WO1999003165A1 - Chip card and process for contacting an antenna embedded in a chip card - Google Patents

Chip card and process for contacting an antenna embedded in a chip card Download PDF

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Publication number
WO1999003165A1
WO1999003165A1 PCT/DE1998/001691 DE9801691W WO9903165A1 WO 1999003165 A1 WO1999003165 A1 WO 1999003165A1 DE 9801691 W DE9801691 W DE 9801691W WO 9903165 A1 WO9903165 A1 WO 9903165A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
contact
chip card
pin
chip
Prior art date
Application number
PCT/DE1998/001691
Other languages
German (de)
French (fr)
Inventor
Erik Heinemann
Frank PÜSCHNER
Michael Huber
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1999003165A1 publication Critical patent/WO1999003165A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]

Definitions

  • the invention relates to a chip card with an antenna for contactless data transfer and a method of Kon ⁇ clocking of such an antenna.
  • Chip cards are card-shaped data carriers that have an integrated semiconductor chip for storing the data.
  • Contact-bearing chip cards have on their surface contact elements which are connected to connections of the integrated circuit and are used for external contacting thereof by a reading device.
  • contactless chip cards have at least one coil acting as an antenna, which is located in their card body and ensures inductive data transmission between the chip and the surroundings of the card.
  • the antenna is also connected to connections of the chip.
  • combination cards are also known, in which there are both contact surfaces for contact-based data transmission and an antenna for contactless data transmission.
  • the electrical connection between the chip and the contact areas on the one hand and the antenna on the other hand can be made via thin lead wires, the so-called bond wires.
  • a common on-site process for chip cards is the so-called implantation process, in which a chip module (consisting of a carrier element which has the external contact surfaces and the chip) is inserted into the cavity of a card body.
  • the electrical connections between the chip and the contact areas are already made via the chip module.
  • the problem is that establish electrical connection between the chip and the antenna.
  • the antenna is usually laminated into or overmolded by the card body, so that in order to establish the electrical connection, contact points of the antenna must first be exposed, for example by milling. Only then can the electrical connection be made to the chip module or to the chip by means of a bonding wire.
  • the invention has for its object to provide a chip card and a corresponding method in which an electrical connection between the chip and antenna is made in a simple manner.
  • a pin made of an electrically conductive material and driven by one of the contact surfaces is provided, one end of which is in contact with the contact surface and the other end of which is non-positively connected to the antenna, so that it is in contact with it.
  • an electrical connection between the contact surface and the antenna is established.
  • the electrical connection between the contact surface and the connections of the chip, on the other hand, is implemented via bond wires, as is common today.
  • FIG. 1 shows an exemplary embodiment of the chip card according to the invention
  • FIG. 2 shows an exemplary embodiment of the pin driven through the contact surface
  • Figure 3 is a plan view of the antenna
  • Figure 4 is a cross-sectional view of the contact area between the pin and antenna.
  • FIG. 1 shows a section of a chip card 1 with a card body 10 which has a cavity 11 into which a chip module 12 is inserted.
  • the chip module 12 has a chip 13 which is applied to a carrier element, which has an insulating layer 14 and a conductive layer
  • the chip 13 is electrically connected to the contact areas 3 via bond wires 15.
  • Chip 13 and bonding wires 15 are usually covered by a masking compound (not shown in FIG. 1), often a thermoset.
  • the chip module 12 is connected to the thermoplastic material of the card body 10 by gluing.
  • the chip card 1 has an antenna 2 inside its card body 10. The antenna 2 can be surrounded by the card body material, for example, by laminating the card body or by extrusion coating.
  • an electrically conductive pin 4 is perpendicular from above through the rightmost one of the contact areas 3 in the card body has been pushed in. Its length is such that it does not protrude beyond the contact surface 3 with its upper end after the formation of a force fit with the antenna 2 at its lower end, which has jagged formations 8 to support the force fit.
  • FIG. 2 shows a detailed view of a further exemplary embodiment of the invention.
  • the contact surface 3 through which the pin 4 has been driven is shown.
  • the adhesive 5 thus also provides good electrical contact between the pin 4 and the contact surface 3.
  • the pin 4 has barbs 6 which prevent the pin from hooking into the Effect the material of the card body 10.
  • only the adhesive 5 or only the barbs 6 can also be provided.
  • FIG. 3 shows a top view of the antenna 2, which can be implemented, for example, as a wound coil. It has a flat contact surface 7 at each of its two ends.
  • a pin 4 is placed on each of the contact surfaces 7 of the antenna 2 and has been driven by a contact surface 3 of the chip card 1.
  • two connections of antenna 2 must always be contacted.
  • only one pin 4 has been shown in FIG.
  • the contact surfaces 7 of the antenna 2 in FIG. 3 have larger dimensions than the diameter of the pins 4. This has the advantage that tolerances in the placement of the respective pin 4 are permitted.
  • Figure 4 shows a sectional view of a side view of the antenna 2 and the lower part of the pin 4.
  • the lower part 9 is designed so that it partially surrounds the round cross section of the antenna 2. In this way, a good electrical contact and a good adhesion between the pin 4 and the antenna 2 is made.
  • FIG. 4 shows the state in which the pin 4 has not yet been fully contacted with the antenna 2. After the pin 4 has been completely driven into the card 1, the two touch, and preferably the pin 4 partially penetrates the material of the antenna 2. Driving in or shooting through the chip card 1 with the pin 4, which is preferably made of aluminum, is not a problem, since the card body 10 is normally made of flexible thermoplastic material.
  • the antenna 2 can be printed, etched or coiled.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

A chip card (1) has an embedded antenna (2) for transmitting data without contact and contact surfaces (3) arranged in the surface of the chip card (1) for transmitting data by contact. Electric contact between the contact surfaces (3) and the antenna (2) is established by an electroconducting pin (4) which is pushed through the contact surface (3) so far into the chip card (1) that its end contacts the contact surface (3) and its other end is frictionally connected to the antenna (2).

Description

Beschreibungdescription
Chipkarte und Verfahren zur Kontaktierung einer in einer Chipkarte eingebetteten AntenneChip card and method for contacting an antenna embedded in a chip card
Die Erfindung betrifft eine Chipkarte mit einer Antenne für eine kontaktlose Datenübertragung und ein Verfahren zur Kon¬ taktierung einer solchen Antenne.The invention relates to a chip card with an antenna for contactless data transfer and a method of Kon ¬ clocking of such an antenna.
Chipkarten sind kartenförmige Datenträger, die zum Speichern der Daten einen integrierten Halbleiterchip aufweisen. Kontaktbehaf ete Chipkarten weisen an ihrer Oberfläche Kontaktelemente auf, die mit Anschlüssen der integrierten Schaltung verbunden sind und einer externen Kontaktierung dieser durch ein Lesegerät dienen. Kontaktlose Chipkarten weisen statt der Kontaktflächen wenigstens eine als Antenne wirkende Spule auf, die sich in ihrem Kartenkörper befindet und einer induktiven Datenübertragung zwischen dem Chip und der Umgebung der Karte sorgt. Zu diesem Zweck ist die Antenne ebenfalls mit Anschlüssen des Chips verbunden. Weiterhin sind sogenannte Kombikarten bekannt, bei denen sowohl Kontaktflächen für die kontaktbehaftete Datenübertragung als auch eine Antenne für die kontaktlose Datenübertragung vorhanden sind. Bei allen genannten Kartentypen kann die elektrische Verbindung zwischen dem Chip und den Kontaktflächen einerseits sowie der Antenne andererseits über dünne Leitungsdrähte, die sogenannten Bonddrähte, erfolgen.Chip cards are card-shaped data carriers that have an integrated semiconductor chip for storing the data. Contact-bearing chip cards have on their surface contact elements which are connected to connections of the integrated circuit and are used for external contacting thereof by a reading device. Instead of the contact areas, contactless chip cards have at least one coil acting as an antenna, which is located in their card body and ensures inductive data transmission between the chip and the surroundings of the card. For this purpose, the antenna is also connected to connections of the chip. So-called combination cards are also known, in which there are both contact surfaces for contact-based data transmission and an antenna for contactless data transmission. In all of the card types mentioned, the electrical connection between the chip and the contact areas on the one hand and the antenna on the other hand can be made via thin lead wires, the so-called bond wires.
Ein verbreitetes ontageverfahren für Chipkarten ist das sogenannte Implantierverfahren, bei dem ein Chipmodul (bestehend aus einem Trägerelement, das die externen Kontaktflächen aufweist, und dem Chip) in die Kavität eines Kartenkörpers eingesetzt wird. Dabei sind die elektrischen Verbin- düngen zwischen dem Chip und den Kontaktflächen bereits über das Chipmodul hergestellt. Will man bei einer Kombicard das Implantierverfahren anwenden, besteht das Problem darin, die elektrische Verbindung zwischen dem Chip und der Antenne herzustellen. Die Antenne ist in der Regel in den Kartenkörper einlaminiert oder von diesem umspritzt, so daß zur Herstellung der elektrischen Verbindung zunächst Kontaktstellen der Antenne, beispielsweise durch Fräsen, freigelegt werden müssen. Erst dann kann die elektrische Verbindung durch einen Bonddraht mit dem Chipmodul beziehungsweise mit dem Chip hergestellt werden.A common on-site process for chip cards is the so-called implantation process, in which a chip module (consisting of a carrier element which has the external contact surfaces and the chip) is inserted into the cavity of a card body. The electrical connections between the chip and the contact areas are already made via the chip module. If you want to use the implantation method with a Kombicard, the problem is that establish electrical connection between the chip and the antenna. The antenna is usually laminated into or overmolded by the card body, so that in order to establish the electrical connection, contact points of the antenna must first be exposed, for example by milling. Only then can the electrical connection be made to the chip module or to the chip by means of a bonding wire.
Der Erfindung liegt die Aufgabe zugrunde, eine Chipkarte und ein entsprechendes Verfahren anzugeben, bei der eine elektrische Verbindung zwischen Chip und Antenne auf einfache Weise hergestellt ist.The invention has for its object to provide a chip card and a corresponding method in which an electrical connection between the chip and antenna is made in a simple manner.
Diese Aufgabe wird durch eine Chipkarte gemäß Anspruch 1 und ein Verfahren gemäß Anspruch 7 gelöst.This object is achieved by a chip card according to claim 1 and a method according to claim 7.
Erfindungsgemäß ist ein durch eine der Kontaktflächen getriebener Stift aus einem elektrisch leitendem Material vorgese- hen, dessen eines Ende mit der Kontaktfläche kontaktiert ist und dessen anderes Ende kraftschlüssig mit der Antenne verbunden ist, so daß es mit dieser kontaktiert ist. Auf diese Weise ist eine elektrische Verbindung zwischen der Kontaktfläche und der Antenne hergestellt. Die elektrische Verbin- düng zwischen Kontaktfläche und den Anschlüssen des Chips ist dagegen wie heute üblich über Bonddrähte realisiert.According to the invention, a pin made of an electrically conductive material and driven by one of the contact surfaces is provided, one end of which is in contact with the contact surface and the other end of which is non-positively connected to the antenna, so that it is in contact with it. In this way, an electrical connection between the contact surface and the antenna is established. The electrical connection between the contact surface and the connections of the chip, on the other hand, is implemented via bond wires, as is common today.
Die Erfindung wird im folgenden anhand von Ausführungsbei- spielen, die in den Figuren dargestellt sind, näher erläu- tert . Es zeigen:The invention is explained in more detail below on the basis of exemplary embodiments which are illustrated in the figures. Show it:
Figur 1 ein Ausführungsbeispiel der erfindungsgemäßen Chipkarte,FIG. 1 shows an exemplary embodiment of the chip card according to the invention,
Figur 2 ein Ausführungsbeispiel des durch die Kontaktfläche getriebenen Stiftes, Figur 3 eine Draufsicht auf die Antenne undFIG. 2 shows an exemplary embodiment of the pin driven through the contact surface, Figure 3 is a plan view of the antenna and
Figur 4 eine Querschnittdarstellung des Kontaktbereichs zwischen Stift und Antenne.Figure 4 is a cross-sectional view of the contact area between the pin and antenna.
Figur 1 zeigt einen Ausschnitt einer Chipkarte 1 mit einem Kartenkörper 10, der eine Kavität 11 aufweist, in welche ein Chipmodul 12 eingesetzt ist . Das Chipmodul 12 weist einen Chip 13 auf, der auf ein Trägerelement aufgebracht ist, wel- ches eine isolierende Schicht 14 sowie eine leitfähigeFIG. 1 shows a section of a chip card 1 with a card body 10 which has a cavity 11 into which a chip module 12 is inserted. The chip module 12 has a chip 13 which is applied to a carrier element, which has an insulating layer 14 and a conductive layer
Schicht aufweist, die zu Kontaktflächen 3 vereinzelt ist. Der Chip 13 ist mit den Kontaktflächen 3 über Bonddrähte 15 elektrisch verbunden. Üblicherweise sind Chip 13 und Bonddrähte 15 von einer in Figur 1 nicht dargestellten Abdeckmasse, häu- fig einem Duroplasten, abgedeckt. Das Chipmodul 12 ist mit dem thermoplastischen Material des Kartenkörpers 10 durch Kleben verbunden. Weiterhin weist die Chipkarte 1 eine Antenne 2 innerhalb ihres Kartenkörpers 10 auf. Die Antenne 2 kann beispielsweise durch Laminieren des Kartenkörpers oder durch Umspritzen mit dem Material des Kartenkörpers von diesem umgeben werden .Has layer that is separated into contact areas 3. The chip 13 is electrically connected to the contact areas 3 via bond wires 15. Chip 13 and bonding wires 15 are usually covered by a masking compound (not shown in FIG. 1), often a thermoset. The chip module 12 is connected to the thermoplastic material of the card body 10 by gluing. Furthermore, the chip card 1 has an antenna 2 inside its card body 10. The antenna 2 can be surrounded by the card body material, for example, by laminating the card body or by extrusion coating.
Um eine elektrische Verbindung zwischen einer der Kontaktflächen 3 und der Antenne 2, und damit zwischen dem Chip 13 und der Antenne 2, herzustellen, ist bei der Chipkarte 1 in Figur 1 ein elektrisch leitfähiger Stift 4 senkrecht von oben durch die rechteste der Kontaktflächen 3 in den Kartenkörper hineingedrückt worden. Seine Länge ist so bemessen, daß er nach der Bildung eines Kraftschlusses mit der Antenne 2 an seinem unteren Ende, welches zur Unterstützung des Kraftschlusses zackenförmige Ausformungen 8 aufweist, mit seinem oberen Ende nicht mehr über die Kontaktfläche 3 hinausragt.In order to establish an electrical connection between one of the contact areas 3 and the antenna 2, and thus between the chip 13 and the antenna 2, in the chip card 1 in FIG. 1, an electrically conductive pin 4 is perpendicular from above through the rightmost one of the contact areas 3 in the card body has been pushed in. Its length is such that it does not protrude beyond the contact surface 3 with its upper end after the formation of a force fit with the antenna 2 at its lower end, which has jagged formations 8 to support the force fit.
Figur 2 ist eine Detailansicht eines weiteren Ausführungsbei- spiels der Erfindung zu entnehmen. Dargestellt ist die Kontaktfläche 3, durch welche der Stift 4 getrieben worden ist. Zur Fixierung des Stiftes 4 in der Chipkarte 1 ist das obere Ende des Stiftes 4 nietförmig gestaltet und durch einen leitfähigen Kleber 5 mit der Kontaktfläche 3 verbunden. Außer der Fixierung dient der Kleber 5 somit auch einer guten elektrischen Kontaktierung zwischen Stift 4 und Kontaktfläche 3. Zu- sätzlich zur Fixierung des Stiftes 4 mittels des Klebstoffes 5 weist der Stift 4 als Widerhaken wirkende Ausformungen 6 auf, die ein Verhaken des Stiftes mit dem Material des Kar- tenkörpers 10 bewirken. Bei anderen Ausführungsbeispielen der Erfindung kann auch nur der Klebstoff 5 oder nur die Widerha- ken 6 vorgesehen sein.FIG. 2 shows a detailed view of a further exemplary embodiment of the invention. The contact surface 3 through which the pin 4 has been driven is shown. To fix the pin 4 in the chip card 1 is the upper one End of the pin 4 rivet-shaped and connected to the contact surface 3 by a conductive adhesive 5. In addition to the fixation, the adhesive 5 thus also provides good electrical contact between the pin 4 and the contact surface 3. In addition to the fixation of the pin 4 by means of the adhesive 5, the pin 4 has barbs 6 which prevent the pin from hooking into the Effect the material of the card body 10. In other exemplary embodiments of the invention, only the adhesive 5 or only the barbs 6 can also be provided.
Figur 3 zeigt in einer Draufsicht die Antenne 2, die beispielsweise als gewickelte Spule realisiert sein kann. Sie weist an ihren beiden Enden je eine flächig ausgebildete Kon- taktfläche 7 auf. Auf jeder der Kontaktflächen 7 der Antenne 2 setzt bei diesem Ausführungsbeispiel je ein Stift 4 auf, der durch je eine Kontaktfläche 3 der Chipkarte 1 getrieben worden ist. Im allgemeinen sind immer zwei Anschlüsse der Antenne 2 zu kontaktieren. In Figur 1 wurde der Einfachheit halber jedoch nur ein Stift 4 dargestellt. Die Kontaktflächen 7 der Antenne 2 in Figur 3 weisen größere Abmessungen auf als der Durchmesser der Stifte 4. Dies hat den Vorteil, daß Toleranzen bei der Plazierung des jeweiligen Stiftes 4 zugelassen sind.FIG. 3 shows a top view of the antenna 2, which can be implemented, for example, as a wound coil. It has a flat contact surface 7 at each of its two ends. In this exemplary embodiment, a pin 4 is placed on each of the contact surfaces 7 of the antenna 2 and has been driven by a contact surface 3 of the chip card 1. In general, two connections of antenna 2 must always be contacted. For the sake of simplicity, however, only one pin 4 has been shown in FIG. The contact surfaces 7 of the antenna 2 in FIG. 3 have larger dimensions than the diameter of the pins 4. This has the advantage that tolerances in the placement of the respective pin 4 are permitted.
Figur 4 zeigt eine Schnittdarstellung einer Seitenansicht der Antenne 2 und des unteren Teiles des Stiftes 4. Der untere Teil 9 ist so ausgebildet, daß er den runden Querschnitt der Antenne 2 teilweise umgibt . Auf diese Weise wird ein guter elektrischer Kontakt und ein guter Kraftschluß zwischen dem Stift 4 und der Antenne 2 hergestellt. In Figur 4 ist der Zustand dargestellt, in dem der Stift 4 noch nicht ganz mit der Antenne 2 kontaktiert ist. Nachdem der Stift 4 vollständig in die Karte 1 hineingetrieben worden ist, berühren sich beide, und vorzugsweise dringt der Stift 4 teilweise in das Material der Antenne 2 ein. Das Hineintreiben beziehungsweise Durchschießen der Chipkarte 1 mit dem Stift 4, der vorzugsweise aus Aluminium gefertigt ist, stellt kein Problem dar, da der Kartenkörper 10 normalerweise aus nachgiebigem thermoplastischen Material hergestellt ist. Die Antenne 2 kann gedruckt, geätzt oder gewik- kelt sein. Figure 4 shows a sectional view of a side view of the antenna 2 and the lower part of the pin 4. The lower part 9 is designed so that it partially surrounds the round cross section of the antenna 2. In this way, a good electrical contact and a good adhesion between the pin 4 and the antenna 2 is made. FIG. 4 shows the state in which the pin 4 has not yet been fully contacted with the antenna 2. After the pin 4 has been completely driven into the card 1, the two touch, and preferably the pin 4 partially penetrates the material of the antenna 2. Driving in or shooting through the chip card 1 with the pin 4, which is preferably made of aluminum, is not a problem, since the card body 10 is normally made of flexible thermoplastic material. The antenna 2 can be printed, etched or coiled.

Claims

Patentansprüche claims
1. Chipkarte (1) mit einer in einem Kartenkörper (10) ange- ordneten Antenne (2) für eine kontaktlose Datenübertragung und mit an einer Oberfläche des Kartenkörpers (10) angeordneten Kontaktflächen (3) für eine kontaktbehaftete Datenübertragung, die wenigstens einen Stift (4) aus einem elektrisch leitenden Material aufweist, dessen eines Ende mit einer der Kontaktflächen (3) kontaktiert ist und dessen anderes Ende mit der Antenne (2) kontaktiert ist.1. Chip card (1) with an antenna (2) arranged in a card body (10) for contactless data transmission and with contact surfaces (3) arranged on a surface of the card body (10) for contact-based data transmission, the at least one pin ( 4) made of an electrically conductive material, one end of which is in contact with one of the contact surfaces (3) and the other end of which is in contact with the antenna (2).
2. Chipkarte nach Anspruch 1 , bei der das mit der Kontaktfläche (3) kontaktierte Ende des Stiftes durch Verkleben (5) in der Chipkarte (1) fixiert ist.2. Chip card according to claim 1, wherein the contact with the contact surface (3) end of the pin is fixed by gluing (5) in the chip card (1).
3. Chipkarte nach Anspruch 1 oder 2 , bei der der Stift (4) mit als Widerhaken wirkenden Ausformun- gen (6) versehen ist, die seine Fixierung in der Chipkarte (1) bewirken.3. Chip card according to claim 1 or 2, in which the pin (4) is provided with barbs (6) which cause it to be fixed in the chip card (1).
4. Chipkarte nach einem der Ansprüche 1 bis 3, bei der die Antenne (2) wenigstens eine Kontaktfläche (7) aufweist, auf der der Stift (4) aufsetzt, die größere Abmessungen aufweist als der Durchmesser der Stiftes.4. Chip card according to one of claims 1 to 3, wherein the antenna (2) has at least one contact surface (7) on which the pin (4) is placed, which has larger dimensions than the diameter of the pin.
5. Chipkarte nach einem der Ansprüche 1 bis 4, bei der das mit der Antenne (2) kontaktierte Ende des Stiftes (4) zackenförmige Ausformungen (8) aufweist, die die kraftschlüssige Verbindung zwischen ihm und der Antenne (2) begünstigt.5. Chip card according to one of claims 1 to 4, wherein the antenna (2) contacted end of the pin (4) has jagged formations (8) which favors the positive connection between it and the antenna (2).
6. Chipkarte nach einem der Ansprüche 1 bis 5, bei der das mit der Antenne (2) kontaktierte Ende des Stiftes (4) so ausgebildet ist, daß es einen Teil der Antenne (2) wenigstens teilweise umschließt. 6. Chip card according to one of claims 1 to 5, in which the antenna (2) contacted end of the pin (4) is designed such that it at least partially encloses part of the antenna (2).
7. Verfahren zur Kontaktierung einer in einer Chipkarte (1) eingebetteten, einer kontaktlosen Datenübertragung dienenden Antenne (2) , wobei die Chipkarte (1) in ihrer Oberfläche Kon- taktflächen (3) für eine kontaktbehaftete Datenübertragung aufweist, bei dem durch wenigstens eine der Kontaktflächen (3) ein Stift (4) aus einem elektrisch leitenden Material soweit in die Chipkarte (1) getrieben wird, daß sein eines Ende mit der Kontaktfläche (3) kontaktiert wird und sein anderes Ende kraftschlüssig mit der Antenne (2) verbunden wird, so daß es mit dieser kontaktiert ist.7. Method for contacting an antenna (2) embedded in a chip card (1) and used for contactless data transmission, the surface of the chip card (1) having contact surfaces (3) for contact-based data transmission, in which at least one of the Contact surfaces (3) a pin (4) made of an electrically conductive material is driven so far into the chip card (1) that one end is contacted with the contact surface (3) and its other end is non-positively connected to the antenna (2), so that it is in contact with it.
8. Verfahren nach Anspruch 7, bei dem zuvor zur Bildung der Chipkarte (1) ein Kartenkörper (10) mit einer Kavität (11) hergestellt wird, wobei die Antenne (2) in den Kartenkörper (10) eingebettet wird, und bei dem in die Kavität (11) ein Chipmodul (12) eingesetzt wird, das die Kontaktflächen (3) aufweist, so daß die wenig- stens eine Kontaktfläche (3) , durch die der Stift (4) getrieben werden soll, oberhalb der Antenne (2) angeordnet wird. 8. The method according to claim 7, in which a card body (10) with a cavity (11) is previously produced to form the chip card (1), the antenna (2) being embedded in the card body (10), and in which the cavity (11) a chip module (12) is inserted, which has the contact surfaces (3), so that at least one contact surface (3) through which the pin (4) is to be driven, above the antenna (2) is arranged.
PCT/DE1998/001691 1997-07-07 1998-06-19 Chip card and process for contacting an antenna embedded in a chip card WO1999003165A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1997128993 DE19728993C1 (en) 1997-07-07 1997-07-07 Chip card with embedded antenna for contactless data transmission
DE19728993.2 1997-07-07

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WO1999003165A1 true WO1999003165A1 (en) 1999-01-21

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WO (1) WO1999003165A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313015A (en) * 1991-12-31 1994-05-17 Schlegel Corporation Ground plane shield
EP0710924A1 (en) * 1994-09-16 1996-05-08 Thomson-Csf IC card with light indicator for ascertaining the proper functioning
EP0713252A2 (en) * 1994-11-16 1996-05-22 Nec Corporation Circuit elements mounting
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
EP0756244A2 (en) * 1995-07-26 1997-01-29 Giesecke & Devrient GmbH Electronic unit and method of producing that unit
WO1997005569A1 (en) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Data carrier with a component-bearing module and a coil, and a process for fabricating such a data carrier

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997005570A1 (en) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Card-shaped data carrier for contactless applications with a component and a transmission system for the contactless applications, method of producing such a card-shaped data carrier, and module therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313015A (en) * 1991-12-31 1994-05-17 Schlegel Corporation Ground plane shield
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
EP0710924A1 (en) * 1994-09-16 1996-05-08 Thomson-Csf IC card with light indicator for ascertaining the proper functioning
EP0713252A2 (en) * 1994-11-16 1996-05-22 Nec Corporation Circuit elements mounting
EP0756244A2 (en) * 1995-07-26 1997-01-29 Giesecke & Devrient GmbH Electronic unit and method of producing that unit
WO1997005569A1 (en) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Data carrier with a component-bearing module and a coil, and a process for fabricating such a data carrier

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