WO2000011487A1 - Equipement pour effectuer des controles electriques et environnementaux sur des dispositifs electriques a semiconducteur - Google Patents

Equipement pour effectuer des controles electriques et environnementaux sur des dispositifs electriques a semiconducteur Download PDF

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Publication number
WO2000011487A1
WO2000011487A1 PCT/IT1998/000234 IT9800234W WO0011487A1 WO 2000011487 A1 WO2000011487 A1 WO 2000011487A1 IT 9800234 W IT9800234 W IT 9800234W WO 0011487 A1 WO0011487 A1 WO 0011487A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic devices
equipment
lid
leads
package
Prior art date
Application number
PCT/IT1998/000234
Other languages
English (en)
Inventor
Antonio Zaffarami
Original Assignee
Eles Equipment S.R.L.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eles Equipment S.R.L. filed Critical Eles Equipment S.R.L.
Priority to PCT/IT1998/000234 priority Critical patent/WO2000011487A1/fr
Priority to AU91834/98A priority patent/AU9183498A/en
Priority to PCT/IT1999/000267 priority patent/WO2000011488A1/fr
Priority to AU53870/99A priority patent/AU5387099A/en
Priority to EP99939611A priority patent/EP1129364A1/fr
Publication of WO2000011487A1 publication Critical patent/WO2000011487A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Definitions

  • This invention relates to equipment for performing electrical and environmental tests on semiconductor electronic devices, and in particular to equipment according to the preamble of the first claim.
  • Semiconductor electronic devices when their manufacture is complete, are generally submitted to a test process in which their functional parameters are checked and in which a set of electrical and environmental stresses are applied to the electronic devices to eliminate those devices which have immediately identifiable defects or which are potentially defective.
  • the electronic devices are submitted to a heat type test, called burn-in test, which consists in making the electronic devices work for tens of hours at very high or very low temperature (for example, ranging from - 50 °C to +300 °C) in order to simulate a long period of operation of the electronic devices at ambient temperature (25°C-50°C) .
  • the electronic devices to be tested are arranged on a test board (called Burn-In Board, or BIB) , on which circuit elements are housed which simulate a working condition of the electronic devices and enable the test board to be interfaced with a driver module.
  • BIB Burn-In Board
  • the test board is provided with suitable sockets, each of which holds one electronic device in place and electrically connects it to the simulation circuit elements; this structure enables the electronic device to be accommodated for the time needed to execute the test and at the same time also enables the electronic device to be removed at the end of the test process without damaging i .
  • the oven consists of a zone at very high (or very low) temperature, in which the electronic devices to be tested are placed, and a zone at ambient temperature, where the driver is located.
  • the high temperature zone is separated from the ambient temperature zone by means of a separator wall, in which slots, generally provided with a seal, have been made for connection purposes.
  • test equipment has is very expensive.
  • each test board may be used solely for a specific type of electronic device for which the test board has been designed and made. This requires the manufacture of a new test board whenever there is a variation of any, even the slightest, characteristic of the electronic devices to be tested. Accordingly, the cost of the test process is extremely high and cannot be depreciated in the short term; this drawback restricts use of the test process, prevents its widespread application and accordingly lowers the level of quality and reliability in the production of semiconductor electronic devices.
  • the object of this invention is to eliminate the abovementioned drawbacks.
  • equipment is proposed for performing electrical and environmental testing on semiconductor electronic devices as described in the main claim.
  • this invention also proposes a corresponding test method.
  • Fig. 1 is a schematic view of an example of test equipment according to this invention.
  • Fig. 2 illustrates a package with lead frame for use in the test equipment
  • Fig. 3 is an illustrative example of the structure housing the lead frame
  • Fig. 4 is a schematic view of a different embodiment of the test e ⁇ uioment of this invention.
  • equipment 100 is illustrated for performing heat tests on semiconductor electronic devices; similar remarks also apply in cases where the equipment is used to perform different electrical and environmental tests, for instance pressure tests, humidity tests and so on.
  • the test equipment 100 consists of a heat chamber comprising a work zone at high, or very low, temperature 102 (in which the electronic devices to be tested are placed) and a zone at ambient temperature 103, separated from each other by a wall 104.
  • the work zone 102 includes various microchambers 105 (of which one only is depicted in the figure) , in each of which one or more electronic devices are placed, so that their temperature can be controlled by means of a corresponding device 110, as described in detail below.
  • the test equipment 100 includes several tens of microchambers 105, for example arranged on two opposite walls between which a robot moves to automatically load/unload the electronic devices. Similar remarks also apply in cases where arrangements have been made for a different number of microchambers (including one only, as a limit case) , devices for housing boards provided with mounting sockets, and in general any test equipment having a work zone wherein means for controlling at least one status quantity and means for housing the electronic devices are provided.
  • the microchambers 105 are affixed to a front surface of the wall 104. Each microchamber 105 electrically connects the electronic devices to a multipoint communication channel, or bus, 120, also arranged on the front surface of the wall 104.
  • each configuration board 125 is inserted in a slot 130a made in the wall 104 and provided with a seal 135a in order to isolate the configuration boards 125 from the work zone 102; the configuration board 125 is connected electrically to the front bus 120 by means of suitable sliding contacts 140a arranged inside the slot 130a. Similar remarks also apply when the boards are connected differently, and so on; in more general terms, means are provided for simulating a work condition of the electronic devices arranged on the outside of the work zone and means for removably connecting the simulation means to the electronic device housing means .
  • the solution of this invention provides test equipment easily configurable for electronic devices of different types (with an identical or similar outer structure) . This drastically reduces the cost of the investments needed for the test processes. In fact, the same test equipment may be used for different electronic devices simply by substituting the configuration boards. This solution also reduces the delay times in setting up a test environment as it is sufficient to make the configuration boards, for which the production time is extremely low. Furthermore, where problems arise with the configuration boards, they can be replaced with other reserve boards, costing little and without interrupting the test process.
  • one or more corresponding configuration boards 125 are associated with each microchamber 105 (or each battery of microchambers 105) .
  • the test equipment is particularly flexible as electronic devices of different types can be tested simultaneously.
  • a single group of configuration boards is provided for all the microchambers (the structure is simpler, but only electronic devices of the same kind can be tested simultaneously), and so on.
  • the test equipment 100 also includes one or more driver boards 145 (or other equivalent means) which perform the operations of controlling the electronic devices.
  • the driver boards 145 are connected together through a rear bus 150; one end of the driver board 145, arranged towards the top, is inserted in a further slot 130b (provided with a seal 135b) and is connected electrically and removably to the front bus 120 by means of sliding contacts 140b.
  • a package 200 in the process for manufacture of the electronic devices to be tested, there is an intermediate stage in which a package 200 is available consisting of numerous electronic devices 205, the number of which varies from a few to a few hundred (thirty in the example illustrated) , joined together by means of a lead frame 206.
  • the lead frame 206 consists of a plate of metal (for example, of tin-plated copper) generally having standard dimensions of 60 x 120 mm. Typically the lead frame 206 is provided with centring holes 207, arranged for example in two parallel rows in the vicinity of the greater edges of the metal plate. Tabs 210 are made (typically by shearing) in the lead frame 206, forming the leads of each electronic device 205. Supporting areas 220 are also provided in the lead frame 206, each of which bears a wafer of semiconductor material 225 in which an integrated circuit is made; the supporting area 220 is joined to the rest of the lead frame 206 by means of interconnection strips 230, extending for example from each edge of the supporting area 220.
  • the wafer of semiconductor material 225 is affixed (typically by welding) to the corresponding supporting area 220 and is connected electrically to the leads 210 through metal wires 235 (wire bonding) .
  • the structure accordingly obtained is fitted in an appropriate mould, into which plastic material in the liquid state is injected (for example, a heat hardening epoxy resin) .
  • the package 200 is obtained comprising, for each electronic device 205, an isolating body 245 encapsulating the elements described above and from which part of the leads 210 and of the interconnection strips 230 protrude.
  • the process for manufacture of electronic devices at this point normally includes shearing of the leads 210 and of the interconnection strips 230, in order to separate the various electronic devices 205.
  • the leads 210 are also bent (lead forming) , generally by using suitable moulds driven by presses.
  • the electronic devices 205 are tested before being separated from each other.
  • the leads 210 of each electronic device 205 are separated from the rest of the lead frame 206, for instance by means of a laser cutting process, so that they are electrically isolated from each other.
  • the electronic devices 205 are still connected to the lead frame 206 through the interconnection strips 230.
  • the package 200 is then placed in the test equipment so as to establish an electric connection with the leads 210 of each electronic device 205 (as described in detail below) .
  • the lead frame is of a different structure, of different dimensions
  • the electronic devices are of another type, for example of the Ball Grid Array (or BGA) type, with their leads already electrically isolated from each other, and so on.
  • BGA Ball Grid Array
  • the solution described above further reduces the cost of the investments needed for the test process, as it does not require a board for housing the electronic devices.
  • the package of electronic devices is in fact very easy to handle in view of its rather large dimensions, and the automatic procedures are also facilitated by the fact that the package of electronic devices is generally of fixed standard dimensions.
  • the embodiment described above is of particular advantage in that it uses an element already present (the lead frame) and does not require any additional structure to keep the electronic devices joined together during the test process.
  • the electronic devices are stuck to a common board and the leads and interconnection strips are then cut (with the electronic devices remaining joined together by means of the common board) .
  • the electronic devices are detached from the common board. More generally, provision is made for any equivalent package, obtained during an intermediate stage of manufacture of the electronic devices and consisting of a plurality of electronic devices joined together by means of a support element and having leads electrically isolated from each other.
  • the microchamber 105 has a box-like structure consisting of a base 305, attached vertically to the wall 104.
  • a closing lid 310 is hinge-mounted to a bottom edge of the fixed base 305.
  • the package 200 is placed against a back wall of the fixed base 305, from which centring pins 315 (arranged in two horizontal lines) extend perpendicularly, corresponding to the holes 207 in the lead frame 206.
  • each microchamber 105 is also provided with a delivery hole and an exhaust hole (not shown in the figure) for injecting dry air (or nitrogen) inside the microchamber 105. This is a means of avoiding oxidation of the leads of the electronic devices 205, while also simultaneously increasing the heat exchange inside the microchamber 105.
  • the package 200 is preferably placed in the fixed base 305 by a robot (not shown in the figure) , provided for example with a vacuum gripper.
  • a robot not shown in the figure
  • self- centring holes 320 are made on an outer frame of the fixed base 305, in the vicinity of two opposite edges.
  • Elastic rocking tabs 325 extend from the centre of an upper inside edge and of a lower inside edge in the frame of the fixed base 305. These elastic tabs 325 enable the lead frame 206 to be held in the fixed base 305 even when the lid 310 is ooen (after the package 200 has been released from the robot gripper, during insertion, or before the package 200 has been gripped by the robot gripper, during removal) .
  • Similar remarks also apply where balls that extend by elastic means into the frame of the fixed base, or other equivalent means, are used.
  • microchambers have a different configuration, are not provided with the elastic rocking tabs (in cases of manual loading/unloading) and consist of horizontal boxes, and so on.
  • Each contact (not shown in the figure) consists of a conducting pin (arranged horizontally) having a telescopic structure, which shortens under the action of an external force in opposition to an inner spring.
  • the pins are made of a material (for example, copper) having a thermal expansion coefficient substantially the same as that of the material used for the leads of the electronic devices 205, in order to guarantee a sound contact a_ all temperatures during the test stage.
  • the electric contacts are of an extremely large number (in their thousands, for example), a subset of which is activated on each occasion (under the control of the configuration boards) , in relation to the number and disposition of the leads present in the package 200.
  • This enables the same test equipment to be used for any type of electronic device having a structure of leads in the lead frame compatible with these electric contacts.
  • the electric contacts and the leads of the electronic devices are made of different materials, the pins are rigid and assembled on a yielding support, elements hinge-mounted on a structure of elastic material are used, the electric contacts are of the same number as the leads of the electronic devices in the lead frame, and so on.
  • each battery of contacts 330 is associated with the leads of a column of electronic devices 205 and is removable from the fixed base 305. Accordingly a single battery of contacts 330 may be replaced easily (for maintenance operations, for example), without requiring the complete substitution of all of the electric contacts of the microchamber (extremely expensive) . Similar remarks also apply where each battery of contacts is associated with a line of electronic devices, and in general with two or more adjacent electronic devices. This solution is an excellent compromise between flexibility of the structure and its construction simplicity. Alternatively, each battery is associated with a single electronic device, or each electric contact may be removed singly; however, this invention is also suitable for production with fixed, non-replaceable electric contacts.
  • the lid 310 has a generically flat structure. From an internal surface of the lid 310, thrust beads 335 extend, consisting of a frame on the inside of which are arranged strips corresponding to the electric contacts of the batteries 330. When the package 200 is inserted in the fixed base 305 and the lid 310 is closed, the beads 335 hold the lead frame 206 pressed (by means of the external frame) against the back of the fixed base 305. At the same time, the beads 335 push (through the inner strips) the leads of the electronic devices 205 against the corresponding electric contacts of the batteries 330, causing them to yield elastically and guaranteeing a good electric connection.
  • the temperature control device 110 consists of a metallic heating board 340, on the inside of which is arranged, for example, a spiral (in the vicinity of an inside surface) , not shown in the figure, which produces heat through the Joule effect.
  • a cooling fan 342 is affixed to an outer surface of the heating board 340.
  • the heating board 340 and the cooling fan 342 are moved by a hydraulic system 345 (or other equivalent means) between an idle position (not shown in the figure) , in which they permit access to the microchamber for insertion or removal of the package 200, and a work position, in which the inner surface of the heating board 340 is arranged against an outer surface of the lid 310 (when closed) , in order to heat or cool the electronic devices of the package 200.
  • the lid 310 is advantageously made of a metal plate (or of another, excellent heat conducting material) , covered on the inside by a thin layer, for example, of plastic, in order to ensure electrical isolation from the leads of the electronic devices 205; alternatively, the lid is made of a different material, it is fastened directly to the inner surface of the heating board, and so on.
  • Suitable temperature sensors are also provided in the lid 310, in order to control (under the control of the driver boards) the operation of the heating board 340 and of the cooling fan 342.
  • This solution reduces the thermal inertia of the structure, enabling the temperature of the various electronic devices to be controlled extremely precisely.
  • the almost-closed system described above is preferable to the traditional, hot air heating systems, on account of the large number of electronic devices crammed into a small space on the lead frame, which does not permit a sufficient exchange of heat with the air.
  • the temperature of the air poor precision is obtained, this temperature being different from that of the electronic devices; on the contrary, by controlling the temperature of the electronic devices, thermal oscillations are generated, in the sense that the electronic devices continue to heat even after the heating of the air has been interrupted and, vice versa, the electronic devices continue to cool for a certain time even after heating of the air has been activated.
  • one heating board 340 (with a corresponding cooling fan 342) , controlled independently (by the driver and configuration boards) , is associated with each microchamber 105.
  • This enables different temperatures to be used for each package 200, making the test equipment extremely flexible.
  • this invention is still suitable for production even with the heating boards and the cooling fans controlled in common (by the driver boards) , with a single heating board and relative cooling fan for all the microchambers, with different heating and cooling systems, for example using Peltier cells, and so on.
  • test equipment 400 consists of a main body 405 having a substantially parallelepiped shape, in which a work chamber 410 and an ambient temperature chamber 415 are made, each comprising an aperture (with horizontal axis) opening into the body 405.
  • the work chamber 410 is kept at high (or very low) temperature by dry air (or nitrogen) injected into the work chamber 410 through appropriate hoses (not depicted in the figure) .
  • Cooling of the chamber 415 is produced by a fan 417 (or other equivalent means) , guaranteeing an adequate exchange of air with the outside (through the delivery and exhaust holes, not depicted in the figure) .
  • a lid 420a and a lid 420b are hinge-mounted on a front surface and on a rear surface respectively of the body 405.
  • the lid 420a (similar remarks also apply to the lid 420b) is of dimensions such that, when it is closed on the front surface of the body 405, it entirely covers the apertures corresponding to the chambers 410 and 415.
  • a battery of mounting sockets 425 for the electronic devices or equivalent means for housing one or more packages with lead frame as described above
  • a driver 430 connected together by means of a bus 435.
  • the lid 420a is hinge-mounted under the chambers 410 and 415, so that when the lid 420a is open, its inner surface is facing upwards, facilitating insertion and removal of the electronic devices from the mounting sockets 425.
  • Slots 440 (or other equivalent means) are provided in an outer surface of the lid 420a for assembly of configuration boards 445 provided with edge connectors; the slots 440 connect the configuration boards to the mounting sockets 425, at the same time permitting easy removal and replacement of the configuration boards 445.
  • test equipment of this invention is extremely compact.
  • this test equipment has a modular structure that is easy to build according to various application requirements; for example, it is possible to use numerous identical equipment items set on top of one another vertically, or side by side.
  • the two opposite lids make it possible to optimize the space available, using a single work chamber for two batteries of mounting sockets.
  • the driver is arranged on the outer surface of the lid (without the ambient temperature chamber) , a single lid is used (with the work chamber and the ambient temperature chamber made from blind cavities) , numerous work chambers (with corresponding lids) are provided, and so on.

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un équipement (100) conçu pour effectuer des contrôles électriques et environnementaux sur des dispositifs électroniques à semiconducteur, lesquels sont pourvus d'organes (125) qui leur permettent de simuler une position de fonctionnement. Cet équipement (100) présente une zone de travail (102) dans laquelle des organes (105) sont destinés à loger les dispositifs électroniques, d'autres organes (110) permettant par ailleurs de contrôler au moins une grandeur d'état de ces dispositifs électroniques (205). Les organes de simulation (125) sont placés à l'extérieur de ladite zone de travail (103), l'équipement (100) de cette invention comportant également des organes (130a, 135a, 140a) destinés à raccorder de manière amovible les organes de simulation (125) aux organes de logement (105).
PCT/IT1998/000234 1998-08-19 1998-08-19 Equipement pour effectuer des controles electriques et environnementaux sur des dispositifs electriques a semiconducteur WO2000011487A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/IT1998/000234 WO2000011487A1 (fr) 1998-08-19 1998-08-19 Equipement pour effectuer des controles electriques et environnementaux sur des dispositifs electriques a semiconducteur
AU91834/98A AU9183498A (en) 1998-08-19 1998-08-19 Equipment for performing electrical and environmental tests on semiconductor electronic devices
PCT/IT1999/000267 WO2000011488A1 (fr) 1998-08-19 1999-08-17 Appareil pour effectuer des controles electriques et environnementaux sur des dispositifs electroniques a semiconducteur
AU53870/99A AU5387099A (en) 1998-08-19 1999-08-17 An apparatus for performing electrical and environmental tests on electronic semiconductor devices
EP99939611A EP1129364A1 (fr) 1998-08-19 1999-08-17 Appareil pour effectuer des controles electriques et environnementaux sur des dispositifs electroniques a semiconducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IT1998/000234 WO2000011487A1 (fr) 1998-08-19 1998-08-19 Equipement pour effectuer des controles electriques et environnementaux sur des dispositifs electriques a semiconducteur

Publications (1)

Publication Number Publication Date
WO2000011487A1 true WO2000011487A1 (fr) 2000-03-02

Family

ID=11332906

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/IT1998/000234 WO2000011487A1 (fr) 1998-08-19 1998-08-19 Equipement pour effectuer des controles electriques et environnementaux sur des dispositifs electriques a semiconducteur
PCT/IT1999/000267 WO2000011488A1 (fr) 1998-08-19 1999-08-17 Appareil pour effectuer des controles electriques et environnementaux sur des dispositifs electroniques a semiconducteur

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/IT1999/000267 WO2000011488A1 (fr) 1998-08-19 1999-08-17 Appareil pour effectuer des controles electriques et environnementaux sur des dispositifs electroniques a semiconducteur

Country Status (3)

Country Link
EP (1) EP1129364A1 (fr)
AU (2) AU9183498A (fr)
WO (2) WO2000011487A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016038176A1 (fr) * 2014-09-11 2016-03-17 Bibench Systems / Charlu Sas Dispositif de régulation de la température d'un module de pilotage d'un composant électronique
KR20230054559A (ko) * 2021-10-15 2023-04-25 송은희 분리 및 결합이 용이한 피로 및 신뢰성 테스트 모듈

Citations (4)

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Publication number Priority date Publication date Assignee Title
US4900948A (en) * 1988-03-16 1990-02-13 Micro Control Company Apparatus providing signals for burn-in of integrated circuits
JPH05136229A (ja) * 1991-11-08 1993-06-01 Fujitsu Ltd バーンイン装置
US5402078A (en) * 1992-10-13 1995-03-28 Micro Control Company Interconnection system for burn-in boards
US5479105A (en) * 1993-06-25 1995-12-26 Samsung Electronics Co., Ltd. Known-good die testing apparatus

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Publication number Priority date Publication date Assignee Title
DE3013215A1 (de) * 1980-04-03 1981-10-15 Luther & Maelzer Gmbh, 3050 Wunstorf Adapter fuer ein selbstprogrammierbares leiterplattenpruefgeraet
DE3630548A1 (de) * 1986-09-08 1988-03-10 Mania Gmbh Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900948A (en) * 1988-03-16 1990-02-13 Micro Control Company Apparatus providing signals for burn-in of integrated circuits
JPH05136229A (ja) * 1991-11-08 1993-06-01 Fujitsu Ltd バーンイン装置
US5402078A (en) * 1992-10-13 1995-03-28 Micro Control Company Interconnection system for burn-in boards
US5479105A (en) * 1993-06-25 1995-12-26 Samsung Electronics Co., Ltd. Known-good die testing apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 514 (E - 1433) 16 September 1993 (1993-09-16) *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016038176A1 (fr) * 2014-09-11 2016-03-17 Bibench Systems / Charlu Sas Dispositif de régulation de la température d'un module de pilotage d'un composant électronique
FR3025899A1 (fr) * 2014-09-11 2016-03-18 Bibench Systems Charlu Sas Dispositif de regulation de la temperature d’un module de pilotage d’un composant electronique
KR20230054559A (ko) * 2021-10-15 2023-04-25 송은희 분리 및 결합이 용이한 피로 및 신뢰성 테스트 모듈
KR102678331B1 (ko) 2021-10-15 2024-06-25 송은희 분리 및 결합이 용이한 피로 및 신뢰성 테스트 모듈

Also Published As

Publication number Publication date
AU5387099A (en) 2000-03-14
AU9183498A (en) 2000-03-14
WO2000011488A1 (fr) 2000-03-02
EP1129364A1 (fr) 2001-09-05

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