WO2000011749A1 - Method for making an antenna for a medium comprising an electronic circuit - Google Patents

Method for making an antenna for a medium comprising an electronic circuit Download PDF

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Publication number
WO2000011749A1
WO2000011749A1 PCT/FR1999/001886 FR9901886W WO0011749A1 WO 2000011749 A1 WO2000011749 A1 WO 2000011749A1 FR 9901886 W FR9901886 W FR 9901886W WO 0011749 A1 WO0011749 A1 WO 0011749A1
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WO
WIPO (PCT)
Prior art keywords
antenna
manufacturing
layer
support
main body
Prior art date
Application number
PCT/FR1999/001886
Other languages
French (fr)
Inventor
Jacques Seneca
Ray Freeman
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU50467/99A priority Critical patent/AU5046799A/en
Publication of WO2000011749A1 publication Critical patent/WO2000011749A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Definitions

  • the invention relates to a method of manufacturing an antenna for an information carrier comprising an electronic circuit.
  • the invention relates more particularly to a method of manufacturing an antenna for an information medium of the integrated circuit card type or of the electronic label type.
  • At least one electronic circuit also called a chip, is integrated in a main body of the card made of plastic.
  • the main body comprises contact tracks of conductive material which are connected to the terminals of the integrated circuit and which allow the communication of the integrated circuit with a device in which the integrated circuit card is introduced.
  • contactless type smart cards are also known in which the same exchange of information is done remotely, by means of antennas.
  • an antenna for an integrated circuit card various methods of manufacturing an antenna for an integrated circuit card have already been proposed.
  • One of the most commonly used methods is to make a winding with a metal wire, this winding then being fixed on the main body of the card, possibly by over-grinding of the main body around the winding.
  • Another known method is to produce the antenna by printing a conductive ink.
  • the conductive ink is for example deposited through a mask which is provided with an opening corresponding to the antenna pattern according to the stencil technique or by screen printing.
  • conductive inks are generally composed of a binder, which is made fluid with the help of a solvent, and in which metallic particles are dispersed.
  • the particles Since the electrical conduction is made only by the metallic particles and not by the binder, the particles must generally be made of a material having a very good electrical conductivity, which requires the use of noble materials, such as silver and gold. As a result, these conductive inks are relatively expensive.
  • a layer of metallic material such as copper can be deposited on one face of the main body of the information medium, this layer extending over the entire surface intended to be occupied by the antenna. , then this metal layer is etched, electrochemically or mechanically, to obtain the antenna.
  • this method is expensive in raw material because a large part of the metal layer originally deposited is subsequently removed during the etching operation which makes it possible to obtain the antenna.
  • the object of the invention is therefore to propose a new method of manufacturing an antenna which is economical, in particular by making it possible to use an inexpensive conductive material and by avoiding any waste of this material. In addition, this process must make it possible to achieve manufacturing times that are short enough to allow mass production.
  • the invention provides a method of manufacturing an antenna for an information medium comprising an electronic circuit for which the antenna forms a communication interface, characterized in that the manufacturing of the antenna notably comprises the steps consisting in:
  • the material constituting the first layer is a metallic material
  • the material constituting the second layer is a metallic material
  • the "electroless" deposition of the first layer is carried out through a mask which covers the face of the antenna support and which is perforated according to the pattern of the antenna;
  • the electrolytic deposition of the second layer is done through a mask which covers the face of the antenna support and which is perforated according to the pattern of the antenna;
  • the mask is removed
  • the antenna support provided with the antenna forms a module which is attached in a main body of the information support;
  • the antenna support consists of at least part of a main body of the information support
  • FIG. 6 is a schematic cross-sectional view illustrating a mode of integration of an antenna produced according to the invention in a card of the credit card type.
  • the invention can be used in the context of the manufacture of any information medium comprising an electronic circuit for which an antenna forms a communication interface.
  • This information medium can equally well be an integrated circuit card, an identification label, a badge or any other medium.
  • the information medium will comprise a main body, the latter carrying an electronic circuit and an antenna, the antenna being electrically connected to the electronic circuit.
  • the main body of the information carrier may include other components and / or one can in particular provide that it also carries contact tracks, which are also electrically connected to the electronic circuit, as is the case in cards. with an integrated circuit of the "combi-card" type in which the same integrated circuit is connected both to contact tracks and to a transmitting antenna.
  • the nature of the electronic circuit can vary depending on the applications. It may be a transponder, as in the case of radio frequency identification badges, a memory unit, as for example in the case of preloaded payment, but it can also be an electronic circuit comprising a microprocessor.
  • the antenna can be manufactured either directly on the main body of the card, or on a separate antenna support which is subsequently fixed to the main body of the card, possibly by being integrated into the inside of it.
  • an antenna support 10 which, in this example, is of very reduced thickness, for example of the order of a few tens of microns.
  • This antenna support is preferably made of an organic polymer material such as ABS, PVC, polyester, polypropylene, polystyrene, or polycarbonate.
  • the method provides for the deposition, on this antenna support 10, of a first layer of a conductive material by "electroless" deposition (non-electrolytic chemical deposition, therefore without voltage at the electrodes, the support being simply immersed in a chemical bath).
  • This technique allows the deposition of a conductive material, for example a metallic material, on a non-conductive body, the adhesion of the metallic material to the body being ensured by chemical reactions of the autocatalytic type.
  • FIG. 2 shows the antenna support 10 after its upper face 12 has been treated in accordance with the electroless method which has been chosen. This treatment may for example consist of mechanical abrasion or of a chemical attack on the surface 12.
  • the process for electroless deposition of the conductive material is carried out through a mask 14 which is applied against the surface 12, this mask being provided with an add r 16 corresponding to the pattern of the antenna.
  • FIG. 4 shows the plate support 10 after a first metal layer 18 has been deposited on its upper surface 12, at the bottom of the aperture 16 of the mask 14 which rests against the upper surface 12 of the support antenna 10.
  • the material deposited electronically is preferably a metallic material. It may for example be nickel, tin or copper.
  • the thickness of the first conductive layer 18 can be relatively small. Indeed, it is known that most of the known methods of electroless deposition do not make it possible to obtain significant thicknesses of deposits in short periods of time compatible with the production of antennas in large series. Also, the thickness of the first layer 18 can for example be of the order of a micron.
  • the manufacture of the antenna is not continued by the deposition, on the first conductive layer 18 formed by electroless means, of a second layer of material conductor 20 which is deposited by an electrolytic route making it possible to obtain, quickly and economical, a relatively large thickness of conductive material, the two layers 18, 20 being of course electrically connected to each other.
  • the second layer 20 can be made of a metallic material. It may be the same metallic material as that of the first layer 18 or another material. Thus, for the production of the second conductive layer 20, it will be possible to use nickel, copper or a metal alloy such as a tin-lead alloy or a tin-indium alloy.
  • the thickness of the second layer 20 will be determined according to the characteristics of the antenna which it is desired to produce. By way of example, the thickness of this second layer 20 can be of the order of magnitude of ten microns. Thus, it can be seen in FIG.
  • an antenna module 22 which comprises the antenna support 10, the mask 14 and the antenna proper formed of the two layers 18, 20 of conductive material.
  • This module 22 the thickness of which can for example be between 50 and 100 microns, can be integrated into any type of information medium.
  • FIG 6 there is illustrated a mode of integration of the antenna model 22 in the main body 24 of a card integrated circuit which has a standardized thickness of the order of 850 microns.
  • the antenna module 22 is received inside a cavity 26 arranged in a central sheet 28 of the main body 24.
  • the card also comprises two upper 30 and lower 32 outer sheets arranged respectively against each of the faces of the central sheet 28, the upper external sheet 30 closing the cavity 26 in which the module 22 is fixed.
  • the main body 24 of the integrated circuit card is produced by rolling, the module 22 can be integrated by imprisonment between two laminated layers. If the main body 24 is produced by injection, it is conceivable that the antenna module 22 is embedded inside of it.
  • the antenna support 10 is formed by a part of the main body of the card, which eliminates any problem of fixing the antenna.
  • the thickness of the antenna module is sufficiently small so that it can be integrated into information carriers when the main body itself has a small thickness. It is thus possible to integrate such an antenna module into thin information carriers made of paper or cardboard. It is even possible to integrate it into information supports whose main body is relatively flexible.
  • the antenna module need not be covered with an outer layer of material from the main body. It can for example be apparent on the surface of it and possibly be simply covered by printing.
  • the method of manufacturing an antenna according to the invention is therefore particularly advantageous for the savings that it makes it possible to achieve. Indeed, the process does not lead to any waste of material. In addition, it avoids having to use noble materials, especially for the production of the antenna. Finally, by combining two types of deposits, electroless and electrolytic, one can obtain a production rate fast enough that this process can be applied to the manufacture of contactless integrated circuit cards, which are produced in very large series at rates very high. The method can be used if necessary for the manufacture of a communication interface of the contact pad type.

Abstract

The invention concerns a method for making an antenna for a medium comprising an electronic circuit for which the antenna forms a communication interface. The invention is characterised in that the method for making the antenna consists in particular in: depositing, on one surface (12) of the antenna support (10) made of polymer material, a first layer (18) of a conductive material, by electroless deposit, according to a pattern corresponding to the shape of the antenna; depositing a second layer (20) of conductive material, by electrolytic deposit, the first layer forming an electrode for the electrolytic deposit.

Description

Procédé de fabrication d'une antenne pou r un support d'informations comportant un circuit électronique. Method of manufacturing an antenna for an information medium comprising an electronic circuit.
L'invention concerne un procédé de fabrication d'une antenne pour un support d'informations comportant un circuit électronique.The invention relates to a method of manufacturing an antenna for an information carrier comprising an electronic circuit.
L'invention se rapporte plus particulièrement à un procédé de fabrication d'une antenne pour un support d'informations du type carte à circuit intégré ou du type étiquette électronique.The invention relates more particularly to a method of manufacturing an antenna for an information medium of the integrated circuit card type or of the electronic label type.
Dans les cartes à circuit intégré, au moins un circuit électronique, aussi appelé puce, est intégré dans un corps principal de la carte réalisé en matière plastique. I l existe des normes qui définissent les dimensions de ces cartes. On connaît les cartes à circuit intégré à contact dans lesquelles le corps principal comporte des pistes de contact en matériau conducteur qui sont reliées aux bornes du circuit intégré et qui permettent la communication du circuit intégré avec un appareil dans lequel la carte à circu it intégré est introduite. Toutefois, on connaît aussi des cartes à puce du type sans contact dans lequel le même échange d'information se fait à distance, par l'intermédiaire d'antennes.In integrated circuit cards, at least one electronic circuit, also called a chip, is integrated in a main body of the card made of plastic. There are standards that define the dimensions of these cards. There are known contact integrated circuit cards in which the main body comprises contact tracks of conductive material which are connected to the terminals of the integrated circuit and which allow the communication of the integrated circuit with a device in which the integrated circuit card is introduced. However, contactless type smart cards are also known in which the same exchange of information is done remotely, by means of antennas.
Ainsi, on a déjà proposé différents procédés de fabrication d'une antenne pour une carte à circuit intégré. Un des procédés les plus couramment utilisés est de réaliser un enroulement avec un fil métallique, cet enroulement étant ensuite fixé sur le corps principal de la carte, éventuellement par surmouiage du corps principal autour de l'enroulement. Une autre méthode connue est de réaliser l'antenne par impression d'une encre conductrice. Dans un tel procédé, l'encre conductrice est par exemple déposée au travers d'un masque qui est muni d'une ouverture correspondant au motif de l'antenne selon la technique du pochoir ou par sérigraphie. Toutefois, les encres conductrices sont généralement composées d'u n liant, qui est rendu fluide à l'aide d'un solvant, et dans lequel sont dispersées des particules métalliques. Étant donné que la conduction électrique se fait uniquement par les particules métalliques et non par le liant, les particules doivent généralement être constituées d'un matériau présentant une très bonne conductivité électrique, ce qui nécessite l'emploi de matériaux nobles, tels que l'argent et l'or. I l en résulte que ces encres conductrices sont relativement onéreuses.Thus, various methods of manufacturing an antenna for an integrated circuit card have already been proposed. One of the most commonly used methods is to make a winding with a metal wire, this winding then being fixed on the main body of the card, possibly by over-grinding of the main body around the winding. Another known method is to produce the antenna by printing a conductive ink. In such a process, the conductive ink is for example deposited through a mask which is provided with an opening corresponding to the antenna pattern according to the stencil technique or by screen printing. However, conductive inks are generally composed of a binder, which is made fluid with the help of a solvent, and in which metallic particles are dispersed. Since the electrical conduction is made only by the metallic particles and not by the binder, the particles must generally be made of a material having a very good electrical conductivity, which requires the use of noble materials, such as silver and gold. As a result, these conductive inks are relatively expensive.
Selon encore un autre procédé, on peut déposer sur une face du corps principal du support d'informations une couche de matériau métallique tel que du cuivre, cette couche s'étendant sur l'intégralité de la surface destinée à être occupée par l'antenne, puis on grave cette couche métallique, par voie électrochimique ou par voie mécanique, pour obtenir l'antenne. Toutefois, ce procédé est coûteux en matière première car une grande partie de la couche métallique déposée à l'origine est enlevée par la suite au cours de l'opération de gravure qui permet d'obtenir l'antenne.According to yet another method, a layer of metallic material such as copper can be deposited on one face of the main body of the information medium, this layer extending over the entire surface intended to be occupied by the antenna. , then this metal layer is etched, electrochemically or mechanically, to obtain the antenna. However, this method is expensive in raw material because a large part of the metal layer originally deposited is subsequently removed during the etching operation which makes it possible to obtain the antenna.
L'invention a donc pour objet de proposer un nouveau procédé de fabrication d'une antenne qui soit économique, notamment en permettant d'utiliser un matériau conducteur peu cher et en évitant tout gaspillage de ce matériau . De plus, ce procédé doit permettre de parvenir à des temps de fabrication suffisamment courts pour autoriser une fabrication en très grande série. Dans ce but, l'invention propose un procédé de fabrication d'une antenne pour un support d'informations comportant un circuit électronique pour lequel l'antenne forme une interface de communication, caractérisé en ce que la fabrication de l'antenne comporte notamment les étapes consistant à :The object of the invention is therefore to propose a new method of manufacturing an antenna which is economical, in particular by making it possible to use an inexpensive conductive material and by avoiding any waste of this material. In addition, this process must make it possible to achieve manufacturing times that are short enough to allow mass production. To this end, the invention provides a method of manufacturing an antenna for an information medium comprising an electronic circuit for which the antenna forms a communication interface, characterized in that the manufacturing of the antenna notably comprises the steps consisting in:
- déposer, sur une face d'un support d'antenne en matériau polymère, une première couche d'un matériau conducteur, par un dépôt "electroless", selon un motif correspondant à la forme de l'antenne ;- deposit, on one face of an antenna support of polymer material, a first layer of a conductive material, by an "electroless" deposit, according to a pattern corresponding to the shape of the antenna;
- déposer une seconde couche d'un matériau conducteur, par un dépôt électrolytique, la première couche formant une électrode pour le dépôt électrolytique.- depositing a second layer of a conductive material, by electrolytic deposition, the first layer forming an electrode for electrolytic deposition.
Selon d'autres caractéristiques de l'invention :According to other characteristics of the invention:
- le matériau constitutif de la première couche est un matériau métallique ;- The material constituting the first layer is a metallic material;
- le matériau constitutif de la seconde couche est un matériau métallique ;- The material constituting the second layer is a metallic material;
- le dépôt "electroless" de la première couche est réalisé à travers un masque qui recouvre la face du support d'antenne et qu i est ajouré suivant le motif de l'antenne ;- The "electroless" deposition of the first layer is carried out through a mask which covers the face of the antenna support and which is perforated according to the pattern of the antenna;
- le dépôt électrolytique de la seconde couche se fait à travers un masque qui recouvre la face du support d'antenne et qui est ajouré suivant le motif de l'antenne ;- the electrolytic deposition of the second layer is done through a mask which covers the face of the antenna support and which is perforated according to the pattern of the antenna;
- après la réalisation de l'antenne, le masque est retiré ;- after completion of the antenna, the mask is removed;
- le support d'antenne muni de l'antenne forme un module qui est rapporté dans un corps principal du support d'informations ;- The antenna support provided with the antenna forms a module which is attached in a main body of the information support;
- le support d'antenne est constitué par au moins une partie d'un corps principal du support d'informations ;the antenna support consists of at least part of a main body of the information support;
- le support d'informations est une carte à circuit intégré ; - le support d'informations est une étiquette électronique d'identification. D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée qui suit pour la compréhension de laquelle on se reportera aux dessins annexés dans lesquels : - les figures 1 à 5 sont des vues schématiques en coupe transversale illustrant diverses étapes de la fabrication d'une antenne selon le procédé de l'invention ;- the information medium is an integrated circuit card; - the information medium is an electronic identification label. Other characteristics and advantages of the invention will appear on reading the detailed description which follows for the understanding of which reference will be made to the appended drawings in which: - Figures 1 to 5 are schematic cross-section views illustrating various stages the manufacture of an antenna according to the method of the invention;
- la figure 6 est une vue schématique en section transversale illustrant un mode d'intégration d'une antenne réalisée selon l'invention dans une carte du type carte de crédit.- Figure 6 is a schematic cross-sectional view illustrating a mode of integration of an antenna produced according to the invention in a card of the credit card type.
L'invention peut être utilisée dans le cadre de la fabrication de tout support d'informations comportant un circuit électronique pour lequel une antenne forme une interface de communication. Ce support d'informations peut aussi bien être une carte à circuit intégré, une étiquette d'identification , un badge ou tout autre support.The invention can be used in the context of the manufacture of any information medium comprising an electronic circuit for which an antenna forms a communication interface. This information medium can equally well be an integrated circuit card, an identification label, a badge or any other medium.
Dans tous les cas, le support d'informations comportera un corps principal , ce dernier portant un circuit électronique et une antenne, l'antenne étant reliée électriquement au circuit électronique. Bien entendu, le corps principal du support d'informations pourra comporter d'autres composants et/ou on peut notamment prévoir qu'il porte aussi des pistes de contact, elles aussi reliées électriquement au circuit électronique, comme cela est le cas dans les cartes à circuit intégré de type "combi-card" dans lesquelles un même circuit intégré est relié à la fois à des pistes de contact et à une antenne d'émission.In all cases, the information medium will comprise a main body, the latter carrying an electronic circuit and an antenna, the antenna being electrically connected to the electronic circuit. Of course, the main body of the information carrier may include other components and / or one can in particular provide that it also carries contact tracks, which are also electrically connected to the electronic circuit, as is the case in cards. with an integrated circuit of the "combi-card" type in which the same integrated circuit is connected both to contact tracks and to a transmitting antenna.
La nature du circuit électronique peut varier en fonction des applications. Il peut s'agir d'un transpondeur, comme dans le cas des badges d'identification radiofréquence, d'une unité de mémoire, comme par exemple dans le cas des cartes de paiement préchargées, mais il peut aussi s'agir d'un circuit électronique comportant un microprocesseur.The nature of the electronic circuit can vary depending on the applications. It may be a transponder, as in the case of radio frequency identification badges, a memory unit, as for example in the case of preloaded payment, but it can also be an electronic circuit comprising a microprocessor.
Comme on le verra par la suite, l'antenne peut être fabriquée soit directement sur le corps principal de la carte, soit sur un support d'antenne distinct qui est ultérieurement fixé sur le corps principal de la carte, éventuellement en étant intégré à l'intérieur de celui-ci.As will be seen below, the antenna can be manufactured either directly on the main body of the card, or on a separate antenna support which is subsequently fixed to the main body of the card, possibly by being integrated into the inside of it.
Aussi, on a représenté sur la figure 1 , de manière schématique, un support d'antenne 10 qui, dans cet exemple, est d'épaisseur très réduite, par exemple de l'ordre de quelques dizaines de microns. Ce support d'antenne est de préférence réalisé en un matériau polymère organique tel que l'ABS, le PVC, un polyester, un polypropylène, un polystyrène, ou un polycarbonate. Conformément à l'invention, le procédé prévoit le dépôt, sur ce support d'antenne 10, d'une première couche d'un matériau conducteur par dépôt "electroless" (dépôt chimique non électrolytique, donc sans tension aux électrodes, le support étant simplement plongé dans un bain chimique). Cette technique permet le dépôt d'u n matériau conducteur, par exemple un matériau métallique, sur un corps non conducteur, l'adhérence du matériau métallique sur le corps étant assurée par des réactions chimiques de type autocatalytiques.Also, there is shown in Figure 1, schematically, an antenna support 10 which, in this example, is of very reduced thickness, for example of the order of a few tens of microns. This antenna support is preferably made of an organic polymer material such as ABS, PVC, polyester, polypropylene, polystyrene, or polycarbonate. According to the invention, the method provides for the deposition, on this antenna support 10, of a first layer of a conductive material by "electroless" deposition (non-electrolytic chemical deposition, therefore without voltage at the electrodes, the support being simply immersed in a chemical bath). This technique allows the deposition of a conductive material, for example a metallic material, on a non-conductive body, the adhesion of the metallic material to the body being ensured by chemical reactions of the autocatalytic type.
De nombreuses techniques ont déjà été proposées pour la mise en oeuvre de tels dépôts electroless. Des exemples de tels procédés de dépôts peuvent par exemple être trouvés dans les documents US-A-5.230.928 ou US-A-5.509.557. Toutefois, les méthodes décrites dans ces deux documents ne constituent que des exemples non limitatifs, d'autres procédés connus pouvant être utilisés.Many techniques have already been proposed for the implementation of such electroless deposits. Examples of such deposition methods can for example be found in documents US-A-5,230,928 or US-A-5,509,557. However, the methods described in these two documents constitute only non-limiting examples, other known methods that can be used.
Dans de nombreux procédés de dépôt electroless, il est nécessaire d'effectuer une préparation de la surface du corps sur laquelle on veut déposer le matériau conducteur. Aussi, on a représenté à la figure 2 le support d'antenne 10 après que sa face supérieure 12 a été traitée conformément au procédé electroless qui aura été choisi. Ce traitement peut par exemple consister en une abrasion mécanique ou en une attaque chimique de la surface 12.In many electroless deposition processes, it is necessary to prepare a body surface on which we want to deposit the conductive material. Also, FIG. 2 shows the antenna support 10 after its upper face 12 has been treated in accordance with the electroless method which has been chosen. This treatment may for example consist of mechanical abrasion or of a chemical attack on the surface 12.
Dans un mode préféré de réalisation de l'invention, le procédé de dépôt electroless du matériau conducteur se fait au travers d'un masque 14 qui est appliqué contre la surface 12, ce masque étant pourvu d'un ajou r 16 correspondant au motif de l'antenne.In a preferred embodiment of the invention, the process for electroless deposition of the conductive material is carried out through a mask 14 which is applied against the surface 12, this mask being provided with an add r 16 corresponding to the pattern of the antenna.
On a représenté à la figure 4 le support de plaque 10 après qu'une première couche métallique 18 a été déposée sur sa surface supérieure 12, au fond de l'ajour 16 du masque 14 qui repose contre la surface supérieure 12 du support d'antenne 10.FIG. 4 shows the plate support 10 after a first metal layer 18 has been deposited on its upper surface 12, at the bottom of the aperture 16 of the mask 14 which rests against the upper surface 12 of the support antenna 10.
Le matériau déposé par voie electroless est de préférence un matériau métallique. Il peut par exemple s'agir de nickel, d'étain ou de cuivre. L'épaisseur de la première couche 18 conductrice peut être relativement faible. En effet, on sait que la plupart des procédés connus des dépôts par voie electroless ne permettent pas d'obtenir des épaisseurs de dépôts importantes dans des durées de temps faibles compatibles avec la production d'antennes en grande série. Aussi, l'épaisseur de la première couche 18 peut par exemple être de l'ordre du micron.The material deposited electronically is preferably a metallic material. It may for example be nickel, tin or copper. The thickness of the first conductive layer 18 can be relatively small. Indeed, it is known that most of the known methods of electroless deposition do not make it possible to obtain significant thicknesses of deposits in short periods of time compatible with the production of antennas in large series. Also, the thickness of the first layer 18 can for example be of the order of a micron.
Conformément aux enseignements de l'invention , et comme on peut le voir sur la figure 5, la fabrication de l'anten ne se poursuit par le dépôt, sur la première couche conductrice 18 formée par voie electroless, d'une seconde couche de matériau conducteur 20 qui est déposée par une voie électrolytique permettant d'obtenir, de manière rapide et économique, une épaisseur de matériau conducteur relativement importante, les deux couches 18, 20 étant bien entendu reliées électriquement l'une à l'autre.In accordance with the teachings of the invention, and as can be seen in FIG. 5, the manufacture of the antenna is not continued by the deposition, on the first conductive layer 18 formed by electroless means, of a second layer of material conductor 20 which is deposited by an electrolytic route making it possible to obtain, quickly and economical, a relatively large thickness of conductive material, the two layers 18, 20 being of course electrically connected to each other.
Bien entendu , ce dépôt électrolytique ne peut être réalisé que grâce à la présence préalable, sur le support d'antenne en matériau isolant, d'une première couche 18 de matériau conducteur qui joue le rôle d'une électrode au cours du dépôt électrolytique. La seconde couche 20 peut être constituée d'un matériau métallique. Il peut s'agir du même matériau métallique que celui de la première couche 18 ou d'un autre matériau. Ainsi, pour la réalisation de la seconde couche conductrice 20, on pourra utiliser du nickel, du cuivre ou un alliage métallique tel qu'un alliage étain-plomb ou un alliage étain-indium. L'épaisseur de la seconde couche 20 sera déterminée en fonction des caractéristiques de l'antenne que l'on souhaite réaliser. A titre d'exemple, l'épaisseur de cette seconde couche 20 peut être de l'ordre de grandeur de la dizaine de microns. Ainsi, on peut voir à la figure 5 que l'on obtient un module d'antenne 22 qui comprend le support d'antenne 10, le masque 14 et l'antenne proprement dite formée des deux couches 18, 20 de matériau conducteur. Éventuellement, on peut prévoir que, après la réalisation de l'antenne, le masque 14 soit ôté du support d'antenne 10, le module d'antenne 22 ne comportant alors plus que le support d'antenne 10 et l'antenne à proprement parier.Of course, this electrolytic deposition can only be achieved thanks to the prior presence, on the antenna support of insulating material, of a first layer 18 of conductive material which plays the role of an electrode during the electrolytic deposition. The second layer 20 can be made of a metallic material. It may be the same metallic material as that of the first layer 18 or another material. Thus, for the production of the second conductive layer 20, it will be possible to use nickel, copper or a metal alloy such as a tin-lead alloy or a tin-indium alloy. The thickness of the second layer 20 will be determined according to the characteristics of the antenna which it is desired to produce. By way of example, the thickness of this second layer 20 can be of the order of magnitude of ten microns. Thus, it can be seen in FIG. 5 that an antenna module 22 is obtained which comprises the antenna support 10, the mask 14 and the antenna proper formed of the two layers 18, 20 of conductive material. Optionally, provision can be made for the mask 14 to be removed from the antenna support 10 after the antenna has been produced, the antenna module 22 then comprising only the antenna support 10 and the antenna proper. to bet.
Ce module 22, dont l'épaisseur peut par exemple être comprise entre 50 et 100 microns, peut être intégré à tout type de support d'informations.This module 22, the thickness of which can for example be between 50 and 100 microns, can be integrated into any type of information medium.
A la figure 6, on a illustré un mode d'intégration du modèle d'antenne 22 dans le corps principal 24 d'une carte à circuit intégré qui présente une épaisseur normalisée de l'ordre de 850 microns.In Figure 6, there is illustrated a mode of integration of the antenna model 22 in the main body 24 of a card integrated circuit which has a standardized thickness of the order of 850 microns.
Dans cet exemple, le module d'antenne 22 est reçu à l'intérieur d'une cavité 26 aménagée dans une feuille centrale 28 du corps principal 24. La carte comporte par ailleurs deux feuilles externes supérieure 30 et inférieure 32 agencées respectivement contre chacune des faces de la feuille centrale 28, la feuille externe supérieure 30 refermant la cavité 26 dans laquelle est fixé le module 22. Bien entendu , d'autres modes d'intégration du module d'antenne peuvent être envisagés. Si le corps principal 24 de la carte à circuit intégré est réalisé par laminage, le module 22 peut être intégré par emprisonnement entre deux couches laminées. Si le corps principal 24 est réalisé par injection, on peut envisager que le module d'antenne 22 soit noyé à l'intérieur de celui-ci.In this example, the antenna module 22 is received inside a cavity 26 arranged in a central sheet 28 of the main body 24. The card also comprises two upper 30 and lower 32 outer sheets arranged respectively against each of the faces of the central sheet 28, the upper external sheet 30 closing the cavity 26 in which the module 22 is fixed. Of course, other modes of integration of the antenna module can be envisaged. If the main body 24 of the integrated circuit card is produced by rolling, the module 22 can be integrated by imprisonment between two laminated layers. If the main body 24 is produced by injection, it is conceivable that the antenna module 22 is embedded inside of it.
Toutefois, il est aussi possible de prévoir que le support d'antenne 10 soit formé par une partie du corps principal de la carte, ce qui élimine tout problème de fixation de l'antenne.However, it is also possible to provide that the antenna support 10 is formed by a part of the main body of the card, which eliminates any problem of fixing the antenna.
Comme on le voit, l'épaisseur du module d'antenne est suffisamment faible pour que l'on puisse l'intégrer à des supports d'informations quand le corps principal présente lui- même une faible épaisseur. Il est ainsi envisageable d'intégrer un tel module d'antenne dans des supports d'informations de faible épaisseur réalisés en papier ou en carton. Il est même possible de l'intégrer dans des supports d'information dont le corps principal est relativement souple.As can be seen, the thickness of the antenna module is sufficiently small so that it can be integrated into information carriers when the main body itself has a small thickness. It is thus possible to integrate such an antenna module into thin information carriers made of paper or cardboard. It is even possible to integrate it into information supports whose main body is relatively flexible.
De même, il n'est pas obligatoire que le module d'antenne soit recouvert d'une couche externe de matière du corps principal. Il peut par exemple être apparent à la surface de celui-ci et éventuellement être simplement recouvert par impression.Likewise, the antenna module need not be covered with an outer layer of material from the main body. It can for example be apparent on the surface of it and possibly be simply covered by printing.
Le procédé de fabrication d'une antenne selon l'invention est donc particulièrement intéressant par les économies qu'il permet de réaliser. En effet, le procédé ne conduit à aucun gaspillage de matière. De plus, il permet d'éviter d'avoir à faire appel à des matériaux nobles, notamment pour la réalisation de l'antenne. Enfin, en combinant deux types de dépôts, electroless et électrolytique, on peut obtenir une cadence de fabrication suffisamment rapide pour que ce procédé puisse être appliqué à la fabrication de cartes à circuit intégré sans contact, lesquelles sont produites en très grande série à des cadences très élevées. Le procédé peut être utilisé le cas échéant pour la fabrication d'une interface de communication de type à plages de contact. The method of manufacturing an antenna according to the invention is therefore particularly advantageous for the savings that it makes it possible to achieve. Indeed, the process does not lead to any waste of material. In addition, it avoids having to use noble materials, especially for the production of the antenna. Finally, by combining two types of deposits, electroless and electrolytic, one can obtain a production rate fast enough that this process can be applied to the manufacture of contactless integrated circuit cards, which are produced in very large series at rates very high. The method can be used if necessary for the manufacture of a communication interface of the contact pad type.

Claims

REVENDICATIONS
1 . Procédé de fabrication d'une antenne pour un support d'informations comportant un circuit électronique pour lequel l'antenne forme une interface de communication, caractérisé en ce que la fabrication de l'antenne comporte notamment les étapes consistant à :1. Method of manufacturing an antenna for an information carrier comprising an electronic circuit for which the antenna forms a communication interface, characterized in that the manufacturing of the antenna comprises in particular the steps consisting in:
- déposer, sur une face (12) d'un support d'antenne (10) en matériau polymère, une première couche (18) d'un matériau conducteur, par un dépôt chimique non électolytique (electroless), selon un motif correspondant à la forme de l'antenne ;- deposit, on one face (12) of an antenna support (10) of polymer material, a first layer (18) of a conductive material, by a non-electolytic chemical deposition (electroless), according to a pattern corresponding to the shape of the antenna;
- déposer une seconde couche (20) d'un matériau conducteur, par un dépôt électrolytique, la première couche formant une électrode pour le dépôt électrolytique.- depositing a second layer (20) of a conductive material, by electrolytic deposition, the first layer forming an electrode for electrolytic deposition.
2. Procédé de fabrication d'une antenne selon la revendication 1 , caractérisé en ce que le matériau constitutif de la première couche ( 1 8) est un matériau métallique.2. A method of manufacturing an antenna according to claim 1, characterized in that the material constituting the first layer (1 8) is a metallic material.
3. Procédé de fabrication d'une antenne selon l'une quelconque des revendications précédentes, caractérisé en ce que le matériau constitutif de la seconde couche (20) est un matériau métallique.3. A method of manufacturing an antenna according to any one of the preceding claims, characterized in that the material constituting the second layer (20) is a metallic material.
4. Procédé de fabrication d'une antenne selon l'une quelconque des revendications précédentes, caractérisé en ce que le dépôt "electroless" de la première couche (18) est réalisé à travers un masque (14) qui recouvre la face (12) du support d'antenne (10) et qui est ajouré suivant le motif de l'antenne.4. Method for manufacturing an antenna according to any one of the preceding claims, characterized in that the "electroless" deposition of the first layer (18) is carried out through a mask (14) which covers the face (12) of the antenna support (10) and which is perforated according to the pattern of the antenna.
5. Procédé de fabrication d'une antenne selon l'une quelconque des revendications précédentes, caractérisé en ce que le dépôt électrolytique de la seconde couche (20) se fait à travers u n masque (14) qui recouvre la face (12) du support d'antenne (10) et qui est ajouré suivant le motif de l'antenne.5. Method of manufacturing an antenna according to any one of the preceding claims, characterized in that the electrolytic deposition of the second layer (20) takes place through a mask (14) which covers the face (12) of the antenna support (10) and which is perforated according to the pattern of the antenna.
6. Procédé de fabrication d'une antenne selon la revendication 5, caractérisé en ce que, après la réalisation de l'antenne, le masque (14) est retiré.6. A method of manufacturing an antenna according to claim 5, characterized in that, after the completion of the antenna, the mask (14) is removed.
7. Procédé de fabrication d'une antenne selon l'une quelconque des revendications précédentes, caractérisé en ce que le support d'antenne (10) muni de l'antenne forme un module (22) qui est rapporté dans un corps principal (24) du support d'informations.7. A method of manufacturing an antenna according to any one of the preceding claims, characterized in that the antenna support (10) provided with the antenna forms a module (22) which is attached in a main body (24 ) information carrier.
8. Procédé de fabrication d'une antenne selon l'une quelconque des revendications 1 à 6, caractérisé en ce que le support d'antenne (10) est constitué par au moins une partie d'un corps principal du support d'informations. 8. A method of manufacturing an antenna according to any one of claims 1 to 6, characterized in that the antenna support (10) consists of at least part of a main body of the information carrier.
9. Procédé de fabrication d'une antenne selon l'une quelconque des revendications précédentes, caractérisé en ce que le support d'informations est une carte à circuit intégré.9. A method of manufacturing an antenna according to any one of the preceding claims, characterized in that the information medium is an integrated circuit card.
10. Procédé de fabrication d'une antenne selon l'une quelconque des revendications 1 à 9, caractérisé en ce que le support d'informations est une étiquette électronique d'identification. 10. A method of manufacturing an antenna according to any one of claims 1 to 9, characterized in that the information carrier is an electronic identification label.
PCT/FR1999/001886 1998-08-25 1999-07-30 Method for making an antenna for a medium comprising an electronic circuit WO2000011749A1 (en)

Priority Applications (1)

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AU50467/99A AU5046799A (en) 1998-08-25 1999-07-30 Method for making an antenna for a medium comprising an electronic circuit

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FR9810891A FR2782885B1 (en) 1998-08-25 1998-08-25 METHOD FOR MANUFACTURING AN ANTENNA FOR AN INFORMATION MEDIUM HAVING AN ELECTRONIC CIRCUIT
FR98/10891 1998-08-25

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004003258A2 (en) * 2002-06-28 2004-01-08 Infineon Technologies Ag Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied
WO2006050363A1 (en) * 2004-11-02 2006-05-11 Precisia, L.L.C. Variation of conductive cross section or material to enhance performance and reduce material consumption of electronic assemblies
WO2006104792A1 (en) * 2005-03-28 2006-10-05 Avery Dennison Corporation Method for making rfid device antennas

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2899366B1 (en) * 2006-04-04 2008-08-08 Microcomposants De Haute Secur METHOD FOR ATTACHING TO A PRODUCT A CIRCUIT FOR AUTHENTICATING THE PRODUCT AND PRODUCT OBTAINED BY CARRYING OUT SAID METHOD

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4305975A (en) * 1979-12-17 1981-12-15 Tokyo Shibaura Denki Kabushiki Kaisha Method of forming printed circuit
EP0312024A1 (en) * 1987-10-15 1989-04-19 Mitsubishi Materials Corporation A method for preparing metal fiber articles
WO1992021790A1 (en) * 1991-06-07 1992-12-10 Monsanto Company Fabricating metal articles from printed images
US5364493A (en) * 1993-05-06 1994-11-15 Litel Instruments Apparatus and process for the production of fine line metal traces
US5472828A (en) * 1992-06-22 1995-12-05 Martin Marietta Corporation Ablative process for printed circuit board technology

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4305975A (en) * 1979-12-17 1981-12-15 Tokyo Shibaura Denki Kabushiki Kaisha Method of forming printed circuit
EP0312024A1 (en) * 1987-10-15 1989-04-19 Mitsubishi Materials Corporation A method for preparing metal fiber articles
WO1992021790A1 (en) * 1991-06-07 1992-12-10 Monsanto Company Fabricating metal articles from printed images
US5472828A (en) * 1992-06-22 1995-12-05 Martin Marietta Corporation Ablative process for printed circuit board technology
US5364493A (en) * 1993-05-06 1994-11-15 Litel Instruments Apparatus and process for the production of fine line metal traces

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004003258A2 (en) * 2002-06-28 2004-01-08 Infineon Technologies Ag Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied
DE10229166A1 (en) * 2002-06-28 2004-01-29 Infineon Technologies Ag Process for the production of galvanically separated antennas for RF-ID labels using selectively applied adhesive
WO2004003258A3 (en) * 2002-06-28 2005-03-03 Infineon Technologies Ag Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied
DE10229166B4 (en) * 2002-06-28 2006-03-09 Infineon Technologies Ag Process for producing a structured metal layer
WO2006050363A1 (en) * 2004-11-02 2006-05-11 Precisia, L.L.C. Variation of conductive cross section or material to enhance performance and reduce material consumption of electronic assemblies
GB2435183A (en) * 2004-11-02 2007-08-15 Precisia L L C Variation of conductive cross section or material to enchance performance and reduce material comsumption of electronic assemblies
US7323993B2 (en) 2004-11-02 2008-01-29 Zih Corp. Variation of conductive cross section and/or material to enhance performance and/or reduce material consumption of electronic assemblies
GB2435183B (en) * 2004-11-02 2009-12-02 Precisia L L C Variation of conductive cross section or material to enchance performance and reduce material comsumption of electronic assemblies
WO2006104792A1 (en) * 2005-03-28 2006-10-05 Avery Dennison Corporation Method for making rfid device antennas

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