WO2000008220A1 - Method of applying metal coatings on particles and substrates - Google Patents
Method of applying metal coatings on particles and substrates Download PDFInfo
- Publication number
- WO2000008220A1 WO2000008220A1 PCT/RU1999/000254 RU9900254W WO0008220A1 WO 2000008220 A1 WO2000008220 A1 WO 2000008220A1 RU 9900254 W RU9900254 W RU 9900254W WO 0008220 A1 WO0008220 A1 WO 0008220A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- particles
- metals
- coating
- oxidizing atmosphere
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/18—Non-metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/18—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/60—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
- C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/087—Coating with metal alloys or metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/041—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by mechanical alloying, e.g. blending, milling
Definitions
- the present invention relates to the technology of applying metal coatings on the surfaces of various materials (particles and substrates) including dielectrics, semiconductors and metals.
- the invention can be used, for example, for the metallization of abrasive particles, in applying metal coating to ceramic materials and in electronics.
- the techniques conventionally used for applying metal coatings on the surfaces of materials include chemical vapor-phase deposition, plasma assisted deposition, metal bath deposition, electroless deposition, electrolytic deposition and solid-phase reaction techniques.
- patents US 5 250 086, US 5 232 469, US 5 224 969, US 5 126 207, US 5 024 680, US 4 399 167, US 3 924 031, US 3 871 840, US 3 650 714) uses gaseous mixtures at low pressures and high substrate temperatures for the deposition of carbide-forming metals, such as chromium, titanium and zirconium.
- carbide-forming metals such as chromium, titanium and zirconium.
- patent US 5 224 969 describes a process in which a layer of fine chromium powder is mixed with the diamond and heated to elevated temperatures (600-700 °C) under 10 "6 torr vacuum (or in the atmosphere of argon or hydrogen).
- agitation is applied in order to prevent the particles from adhering to one another.
- the treatment causes the metal powder to vaporize and redeposit on the surfaces of the diamond powder forming metal carbide.
- the drawbacks of this technique include the use of elevated temperatures (600-700 °C) which causes diamond degradation, the use of expensive carbide-forming metals, the necessity to apply a second layer of metals which are more oxidation resistant and the necessity to apply agitation in order to prevent the particles from adhering to one another.
- Plasma assisted deposition technique allows one to obtain an adherent metal coating on a flat dielectric substrate.
- it is necessary to create fiuidized bed conditions in order to prevent particles from adhering to one another. This causes high expenditure of purified gases, especially if the particles are relatively large (more than 40 ⁇ m).
- Other disadvantages of the technique include the use of elevated temperatures, expensive reactors, high expenditure of oxygen-free gas and short lifetime of the electrodes.
- abrasive particles are immersed within a molten bath of one or more alkali or alkaline earth halides with a carbide-forming metal, such as chromium, titanium, tungsten, zirconium, vanadium, niobium, tantalum, molybdenum, the process operating at 600 - 100 °C, for chromium, preferrably, between 800-950 °C (US 5 250 086).
- a carbide-forming metal such as chromium, titanium, tungsten, zirconium, vanadium, niobium, tantalum, molybdenum
- Patent US 5 306 318 describes the process of coating particles of cubic boron nitride with titanium;
- patent US 5 090 969 describes the use of molten alkali metal ftoride for the metallization of diamond and cubic boron nitride.
- the disadvantages of the technique include the use of elevated temperatures (600-700 °C), which causes diamond degradation, the use of expensive carbide-forming metals, the necessity to apply a second layer of metals which are more oxidation resistant and the necessity to apply agitation in order to prevent the particles from adhering to one another.
- the melts containing titanium (US 3 929 432) and titanium hydrides (US 4 591 363) have been described. Mechanical crushing of sintered particles aggregates is needed in this case, which leads to appearance of uncoated areas, cracks and other defects.
- dielectric materials first must be coated with a layer of metal by means of other techniques.
- the technique does not have the drawbacks of the described above methods and is characterized by high productivity; however, in case of powders containing up to 50 w. % of metal the quality of the metal coating obtained is low.
- Electroless technique (US 4 435 189, US 5 188 643, US 5 648 125. US 5 221 328, US 4 997 686, US 4 520 052) comprises degreasing, cleaning, activation and sensibilization of the surface of a dielectric material with a subsequent reducing of a metal on the surface from the metal salt solution. The process is slow; increasing metal content in the solution leads to segregation of coarse metal particles and the coated material; the degree of coverage is low (coverage coefficient 50-70 %) which can be explained by the low density of metal crystallization centers on the surface of the dielectric material. In this technique it is difficult to control the thickness of the metal layer.
- Patent US 4 063 907 describes a process in which mechanical treatment of abrasive particles and metal compounds is used, with a metal compound being able to be decomposed or reduced at atmospheric pressure and temperatures 800-1400 °C, e.g. molibdenium, tungsten, titanium, niobium, tantalum, chromium and zirconium sulfides.
- the use of high temperatures and low degree of coverage of the material are disadvantages of the technique.
- Patent EP 0 513 821 describes a process in which a thin film of solution containing a noble metal alkoxide is deposited on the surface of a substrate, dried and heated in a reducing atmosphere in order to obtain a thin film of noble metals and/or in oxidizing atmosphere in order to obtain a thin film of noble metal oxides.
- Patent 5 256 443 describes a process in which a sol containing noble metal alkoxides is prepared, and a thin film is dried until a gel is formed. The technique does not permit to obtain a thick adherent coating; the reagents (metal alkoxides and palladium salts) are expensive.
- Patent EP 0 508 399 which is the closest analog of the present invention (prototype), describes a process in which a substrate and an organic salt of a metal are heated to temperatures not higher than 400 °C at low pressure in the presence of palladium salts. Pyrolysis of the organic salt of metal takes place, and the products of the pyrolysis form the necessary coating on the substrate.
- the goal of the present invention is to obtain a dense adherent coating with a controlled thickness on the surface of various materials which are able to withstand heating to 200- 500 °C (diamond, abrasives, ceramics, glass, dielectrics, semiconductors, metals), the coating having high degree of coverage and the process being highly productive and inexpensive.
- the particles of a compound chosen from the group of metals, alloys, metal oxides, metal hydroxides, metal sulfides (metals are copper, nickel, aluminum, zinc, titanium, tungsten, germanium, gold, cobalt, molybdenum, tin, palladium, platinum) are mechanically smeared on the surface of the material with a subsequent reducing of the compound in non-oxidizing atmosphere on heating to 200-500 °C.
- said inorganic compounds release small amounts of gaseous products of decomposition, which allows one to obtain a dense adherent coating with a high degree of coverage.
- the thickness and degree of coverage were estimated by the technique of X-ray diffraction (see Mode 1). Adherence of the obtained coating was estimated by means of comparison of the X-ray diffraction patterns of the metallized powder before and after treatment in an ultrasonic bath (see Mode 3).
- the described technique is less laborious and less expensive than the prototype as its application to the coating of powders does not require neither fluidized bed conditions nor pulverization and drying; expensive reagents such as palladium salts and organic salts of metals are not needed.
- Degreasing of the surface is usually performed in an alkaline solution. Cleaning of the surface can be performed by etching in dilute acid or by other methods, for example, by laser treatment of the surface of the substrate (S.M. Pimenov, G.A. Shafeev, V.A. Laptev, E.N. Loubnin, Appl. Phys. Lett., 64 (15) 1994, p. 1935-1937).
- the materials which can be coated by means of the described process are: synthetic and natural diamond, cubic boron nitride, corundum, ruby, sapphire, silicon carbide, fianite, ceramics, glass, semiconductors and other materials that are able to withstand heating to said temperatures.
- Coating may contain copper, nickel, aluminum, zinc, titanium, tungsten, germanium, gold, cobalt, molybdenum, tin, palladium, platinum and their alloys.
- Mechanical smearing of the particles, which would form coating, is achieved by mixing in various mills and mixers. If the surface to be coated is flat, one has to spread the particles on the surface by rolling or by pouring a suspension with a high content of the solid phase with a subsequent drying and rolling.
- a substrate having a complex shape can be treated with the help of pulverization of a suspension or of a powder.
- the compounds that serve to form a coating are monoxide and dioxide of copper, monoxide of nickel, oxides, hydroxides and sulfides of said metals.
- One or several layers of the metal coating can be deposited by means of the described technique or by other methods on the metal coating obtained.
- the metal coating obtained can be protected from oxidation by treatment in organic solvents (CF 2 C1 2 , CHC1F or CF 4 ). Sometimes it is necessary to obtain a layer of metal oxide on a substrate or on a powder. In this case the metal layer obtained is heated in oxidizing atmosphere till the required degree of oxidation is attained.
- organic solvents CF 2 C1 2 , CHC1F or CF 4 .
- the metal coating produced by the described method is characterized by high density and high value of adhesion to the surface of the coated material; one can obtain a coating of desired thickness and degree of coverage; 100 % degree of coverage can be achieved.
- the method is also advantageous in that the process is performed at relatively low temperatures and does not require neither equipment of complicated design nor expensive reagents, the process has high productivity and it can be organized in such a way that it has no waste products.
- the metal coating obtained has a rough surface, which provides good retention of metallized abrasive grains both in metal and organic matrixes of abrasive instruments.
- the degree of coverage and the thickness were estimated with the help of X-ray diffraction technique.
- the depth of penetration of CuK ⁇ radiation in a copper sample is more than 3 ⁇ m.
- the diffraction maximums corresponding to the structure of diamond were not observed in the X-ray diffraction pattern of the dimond powder coated with copper.
- the thickness of the coating is more than 3 ⁇ m and the degree of coverage is 100 % (the accuracy of the measurements is 0.5 %).
- corundum powder Al 2 O 3 , particles size 60-80 ⁇ m
- the suspension had been obtained by mixing of titanium powder in a solution containing water and ethanol for 15-30 min. The solvent was then evaporated at 100 °C and the mixture was heated in a closed reactor at temperatures 250-300 °C. After cooling the powder was treated by CF 4 and dried.
- Adherence of the coating was estimated by comparison of the X-ray diffraction data obtained before and after treatment of the metallized powder in an ultrasonic bath at frequency 20 kHz for 3 min. No difference between the X-ray diffraction spectra of the metallized powder before and after ultrasonic treatment was found, which is an evidence of a high value of adhesion at the metal/dielectric boundary.
- a ceramic plate containing zirconium dioxide was degreased, cleaned and dried.
- a suspension of high solid phase content was poured on the surface of the plate to form a film of 10 ⁇ m.
- the suspension had been prepared by mixing nickel monoxide (90 %), polyvinilbutiral, plastifier and stabilizer in a mill containing milling balls. After drying the plate was heated in the atmosphere of dry hydrogen at 390 °C. Release of the calculated amount of water indicated the end of the process. After cooling the plate was treated in CF 2 C1 2 and dried. Industrial application.
- the invention can be used in industry in applying metal coatings on the surfaces of various materials (particles and substrates) including dielectrics, semiconductors and metals. It can be used, for example, in manufacturing of abrasive tools for the metallization of abrasive particles, in automotive industry for producing metal-matrix composites, in applying metal coating to ceramic materials and in electronics in manufacturing of such devices as heat sinks, circuit boards, resistors, electrodes, sensors and magnetic media.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU15884/00A AU1588400A (en) | 1998-07-17 | 1999-07-14 | Method of applying metal coatings on particles and substrates |
GBGB0103602.9A GB0103602D0 (en) | 1998-07-17 | 2001-02-14 | Method of applying metal coatings on particles and substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU98113972 | 1998-07-17 | ||
RU98113972/02A RU2149217C1 (en) | 1998-07-17 | 1998-07-17 | Method of applying metal coating on the surface of powders and substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000008220A1 true WO2000008220A1 (en) | 2000-02-17 |
Family
ID=20208708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/RU1999/000254 WO2000008220A1 (en) | 1998-07-17 | 1999-07-14 | Method of applying metal coatings on particles and substrates |
Country Status (4)
Country | Link |
---|---|
AU (1) | AU1588400A (en) |
GB (1) | GB0103602D0 (en) |
RU (1) | RU2149217C1 (en) |
WO (1) | WO2000008220A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2298474A3 (en) * | 2003-01-23 | 2013-12-25 | General Electric Company | Fabrication and utilization of metallic powder prepared without melting |
US8778015B2 (en) * | 2005-03-04 | 2014-07-15 | Noureddine Frid | Interventional medical device for use in MRI |
US10100386B2 (en) | 2002-06-14 | 2018-10-16 | General Electric Company | Method for preparing a metallic article having an other additive constituent, without any melting |
JP2020002434A (en) * | 2018-06-28 | 2020-01-09 | 東邦チタニウム株式会社 | Manufacturing method of metallic reduction reaction vessel including diffusion layer, manufacturing method of high melting point metal, and coating material for metallic reduction reaction vessel |
US10604452B2 (en) | 2004-11-12 | 2020-03-31 | General Electric Company | Article having a dispersion of ultrafine titanium boride particles in a titanium-base matrix |
US11894233B2 (en) * | 2018-08-23 | 2024-02-06 | Applied Materials, Inc. | Electronic device having an oxygen free platinum group metal film |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2493938C2 (en) * | 2011-12-26 | 2013-09-27 | Учреждение Российской академии наук Институт химии твердого тела Уральского отделения РАН | Composite nanopowder and method for production thereof |
RU2505621C1 (en) * | 2012-07-12 | 2014-01-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский Томский политехнический университет" | Copper coating application method |
EP3527306A1 (en) | 2018-02-14 | 2019-08-21 | H.C. Starck Tungsten GmbH | Powder comprising coated hard particles |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0297678A1 (en) * | 1987-06-30 | 1989-01-04 | Akzo N.V. | Conductive metallization of substrates without developing agents |
SU318314A1 (en) * | 1969-11-28 | 1990-01-07 | Vajstukh I M | Method of metal-coating of diamond grains |
EP0358829A1 (en) * | 1988-09-13 | 1990-03-21 | Triad Investors Corporation | Process for modifying the surface of metal or metal alloy substrates and surface modified products produced thereby |
-
1998
- 1998-07-17 RU RU98113972/02A patent/RU2149217C1/en not_active IP Right Cessation
-
1999
- 1999-07-14 WO PCT/RU1999/000254 patent/WO2000008220A1/en not_active Application Discontinuation
- 1999-07-14 AU AU15884/00A patent/AU1588400A/en not_active Abandoned
-
2001
- 2001-02-14 GB GBGB0103602.9A patent/GB0103602D0/en not_active Ceased
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU318314A1 (en) * | 1969-11-28 | 1990-01-07 | Vajstukh I M | Method of metal-coating of diamond grains |
EP0297678A1 (en) * | 1987-06-30 | 1989-01-04 | Akzo N.V. | Conductive metallization of substrates without developing agents |
EP0358829A1 (en) * | 1988-09-13 | 1990-03-21 | Triad Investors Corporation | Process for modifying the surface of metal or metal alloy substrates and surface modified products produced thereby |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10100386B2 (en) | 2002-06-14 | 2018-10-16 | General Electric Company | Method for preparing a metallic article having an other additive constituent, without any melting |
EP2298474A3 (en) * | 2003-01-23 | 2013-12-25 | General Electric Company | Fabrication and utilization of metallic powder prepared without melting |
US10604452B2 (en) | 2004-11-12 | 2020-03-31 | General Electric Company | Article having a dispersion of ultrafine titanium boride particles in a titanium-base matrix |
US8778015B2 (en) * | 2005-03-04 | 2014-07-15 | Noureddine Frid | Interventional medical device for use in MRI |
JP2020002434A (en) * | 2018-06-28 | 2020-01-09 | 東邦チタニウム株式会社 | Manufacturing method of metallic reduction reaction vessel including diffusion layer, manufacturing method of high melting point metal, and coating material for metallic reduction reaction vessel |
JP7106371B2 (en) | 2018-06-28 | 2022-07-26 | 東邦チタニウム株式会社 | METHOD FOR MANUFACTURING METAL REDUCTION REACTION VESSEL WITH DIFFUSION LAYER, METHOD FOR MANUFACTURE OF HIGH-MELTING METAL, AND COATING MATERIAL FOR METAL REDUCE REACTION VESSEL |
US11894233B2 (en) * | 2018-08-23 | 2024-02-06 | Applied Materials, Inc. | Electronic device having an oxygen free platinum group metal film |
Also Published As
Publication number | Publication date |
---|---|
RU2149217C1 (en) | 2000-05-20 |
GB0103602D0 (en) | 2001-03-28 |
AU1588400A (en) | 2000-02-28 |
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