurality of chips in a plurality of cavities in order to accommodate a large circuit or a plurality of circuits which are cut after the connection step.
- the bosses are embedded in the thickness of the antenna, the interconnection assembly formed by the chip and the antenna has a reduced bulk, which is very advantageous for producing an ultra-flat electronic module. .
- Figures la to lf illustrate the connection steps between a chip 10 and an antenna 6.
- the interconnection assembly formed by the chip 10 and the antenna 6 is intended to be inserted in a smart card without contact thickness ultra fine and less than the ISO standardized thickness, or in any other electronic device comprising an antenna.
- the figures and the description which follow refer to a chip and an antenna.
- the present invention also applies to a method of manufacturing a contactless inset circuit comprising a plurality of chips and a plurality of antennas.
- an imprint 3 is made in an insulating support 1, of dimension slightly larger than the size of a chip.
- the insulating substrate 1 can consist, for example, of plastic sheets of polyvinyl chloride (PVC) or polyethylene (PE).
- this imprint 3 can be machined in the insulating support 1 or created by gluing or by lamination of two insulating sheets 1 and 2 one on the other, the sheet 1 being perforated by an imprint 3.
- These sheets 1 and 2 are preferably cut to the format of the card or of the circuit that we want to make.
- FIG. 1b illustrates the transfer of a chip 10 in the imprint 3 of the sheet 1. This transfer is carried out, active face up, according to any known technique.
- the contacts 11 of the chip 10 are flush with the surface of the insulating sheet 1.
- a preliminary step of the manufacturing method according to the invention consists in forming metallized bosses 12 on contact pads 11 of the chip 10.
- the bosses 12 are intended to ensure the electrical connection between the chip 10 and the antenna 6. They are therefore necessarily made of a conductive material. They can for example be made of gold, or else of a polymer material loaded with metallic particles.
- the bosses 12 are made on the two contact pads 11 of the chip 10 in order to be able to make a connection on conductive pads of the antenna 6 located at its ends. Since the bosses 12 are intended to become embedded in the thickness of the antenna 6, they preferably have a thickness approximately equal to, or slightly less than, that of the antenna. In addition, to allow good penetration of the bosses 12 in the thickness of the antenna 6, a substantially conical shape is preferred to them.
- edge of the chip 10 is conductive, it is advantageous to insulate its sides. This step is not necessary when using a type of chip 10 whose wafers are not conductive by nature, and are therefore already isolated.
- Figures le and ld illustrate a particular embodiment of the insulation of the sides of the chip 10.
- a sheet 4 is hot rolled on the insulating sheet-chip assembly.
- This sheet 4 is advantageously such that it does not adhere to the insulating sheets 1 and 2 defining the imprint 3.
- a lamination mat in place of the sheet 4.
- hot lamination on the insulating sheet-chip assembly produced by a mat or by a sheet 4, makes it possible to promote the spreading of the partially molten material of the insulating sheet 1 so as to isolate the edges of the chip 10.
- a casting 13 of the material of the sheet 1 makes it possible to close the gap left between the chip 10 and footprint 3 slightly larger than the latter.
- the chip 10 is thus embedded in an insulating substrate constituted by the two sheets 1 and 2, with the contact pads 11 and its bosses 12 flush with the surface of the sheet 1.
- flanks of the chip 10 can be isolated by distribution or by spraying an insulating material filling the gap between the edges of the imprint 3 and the flanks of the chip 10.
- an antenna 6 is produced on an insulating support 5.
- the insulating support 5 is for example constituted by a plastic sheet in the format of the smart card or of the circuit to be produced. It can for example be composed of polyvinyl chloride (PVC) or polyethylene (PE).
- PVC polyvinyl chloride
- PE polyethylene
- the antenna 6 is made of a conductive material capable of being softened at the time of its connection with the chip 10, in order to allow better penetration of the bosses 12. Its shape does not matter, it can for example represent a spiral or any other pattern .
- a first embodiment consists in producing the antenna 2 in a thermoplastic material loaded with metallic particles.
- the antenna is formed by screen printing of conductive ink with a thermoplastic base.
- the metal particles are for example constituted by small silver beads.
- the sheet 5 is hot rolled on the sheets 1 and 2.
- the addition of heat makes it possible to soften the thermoplastic material constituting the antenna 6, and the lamination facilitates the penetration of the bosses 12 into the thickness of the antenna in view to make the connection of the chip 10 to the antenna 6.
- the interconnection assembly obtained is allowed to cool in ambient air in order to allow the material of the antenna to recover its solid state and its initial form.
- the thermoplastic antenna generally has adhesive properties during its softening which allow the chip to be fixed.
- the antenna 6 is made of a conductive thermosetting polymeric material, that is to say charged with metallic particles.
- care is taken not to polymerize the antenna material before the step of connecting the chip with the antenna, so that this material is present in a viscous state.
- the hot lamination then makes it possible on the one hand to facilitate the penetration of the bosses 12 into the thickness of the material of the antenna 6, and on the other hand to polymerize the thermosetting material constituting the antenna 6 in order to harden it.
- FIG. 1f illustrates the interconnection assembly obtained by the method according to the present invention.
- the manufacturing method according to the invention it is possible to manufacture electronic devices such as labels or smart cards without contact of ultra thin thickness.
- the thickness of the device obtained is in fact equal to the sum of the thicknesses of the three plastic sheets 1, 2 and 5, and of the antenna 6, the chip 10 being embedded in the sheet 1, and the bosses 12 being embedded in the thickness of the antenna 6.
- the bosses 12 being completely embedded in the thickness of the antenna 6, they are not likely to be damaged by mechanical stresses.
- the interconnection assembly obtained therefore has very good mechanical strength and an increased service life. Furthermore, it is possible, using the method of the present invention, not to work only in the format of a card, but in a larger format and then to cut out a plurality of cards. It is thus possible, in a single operation, to connect an array of chips to an array of antennas and to carry out their insertion.
- the method according to the invention produced from large insulating sheets 1, 2, 5, allows precise positioning of the sheets with respect to each other, and therefore precise positioning of the contact pads of the chips with respect to the connection pads antennas.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60003167T DE60003167T2 (de) | 1999-03-12 | 2000-03-06 | Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art |
AT00909436T ATE242518T1 (de) | 1999-03-12 | 2000-03-06 | Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art |
US09/936,302 US6677186B1 (en) | 1999-03-12 | 2000-03-06 | Method for making an electronic device such as a contactless card |
EP00909436A EP1163637B1 (fr) | 1999-03-12 | 2000-03-06 | Procede de fabrication pour dispositif electronique du type carte sans contact |
AU31724/00A AU3172400A (en) | 1999-03-12 | 2000-03-06 | Method for making an electronic device such as a contactless card |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9903102A FR2790849B1 (fr) | 1999-03-12 | 1999-03-12 | Procede de fabrication pour dispositif electronique du type carte sans contact |
FR99/03102 | 1999-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000055808A1 true WO2000055808A1 (fr) | 2000-09-21 |
Family
ID=9543140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2000/000555 WO2000055808A1 (fr) | 1999-03-12 | 2000-03-06 | Procede de fabrication pour dispositif electronique du type carte sans contact |
Country Status (8)
Country | Link |
---|---|
US (1) | US6677186B1 (fr) |
EP (1) | EP1163637B1 (fr) |
CN (1) | CN1343340A (fr) |
AT (1) | ATE242518T1 (fr) |
AU (1) | AU3172400A (fr) |
DE (1) | DE60003167T2 (fr) |
FR (1) | FR2790849B1 (fr) |
WO (1) | WO2000055808A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007511811A (ja) * | 2003-05-13 | 2007-05-10 | ナグライーデー エスアー | 基板への電子部品の実装方法 |
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FR2775810B1 (fr) * | 1998-03-09 | 2000-04-28 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
IL127569A0 (en) | 1998-09-16 | 1999-10-28 | Comsense Technologies Ltd | Interactive toys |
US6607136B1 (en) | 1998-09-16 | 2003-08-19 | Beepcard Inc. | Physical presence digital authentication system |
AU5997299A (en) | 1998-10-02 | 2000-04-26 | Comsense Technologies Ltd. | Card for interaction with a computer |
US8019609B2 (en) | 1999-10-04 | 2011-09-13 | Dialware Inc. | Sonic/ultrasonic authentication method |
US9219708B2 (en) | 2001-03-22 | 2015-12-22 | DialwareInc. | Method and system for remotely authenticating identification devices |
DE10114355A1 (de) * | 2001-03-22 | 2002-10-17 | Intec Holding Gmbh | Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte |
EP1381985A4 (fr) * | 2001-03-22 | 2013-06-26 | Dialware Inc | Procede et systeme d'authentification a distance de dispositifs d'identification |
US6606247B2 (en) * | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
US7214569B2 (en) * | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
KR100910769B1 (ko) * | 2002-06-11 | 2009-08-04 | 삼성테크윈 주식회사 | Ic 카드 및, 그것의 제조 방법 |
FR2847365B1 (fr) * | 2002-11-15 | 2005-03-11 | Gemplus Card Int | Connexion/raccordement simultane par un percage d'adhesif d'encartage |
JP2004185208A (ja) * | 2002-12-02 | 2004-07-02 | Sony Corp | Icカード |
DE10257111B4 (de) * | 2002-12-05 | 2005-12-22 | Mühlbauer Ag | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
JP4479209B2 (ja) * | 2003-10-10 | 2010-06-09 | パナソニック株式会社 | 電子回路装置およびその製造方法並びに電子回路装置の製造装置 |
US7353598B2 (en) * | 2004-11-08 | 2008-04-08 | Alien Technology Corporation | Assembly comprising functional devices and method of making same |
US7615479B1 (en) | 2004-11-08 | 2009-11-10 | Alien Technology Corporation | Assembly comprising functional block deposited therein |
US20060109130A1 (en) * | 2004-11-22 | 2006-05-25 | Hattick John B | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
US7688206B2 (en) | 2004-11-22 | 2010-03-30 | Alien Technology Corporation | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
US7385284B2 (en) * | 2004-11-22 | 2008-06-10 | Alien Technology Corporation | Transponder incorporated into an electronic device |
WO2007002995A1 (fr) * | 2005-07-04 | 2007-01-11 | Griffith University | Fabrication de composants electroniques en plastique |
US7456748B2 (en) * | 2005-10-20 | 2008-11-25 | National Starch And Chemical Investment Holding Corporation | RFID antenna with pre-applied adhesives |
EP2001077A1 (fr) * | 2007-05-21 | 2008-12-10 | Gemplus | Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu |
EP2034429A1 (fr) * | 2007-09-05 | 2009-03-11 | Assa Abloy AB | Procédé de fabrication d'une carte et carte obtenue selon ledit procédé |
DE102007050102A1 (de) * | 2007-10-16 | 2009-04-23 | Smartrac Ip B.V. | Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul |
US20120256004A1 (en) * | 2011-04-07 | 2012-10-11 | Redbud Systems, LLC | Selectively enabled rfid tag |
DE102011115315A1 (de) * | 2011-09-29 | 2013-04-04 | Infineon Technologies Ag | Chipkarten-Modul für eine Chipkarte |
WO2014006787A1 (fr) * | 2012-07-04 | 2014-01-09 | パナソニック株式会社 | Structure de montage de composant électronique, carte de circuit imprimé et boîtier de puce sur film |
US10622700B2 (en) * | 2016-05-18 | 2020-04-14 | X-Celeprint Limited | Antenna with micro-transfer-printed circuit element |
FR3058545B1 (fr) * | 2016-11-04 | 2018-10-26 | Smart Packaging Solutions | Procede de fabrication d'un module electronique pour carte a puce |
CN109409486B (zh) * | 2018-10-31 | 2020-01-31 | 江苏恒宝智能***技术有限公司 | 一种智能卡及其加工方法 |
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ZA941671B (en) * | 1993-03-11 | 1994-10-12 | Csir | Attaching an electronic circuit to a substrate. |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
US6036099A (en) * | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
FR2769441A1 (fr) * | 1997-10-07 | 1999-04-09 | Philips Electronics Nv | Carte electronique sans contact et son procede de fabrication |
FR2769389B1 (fr) * | 1997-10-07 | 2000-01-28 | Rue Cartes Et Systemes De | Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte |
FR2778308B1 (fr) * | 1998-04-30 | 2006-05-26 | Schlumberger Systems & Service | Procede de realisation d'un composant electronique et composant electronique |
FR2780551B1 (fr) * | 1998-06-29 | 2001-09-07 | Inside Technologies | Micromodule electronique integre et procede de fabrication d'un tel micromodule |
FR2781298B1 (fr) * | 1998-07-20 | 2003-01-31 | St Microelectronics Sa | Procede de fabrication d'une carte a puce electronique et carte a puce electronique |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
FR2801707B1 (fr) * | 1999-11-29 | 2002-02-15 | A S K | Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux |
-
1999
- 1999-03-12 FR FR9903102A patent/FR2790849B1/fr not_active Expired - Fee Related
-
2000
- 2000-03-06 EP EP00909436A patent/EP1163637B1/fr not_active Expired - Lifetime
- 2000-03-06 CN CN00804888A patent/CN1343340A/zh active Pending
- 2000-03-06 DE DE60003167T patent/DE60003167T2/de not_active Expired - Lifetime
- 2000-03-06 US US09/936,302 patent/US6677186B1/en not_active Expired - Fee Related
- 2000-03-06 AT AT00909436T patent/ATE242518T1/de not_active IP Right Cessation
- 2000-03-06 AU AU31724/00A patent/AU3172400A/en not_active Abandoned
- 2000-03-06 WO PCT/FR2000/000555 patent/WO2000055808A1/fr active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US4931853A (en) * | 1986-05-20 | 1990-06-05 | Kabushiki Kaisha Toshiba | IC card and method of manufacturing the same |
US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
US5826328A (en) * | 1996-03-25 | 1998-10-27 | International Business Machines | Method of making a thin radio frequency transponder |
WO1998006063A1 (fr) * | 1996-08-02 | 1998-02-12 | Solaic | Carte a circuit integre a connexion mixte |
FR2756955A1 (fr) * | 1996-12-11 | 1998-06-12 | Schlumberger Ind Sa | Procede de realisation d'un circuit electronique pour une carte a memoire sans contact |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007511811A (ja) * | 2003-05-13 | 2007-05-10 | ナグライーデー エスアー | 基板への電子部品の実装方法 |
US8127997B2 (en) | 2003-05-13 | 2012-03-06 | Nagraid S.A. | Method for mounting an electronic component on a substrate |
Also Published As
Publication number | Publication date |
---|---|
ATE242518T1 (de) | 2003-06-15 |
US6677186B1 (en) | 2004-01-13 |
CN1343340A (zh) | 2002-04-03 |
DE60003167T2 (de) | 2004-05-06 |
EP1163637A1 (fr) | 2001-12-19 |
FR2790849A1 (fr) | 2000-09-15 |
EP1163637B1 (fr) | 2003-06-04 |
DE60003167D1 (de) | 2003-07-10 |
AU3172400A (en) | 2000-10-04 |
FR2790849B1 (fr) | 2001-04-27 |
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