WO1999062644A1 - Device for uniformly applying paste - Google Patents

Device for uniformly applying paste Download PDF

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Publication number
WO1999062644A1
WO1999062644A1 PCT/JP1998/002513 JP9802513W WO9962644A1 WO 1999062644 A1 WO1999062644 A1 WO 1999062644A1 JP 9802513 W JP9802513 W JP 9802513W WO 9962644 A1 WO9962644 A1 WO 9962644A1
Authority
WO
WIPO (PCT)
Prior art keywords
paste
nozzle
parts
electrode
discharge member
Prior art date
Application number
PCT/JP1998/002513
Other languages
French (fr)
Japanese (ja)
Inventor
Akio Harada
Tsuyoshi Nishi
Original Assignee
Daiken Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiken Chemical Co., Ltd. filed Critical Daiken Chemical Co., Ltd.
Priority to PCT/JP1998/002513 priority Critical patent/WO1999062644A1/en
Priority to JP56026099A priority patent/JP3536924B2/en
Publication of WO1999062644A1 publication Critical patent/WO1999062644A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/082—Coating starting from inorganic powder by application of heat or pressure and heat without intermediate formation of a liquid in the layer
    • C23C24/085—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/087—Coating with metal alloys or metal elements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C7/00—Apparatus specially designed for applying liquid or other fluent material to the inside of hollow work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
    • C23C10/30—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes using a layer of powder or paste on the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/06—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00 specially designed for treating the inside of hollow bodies
    • B05B13/0645—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00 specially designed for treating the inside of hollow bodies the hollow bodies being rotated during treatment operation

Definitions

  • the present invention relates to an apparatus for applying a metal paste to a desired shape on the inner surface of a component such as an electronic component, and more particularly, to apply a paste containing a noble metal to a uniform thickness to minimize the amount of the noble metal used.
  • the present invention relates to a paste uniform coating apparatus capable of producing an electronic component of good quality by forming an electrode film with a very uniform thickness.
  • This noble metal paste is, for example, a semi-fluid substance having a predetermined viscosity in which an organometallic complex of a noble metal is dispersed in an organic solvent.
  • a desired pattern is formed on a flat electronic component surface by using a screen printing technique. It can be applied to If a noble metal paste is applied and dried, and the electrode part is baked at a predetermined temperature, all organic substances are removed and scattered, and finally only the metal is sintered as a metal film, and metal wiring and A metal electrode is formed.
  • the screen printing technology described above is a very effective technology for applying a metal paste to the surface of a planar electronic component.
  • a large number of electronic components having a curved surface or a cylindrical shape have appeared, and a new technology for forming an electrode or a wiring having a desired shape on the inner surface of the curved surface or the cylindrical component has been demanded.
  • a new technology for forming an electrode or a wiring having a desired shape on the inner surface of the curved surface or the cylindrical component has been demanded.
  • FIG. 1 is a cross-sectional view of a main part of an oxygen sensor for detecting an oxygen concentration in an exhaust gas of an automobile.
  • the cylindrical oxygen sensor 2 is made of ceramic, and has an inner ring-shaped inner electrode 4 made of platinum and a lead portion 6 formed on the inner surface, and an outer electrode (not shown) formed on the outer surface at a tip portion. Is formed.
  • This oxygen sensor is installed in the exhaust pipe, and the oxygen concentration in the exhaust gas is detected by an external electrode, the oxygen concentration in the atmosphere is detected by an internal electrode, and a voltage corresponding to the difference between the internal and external oxygen concentrations is generated. It measures oxygen concentration in exhaust gas.
  • the shape is not limited to a cylindrical shape, and various shapes such as a polygonal cylindrical shape, a conical shape, and a hollow shape are conceivable.
  • External electrodes can be easily immersed in the paste of electronic components—existing printing techniques, but the problem is how to form the internal electrodes.
  • the present inventors have already proposed a paste coating apparatus disclosed in Japanese Patent Application Laid-Open No. Hei 9-97510.
  • FIG. 7 shows a schematic front view of this conventional device. This device has a mounting portion 10 on which a cylindrical electronic component 8 such as an oxygen sensor is mounted, and this mounting portion 10 can be moved up and down.
  • Fig. 8 is an explanatory diagram of the paste application state using this conventional device.
  • a soft member 20 is attached to the end of a nozzle 16 whose tip is sealed, and a discharge penetrating through the soft member 20 and the nozzle 16 is shown.
  • a hole 22 is formed.
  • the feature of this conventional device is that the paste is applied while the shrinkable soft member 20 is pressed against the inner surface 8 a of the electronic component 8.
  • the paste pumping section 18 is pressurized for a predetermined time, a fixed amount of paste is pumped from the dispenser body 14 and the paste flows out of the discharge holes 22.
  • an annular internal electrode 4 having a predetermined width is formed.
  • Part 6 is formed.
  • the first disadvantage of this conventional device is that the soft member 20 is pressed against the inner surface 8 a of the electronic component 8.
  • an electrode having a width of only the width w of the soft member 20 could be formed by the pressure welding method.
  • the application of the pressure welding can reliably apply the internal electrode 4 and the lead portion 6.
  • this pressure welding method causes the thickness of the internal electrode 4 and the lead portion 6 to be uneven in the width direction.
  • the pressure welding method has the effect of increasing the thickness of the paste at the left and right ends in the electrode width direction and reducing the thickness at the center.
  • this drawback also appears in the non-uniform thickness of the lead portion 6 and the increase in the width, which is the greatest weakness of the electrode formation by the pressure welding method.
  • the second drawback arises from the fact that the dispenser body 14 is arranged in the horizontal direction, as can be seen from FIG.
  • the paste pumping section 18 When the paste pumping section 18 is in a pressurized state, the paste filled in the dispenser 14 is pressed to the nozzle side, and does not drop down to the paste pumping section 18 side. Absent.
  • the paste in the dispenser body 14 flows down to the paste pumping section 18 by its own weight. Solidification of the paste in the paste feeding section due to long-term non-use has also caused equipment failure.
  • the soft member is not brought into contact with the surface of the electronic component. Since they are not brought into contact with each other, there is no fear of damaging the electronic components, and not only soft members but also hard members can be used. In other words, there is no need to limit the material of the soft member to the hard member, and the concept will be expressed in the future as a discharge member that includes both.
  • the point of the present invention is how far the ejection member is kept away from the surface of the electronic component. In other words, if the discharge member is moved relative to the surface of the component while discharging the paste into the space, that is, the gap, the discharge speed and the relative speed are adjusted to make the uniformity determined at the space. It is possible to form a thick paste film.
  • the interval between the discharge speed and the relative speed can be determined empirically, it can be determined empirically, and ultimately the point of the present invention is how to make the interval.
  • a paste is a material obtained by dissolving an organometallic complex in an organic solvent at a predetermined viscosity. Even if this wet paste is applied with a certain thickness, the paste is evaporated to evaporate the organic solvent. As a result, its thickness shrinks. In addition, if fired thereafter, organic substances are scattered and removed. Therefore, after a sudden decrease in volume, a film of a simple metal such as platinum may be finally formed. And As a result of intensive studies, the present inventors have calculated that the thickness of a metal film that can function as an electrode of an electronic component is l to 10 / im, preferably 2 to 7 / m. It is intended that this value can be applied not only to the electrode film but also to the semiconductor thick film technology.
  • the thickness of the dried paste was reduced to about 15 by firing, and the thickness of the wet paste was reduced to 50% by drying. Therefore, when the thickness of the metal film was calculated backward, the thickness of the dry paste was 5 to 50 ⁇ , and it was found that the appropriate thickness of the wet paste was 10 to 100 m.
  • the distance between the surface of the ejection member and the surface of the electronic component should be set to 10 to 100 ⁇ . Desirably, it should be set to 20 to 70 im. With such a setting, the electrode film thickness can be formed to 1 to 10 / im, preferably 2 to 7 / im.
  • a nozzle for fixing the ejection member or a vertical position adjustment device capable of vertically moving the electronic component may be provided.
  • a well-known vertical position adjusting device is provided for the entirety of the mounting means for mounting the electronic components and the rotation drive unit thereof ( and a vertical position adjusting device for the entire nozzle whose tip is covered with the discharge member is provided. Or adjust the distance with both vertical position adjustment devices.
  • the means for discharging the paste includes a dispenser body filled with the paste, a nozzle connected to the tip of the body, and a predetermined amount of a nozzle from the dispenser body to the tip of the nozzle.
  • It can be composed of a pasting pumping section that pumps the pump.
  • a means such as a rotating mechanism or a piston mechanism for mechanically feeding the paste by a predetermined amount may be employed.
  • the relative movement device between the component such as an electronic component and the discharge member depends on the shape of the paste applied to the component.
  • the component is a cylindrical component such as the oxygen sensor described above, and an annular internal electrode is applied to the inner surface of the cylinder, it is only necessary to rotationally drive a mounting portion on which the component is mounted. It becomes a relative motion device.
  • the nozzle in order to form a linear lead portion on the inner surface of the cylinder, the nozzle can be freely moved in and out of the cylinder axis direction, and the driving device of the nozzle is a relative movement device.
  • the present invention is not limited to cylindrical electronic components, but is also effective for various shapes such as curved surfaces and conical shapes.
  • a horizontal movement device and a vertical movement device that move the nozzle three-dimensionally are required.
  • the nozzle is moved three-dimensionally while reading the coordinates of the curved surface with a computer. become. in this case ,
  • the horizontal movement device and the vertical movement device become relative movement devices.
  • Such a three-dimensional relative motion device can be easily realized by using computer technology.
  • Fig. 1 is a cross-sectional view of the main part of a cylindrical oxygen sensor that detects the oxygen concentration in the exhaust gas of an automobile.
  • FIG. 2 is a schematic front view of the paste uniform coating apparatus according to the present invention.
  • FIG. 3 is an explanatory view of a paste application state for forming an annular internal electrode by the apparatus of the present invention.
  • FIG. 4 is an explanatory view of a paste application state for forming a linear lead portion by the apparatus of the present invention.
  • FIG. 5 is an end view taken along line AA of FIG.
  • Figure 6 is a cross-sectional view of the main part of a two-stage cylindrical oxygen sensor that detects the oxygen concentration in the exhaust gas.
  • FIG. 7 is a schematic front view of a conventional paste coating apparatus.
  • FIG. 8 is an explanatory view of a paste application state for forming an annular internal electrode by a conventional apparatus.
  • FIG. 9 is an explanatory diagram of a paste application state for forming a linear lead portion by a conventional apparatus.
  • FIG. 2 is a schematic front view of the paste uniform coating apparatus according to the present invention.
  • This device has a mounting portion 10 composed of a chuck or the like on which a cylindrical electronic component 8 such as an oxygen sensor is mounted, a driving portion 12 for rotating the mounting portion 10, and a mounting portion 1.
  • the vertical position adjustment device 13 that moves the 0 and the drive unit 12 up and down together with the dispenser body 14 with the paste filled vertically, the nozzle 16 with the tip horizontally arranged, and the dispenser body It comprises an advance / retreat moving device 17 for horizontally moving the nozzle 14 and the nozzle 16 together in the horizontal direction, and a paste feeding section 18.
  • the display Since the sensor body is arranged almost vertically, the paste filled inside has a tendency to always flow down to the nozzle side by its own weight. However, the pressure is adjusted so that it does not actually flow down to the nozzle side. Therefore, since the paste does not flow backward to the paste pumping section, the paste clogging is improved.
  • FIG. 3 is an explanatory view of a state of a base applied by the apparatus of the present invention.
  • the tip of a nozzle 16 is coated with a discharge member 21, and the discharge member 21 and a discharge hole 2 penetrating the nozzle 16 are provided. 2 is perforated.
  • the feature of the device of the present invention is that the discharge member 21 is separated from the inner surface 8a of the electronic component 8 by a constant distance h.
  • the interval h is set to a suitable value within the range of 10 to 100 ⁇ , preferably 20 to 70; m. This interval is equal to the formed paste film thickness, and this film thickness is directly related to the finally formed electrode film thickness. According to the inventor's research.
  • the thickness of a commercially available metal paste is reduced to about 1/10 by drying and firing, the thickness of the paste is 10 to 100 ⁇ . If there is, the metal film thickness will be reduced to 1 to 10 jum. Therefore, it is important to set the interval h to about 10 times the finally obtained metal film thickness.
  • the paste pressure feeding section 18 When the paste pressure feeding section 18 is driven while maintaining the interval h, an amount of paste corresponding to the operating pressure and the operating time is supplied from the dispenser body 14.
  • the paste is discharged from the discharge hole 22 of the discharge member 21 via the nozzle 16, during which the mounting portion 10 rotates in the direction of arrow a to form the annular internal electrode 4.
  • the paste film thickness of the internal electrode 4 is equal to the interval h.
  • the width w of the discharge member becomes equal to the width of the internal electrode 4, and the electrode width can be designed by the width of the discharge member. That is, the electrode width can be varied by selecting the width of the discharge member.
  • the number of the discharge holes 22 formed in the discharge member 21 can also be changed according to the width.
  • FIG. 4 shows a process of forming the lead portion 6.
  • the reciprocating device 17 retreats, and the discharge member 21 moves horizontally in the direction of the arrow b to the outlet portion 8b of the electronic component 8.
  • the paste feeding section 18 is operated, and the linear lead section 6 is formed.
  • the paste film thickness of the lead portion 6 is also equal to the interval h.
  • FIG. 5 is an end view taken along the line A—A in FIG. 4, in which the thickness of the lead portion 6 is equal to the distance h, and This indicates that is uniformly formed.
  • the width L of the lead portion 6 can be set finely by adjusting the discharge speed and the relative movement speed, and as a result, the amount of paste used can be reduced.
  • the organic solvent evaporates from the wet paste film to form a dry paste film. After baking to remove the organic substance, the paste film changes to a metal film.
  • the oxygen sensor 4 shown in FIG. 1 is formed.
  • FIG. 6 is a cross-sectional view of a main part of a two-stage cylindrical oxygen sensor for detecting oxygen concentration in exhaust gas.
  • This step 6a can be formed by the following steps. While the nozzle 16 is moving backward by the reciprocating device 17, if the mounting portion 10 is moved up by the step by the vertical position adjusting device 13, the step portion 6 a is provided. Lead part 6 is completed.
  • interval is set between the discharge member of a nozzle tip part, and a component surface, and under this condition, a predetermined amount of paste is discharged from a discharge hole.
  • a paste coating having a very uniform thickness can be formed on the component surface.
  • the thickness of the metal film that can be formed after the drying and firing is extremely uniform, and a high-quality electrode film having no unevenness in resistance performance and conductive performance can be formed.
  • noble metals such as platinum are extremely expensive, the use of noble metals can be reduced to the minimum necessary by limiting the thickness of the electrodes, which can contribute to a reduction in the cost of electronic components.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A device for uniformly applying paste, which applies a noble metal paste on the inner surfaces of parts such as electronic parts in a desired configuration. The device is constituted of a mount (10) for mounting thereto parts (2, 8) to be coated with a paste, a nozzle (16) for supplying the paste, a delivery member (21) which covers the tip end of the nozzle (16), delivery ports (22) extending through the nozzle (16) and the delivery member (21), means for adjusting a spacing (h) between the surface of the delivery member and the surface of each part to be coated with the paste to 10 to 100 νm, means for delivering the paste with such spacing kept, and means for moving the parts and the nozzle relative to each other with the spacing maintained while the paste is delivered. Since a predetermined amount of paste is delivered to the parts with the spacing maintained, a paste film having an exceedingly uniform thickness can be formed on the surfaces of the parts. Accordingly, it is possible to form an electrode film of good quality which is uniform in terms of resistance performance and electric conductive performance and is provided with a metallic film of an exceedingly uniform thickness formed after drying and baking. As noble metals such as platinum are extremely expensive, limiting the electrode thickness can minimize the amount of a noble metal used and thus contribute to reduction in electronic part unit price.

Description

m 糸田 ペース ト均一塗布装置  m Itoda paste uniform dispenser
(技術分野） (Technical field)
本発明は電子部品等の部品内面に金属ペース トを所望形状に塗布する装置に関し、 更に詳細には、 貴金属を含有したペース トを均一な厚さに塗布して貴金属の使用量を 必要最小限に制限でき、 しかも電極膜の厚さを極めて均一に形成して良品質の電子部 品を生産できるペース ト均一塗布装置に関する。  The present invention relates to an apparatus for applying a metal paste to a desired shape on the inner surface of a component such as an electronic component, and more particularly, to apply a paste containing a noble metal to a uniform thickness to minimize the amount of the noble metal used. The present invention relates to a paste uniform coating apparatus capable of producing an electronic component of good quality by forming an electrode film with a very uniform thickness.
(背景技術） (Background technology)
電子部品技術の進展に伴って、 半導体等の電子部品の電極を形成するために、 白金 等の貴金属ペース ト が用いられるこ とが多く なつた。 この貴金属ペース トは、 例えば 貴金属の有機金属錯体を有機溶媒中に分散させた所定粘度を有する半流動状物質で、 平面状の電子部品表面にはスク リ 一ン印刷技術を用いて所望のパターンに塗布するこ とができ る。 貴金属ペース トを塗布した後乾燥させ、 電極部分を所定温度で焼成すれ ば、 有機物質はすべて除去飛散され、 最終的に金属だけが金属膜と して焼結し、 電子 部品表面に金属配線や金属電極が形成される。  With the development of electronic component technology, precious metal pastes such as platinum have been increasingly used to form electrodes for electronic components such as semiconductors. This noble metal paste is, for example, a semi-fluid substance having a predetermined viscosity in which an organometallic complex of a noble metal is dispersed in an organic solvent. A desired pattern is formed on a flat electronic component surface by using a screen printing technique. It can be applied to If a noble metal paste is applied and dried, and the electrode part is baked at a predetermined temperature, all organic substances are removed and scattered, and finally only the metal is sintered as a metal film, and metal wiring and A metal electrode is formed.
前述したス ク リ ーン印刷技術は金属ペース トを平面状電子部品の表面に塗布するに は極めて有効な技術である。 しかし、 近年、 曲面状や筒状の電子部品が多く 出現する よ う になり 、 この曲面や筒状部品の内面に所望形状の電極や配線を形成する新しい技 術が要望されるよ う になった。  The screen printing technology described above is a very effective technology for applying a metal paste to the surface of a planar electronic component. However, in recent years, a large number of electronic components having a curved surface or a cylindrical shape have appeared, and a new technology for forming an electrode or a wiring having a desired shape on the inner surface of the curved surface or the cylindrical component has been demanded. Was.
例えば、 図 1 は自動車の排気ガス中の酸素濃度を検出する酸素センサの要部断面図 である。 この円筒状の酸素センサ 2 はセラ ミ ック製で、 内面には白金からなる環状の 内部電極 4 とそのリ ー ド部 6 が形成され、 外面には先端部に外部電極 （図示せず） が 形成されている。 この酸素センサを排気管内に装着し、 排気ガス中酸素濃度を外部電 極によ り 、 大気中酸素濃度を内部電極によ り検出し、 内外の酸素濃度の差に応じた電 圧を発生して、 排気ガス中酸素濃度を測定するものである。 形状は円筒状に限らず、 多角筒状や円錐状、 窪み状など多様な形状が考えられる。 外部電極は電子部品のペース トへの浸漬ゃ既存の印刷技術で簡単に形成できるが、 問題は内部電極を如何に形成するかである。 このよ う な電子部品の內部電極を連続的 に形成するために、 本発明者は特開平 9 7 5 8 1 0号公報に開示されたペース ト塗 布装置を既に提案している。 図 7はこの従来装置の概略正面図を示しており 、 この装 置は、 酸素センサ等の円筒状の電子部品 8 を装着した取付部 1 0 と、 この取付部 1 0 を上下に移動可能に回転させる駆動部 1 2 と、 ペース トを充填した水平配置のデイ ス ペンサ本体 1 4 と、 そのノズル 1 6 と、 ペース ト圧送部 1 8 とから構成される。 図 8 はこの従来装置によるペース ト塗布状態の説明図で、 先端を封止したノ ズル 1 6 の端部に軟質部材 2 0を取り付け、 この軟質部材 2 0 と ノ ズル 1 6 を貫通する吐出 孔 2 2を形成している。 こ の従来装置の特徴は、 弹縮自在な軟質部材 2 0 を電子部品 8の内面 8 a に圧接させながらペース トを塗布してゆく こ とである。 ペース ト圧送部 1 8 を所定時間だけ加圧状態にする と、 デイ スペンサ本体 1 4から一定量のペース ト が圧送され、 吐出孔 2 2からペース トが流出する。 こ の状態で電子部品 8 を回転させ ると、 所定幅の環状の内部電極 4が形成され、 回転停止後にノ ズル 1 6 を後退させる と、 図 9に示すよ う な直線状のリ ー ド部 6が形成される。 For example, FIG. 1 is a cross-sectional view of a main part of an oxygen sensor for detecting an oxygen concentration in an exhaust gas of an automobile. The cylindrical oxygen sensor 2 is made of ceramic, and has an inner ring-shaped inner electrode 4 made of platinum and a lead portion 6 formed on the inner surface, and an outer electrode (not shown) formed on the outer surface at a tip portion. Is formed. This oxygen sensor is installed in the exhaust pipe, and the oxygen concentration in the exhaust gas is detected by an external electrode, the oxygen concentration in the atmosphere is detected by an internal electrode, and a voltage corresponding to the difference between the internal and external oxygen concentrations is generated. It measures oxygen concentration in exhaust gas. The shape is not limited to a cylindrical shape, and various shapes such as a polygonal cylindrical shape, a conical shape, and a hollow shape are conceivable. External electrodes can be easily immersed in the paste of electronic components—existing printing techniques, but the problem is how to form the internal electrodes. In order to continuously form the lower electrode of such an electronic component, the present inventors have already proposed a paste coating apparatus disclosed in Japanese Patent Application Laid-Open No. Hei 9-97510. FIG. 7 shows a schematic front view of this conventional device. This device has a mounting portion 10 on which a cylindrical electronic component 8 such as an oxygen sensor is mounted, and this mounting portion 10 can be moved up and down. It comprises a drive unit 12 to be rotated, a dispenser body 14 in a horizontal arrangement filled with paste, a nozzle 16 thereof, and a paste pressure feeding unit 18. Fig. 8 is an explanatory diagram of the paste application state using this conventional device. A soft member 20 is attached to the end of a nozzle 16 whose tip is sealed, and a discharge penetrating through the soft member 20 and the nozzle 16 is shown. A hole 22 is formed. The feature of this conventional device is that the paste is applied while the shrinkable soft member 20 is pressed against the inner surface 8 a of the electronic component 8. When the paste pumping section 18 is pressurized for a predetermined time, a fixed amount of paste is pumped from the dispenser body 14 and the paste flows out of the discharge holes 22. When the electronic component 8 is rotated in this state, an annular internal electrode 4 having a predetermined width is formed. When the nozzle 16 is retracted after the rotation is stopped, a linear lead as shown in FIG. 9 is obtained. Part 6 is formed.
この従来装置の第 1 の欠点は、 軟質部材 2 0 を電子部品 8 の内面 8 a に圧接してい るこ とである。 発明者がこの従来装置を発明 した段階では、 圧接方式によ り 、 軟質部 材 2 0の幅 wだけの幅を有する電極を形成でき ると考えていた。 また、 圧接によ り 、 内部電極 4 と リ ー ド部 6の塗布を確実に行う こ とができる と考えていたのである。 し かし、 この圧接方式が内部電極 4 と リ一ド部 6 の厚みを幅方向に不均一にする原因で あることが分かってきた。 つま り 、 圧接方式は、 電極幅方向の左右両端部のペース ト を厚く し、 中央部を薄くする効果を有する。 中央の吐出孔からから流出するペース ト は軟質部材 2 0の圧接によって左右にかき出されてゆく からである。 その結果、 図示 するよ う に電極の幅方向の厚みが不均一になり 、 電極の抵抗性能や導電性能にムラを 生じ、 電子部品と しての測定精度の誤差を増大するこ とにつながる。 また、 ペース ト の滲みだしによ り 内部電極 4の幅 Wがどう しても軟質部材 2 0の幅 wよ り 大き く なり 軟質部材 2 0の幅 wによって内部電極 4の幅を設計できないという欠点があった。 こ の欠点は、 図 9からも分かるよ う に、 リ ー ド部 6の厚み不均一と幅の拡大にも現れ、 圧接方式による電極形成の最大の弱点となっている。 また、 第 2の欠点は、 図 7から分かるよ う に、 デイ ス べンサ本体 1 4が水平方向に 配置されているこ とから生じる。 ペース ト圧送部 1 8 を加圧状態にしている場合は、 デイ スペンサ 1 4 内に充填されているペース トはノ ズル側に押圧され、 ペース ト圧送 部 1 8側に垂れ下がってく るこ とはない。 しかし、 圧送を止めると、 デイ スペンサ本 体 1 4内のペース トが自重でペー ス ト圧送部 1 8 に流下する。 長期間の不使用によつ てペース ト圧送部内でペース トが固結する と装置の故障の原因と もなつてきた。 The first disadvantage of this conventional device is that the soft member 20 is pressed against the inner surface 8 a of the electronic component 8. At the stage when the inventor invented this conventional device, he thought that an electrode having a width of only the width w of the soft member 20 could be formed by the pressure welding method. In addition, it was thought that the application of the pressure welding can reliably apply the internal electrode 4 and the lead portion 6. However, it has been found that this pressure welding method causes the thickness of the internal electrode 4 and the lead portion 6 to be uneven in the width direction. In other words, the pressure welding method has the effect of increasing the thickness of the paste at the left and right ends in the electrode width direction and reducing the thickness at the center. This is because the paste flowing out of the central discharge hole is swept right and left by the pressure contact of the soft member 20. As a result, as shown in the figure, the thickness of the electrode in the width direction becomes non-uniform, and the resistance performance and the conductive performance of the electrode become uneven, which leads to an increase in the error of the measurement accuracy as an electronic component. In addition, the width W of the internal electrode 4 is inevitably greater than the width w of the soft member 20 due to the bleeding of the paste, and the width of the internal electrode 4 cannot be designed by the width w of the soft member 20. There were drawbacks. As can be seen from FIG. 9, this drawback also appears in the non-uniform thickness of the lead portion 6 and the increase in the width, which is the greatest weakness of the electrode formation by the pressure welding method. Further, the second drawback arises from the fact that the dispenser body 14 is arranged in the horizontal direction, as can be seen from FIG. When the paste pumping section 18 is in a pressurized state, the paste filled in the dispenser 14 is pressed to the nozzle side, and does not drop down to the paste pumping section 18 side. Absent. However, when the pumping is stopped, the paste in the dispenser body 14 flows down to the paste pumping section 18 by its own weight. Solidification of the paste in the paste feeding section due to long-term non-use has also caused equipment failure.
(発明の開示） (Disclosure of the Invention)
前記欠点を解消するために鋭意研究した結果、 軟質部材を電子部品表面に圧接しな がらペース トを吐出するこ とが厚みムラの最大原因であるこ とが分かった。 本発明者 が前記従来技術を開発したと きには、 軟質部材でペース トを引きずり ながら内部電極 やリ ー ド部を形成することが適切であ り 、 圧接によって電子部品の内面を傷つけない ために軟質部材に材料を限定したのである。  As a result of intensive studies to solve the above-mentioned drawbacks, it was found that discharging paste while pressing a soft member against the surface of an electronic component was the largest cause of thickness unevenness. When the present inventor developed the above-described conventional technology, it is appropriate to form the internal electrodes and the lead portion while dragging the paste with a soft member, and the inner surface of the electronic component is not damaged by the pressure welding. Therefore, the material is limited to the soft member.
従って、 本発明では軟質部材を電子部品表面に接触させない方式を採用するこ とに した。 接触させないのであるから電子部品に傷を付ける という心配がなく 、 軟質部材 に限らず硬質部材も利用するこ とができる。 つま り 、 軟質部材ゃ硬質部材の材料限定 は不要で、 今後両者を包含した吐出部材という概念で表現する。 この吐出部材を電子 部品表面から どれく らいの間隔を保って離間させるかが本発明のポイ ン トになる。 つ ま り 、 ペース トをその間隔、 即ち隙間に吐出させながら吐出部材を部品表面に対し相 対運動させれば、 吐出速度と相対速度を調整するこ と によって、 その間隔で決められ た均一な厚みのペース ト膜を形成するこ とが可能となる。 換言すれば、 その隙間が過 不足なくペース トで満たされるよ う な吐出速度と相対速度に設定すれば、 その間隔が ペース ト膜厚になり 、 吐出部材の幅がペース ト膜の幅になるのである。 吐出速度と相 対速度とは間隔が決まれば経験的に割 り 出すこ とができ るから、 結局はその間隔をど うするかが本発明のポイン ト となる。  Therefore, in the present invention, a method in which the soft member is not brought into contact with the surface of the electronic component is adopted. Since they are not brought into contact with each other, there is no fear of damaging the electronic components, and not only soft members but also hard members can be used. In other words, there is no need to limit the material of the soft member to the hard member, and the concept will be expressed in the future as a discharge member that includes both. The point of the present invention is how far the ejection member is kept away from the surface of the electronic component. In other words, if the discharge member is moved relative to the surface of the component while discharging the paste into the space, that is, the gap, the discharge speed and the relative speed are adjusted to make the uniformity determined at the space. It is possible to form a thick paste film. In other words, if the discharge speed and the relative speed are set so that the gap is filled with the paste without any excess or shortage, the interval becomes the paste film thickness, and the width of the discharge member becomes the paste film width. It is. If the interval between the discharge speed and the relative speed can be determined empirically, it can be determined empirically, and ultimately the point of the present invention is how to make the interval.
前述したよ う に、 一般にペース トは有機金属錯体を有機溶媒に所定粘度で溶解させ た材料であり 、 こ の湿潤状態のペース トをある厚みで塗布しても乾燥させる と有機溶 媒の蒸発によってその厚みは収縮する。 また、 その後焼成すれば有機物質は飛散除去 されるから、 急激な体積減少後に、 最終的には白金等の金属単体の膜が形成されるこ とになる。 本発明者は鋭意検討した結果、 電子部品の電極と して機能できる金属膜の 厚みを l 〜 1 0 /i m と算定し、 好適には 2〜 7 / mと考えた。 この数値は電極膜に適 用できるだけでなく 、 半導体の厚膜技術にも適用できるこ とが意図されている。 As described above, generally, a paste is a material obtained by dissolving an organometallic complex in an organic solvent at a predetermined viscosity. Even if this wet paste is applied with a certain thickness, the paste is evaporated to evaporate the organic solvent. As a result, its thickness shrinks. In addition, if fired thereafter, organic substances are scattered and removed. Therefore, after a sudden decrease in volume, a film of a simple metal such as platinum may be finally formed. And As a result of intensive studies, the present inventors have calculated that the thickness of a metal film that can function as an electrode of an electronic component is l to 10 / im, preferably 2 to 7 / m. It is intended that this value can be applied not only to the electrode film but also to the semiconductor thick film technology.
各種の実験を行う こ とによ り 、 焼成によって乾燥ペース トの厚みは約 1 5 に減縮 し、 乾燥によって湿潤ぺ一ス ト の厚みはその 5 0 %に減縮する という結果を得た。 従 つて、 前記金属膜の厚みから逆算する と、 乾燥ペース ト の厚みは 5〜 5 0 μ πιとなり 湿潤ペース トの厚みは 1 0〜 1 0 0 mが適切であるこ とを見いだすに至った。 結論 的には、 吐出部材表面と電子部品表面の間隔は 1 0〜 1 0 0 μ πιに設定されるべきで. 望ま しく は 2 0〜 7 0 ii mに設定されるべきである。 このよ う に設定すれば、 電極膜 厚を 1 〜 1 0 /i mに、 好適には 2〜 7 /i mに形成するこ とができる。  By conducting various experiments, it was found that the thickness of the dried paste was reduced to about 15 by firing, and the thickness of the wet paste was reduced to 50% by drying. Therefore, when the thickness of the metal film was calculated backward, the thickness of the dry paste was 5 to 50 μπι, and it was found that the appropriate thickness of the wet paste was 10 to 100 m. In conclusion, the distance between the surface of the ejection member and the surface of the electronic component should be set to 10 to 100 μπι. Desirably, it should be set to 20 to 70 im. With such a setting, the electrode film thickness can be formed to 1 to 10 / im, preferably 2 to 7 / im.
吐出部材と部品表面の間隔を調整する手段と しては、 吐出部材を固定するノ ズルま たは電子部品を上下動でき る上下位置調整装置を設ければよい。 例えば、 電子部品を 装着する取付手段とその回転駆動部の全体に対する公知の上下位置調整装置を設ける ( また、 先端を吐出部材で被覆したノ ズルの全体に対する上下位置調整装置を設ける。 これらの一方または両方の上下位置調整装置によ り 間隔調整を行う。 As a means for adjusting the distance between the ejection member and the surface of the component, a nozzle for fixing the ejection member or a vertical position adjustment device capable of vertically moving the electronic component may be provided. For example, a well-known vertical position adjusting device is provided for the entirety of the mounting means for mounting the electronic components and the rotation drive unit thereof ( and a vertical position adjusting device for the entire nozzle whose tip is covered with the discharge member is provided. Or adjust the distance with both vertical position adjustment devices.
ペース トを吐出させる手段は、 ペース トを内部に充填したデイ スペンサ本体と、 こ の本体の先端に連結されたノズルと、 ディ スぺンサ本体からノ ズル先端に所定量のぺ The means for discharging the paste includes a dispenser body filled with the paste, a nozzle connected to the tip of the body, and a predetermined amount of a nozzle from the dispenser body to the tip of the nozzle.
—ス トを圧送するペース ト圧送部から構成でき る。 こ の方法以外にペース トを機械的 に所定量づっ送り 込む回転機構やビス ト ン機構等の手段が採用されてもよい。 —It can be composed of a pasting pumping section that pumps the pump. In addition to this method, a means such as a rotating mechanism or a piston mechanism for mechanically feeding the paste by a predetermined amount may be employed.
電子部品等の部品と吐出部材との相対運動装置は、 部品へのペース トの塗布形状に 依存する。 例えば、 部品が前述した酸素センサ等の筒状部品であり 、 その筒状の内面 に環状の内部電極を塗布する場合には、 部品を装着する取付部を回転駆動すればよ く 回転駆動装置が相対運動装置となる。 また、 その円筒状の内面に直線状のリ ー ド部を 形成するには、 ノ ズルを前記円筒軸方向に進退自在にすればよ く、 ノ ズルの進退駆動 装置が相対運動装置となる。  The relative movement device between the component such as an electronic component and the discharge member depends on the shape of the paste applied to the component. For example, when the component is a cylindrical component such as the oxygen sensor described above, and an annular internal electrode is applied to the inner surface of the cylinder, it is only necessary to rotationally drive a mounting portion on which the component is mounted. It becomes a relative motion device. Further, in order to form a linear lead portion on the inner surface of the cylinder, the nozzle can be freely moved in and out of the cylinder axis direction, and the driving device of the nozzle is a relative movement device.
また、 本発明は筒状電子部品に限られるものではなく 、 部品が曲面形状や円錐形状 等の多様な形状に対しても有効である。 例えば、 部品表面が曲面形状である場合には ノ ズルを 3次元的に移動させる水平移動装置と上下移動装置が必要となり 、 曲面の座 標をコンピュータで読み取り ながらノ ズルを 3次元移動させるこ とになる。 この場合 には水平移動装置と上下移動装置が相対運動装置となる。 この様な 3次元相対運動装 置もコ ンピュータ技術を利用すれば容易に実現でき る。 The present invention is not limited to cylindrical electronic components, but is also effective for various shapes such as curved surfaces and conical shapes. For example, if the surface of the part has a curved surface, a horizontal movement device and a vertical movement device that move the nozzle three-dimensionally are required.The nozzle is moved three-dimensionally while reading the coordinates of the curved surface with a computer. become. in this case , The horizontal movement device and the vertical movement device become relative movement devices. Such a three-dimensional relative motion device can be easily realized by using computer technology.
(図面の簡単な説明） (Brief description of drawings)
図 1 は自動車の排気ガス中の酸素濃度を検出する円筒状の酸素センサの要部断面図 である。  Fig. 1 is a cross-sectional view of the main part of a cylindrical oxygen sensor that detects the oxygen concentration in the exhaust gas of an automobile.
図 2は本発明に係るペース ト均一塗布装置の概略正面図である。  FIG. 2 is a schematic front view of the paste uniform coating apparatus according to the present invention.
図 3は本発明装置によ り環状内部電極を形成するためのペース ト塗布状態の説明図 である。  FIG. 3 is an explanatory view of a paste application state for forming an annular internal electrode by the apparatus of the present invention.
図 4は本発明装置によ り 直線状の リ ー ド部を形成するためのペース ト塗布状態の説 明図である。  FIG. 4 is an explanatory view of a paste application state for forming a linear lead portion by the apparatus of the present invention.
図 5は図 4の A— A線端面図である。  FIG. 5 is an end view taken along line AA of FIG.
図 6 は排気ガス中の酸素濃度を検出する 2段円筒状の酸素セ ンサの要部断面図であ る。  Figure 6 is a cross-sectional view of the main part of a two-stage cylindrical oxygen sensor that detects the oxygen concentration in the exhaust gas.
図 7は従来のペース ト塗布装置の概略正面図である。  FIG. 7 is a schematic front view of a conventional paste coating apparatus.
図 8は従来装置による環状内部電極を形成するためのペース ト塗布状態の説明図で ある。  FIG. 8 is an explanatory view of a paste application state for forming an annular internal electrode by a conventional apparatus.
図 9は従来装置による直線状リ ー ド部を形成するためのペース ト塗布状態の説明図 である。  FIG. 9 is an explanatory diagram of a paste application state for forming a linear lead portion by a conventional apparatus.
(発明を実施するための最良の形態） (Best mode for carrying out the invention)
本発明を実施するための最良の形態を実施例と して図面によ り説明する。  The best mode for carrying out the present invention will be described as an example with reference to the drawings.
図 2は本発明に係るペース ト均一塗布装置の概略正面図である。 図 7 と同一部分に は同一番号を付してその詳細を説明する。 本装置は、 酸素センサ等の円筒状の電子部 品 8 を装着したチャ ック等からなる取付部 1 0 と、 こ の取付部 1 0 を回転駆動する駆 動部 1 2 と、 取付部 1 0 と駆動部 1 2 を一体に上下動させる上下位置調整装置 1 3 と ペース トを充填した垂直配置のデイ スペンサ本体 1 4 と、 先端部が水平配置されたノ ズル 1 6 と、 デイ スペンサ本体 1 4 と ノ ズル 1 6 を一体に水平方向に左右移動させる 進退移動装置 1 7 と、 ペース ト圧送部 1 8 とから構成される。 本発明では、 ディスぺ ンサ本体を略垂直に配置しているから、 内部に充填されたへー ス トは常にノ ズル側に 自重で流下する傾向を有する。 但し、 実際にはノ ズル側に流下しないよ う に圧力調整 されている。 従って、 ペース ト圧送部側にペース トが逆流するこ とがないので、 ぺー ス ト詰ま り は改善されている。 FIG. 2 is a schematic front view of the paste uniform coating apparatus according to the present invention. The same parts as those in FIG. This device has a mounting portion 10 composed of a chuck or the like on which a cylindrical electronic component 8 such as an oxygen sensor is mounted, a driving portion 12 for rotating the mounting portion 10, and a mounting portion 1. The vertical position adjustment device 13 that moves the 0 and the drive unit 12 up and down together with the dispenser body 14 with the paste filled vertically, the nozzle 16 with the tip horizontally arranged, and the dispenser body It comprises an advance / retreat moving device 17 for horizontally moving the nozzle 14 and the nozzle 16 together in the horizontal direction, and a paste feeding section 18. In the present invention, the display Since the sensor body is arranged almost vertically, the paste filled inside has a tendency to always flow down to the nozzle side by its own weight. However, the pressure is adjusted so that it does not actually flow down to the nozzle side. Therefore, since the paste does not flow backward to the paste pumping section, the paste clogging is improved.
図 3は本発明装置によるべ一ス ト塗布状態の説明図で、 ノ ズル 1 6 の先端に吐出部 材 2 1 を被覆し、 この吐出部材 2 1 と ノ ズル 1 6 を貫通する吐出孔 2 2 を穿孔してい る。 本発明装置の特徴は、 吐出部材 2 1 を電子部品 8 の内面 8 a から一定間隔 hだけ 離間させているこ とである。 この間隔 hは 1 0 〜 ； 1 0 0 μ πι、 望ま しく は 2 0〜 7 0 ； mの範囲内の好適値に設定される。 この間隔は形成されるペース ト膜厚と等しく な り 、 この膜厚は最終的に形成される電極膜厚と直接関係する。 発明者の研究によれば. 前述したよ う に市販の金属ペース トでは乾燥焼成によ り約 1 / 1 0 に厚みが縮減する から、 ペース ト膜厚が 1 0〜 1 0 0 μ πιであれば金属膜厚は 1 〜 1 0 ju mにまで縮減 する。 従って、 最終的に得よ う とする金属膜厚の約 1 0倍に前記間隔 h を設定するこ とが重要となる。  FIG. 3 is an explanatory view of a state of a base applied by the apparatus of the present invention. The tip of a nozzle 16 is coated with a discharge member 21, and the discharge member 21 and a discharge hole 2 penetrating the nozzle 16 are provided. 2 is perforated. The feature of the device of the present invention is that the discharge member 21 is separated from the inner surface 8a of the electronic component 8 by a constant distance h. The interval h is set to a suitable value within the range of 10 to 100 μπι, preferably 20 to 70; m. This interval is equal to the formed paste film thickness, and this film thickness is directly related to the finally formed electrode film thickness. According to the inventor's research. As described above, since the thickness of a commercially available metal paste is reduced to about 1/10 by drying and firing, the thickness of the paste is 10 to 100 μππι. If there is, the metal film thickness will be reduced to 1 to 10 jum. Therefore, it is important to set the interval h to about 10 times the finally obtained metal film thickness.
この間隔 h を保持した状態でペース ト圧送部 1 8 を駆動させると 、 その作動圧力と 作動時間に相応した量のペース トがデイ スペンサ本体 1 4から供給される。 ペース ト はノ ズル 1 6 を介して吐出部材 2 1 の吐出孔 2 2から吐出され、 その間に取付部 1 0 が矢印 a 方向に回転して環状の内部電極 4が形成される。 この内部電極 4のペース ト 膜厚は前記間隔 h に等し く なる。 つま り 、 回転速度とペース ト吐出速度とを経験的に 調整するこ とによ り 、 間隔 h の隙間にペー ス トを過不足なく一杯に充填しながら、 無 理なく環状の内部電極が形成されるのである。 この場合には吐出部材の幅 wが内部電 極 4の幅に等しく なり 、 電極幅を吐出部材の幅によ り設計でき る。 つま り 、 吐出部材 の幅を選択するこ とによって電極幅を可変にできる。 もちろん、 吐出部材 2 1 に穿孔 される吐出孔 2 2 の個数も幅長に応じて変更するこ とができ る。  When the paste pressure feeding section 18 is driven while maintaining the interval h, an amount of paste corresponding to the operating pressure and the operating time is supplied from the dispenser body 14. The paste is discharged from the discharge hole 22 of the discharge member 21 via the nozzle 16, during which the mounting portion 10 rotates in the direction of arrow a to form the annular internal electrode 4. The paste film thickness of the internal electrode 4 is equal to the interval h. In other words, by empirically adjusting the rotation speed and the paste discharge speed, it is possible to form a ring-shaped internal electrode without difficulty while filling the gap at the interval h fully and completely. It is done. In this case, the width w of the discharge member becomes equal to the width of the internal electrode 4, and the electrode width can be designed by the width of the discharge member. That is, the electrode width can be varied by selecting the width of the discharge member. Of course, the number of the discharge holes 22 formed in the discharge member 21 can also be changed according to the width.
図 4はリ ー ド部 6 の形成工程を示している。 取付部 1 0が回転した後、 進退移動装 置 1 7が後退して、 吐出部材 2 1 が電子部品 8 の出口部 8 b まで矢印 b方向に水平に 移動する。 この間もペース ト圧送部 1 8が作動して、 直線状のリ ー ド部 6が形成され る。 リ ー ド部 6 のペー ス ト膜厚も前記間隔 hに等しく なるこ と は云う までもない。 図 5 は図 4 の A— A線端面図であり 、 リ ー ド部 6 の厚みが間隔 h に等し く 、 しかも膜厚 が均一に形成されているこ と を示す。 しかも リ ー ド部 6 の幅 Lは吐出速度と相対運動 速度を調整するこ とによ り細く設定でき、 この結果使用するペース ト量を減少化でき る。 この電子部品 8 を乾燥させる と湿潤ペース ト膜から有機溶媒が蒸発して乾燥ぺ一 ス ト膜になり 、 その後焼成して有機物質を飛散除去させると、 ペース ト膜が金属膜に 変化し、 図 1 に示される酸素センサ 4が形成される。 FIG. 4 shows a process of forming the lead portion 6. After the mounting portion 10 rotates, the reciprocating device 17 retreats, and the discharge member 21 moves horizontally in the direction of the arrow b to the outlet portion 8b of the electronic component 8. During this time, the paste feeding section 18 is operated, and the linear lead section 6 is formed. It goes without saying that the paste film thickness of the lead portion 6 is also equal to the interval h. FIG. 5 is an end view taken along the line A—A in FIG. 4, in which the thickness of the lead portion 6 is equal to the distance h, and This indicates that is uniformly formed. Moreover, the width L of the lead portion 6 can be set finely by adjusting the discharge speed and the relative movement speed, and as a result, the amount of paste used can be reduced. When the electronic component 8 is dried, the organic solvent evaporates from the wet paste film to form a dry paste film. After baking to remove the organic substance, the paste film changes to a metal film. The oxygen sensor 4 shown in FIG. 1 is formed.
図 6は排気ガス中の酸素濃度を検出する 2段円筒状の酸素セ ンサの要部断面図であ る。 酸素センサ 2の直線状のリ ー ド部 6に段部 6 a が存在する。 この段部 6 a は次の よ う な工程で形成でき る。 進退移動装置 1 7によ り ノ ズル 1 6 が後退している途中で. 上下位置調整装置 1 3によ り 取付部 1 0をその段差だけ上動させれば、 段部 6 a を有 する リ ー ド部 6が完成される。  FIG. 6 is a cross-sectional view of a main part of a two-stage cylindrical oxygen sensor for detecting oxygen concentration in exhaust gas. There is a step 6 a in the linear lead 6 of the oxygen sensor 2. This step 6a can be formed by the following steps. While the nozzle 16 is moving backward by the reciprocating device 17, if the mounting portion 10 is moved up by the step by the vertical position adjusting device 13, the step portion 6 a is provided. Lead part 6 is completed.
尚、 本発明は上記実施例に限定されるものではなく 、 本発明の技術的思想を逸脱し ない範囲における種々の変形例、 設計変更等をその技術的範囲内に包含するものであ る。  It should be noted that the present invention is not limited to the above-described embodiment, but encompasses various modifications and design changes within the technical scope of the present invention without departing from the technical spirit of the present invention.
(産業上の利用可能性） (Industrial applicability)
本発明に係るペース ト均一塗布装置によれば、 ノ ズル先端部の吐出部材と部品表面 との間に一定間隔を設定し、 こ の条件下で吐出孔から所定量のペース トを吐出するか ら、 部品表面に極めて均一な厚みを有するペース ト塗膜を形成でき る。 従って、 乾燥 焼成後に形成できる金属膜の厚みも極めて均一な膜厚を有し、 抵抗性能や導電性能に おいてもムラのない良質な電極膜を形成するこ とができ る。 白金等の貴金属は極めて 高価であるから、 電極の厚みを限定するこ とによって貴金属の使用量を必要最小限に 制限でき、 電子部品単価の低減化にも貢献できる。 また、 電子部品の回転、 上下移動 デイ スペンサ本体の進退移動や上下移動の条件設定によ り 、 内孔面全面あるいは必要 部分のみへの電極膜形成も容易に行う ことができ、 作業性が大幅に改善でき る。 従つ て、 産業上極めて有益なペース ト均一塗布装置を実現できた。  ADVANTAGE OF THE INVENTION According to the paste uniform application apparatus which concerns on this invention, a fixed space | interval is set between the discharge member of a nozzle tip part, and a component surface, and under this condition, a predetermined amount of paste is discharged from a discharge hole. As a result, a paste coating having a very uniform thickness can be formed on the component surface. Accordingly, the thickness of the metal film that can be formed after the drying and firing is extremely uniform, and a high-quality electrode film having no unevenness in resistance performance and conductive performance can be formed. Since noble metals such as platinum are extremely expensive, the use of noble metals can be reduced to the minimum necessary by limiting the thickness of the electrodes, which can contribute to a reduction in the cost of electronic components. In addition, by setting the conditions for the rotation and vertical movement of the electronic components, the reciprocating movement and the vertical movement of the dispenser body, it is possible to easily form the electrode film on the entire inner surface of the bore or only on the necessary parts, greatly improving workability. Can be improved. Therefore, a paste uniform coating apparatus which is extremely useful in industry was realized.

Claims

求 の 範 囲 Range of request
1 . ペース トを塗布すべき部品を装着する取付部と、 ペース トを供給するノ ズルと . このノ ズルの先端部を被覆する吐出部材と、 ノ ズル と吐出部材を貫通する吐出孔と、 ペース ト塗布時に吐出部材表面と前記部品の塗布表面との間隔を 1 0〜 1 0 0 /z mに 設定する間隔調整手段と、 この間隔にてペース トを吐出させる手段と、 吐出 しながら この間隔で部品と ノ ズルを相対運動させる手段とからなるこ と を特徴とするぺ一ス ト 均一塗布装置。 1. A mounting portion for mounting a part to be coated with a paste, a nozzle for supplying the paste, a discharge member for covering the tip of the nozzle, a discharge hole for penetrating the nozzle and the discharge member, An interval adjusting means for setting an interval between the surface of the ejection member and the application surface of the component at the time of paste application to 10 to 100 / zm; a means for ejecting the paste at the interval; And a means for relatively moving the part and the nozzle with each other.
2 . 筒状の内面を有した電子部品を上下位置調整可能に装着する取付部と、 この取 付部を回転させる駆動部と、 ペース トを内部に充填したデイ スペンサ本体と、 のディ スペンサ本体の先端に固定されたノ ズルと 、 こ の ノ ズルを進退自在に制御する進退制 御手段と、 加圧によ り所定量のペース トを ノ ズルに流送するペー ス ト圧送部と、 この ノズルの先端部を被覆する吐出部材と、 ノズルと吐出部材を貫通する吐出孔とからな り 、 ペース ト塗布時に吐出部材表面と前記電子部品の筒状内面との間隔を 1 0〜 1 0 Ο μ πιに設定するこ と を特徴とするペース ト均一塗布装置。  2. A dispenser body with a mounting part for mounting electronic parts having a cylindrical inner surface so that the vertical position can be adjusted, a drive part for rotating this mounting part, and a dispenser body filled with paste. A nozzle fixed to the tip of the nozzle, forward / backward control means for controlling the forward / backward movement of the nozzle, a paste feeding section for feeding a predetermined amount of paste to the nozzle by pressurization, A discharge member that covers the tip of the nozzle, and a discharge hole that penetrates the nozzle and the discharge member, make a distance between the discharge member surface and the cylindrical inner surface of the electronic component 10 to 10 during paste application. A paste uniform coating device characterized by setting to Ομππ.
3 . 前記ディ スペ ンサ本体を略鉛直に配置した請求項 2記載のペース ト均一塗布装置 c 3. The paste uniform coating device c according to claim 2, wherein the dispenser body is arranged substantially vertically.
PCT/JP1998/002513 1998-06-03 1998-06-03 Device for uniformly applying paste WO1999062644A1 (en)

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JP56026099A JP3536924B2 (en) 1998-06-03 1998-06-03 Paste uniform application device

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
US6843105B1 (en) 2003-06-30 2005-01-18 Robert Bosch Corporation Contact pin for exhaust gas sensor
GB2414245A (en) * 2004-05-19 2005-11-23 Diffusion Alloys Ltd Metallising internal surfaces
JP2009125625A (en) * 2007-11-20 2009-06-11 Tokai Rubber Ind Ltd Rubber bush coated with lubricant, and method for fabricating the same
JP2019197615A (en) * 2018-05-08 2019-11-14 岡谷電機産業株式会社 Manufacturing method of discharge type surge absorbing element
WO2019215938A1 (en) * 2018-05-08 2019-11-14 岡谷電機産業株式会社 Discharge-type surge absorption element and method for manufacturing discharge-type surge absorption element
JP2020027749A (en) * 2018-08-13 2020-02-20 岡谷電機産業株式会社 Manufacturing method of discharge type surge absorbing element

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Publication number Priority date Publication date Assignee Title
CN104759387B (en) * 2015-01-27 2017-02-22 诺博橡胶制品有限公司 Device for automatic roller coating of oil

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JPH0564762A (en) * 1991-09-05 1993-03-19 Kubota Corp Apparatus for coating inner surface of pipe
JPH0975810A (en) * 1995-09-14 1997-03-25 Daiken Kagaku Kogyo Kk Paste coating device

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JPS6179677U (en) * 1984-10-29 1986-05-27
JPS6253765A (en) * 1985-09-02 1987-03-09 Matsushita Electric Ind Co Ltd Emitting nozzle
JPH0564762A (en) * 1991-09-05 1993-03-19 Kubota Corp Apparatus for coating inner surface of pipe
JPH0975810A (en) * 1995-09-14 1997-03-25 Daiken Kagaku Kogyo Kk Paste coating device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6843105B1 (en) 2003-06-30 2005-01-18 Robert Bosch Corporation Contact pin for exhaust gas sensor
GB2414245A (en) * 2004-05-19 2005-11-23 Diffusion Alloys Ltd Metallising internal surfaces
GB2414245B (en) * 2004-05-19 2007-10-10 Diffusion Alloys Ltd Metallising process
JP2009125625A (en) * 2007-11-20 2009-06-11 Tokai Rubber Ind Ltd Rubber bush coated with lubricant, and method for fabricating the same
JP4640403B2 (en) * 2007-11-20 2011-03-02 東海ゴム工業株式会社 Manufacturing method of rubber bush with lubricant
JP2019197615A (en) * 2018-05-08 2019-11-14 岡谷電機産業株式会社 Manufacturing method of discharge type surge absorbing element
WO2019215938A1 (en) * 2018-05-08 2019-11-14 岡谷電機産業株式会社 Discharge-type surge absorption element and method for manufacturing discharge-type surge absorption element
JP2020027749A (en) * 2018-08-13 2020-02-20 岡谷電機産業株式会社 Manufacturing method of discharge type surge absorbing element

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