WO2000005758A1 - Electronic component and method for the production thereof - Google Patents

Electronic component and method for the production thereof Download PDF

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Publication number
WO2000005758A1
WO2000005758A1 PCT/EP1999/004839 EP9904839W WO0005758A1 WO 2000005758 A1 WO2000005758 A1 WO 2000005758A1 EP 9904839 W EP9904839 W EP 9904839W WO 0005758 A1 WO0005758 A1 WO 0005758A1
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WIPO (PCT)
Prior art keywords
substrate
spray
injection
electronic
elements
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Application number
PCT/EP1999/004839
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German (de)
French (fr)
Inventor
Joachim Sieg
Original Assignee
Elcos Gmbh Electronic Components Support
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Publication date
Application filed by Elcos Gmbh Electronic Components Support filed Critical Elcos Gmbh Electronic Components Support
Priority to AU54103/99A priority Critical patent/AU5410399A/en
Publication of WO2000005758A1 publication Critical patent/WO2000005758A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14967—Injecting through an opening of the insert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Definitions

  • the invention relates to an electronic component in which at least one electronic element is arranged on a substrate and is encapsulated by an injection element produced in the transfer mold injection molding process. It also relates to a method for producing these electronic components.
  • the transfer mold spraying process is usually used in semiconductor technology to encapsulate integrated circuits.
  • the structures and components to be encapsulated are covered with a mold into which the spray material is pressed via a side sprue.
  • the resulting spray element is firmly connected to the substrate and encapsulates the desired structure or the desired components.
  • a non-transparent plastic material is usually used as the spray material.
  • each segment has a light source that is encapsulated by a spray element.
  • a transparent material is used as the spray material in order to make the segment, that is to say in particular the spray element, shine by controlling the light source. Since all segments do not have to light up each time when a certain number is represented by means of such a 7-segment display, it must be ensured that the light from a light source of a segment does not shine into a neighboring segment which is not yet illuminated.
  • the invention is therefore based on the object of an electronic component and a method for its Specify production, in which a more reliable encapsulation of the individual components is made possible.
  • the substrate has a bore below the injection element as an injection cannula for the injection element.
  • the lateral sprue channels can be dispensed with, which also avoids the problems described above when spraying enclosed structures.
  • the individual spray elements are sprayed from the underside of the substrate via the individual injection cannulas. In this way, a plurality of spray elements can also be arranged on a substrate completely separately from one another if a spray element would not be accessible laterally from surrounding spray elements.
  • This type of encapsulation can be used for all electronic components. However, its use is particularly expedient in optoelectronic components in which the spraying elements act as light guide towers and it is particularly important that the individual light guide towers are arranged on a substrate in a completely separate manner.
  • Fig.l is a supervision of an electronic
  • FIG. 2 shows a sectional view along the line II-II of Fig.l.
  • an electronic component is shown as an example, in which a multiplicity of electronic elements 2 are arranged on a substrate 1.
  • Each of these electronic elements 2 is encapsulated by an injection element 3 produced using the transfer-old injection molding process.
  • the substrate 1 has a bore 4 beneath each injection element 2, which serves as an injection cannula for the associated injection element 3.
  • the spraying material which is usually a plastic material, is fed from the underside of the substrate through the bores 4, as indicated by the arrow 5 in FIG.
  • a shape complementary to the individual spray elements is placed on the top of the substrate, as is well known from practice.
  • each individual injection element 3 has a separate injection cannula, which is accessible from the underside of the substrate, the individual injection elements can be arranged on the substrate completely separately from one another. Distances between the individual segments of, for example, 0.5 mm can be realized without any problems.
  • the method described above for the production of electronic components is particularly suitable for the production of optoelectronic components in which the spray elements enclose an optoelectronic component, in particular a light source, and the spray elements themselves act as light guide towers.
  • the exemplary embodiment shown in the figures is an optoelectronic component of this type, which is designed here as a 7-segment display.
  • the optoelectronic component thus has seven spray elements 3 which act as light guide towers and to which a corresponding number of light sources 2 are assigned.
  • the light from the light sources 2 is guided in the spray elements 3 by reflection on the boundary walls to the end face 3a.
  • Appropriate control of the individual segments can therefore illuminate the associated end faces 3a, for example to represent digits.
  • the middle segment shown in FIG. 1 forms an "island" which, in the conventional manufacturing processes, could only be injected through a sprue which was passed between two outer segments. Due to the relatively small distance between the two outer segments of, for example, 0.5 mm, it was unavoidable in the conventional manufacturing processes that the sprue channel also established a connection to the two outer segments. However, a connection, however small, has the disadvantage that when one of the segments connected in this way is actuated, the other segment also increases slightly glow begins because the light is partly reflected in the not directly controlled segment.
  • the spraying process As a result of the spraying process, 4 spray approaches remain on the underside of the substrates in the area of the bores, which can lead to a relatively unclean underside of the substrate. If the electronic component is manufactured, for example, as an SMD component, a relatively smooth underside of the substrate is desirable.
  • a film 6, in particular a self-adhesive plastic film, is therefore expediently applied to the underside of the substrate before spraying. After spraying, the film 6 can be pulled off again, the spray attachments being torn off, as a result of which a clean and smooth substrate underside is obtained.
  • transparent spray material is expediently not to be understood as a highly transparent material. Rather, the material should be translucent for the light from the light source 2 in such a way that the light source 2 is not to be seen as a punctiform light source in the plan view according to FIG. 1, but rather the entire upper end face 3a is illuminated uniformly. With everyone else Applications can of course also use non-transparent spray material.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention relates to an electronic component and to a method for the production thereof, whereby at least one electronic element (2) is arranged on a substrate (1) and encapsulated by an injection-moulded element (3) that is produced according to a transfer-mould injection method. The substrate (1) has a bore hole (4) beneath the injection-moulded element (3). Said bore hole acts as an injection cannula for the injection-moulded element (3).

Description

Elektronisches Bauteil und Verfahren zu seiner HerstellungElectronic component and method for its production
Die Erfindung betrifft ein elektronisches Bauteil, bei dem auf einem Substrat wenigstens ein elektronisches Element angeordnet ist, das durch ein im Transfermold- Spritzverfahren hergestelltes Spritzelement verkapselt ist. Sie bezieht sich ferner auf ein Verfahren zur Herstellung dieser elektronischen Bauteile.The invention relates to an electronic component in which at least one electronic element is arranged on a substrate and is encapsulated by an injection element produced in the transfer mold injection molding process. It also relates to a method for producing these electronic components.
Das Transfermold-Spritzverfahren wird in der Halbleitertechnik üblicherweise zum Verkapseln von integrierten Schaltungen verwendet. Dabei werden die zu verkapselnden Strukturen und Bauteile mit einer Form abge- deckt, in die über einen seitlichen Angußkanal das Spritzmaterial hineingepreßt wird. Das dadurch entstehende Spritzelement ist fest mit dem Substrat verbunden und verkapselt die gewünschte Struktur bzw. die gewünschten Bauteile. Als Spritzmaterial wird üblicher- weise ein nicht transparentes Kunststoffmaterial verwendet.The transfer mold spraying process is usually used in semiconductor technology to encapsulate integrated circuits. The structures and components to be encapsulated are covered with a mold into which the spray material is pressed via a side sprue. The resulting spray element is firmly connected to the substrate and encapsulates the desired structure or the desired components. A non-transparent plastic material is usually used as the spray material.
In der Optoelektronik gibt es Anwendungsfälle, bei denen auf einem Substrat mehrere optoelektronische Bau- teile getrennt voneinander verkapselt werden müssen. Dies ist beispielsweise bei 7-Segment-Anzeigen der Fall, mit deren Hilfe sich beispielsweise Zahlen darstellen lassen. Hierbei weist jedes Segment eine Lichtquelle auf, die durch ein Spritzelement verkapselt wird. Als Spritzmaterial wird hierbei ein transparentes Material verwendet, um durch Ansteuerung der Lichtquelle das Segment, d.h. insbesondere das Spritzelement, zum Leuchten zu bringen. Da bei Darstellung einer bestimmten Ziffer mittels einer derartigen 7-Segment-Anzeige nicht jedesmal alle Segmente leuchten müssen, muß gewährleistet sein, daß das Licht einer Lichtquelle eines Segments nicht in ein gerade nicht beleuchtetes, benachbartes Segment einstrahlt.There are applications in optoelectronics in which several optoelectronic components have to be encapsulated separately from one another on a substrate. This is the case, for example, with 7-segment displays, which can be used, for example, to display numbers. Here, each segment has a light source that is encapsulated by a spray element. In this case, a transparent material is used as the spray material in order to make the segment, that is to say in particular the spray element, shine by controlling the light source. Since all segments do not have to light up each time when a certain number is represented by means of such a 7-segment display, it must be ensured that the light from a light source of a segment does not shine into a neighboring segment which is not yet illuminated.
Um dies zu erreichen, müssen die einzelnen Spritzelemente völlig getrennt voneinander auf dem Substrat an- geordnet werden. Mit dem derzeitigen Spritzverfahren ist dies jedoch insbesondere für das mittlere Spritzelement, das von den anderen Spritzelementen umgeben ist, besonders schwierig zu realisieren, da der Angußkanal seitlich herausgeführt werden muß. Die Abstände der umgebenden Spritzelemente sind jedoch so gering, daß es sich nicht vermeiden läßt, daß der Angußkanal zum mittleren Spritzelement eine, wenn auch geringfügige Verbindung zu den beiden äußeren Spritzelementen eingeht, zwischen denen der Angußkanal hindurchgeführt wird.In order to achieve this, the individual spray elements must be arranged on the substrate completely separately from one another. With the current spraying method, however, this is particularly difficult to achieve, in particular for the middle spraying element, which is surrounded by the other spraying elements, since the sprue must be led out to the side. However, the distances between the surrounding spray elements are so small that it cannot be avoided that the sprue channel to the middle spray element makes a connection, albeit a slight one, to the two outer spray elements, between which the sprue channel is passed.
Eine noch so geringe Verbindung hat jedoch den Effekt, daß bei Ansteuerung eines der auf diese Weise verbundenen Segmente das dort erzeugte Licht auch in das ver- bundene, nicht angesteuerte Segment einstrahlt und dieses dann auch schwach zu leuchten beginnt.However small a connection, however, has the effect that when one of the segments connected in this way is activated, the light generated there also radiates into the connected, non-activated segment and this then also begins to glow weakly.
Für eine hochwertige 7-Segment-Anzeige ist es jedoch wünschenswert, daß lediglich die angesteuerten Segmente leuchten und alle anderen völlig dunkel bleiben.For a high-quality 7-segment display, however, it is desirable that only the activated segments light up and all the others remain completely dark.
Der Erfindung liegt daher die Aufgabe zugrunde, ein elektronisches Bauteil sowie ein Verfahren zu seiner Herstellung anzugeben, bei dem eine zuverlässigere Ver- kapselung der einzelnen Bauteile ermöglicht wird.The invention is therefore based on the object of an electronic component and a method for its Specify production, in which a more reliable encapsulation of the individual components is made possible.
Erfindungsgemäß wird diese Aufgabe durch die Merkmale der Ansprüche 1 und 5 gelöst.According to the invention, this object is achieved by the features of claims 1 and 5.
Weitere Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche.Further embodiments of the invention are the subject of the dependent claims.
Erfindungsgemäß weist das Substrat unterhalb des Spritzelements eine Bohrung als Anspritzkanüle für das Spritzelement auf. Auf diese Weise kann auf die seitlichen Angußkanäle verzichtet werden, wodurch auch die oben beschriebene Problematik beim Spritzen von einge- schlossenen Strukturen vermieden wird. Das Spritzen der einzelnen Spritzelemente erfolgt von der Unterseite des Substrats über die einzelnen Anspritzkanülen. Auf diese Art und Weise können auf einem Substrat vor allem auch dann mehrere Spritzelemente völlig voneinander getrennt angeordnet werden, wenn ein Spritzelement durch umgebende Spritzelemente seitlich nicht zugänglich wäre.According to the invention, the substrate has a bore below the injection element as an injection cannula for the injection element. In this way, the lateral sprue channels can be dispensed with, which also avoids the problems described above when spraying enclosed structures. The individual spray elements are sprayed from the underside of the substrate via the individual injection cannulas. In this way, a plurality of spray elements can also be arranged on a substrate completely separately from one another if a spray element would not be accessible laterally from surrounding spray elements.
Diese Art der Verkapselung ist für alle elektronischen Bauteile verwendbar. Besonders zweckmäßig ist jedoch sein Einsatz bei optoelektronischen Bauelementen, bei denen die Spritzelemente als Lichtleitertürme wirken und es dabei von besonderer Bedeutung ist, daß die einzelnen Lichtleitertürme völlig voneinander getrennt auf einem Substrat angeordnet sind.This type of encapsulation can be used for all electronic components. However, its use is particularly expedient in optoelectronic components in which the spraying elements act as light guide towers and it is particularly important that the individual light guide towers are arranged on a substrate in a completely separate manner.
Weitere Vorteile und Ausgestaltungen der Erfindung werden anhand der folgenden Beschreibung und der Zeichnung näher erläutert. In der Zeichnung zeigenFurther advantages and refinements of the invention are explained in more detail on the basis of the following description and the drawing. Show in the drawing
Fig.l eine Aufsicht auf ein elektronischesFig.l is a supervision of an electronic
Bauteil,Component,
Fig.2 eine Schnittdarstellung längs der Linie II-II der Fig.l.2 shows a sectional view along the line II-II of Fig.l.
In den Zeichnungen ist beispielhaft ein elektronisches Bauteil dargestellt, bei dem auf einem Substrat 1 eine Vielzahl von elektronischen Elementen 2 angeordnet sind. Jedes dieser elektronischen Elemente 2 ist durch ein im Transfer old-Spritzverfahren hergestelltes Spritzelement 3 verkapselt.In the drawings, an electronic component is shown as an example, in which a multiplicity of electronic elements 2 are arranged on a substrate 1. Each of these electronic elements 2 is encapsulated by an injection element 3 produced using the transfer-old injection molding process.
Das Substrat 1 weist unter jedem Spritzelement 2 eine Bohrung 4 auf, die als Anspritzkanüle für das zugehörige Spritzelement 3 dient. Bei der Herstellung der Spritzelemente 3 wird das Spritzmaterial, bei dem es sich üblicherweise um ein Kunststoffmaterial handelt, von der Unterseite des Substrats durch die Bohrungen 4 zugeführt, wie das in Fig.2 mit dem Pfeil 5 angedeutet ist. Auf der Oberseite des Substrats ist eine komplementär zu den einzelnen Spritzelementen ausgebildete Form aufgesetzt, wie das aus der Praxis hinlänglich bekannt ist.The substrate 1 has a bore 4 beneath each injection element 2, which serves as an injection cannula for the associated injection element 3. In the manufacture of the spraying elements 3, the spraying material, which is usually a plastic material, is fed from the underside of the substrate through the bores 4, as indicated by the arrow 5 in FIG. A shape complementary to the individual spray elements is placed on the top of the substrate, as is well known from practice.
Nachdem jedes einzelne Spritzelement 3 eine separate Anspritzkanüle aufweist, die von der Unterseite des Substrats zugänglich ist, können die einzelnen Spritzelemente völlig voneinander getrennt auf dem Substrat angeordnet werden. Dabei sind Abstände zwischen den einzelnen Segmenten von beispielsweise 0,5 mm völlig problemlos zu realisieren. Das oben beschriebene Verfahren zur Herstellung von elektronischen Bauteilen ist besonders für die Herstellung von optoelektronischen Bauteilen geeignet, bei denen die Spritzelemente ein optoelektronisches Bauteil, insbesondere eine Lichtquelle umschließen und die Spritzelemente selbst als Lichtleitertürme wirken. Bei dem in den Figuren dargestellten Ausführungsbeispiel handelt es sich um ein solches optoelektronisches Bau- teil, das hier als 7-Segment-Anzeige ausgebildet ist.After each individual injection element 3 has a separate injection cannula, which is accessible from the underside of the substrate, the individual injection elements can be arranged on the substrate completely separately from one another. Distances between the individual segments of, for example, 0.5 mm can be realized without any problems. The method described above for the production of electronic components is particularly suitable for the production of optoelectronic components in which the spray elements enclose an optoelectronic component, in particular a light source, and the spray elements themselves act as light guide towers. The exemplary embodiment shown in the figures is an optoelectronic component of this type, which is designed here as a 7-segment display.
Das optoelektronische Bauteil weist somit sieben, als Lichtleitertürme wirkende Spritzelemente 3 auf, denen eine entsprechende Anzahl an Lichtquellen 2 zugeordnet ist. Das Licht der Lichtquellen 2 wird in den Spritzelementen 3 durch Reflektion an den Begrenzungswänden zur Stirnfläche 3a geführt.The optoelectronic component thus has seven spray elements 3 which act as light guide towers and to which a corresponding number of light sources 2 are assigned. The light from the light sources 2 is guided in the spray elements 3 by reflection on the boundary walls to the end face 3a.
Durch entsprechende Ansteuerung der einzelnen Segmente können daher die zugehörigen Stirnflächen 3a beleuchtet werden, um beispielsweise Ziffern darzustellen.Appropriate control of the individual segments can therefore illuminate the associated end faces 3a, for example to represent digits.
Das in Fig.l dargestellte mittlere Segment bildet eine "Insel", das bei den herkömmlichen Herstellungsverfah- ren nur durch einen Angußkanal gespritzt werden konnte, der zwischen zwei äußeren Segmenten hindurchgeführt worden ist. Aufgrund des relativ geringen Abstands zwischen den zwei äußeren Segmenten von beispielsweise 0,5 mm war es bei den herkömmlichen Herstellungsverfahren nicht zu vermeiden, daß der Angußkanal auch eine Verbindung zu den beiden äußeren Segmenten aufgebaut hat. Eine noch so kleine Verbindung hat jedoch den Nachteil, daß bei Ansteuerung eines der auf diese Weise verbundenen Segmente auch das andere Segment geringfügig zu leuchten beginnt, da das Licht zum Teil auch in das nicht direkt angesteuerte Segment reflektiert wird.The middle segment shown in FIG. 1 forms an "island" which, in the conventional manufacturing processes, could only be injected through a sprue which was passed between two outer segments. Due to the relatively small distance between the two outer segments of, for example, 0.5 mm, it was unavoidable in the conventional manufacturing processes that the sprue channel also established a connection to the two outer segments. However, a connection, however small, has the disadvantage that when one of the segments connected in this way is actuated, the other segment also increases slightly glow begins because the light is partly reflected in the not directly controlled segment.
Diese Problematik wird erfindungsgemäß jedoch durch die im Substrat unter den einzelnen Spritzelementen 3 vorgesehenen Bohrungen 4 vermieden.According to the invention, however, this problem is avoided by the holes 4 provided in the substrate under the individual spray elements 3.
Bedingt durch das Spritzverfahren verbleiben an der Unterseite der Substrate im Bereich der Bohrungen 4 Spritzansätze bestehen, die zu einer relativ unsauberen Unterseite des Substrats führen können. Wird das elektronische Bauteil beispielsweise als SMD-Bauteil hergestellt, ist jedoch eine relativ glatte Unterseite des Substrats wünschenswert.As a result of the spraying process, 4 spray approaches remain on the underside of the substrates in the area of the bores, which can lead to a relatively unclean underside of the substrate. If the electronic component is manufactured, for example, as an SMD component, a relatively smooth underside of the substrate is desirable.
Zur Vermeidung der überstehenden Spritzansätze wird daher zweckmäßigerweise vor dem Spritzen auf die Unterseite des Substrats eine Folie 6, insbesondere eine selbstklebende Kunststoff-Folie aufgebracht. Nach dem Spritzen kann die Folie 6 wieder abgezogen werden, wobei die Spritzansätze mitabgerissen werden, wodurch man eine saubere und glatte Substratunterseite erhält.To avoid the protruding spray deposits, a film 6, in particular a self-adhesive plastic film, is therefore expediently applied to the underside of the substrate before spraying. After spraying, the film 6 can be pulled off again, the spray attachments being torn off, as a result of which a clean and smooth substrate underside is obtained.
Als Spritzmaterial verwendet man zweckmäßigerweise ein Kunststoffmaterial auf Epoxydharzbasis, das im Falle von optoelektronischen Bauelementen transparent ausgebildet ist. Unter transparentem Spritzmaterial ist im Rahmen der Erfindung jedoch zweckmäßigerweise kein hochtransparentes Material zu verstehen. Das Material soll vielmehr für das Licht der Lichtquelle 2 derart durchscheinend sein, daß die Lichtquelle 2 in der Aufsicht gemäß Fig.l nicht als punktförmige Lichtquelle zu sehen ist, sondern vielmehr die gesamte obere Stirnfläche 3a gleichmäßig erleuchtet wird. Bei allen anderen Anwendungen kann selbstverständlich auch nicht transparentes Spritzmaterial Verwendung finden. A plastic material based on epoxy resin, which is transparent in the case of optoelectronic components, is expediently used as the spray material. In the context of the invention, however, transparent spray material is expediently not to be understood as a highly transparent material. Rather, the material should be translucent for the light from the light source 2 in such a way that the light source 2 is not to be seen as a punctiform light source in the plan view according to FIG. 1, but rather the entire upper end face 3a is illuminated uniformly. With everyone else Applications can of course also use non-transparent spray material.

Claims

Patentansprüche: Claims:
1. Elektronische Bauteil, bei dem auf einem Substrat (1) wenigstens ein elektronisches Element (2) ange- ordnet ist, das durch ein im Transfermold-Spritzver- fahren hergestelltes Spritzelement (3) verkapselt ist,1. Electronic component in which at least one electronic element (2) is arranged on a substrate (1) and is encapsulated by a spray element (3) produced by the transfer mold injection molding process,
dadurch gekennzeichnet, daß das Substrat (1) unter- halb des Spritzelements (3) eine Bohrung (4) als Anspritzkanüle für das Spritzelement (3) aufweist.characterized in that the substrate (1) below the spray element (3) has a bore (4) as a spraying cannula for the spray element (3).
2. Bauteil nach Anspruch 1, dadurch gekennzeichnet, daß auf dem Substrat mehrere elektronische Elemente (2) angeordnet sind, die jeweils durch ein im Transfer- mold-Spritzverfahren hergestelltes Spritzelement (3) verkapselt sind, wobei für jedes Spritzelement wenigstens eine zugeordnete Bohrung im Substrat als Anspritzkanüle vorgesehen ist und die einzelnen Spritzelemente (3) völlig voneinander getrennt auf dem Substrat (1) angeordnet sind.2. Component according to claim 1, characterized in that a plurality of electronic elements (2) are arranged on the substrate, each of which is encapsulated by an injection element (3) produced in the transfer-mold injection molding process, with at least one associated hole in the injection element for each injection element The substrate is provided as an injection cannula and the individual spray elements (3) are arranged on the substrate (1) in a manner completely separate from one another.
3. Bauteil nach Anspruch 1, dadurch gekennzeichnet, daß es sich bei dem Bauteil um ein optoelektronisches Bauteil handelt und die Spritzelemente (3) transparent ausgebildet sind.3. Component according to claim 1, characterized in that the component is an optoelectronic component and the spray elements (3) are transparent.
4. Bauteil nach Anspruch 1, dadurch gekennzeichnet, daß es sich bei dem elektronischen Element um eine Lichtquelle handelt und das Spritzelement (3) zur4. The component according to claim 1, characterized in that the electronic element is a light source and the spray element (3) for
Führung der von der Lichtquelle ausgehenden Lichtstrahlen dient. Guidance of the light rays emanating from the light source is used.
5. Verfahren zur Herstellung von elektronischen Bauteilen, die wenigstens ein elektronisches Element (2) aufweisen, das auf einem Substrat (1) angeordnet und anschließend im Transfermold-Spritzverfahren verkap- seit wird,5. Process for the production of electronic components which have at least one electronic element (2) which is arranged on a substrate (1) and then encapsulated in the transfer mold injection process,
dadurch gekennzeichnet, daß das Substrat (1) mit wenigstens einer Bohrung (4) versehen wird und das Spritzmaterial zur Verkapselung des elektronischen Elements (2) von der Unterseite des Substrats durch diese Bohrung zugeführt wird.characterized in that the substrate (1) is provided with at least one bore (4) and the spray material for encapsulation of the electronic element (2) is fed through this bore from the underside of the substrate.
6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, daß als Spritzmaterial transparentes Kunststoff ate- rial verwendet wird.6. The method according to claim 5, characterized in that transparent plastic is used as a spray material.
7. Verfahren nach Anspruch 5, dadurch gekennzeichnet, daß auf die Unterseite des Substrats (1) vor dem Bohren eine Folie (6) , insbesondere eine Kunststoff- Folie aufgebracht wird.7. The method according to claim 5, characterized in that a film (6), in particular a plastic film is applied to the underside of the substrate (1) before drilling.
8. Verfahren nach Anspruch 7, dadurch gekennzeichnet, daß die Folie (6) nach dem Spritzen wieder entfernt wird. 8. The method according to claim 7, characterized in that the film (6) is removed again after spraying.
PCT/EP1999/004839 1998-07-22 1999-07-09 Electronic component and method for the production thereof WO2000005758A1 (en)

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DE19833039.1 1998-07-22
DE1998133039 DE19833039A1 (en) 1998-07-22 1998-07-22 Opto-electronic components encapsulated in transparent plastic to make e.g. displays, are rear-injected individually through holes in substrate to prevent undesirable segment cross-illumination

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