WO1999057954A1 - Verification de la position des composants basee sur les coordonnees locales - Google Patents

Verification de la position des composants basee sur les coordonnees locales Download PDF

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Publication number
WO1999057954A1
WO1999057954A1 PCT/US1998/009279 US9809279W WO9957954A1 WO 1999057954 A1 WO1999057954 A1 WO 1999057954A1 US 9809279 W US9809279 W US 9809279W WO 9957954 A1 WO9957954 A1 WO 9957954A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
local
image
fiducial
component
Prior art date
Application number
PCT/US1998/009279
Other languages
English (en)
Inventor
Richard Pye
Ronnie K. Riggs
Bruce E. Smyth
Original Assignee
Genrad, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Genrad, Inc. filed Critical Genrad, Inc.
Priority to AU73709/98A priority Critical patent/AU7370998A/en
Priority to PCT/US1998/009279 priority patent/WO1999057954A1/fr
Publication of WO1999057954A1 publication Critical patent/WO1999057954A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Definitions

  • the present invention is directed to visual printed-circuit-board testing. It par- ticularly concerns machine- vision detection of proper electrical-component positioning.
  • circuit- board manufacture involves considerable automated testing. Before components are placed on the circuit boards, of course, the component manufacturers perform their own tests. Even if all of the components operate properly, though, the resultant printed-circuit board may not. The reasons vary, but among the most common are missing or misoriented parts, solder bridges, and cold solder joints.
  • Printed-circuit-board manufacturers employ electrical tests to detect many of these defects. But they have found it profitable also to perform visual tests, which they automate by employing machine-vision equipment. Although such tests typically cannot detect the open circuits symptomatic of poor solder joints, they can detect missing, mispositioned, or misoriented parts. In many cases, an electrical test could find such defects, too. But the vision test often has the advantage that it can be performed earlier in the process, and typically without disrupting it as much. Specifically, visual tests have the advantage that for most purposes they can be performed before the solder-reflow step. Printed-circuit boards are typically "stuffed" with components by pick-and-place machines, which stick components to solder-paste locations on the boards.
  • solder is then reflowed to make the necessary electrical connections between the components and the board's conductor traces. It is only after this reflow step has occurred that electrical tests can be performed, and repair at that stage tends to be more difficult than it is before solder reflow. Vision tests do not depend on the electrical connections that the reflow step establishes, so they can be per- formed before that step, when repair is still relatively easy. The circuit-board manufacturer therefore has a strong incentive to employ machine-vision inspection.
  • Such inspection begins with, say, a line-scan camera's forming an image of the printed-circuit board's surface after the components have been attached. From this image, the machine-vision system uses various image-processing techniques to identify image features corresponding to the components of interest and to determine those components' positions on the circuit board.
  • Machine-vision inspection not only reduces labor cost but also permits some tests to be made visually that humans either cannot perform or can perform only with considerable difficulty.
  • Current-day electrical components and the conductive board traces with which their leads must register are now so small that human-vision verification is impossible, at least with the unaided eye, and is impractical in any event.
  • machine-vision systems can routinely achieve the resolution necessary to make the necessary high-accuracy position determinations.
  • Fig. 1 is plan view of a printed-circuit board to be tested
  • FIG. 2 is block diagram illustrating the use of a machine- vision system in accordance with the present invention's teachings.
  • Fig. 3 is a more-detailed view of a small region of the board, showing indicia placed on the board in accordance with the present invention' s teachings.
  • Fig. 1 is a simplified plan view of a printed-circuit board.
  • Fig. 1 shows only two of the typically large number of electrical components typically mounted on such a board.
  • Reference numerals 12 and 14 identify those two illustrated components.
  • Fig. 1 also omits the conductive traces that interconnect those components' leads with the leads of other components.
  • a machine- vision system inspects the board to verify that various of its components have been properly placed, as Fig. 2 shows.
  • the type of machine-vision system typically employed for such applications includes a video (typically line-scan) camera 16 under which the board passes as the camera 16 forms an image used by an image processor 18 to make the determinations described below.
  • the system ordinarily begins with a rough approximation of various board features' positions. For example, there may be some means for detecting board edges in the image, and the processing system can look for various features by reference to the location of those edges.
  • a component's position with respect to a feature such as a board edge is not ordinarily a reliable indicator of whether its leads are likely to register with the corresponding board conductors. So it is conventional for an image processor initially to search predetermined neighborhoods with respect to those edges or some other rough reference for fiducial marks disposed at locations such as Fig. I's locations 20 in the board's corners. Once these board fiducial marks have been located, the positions of other features can be referenced to these marks. Conventional approaches base component-position verification on component positions determined in this manner.
  • component 12's nominal x position with respect to a coordinate system established by reference to the main board fiducial marks is X c .
  • This position (together with the appropriate y position and orientation angle) is what is required to make a given one of the component's leads register with the corresponding nominal solder-pad position X p .
  • machine-vision image analysis reveals the component's actual position to be x c
  • the component's -position error ⁇ x would con- ventionally be considered to be x c - X c . This is the error conventionally used as the basis for determining whether the component position is within tolerances. If that position is not within tolerances, the system produces an electrical signal indicative of this fact.
  • Such a signal may cause a display such as Fig. 2's display 22 to produce an image of the board with the mispositioned component's position highlighted.
  • the error value may be used for other purposes, too. Even if it is within tolerances, it may alone or with measurements from other boards be a basis on which a decision to adjust the process can be made.
  • Fig. 3's vias 26 can be used in place of marks 24 as component 12's local fiducial marks.
  • the vision system it is sometimes difficult for the vision system to distinguish an intended via from others, since the vias is not typically designed specifically for vision-system recognition. So it is often preferable in that situation to select a plurality of such vias as the local fiducial mark, i.e., to have the vision system search for the pattern that a cluster of such vias makes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne un système d'affichage par machine (18 et 22) qui réalise la prise d'image d'une plaquette (10) et localise dans ladite image les différents composants électriques (12 et 14) en se référant a des ensembles distincts de repères d'alignement. Le système détermine à partir des localisations des composants obtenues si les composants électriques sont positionnées correctement.
PCT/US1998/009279 1998-05-06 1998-05-06 Verification de la position des composants basee sur les coordonnees locales WO1999057954A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU73709/98A AU7370998A (en) 1998-05-06 1998-05-06 Local-coordinate-based component-position verification
PCT/US1998/009279 WO1999057954A1 (fr) 1998-05-06 1998-05-06 Verification de la position des composants basee sur les coordonnees locales

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1998/009279 WO1999057954A1 (fr) 1998-05-06 1998-05-06 Verification de la position des composants basee sur les coordonnees locales

Publications (1)

Publication Number Publication Date
WO1999057954A1 true WO1999057954A1 (fr) 1999-11-11

Family

ID=22266992

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/009279 WO1999057954A1 (fr) 1998-05-06 1998-05-06 Verification de la position des composants basee sur les coordonnees locales

Country Status (2)

Country Link
AU (1) AU7370998A (fr)
WO (1) WO1999057954A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1220597A1 (fr) * 2000-12-27 2002-07-03 Alps Electric Co., Ltd. Dispositif d'inspection de l'alignement de composants électriques
EP1901397A2 (fr) * 2006-09-15 2008-03-19 Magneti Marelli France Dispositif de connexion électrique

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5237622A (en) * 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
DE19711476A1 (de) * 1997-03-19 1998-10-15 Siemens Ag Verfahren und Vorrichtung zum Vermessen einer Einrichtung zur Herstellung von elektrischen Baugruppen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5237622A (en) * 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
DE19711476A1 (de) * 1997-03-19 1998-10-15 Siemens Ag Verfahren und Vorrichtung zum Vermessen einer Einrichtung zur Herstellung von elektrischen Baugruppen

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1220597A1 (fr) * 2000-12-27 2002-07-03 Alps Electric Co., Ltd. Dispositif d'inspection de l'alignement de composants électriques
US6518512B2 (en) 2000-12-27 2003-02-11 Alps Electric Co., Ltd. Structure for inspecting electrical component alignment
EP1901397A2 (fr) * 2006-09-15 2008-03-19 Magneti Marelli France Dispositif de connexion électrique
EP1901397B1 (fr) * 2006-09-15 2016-03-30 Magneti Marelli France Dispositif de connexion électrique

Also Published As

Publication number Publication date
AU7370998A (en) 1999-11-23

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