WO1998057298A1 - Method for making a contactless smart card - Google Patents

Method for making a contactless smart card Download PDF

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Publication number
WO1998057298A1
WO1998057298A1 PCT/FR1998/001192 FR9801192W WO9857298A1 WO 1998057298 A1 WO1998057298 A1 WO 1998057298A1 FR 9801192 W FR9801192 W FR 9801192W WO 9857298 A1 WO9857298 A1 WO 9857298A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
cavity
conductive
sheet
manufacturing
Prior art date
Application number
PCT/FR1998/001192
Other languages
French (fr)
Inventor
Vincent Lambert
Joël TURIN
Henri Boccia
Original Assignee
Gemplus S.C.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus S.C.A. filed Critical Gemplus S.C.A.
Priority to EP98929541A priority Critical patent/EP0988619A1/en
Priority to KR19997011585A priority patent/KR20010013578A/en
Priority to JP50177999A priority patent/JP2002505022A/en
Priority to AU79257/98A priority patent/AU7925798A/en
Priority to CA002293460A priority patent/CA2293460A1/en
Publication of WO1998057298A1 publication Critical patent/WO1998057298A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Definitions

  • the invention relates to the manufacture of smart cards, and more particularly of cards capable of operating without contact using an antenna integrated in the card.
  • contactless card we will consider on the one hand cards that can communicate with the outside only through the antenna, and also and above all mixed cards that can communicate with the outside either by l 'intermediary of the antenna either by means of standard conventional contacts.
  • Such cards are intended to carry out various operations, such as, for example, banking operations, telephone communications, identification operations, debit operations or recharging of account units, and all kinds of operations which can be done either by inserting the card in a reader or remotely by electromagnetic coupling (in principle of the inductive type) between a transmission-reception terminal and a card placed in the zone of action of this terminal.
  • operations such as, for example, banking operations, telephone communications, identification operations, debit operations or recharging of account units, and all kinds of operations which can be done either by inserting the card in a reader or remotely by electromagnetic coupling (in principle of the inductive type) between a transmission-reception terminal and a card placed in the zone of action of this terminal.
  • Contactless cards should preferably have standardized dimensions identical to those of conventional smart cards with contacts. This is obviously particularly essential for mixed cards, and it is desirable for cards operating only without contact.
  • the usual ISO 7810 standard defines a card 85 mm long, 54 mm wide, and 0.76 mm thick.
  • the contacts are flush with well-defined positions on the surface of the card.
  • the object of the invention is to propose a manufacturing method which makes it possible to best resolve the various constraints of dimensioning, manufacturing precision, mechanical strength, and more generally reliability, cost and card manufacturing efficiency.
  • a method of manufacturing a smart card is proposed according to the invention, comprising the following steps:
  • the conductive access areas of the antenna will preferably be constituted by the ends, covered with conductive glue, an antenna conductor.
  • This conductive adhesive will in principle be deposited after opening the cavity, but it could also be deposited between two phases of a rolling carried out in several passes.
  • the sheet assembly comprises a sheet provided with perforations coming above the ends of the antenna, the perforations being updated during the opening of the cavity and conductive adhesive being deposited in these perforations.
  • the electronic module can be of the single-sided or double-sided type, and, in the latter case, it can advantageously be provided that it is a double-sided circuit without contact via between the two faces, with wires welded between the chip and the conductors on both sides.
  • the cavity is preferably made for the cavity to define a housing in the shape of the module, so that the conductors of the module are flush with the upper surface of the card and thus constitute the access contacts to the card.
  • the antenna conductor is preferably a conductor printed on an insulating sheet, but it could also consist of a wound wire enclosed in the assembly of plastic sheets.
  • FIG. 6 shows the constitution of a double-sided electronic module without via conductors between the two faces;
  • FIG. 7 to 9 show the method according to the invention in a second embodiment.
  • contactless smart cards will be made by gluing (hot or cold ination) of plastic sheets in which the antenna conductor will have been inserted or inserted, then opening a cavity in the sheets assembled to create a housing there for an integrated circuit module, or to complete a housing already partially created, and positioning of the module so that two conductive pads of the module come into electrical contact with two ends of the conductor antenna, either directly or most often via a conductive adhesive.
  • Figures 1 to 5 show a first embodiment of the method according to the invention.
  • the sheet 20 carries a printed circuit antenna 22, that is to say a conductor deposited and engraved, or screen printed, on the sheet.
  • the antenna 22 generally makes several turns following the outer periphery of the card, in order to cut off as large an electromagnetic flux as possible.
  • the antenna has two ends 24 and 26 slightly spaced from each other. The spacing is chosen according to the conductive areas of the electronic module that will be inserted in the card.
  • the sheet 30 preferably comprises two perforations 34 and 36 each located above a respective end, 24, 26, of the antenna. The electrical contact between the antenna and the integrated circuit module will be made through these perforations.
  • the sheet 40 constitutes a coating on the front face of the chip (FIG. 1).
  • the rolling operation makes it possible to constitute, from the four sheets, a plastic plate 50 in which the antenna 22 and its ends 24, 26 are enclosed, the latter being below the perforations 34, 36 (FIG. 2).
  • a cavity 52 is then hollowed out having the general shape of the electronic module which must be inserted therein, the depth of the cavity being such that the external access contacts of the module, which will become the access contacts of the card for the insertion in a contact reader, flush with the upper surface of the board.
  • the cavity has a double bowl shape with two flat bottoms, one of the bottoms, 54, being shallower, the other, 56, being deeper. The shallower part reaches above the ends 24 and 26, while the deeper part is located entirely between the ends.
  • the cavity is preferably formed by two successive milling operations. After formation of the cavity, the ends 24 and 26 of the antenna conductor are accessible through the perforations 34 and 36; this means that the depth of the bottom 54 is at least sufficient to pierce the entire thickness of the sheet 40 and reach the sheet 30 and its perforations (FIG. 3). A drop of conductive glue 60, 62 is then preferably placed in each of the perforations 34 and 36. The ends of the antenna thus covered constitute the conductive areas for access to the antenna (FIG. 4). Then, the electronic module M is installed containing the integrated circuit ensuring the electronic operation of the smart card.
  • This module can be a single-sided printed circuit module or a double-sided printed-circuit module, and in the latter case it can have two possible configurations to which we will return later.
  • a module M is shown in FIG. 4 above the cavity 52.
  • it is a double-sided printed circuit module comprising upper conductors 70 on the face which will be turned towards the outside of the cavity and lower conductors 72 on the face which will face the interior of the cavity.
  • the conductors are formed on an insulating sheet and via conductors connect the upper and lower conductors.
  • a chip embedded in a protective resin 74 is mounted on the underside and connected to the conductors 72 (and thereby the conductors 70).
  • FIG. 5 shows the module mounted in the card.
  • Two conductive pads on the underside of the module, arranged just above the ends 24, 26 of the antenna, are electrically connected to these two ends by means of the conductive adhesive present in the perforations 34 and 36.
  • the conductive adhesive holds the module in place, but we can also consider additional support with a non-conductive adhesive deposited in the bottom of the cavity or on the underside of the module outside the places reserved for contact with the antenna ends.
  • An anisotropic conductive glue leading perpendicular to the adhesive layer but not parallel to the layer can also be used to avoid short circuits between certain electrical parts of the module or antenna which must not be connected together. This anisotropic adhesive could be deposited both in the perforations 34, 36 and in the rest of the cavity 52 without special precautions.
  • the method can also be easily used with a single-sided integrated circuit module.
  • the chip is placed on a metal grid whose upper face will constitute the access contacts of the smart card and whose lower face, facing the antenna ends, will allow connection with these ends by glue.
  • conductive This metal grid will generally be covered, on the lower side, by an insulating sheet.
  • the insulating sheet is perforated where contact must be made with the antenna, the other conductive parts of the underside of the grid preferably being protected either by this insulating sheet or by the chip protection resin.
  • the module consists of a double-sided printed circuit carrying the integrated circuit chip, but this double-sided circuit is produced without a conductor between the conductors of the two faces, which makes it less expensive.
  • FIG. 6 shows in detail the realization of such a double-sided module without via.
  • the module comprises an insulating sheet 80 with first conductors 70 deposited and etched on its upper face (external face when the module is placed in the card), and second conductors 72 deposited and etched on the lower face.
  • the first conductors will serve as access contacts for the smart card.
  • the second are intended to ensure the connection of the chip with the antenna.
  • the circuit chip integrated 82 is bonded to the underside and is connected by wires welded on the one hand directly to conductors on the underside and on the other hand, through openings in the insulating sheet, behind the conductors 70 of the upper side.
  • two welded connecting wires start from the chip and lead to two conductors 72 on the underside, these conductors being intended to be connected to the ends of the antenna. Only one of these wires, 84, is shown in FIG. 6. And other connecting wires leave the chip and are soldered to the rear of the conductors 70 of the upper face in order to provide the accesses of the card in a reader with contacts. Only one of these welded wires, 86, is shown in FIG. 6.
  • the embodiment which has been described in FIGS. 1 to 6 uses a lamination of four sheets of plastic material. It will be understood that the sheets 10 and 20 can be replaced by a single sheet 20, possibly thicker, and likewise the sheets 30 and 40 can be replaced by a single sheet 30, possibly thicker.
  • the perforations 34 and 36 are flush with the surface of the laminated wafer 50; the perforations are then updated regardless of the depth of the bottom 54 of the cavity.
  • the deposits of conductive adhesive 60 and 62 can be made before gluing the upper sheet 40 on the sheet 30, but after gluing the sheet 30 on the sheet 20.
  • the lamination is done in this case by two passages, the adhesive deposit being carried out between the two passages.
  • the glue is then enclosed in the perforations 34 and 36 and is exposed during the machining of the cavity 52. We can then, if desired, put a dose of glue on the perforations 34 and 36 already filled with glue , before installing the electronic module.
  • a non-stick substance is placed between two sheets of the assembly in the region provided for the cavity so as to prevent the sticking of the two sheets in this region and to facilitate the removal of material in this region during the opening of the cavity; one of the sheets is that which carries the antenna so that the opening of the cavity exposes the ends of the antenna. More specifically, the upper sheet 30 does not have perforations 34 and 36 but comprises, above the cavity 52 this non-stick substance 90 which will prevent the sheet 30 from sticking to the ends of the antenna. After lamination, the plastic from the sheet 30 is torn off where it is not adherent, exposing the contacts and partially establishing the cavity 52 (FIG. 8).
  • the final shape of the cavity can be obtained by machining, in particular to define a deeper part.
  • a drop of conductive glue can then be deposited on the ends of the antenna conductor before bonding the module ( Figure 9).
  • a wound wire antenna rather than an antenna printed on an insulating sheet.
  • the coiled antenna is pressed against a sheet of plastic material similar to the sheet 20 and is thus locked in the smart card during hot or cold lamination.
  • Perforations such as 34 and 36 can be provided in the sheet 30, but they are not compulsory because it can be provided that the ends of the coiled antenna are exposed during the machining operation of the cavity.
  • This solution is indeed possible due to the fact that the wound wire is thicker than the printed conductor and that machining can therefore be limited when the wire is exposed. A drop of conductive glue can then be deposited on the ends of bare wire before installing the electronic module.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention concerns smart cards, and more particularly those capable operating without contact with an antenna integrated in the card, including mixed cards having standard contacts. The manufacturing method comprises the following operations: assembling superposed plastic sheets by enclosing within the layers an antenna (22) comprising two conductive access zones (60, 24; 62, 26); opening a cavity in the assembly top surface, and exposing the conductive access zones during said opening; gluing an electronic module (M) in the cavity, the module having on its bottom surface, facing inside the cavity, conductive ranges (72) coming into electric contact with the antenna conductive access zones. The antenna conductive access zones consist of the antenna two conductive ends (24, 26) coated with conductive adhesive (60, 62). The conductive adhesive is deposited on the antenna ends after opening the cavity.

Description

PROCEDE DE FABRICATION DE CARTE A PUCE SANS CONTACT NON-CONTACT CHIP CARD MANUFACTURING PROCESS
L'invention concerne la fabrication des cartes à puces, et plus particulièrement des cartes capables de fonctionner sans contact à l'aide d'une antenne intégrée dans la carte. Sous cette appellation "carte sans contact", on envisagera d'une part les cartes ne pouvant communiquer avec l'extérieur que par l'intermédiaire de l'antenne, et aussi et surtout les cartes mixtes pouvant communiquer avec l'extérieur soit par l'intermédiaire de l'antenne soit par l'intermédiaire de contacts classiques normalisés.The invention relates to the manufacture of smart cards, and more particularly of cards capable of operating without contact using an antenna integrated in the card. Under this name "contactless card", we will consider on the one hand cards that can communicate with the outside only through the antenna, and also and above all mixed cards that can communicate with the outside either by l 'intermediary of the antenna either by means of standard conventional contacts.
De telles cartes sont destinées à réaliser diverses opérations, telles que, par exemple, des opérations bancaires, des communications téléphoniques, des opérations d'identification, des opérations de débit ou de rechargement d'unités de compte, et toutes sortes d'opérations qui peuvent s'effectuer soit en insérant la carte dans un lecteur soit à distance par couplage électromagnétique (en principe de type inductif) entre une borne d' émission-réception et une carte placée dans la zone d'action de cette borne.Such cards are intended to carry out various operations, such as, for example, banking operations, telephone communications, identification operations, debit operations or recharging of account units, and all kinds of operations which can be done either by inserting the card in a reader or remotely by electromagnetic coupling (in principle of the inductive type) between a transmission-reception terminal and a card placed in the zone of action of this terminal.
Les cartes sans contact doivent avoir de préférence des dimensions normalisées identiques à celles des cartes à puces classiques pourvues de contacts. Ceci est évidemment tout particulièrement indispensable pour les cartes mixtes, et c'est souhaitable pour les cartes fonctionnant uniquement sans contact.Contactless cards should preferably have standardized dimensions identical to those of conventional smart cards with contacts. This is obviously particularly essential for mixed cards, and it is desirable for cards operating only without contact.
La norme usuelle ISO 7810 définit une carte de 85 mm de long, 54 mm de large, et 0,76 mm d'épaisseur. Les contacts affleurent à des positions bien définies à la surface de la carte.The usual ISO 7810 standard defines a card 85 mm long, 54 mm wide, and 0.76 mm thick. The contacts are flush with well-defined positions on the surface of the card.
Ces normes imposent des contraintes sévères pour la fabrication. L'épaisseur très faible de la carte est en particulier une contrainte majeure, plus sévère encore pour les cartes sans contact que pour les cartes simplement munies de contact, car il faut prévoir l'incorporation d'une antenne dans la carte.These standards impose severe constraints for manufacturing. The very small thickness of the card is in particular a major constraint, even more severe for contactless cards only for cards simply fitted with contact, as it is necessary to provide for the incorporation of an antenna in the card.
Les problèmes techniques qui se posent sont des problèmes de positionnement de l'antenne par rapport à la carte, car l'antenne occupe presque toute la surface de la carte, des problèmes de positionnement du module de circuit intégré (comprenant la puce et ses contacts) qui assure le fonctionnement électronique de la carte, et des problèmes de précision et de fiabilité de la connexion entre le module et l'antenne; enfin, des contraintes de tenue mécanique, de fiabilité et de coût de fabrication doivent être prises en compte.The technical problems which arise are problems of positioning the antenna relative to the card, since the antenna occupies almost the entire surface of the card, problems of positioning of the integrated circuit module (comprising the chip and its contacts ) which ensures the electronic functioning of the card, and problems of precision and reliability of the connection between the module and the antenna; finally, mechanical strength, reliability and manufacturing cost constraints must be taken into account.
L'invention a pour but de proposer un procédé de fabrication qui permet de résoudre au mieux les différentes contraintes de dimensionnement , de précision de fabrication, de tenue mécanique, et plus généralement de fiabilité, de coût et de rendement de fabrication de la carte. Pour cela on propose selon l'invention un procédé de fabrication de carte à puce comportant les étapes suivantes :The object of the invention is to propose a manufacturing method which makes it possible to best resolve the various constraints of dimensioning, manufacturing precision, mechanical strength, and more generally reliability, cost and card manufacturing efficiency. For this, a method of manufacturing a smart card is proposed according to the invention, comprising the following steps:
- assemblage de feuilles de matière plastique superposées en enfermant dans la superposition une antenne comportant deux zones d'accès conductrices;- assembly of superimposed plastic sheets by enclosing in the superposition an antenna comprising two conductive access zones;
- ouverture d'une cavité dans une face supérieure de l'assemblage, et mise à jour des zones d'accès conductrices lors de cette ouverture;- opening of a cavity in an upper face of the assembly, and updating of the conductive access zones during this opening;
- collage d'un module électronique dans la cavité, le module ayant sur sa face inférieure, tournée vers l'intérieur de la cavité, des plages conductrices venant en contact électrique avec les zones d'accès conductrices de l'antenne.bonding of an electronic module into the cavity, the module having on its underside, turned towards the interior of the cavity, conductive pads coming into electrical contact with the conductive access zones of the antenna.
Les zones d'accès conductrices de l'antenne seront de préférence constituées par les extrémités, recouvertes de colle conductrice, d'un conducteur d'antenne. Cette colle conductrice sera en principe déposée après ouverture de la cavité, mais elle pourrait également être déposée entre deux phases d'un laminage effectué en plusieurs passes. De préférence, l'assemblage de feuilles comporte une feuille pourvue de perforations venant au dessus des extrémités de l'antenne, les perforations étant mises à jour lors de l'ouverture de la cavité et de la colle conductrice étant déposée dans ces perforations. Comme on le verra, le module électronique peut être de type simple face ou double face, et, dans ce dernier cas, on peut prévoir avantageusement que ce soit un circuit double face sans via de contact entre les deux faces, avec des fils soudés entre la puce et les conducteurs des deux faces. Quelle que soit la réalisation du module, on prévoit de préférence que la cavité définit un logement à la forme du module, de manière que des conducteurs du module affleurent à la surface supérieure de la carte et constituent ainsi les contacts d'accès à la carte à puce. Le conducteur d'antenne est de préférence un conducteur imprimé sur une feuille isolante, mais il pourrait être aussi constitué par un fil bobiné enfermé dans l'assemblage de feuilles de matière plastique.The conductive access areas of the antenna will preferably be constituted by the ends, covered with conductive glue, an antenna conductor. This conductive adhesive will in principle be deposited after opening the cavity, but it could also be deposited between two phases of a rolling carried out in several passes. Preferably, the sheet assembly comprises a sheet provided with perforations coming above the ends of the antenna, the perforations being updated during the opening of the cavity and conductive adhesive being deposited in these perforations. As will be seen, the electronic module can be of the single-sided or double-sided type, and, in the latter case, it can advantageously be provided that it is a double-sided circuit without contact via between the two faces, with wires welded between the chip and the conductors on both sides. Whatever the embodiment of the module, provision is preferably made for the cavity to define a housing in the shape of the module, so that the conductors of the module are flush with the upper surface of the card and thus constitute the access contacts to the card. smart. The antenna conductor is preferably a conductor printed on an insulating sheet, but it could also consist of a wound wire enclosed in the assembly of plastic sheets.
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée qui suit et qui est faite en référence aux dessins annexés dans lesquels :Other characteristics and advantages of the invention will appear on reading the detailed description which follows and which is given with reference to the appended drawings in which:
- les figures 1 à 5 représentent les opérations successives du procédé selon l'invention dans un mode de mise en oeuvre;- Figures 1 to 5 show the successive operations of the method according to the invention in one embodiment;
- la figure 6 représente la constitution d'un module électronique double face sans via conducteurs entre les deux faces; - les figures 7 à 9 représentent le procédé selon l'invention dans un deuxième mode de mise en oeuvre.- Figure 6 shows the constitution of a double-sided electronic module without via conductors between the two faces; - Figures 7 to 9 show the method according to the invention in a second embodiment.
D'une manière générale, les cartes à puces sans contact seront réalisées par collage (la ination à chaud ou à froid) de feuilles de matière plastique dans lesquelles on aura inséré ou intercalé le conducteur d'antenne, puis ouverture d'une cavité dans les feuilles assemblées pour y créer un logement pour un module de circuit-intégré, ou pour compléter un logement déjà partiellement créé, et mise en place du module de manière que deux plages conductrices du module viennent en contact électrique avec deux extrémités du conducteur d'antenne, soit directement soit le plus souvent par l'intermédiaire d'une colle conductrice.In general, contactless smart cards will be made by gluing (hot or cold ination) of plastic sheets in which the antenna conductor will have been inserted or inserted, then opening a cavity in the sheets assembled to create a housing there for an integrated circuit module, or to complete a housing already partially created, and positioning of the module so that two conductive pads of the module come into electrical contact with two ends of the conductor antenna, either directly or most often via a conductive adhesive.
Les figures 1 à 5 représentent un premier mode de mise en oeuvre du procédé selon l'invention.Figures 1 to 5 show a first embodiment of the method according to the invention.
On part de plusieurs feuilles de matière plastique, ici quatre feuilles 10, 20, 30, 40, qu'on superpose par laminage à chaud ou à froid pour les solidariser ensemble. On pourrait n'utiliser que deux ou trois feuilles superposées comme on le verra plus loin. L'opération de laminage consiste à presser les feuilles à plat les unes contre les autres en présence éventuelle de substances liantes entre les feuilles. Le découpage de la carte à des dimensions normalisées peut se faire soit avant soit après l'opération de laminage, de préférence après.We start from several plastic sheets, here four sheets 10, 20, 30, 40, which are superimposed by hot or cold rolling to join them together. We could use only two or three superimposed sheets as we will see later. The rolling operation consists in pressing the sheets flat against each other in the possible presence of binding substances between the sheets. Cutting the card to standard dimensions can be done either before or after the laminating operation, preferably after.
La feuille 10, au dessous de l'empilement, constitue un revêtement arrière de la carte à puce. La feuille 20 porte une antenne en circuit imprimé 22, c'est-à-dire un conducteur déposé et gravé, ou sérigraphié, sur la feuille. L'antenne 22 fait en général plusieurs tours en suivant la périphérie extérieure de la carte, pour couper un flux électromagnétique aussi grand que possible. L'antenne comporte deux extrémités 24 et 26 légèrement espacées l'une de l'autre. L'espacement est choisi en fonction des plages conductrices du module électronique qu'on va insérer dans la carte.The sheet 10, below the stack, constitutes a rear covering of the smart card. The sheet 20 carries a printed circuit antenna 22, that is to say a conductor deposited and engraved, or screen printed, on the sheet. The antenna 22 generally makes several turns following the outer periphery of the card, in order to cut off as large an electromagnetic flux as possible. The antenna has two ends 24 and 26 slightly spaced from each other. The spacing is chosen according to the conductive areas of the electronic module that will be inserted in the card.
La feuille 30 comporte de préférence deux perforations 34 et 36 situées chacune au dessus d'une extrémité respective, 24, 26, de l'antenne. Le contact électrique entre l'antenne et le module de circuit intégré se fera à travers ces perforations.The sheet 30 preferably comprises two perforations 34 and 36 each located above a respective end, 24, 26, of the antenna. The electrical contact between the antenna and the integrated circuit module will be made through these perforations.
Enfin, la feuille 40 constitue un revêtement de face avant de la puce (figure 1) .Finally, the sheet 40 constitutes a coating on the front face of the chip (FIG. 1).
L'opération de laminage permet de constituer à partir des quatre feuilles une plaquette de matière plastique 50 dans laquelle sont enfermées l'antenne 22 et ses extrémités 24, 26, ces dernières étant au dessous des perforations 34, 36 (figure 2) .The rolling operation makes it possible to constitute, from the four sheets, a plastic plate 50 in which the antenna 22 and its ends 24, 26 are enclosed, the latter being below the perforations 34, 36 (FIG. 2).
On creuse alors une cavité 52 ayant la forme générale du module électronique qu'il faudra y insérer, la profondeur de la cavité étant telle que les contacts d'accès extérieur du module, qui deviendront les contacts d'accès de la carte pour l'insertion dans un lecteur à contacts, affleurent à la surface supérieure de la plaquette. Dans le cas général, la cavité a une forme de cuvette double à deux fonds plats, l'un des fonds, 54, étant moins profond, l'autre, 56, étant plus profond. La partie moins profonde arrive au dessus des extrémités 24 et 26, tandis que la partie plus profonde est située entièrement entre les extrémités.A cavity 52 is then hollowed out having the general shape of the electronic module which must be inserted therein, the depth of the cavity being such that the external access contacts of the module, which will become the access contacts of the card for the insertion in a contact reader, flush with the upper surface of the board. In the general case, the cavity has a double bowl shape with two flat bottoms, one of the bottoms, 54, being shallower, the other, 56, being deeper. The shallower part reaches above the ends 24 and 26, while the deeper part is located entirely between the ends.
La cavité est de préférence formée par deux opérations de fraisage successives. Après formation de la cavité, les extrémités 24 et 26 du conducteur d'antenne sont accessibles à travers les perforations 34 et 36; cela veut dire que la profondeur du fond 54 est au moins suffisante pour percer toute l'épaisseur de la feuille 40 et atteindre la feuille 30 et ses perforations (figure 3) . On place alors de préférence une goutte de colle conductrice 60, 62 dans chacune des perforations 34 et 36. Les extrémités de l'antenne ainsi recouvertes constituent les zones conductrices d'accès à l'antenne (figure 4). Puis, on met en place le module électronique M contenant le circuit-intégré assurant le fonctionnement électronique de la carte à puce. Ce module peut être un module à circuit imprimé simple face ou un module à circuit-imprimé double face, et dans ce dernier cas il peut avoir deux configurations possibles sur lesquelles on reviendra plus loin. Un module M est représenté sur la figure 4 au dessus de la cavité 52. Dans cet exemple il s'agit d'un module à circuit imprimé double face comportant des conducteurs supérieurs 70 sur la face qui sera tournée vers l'extérieur de la cavité et des conducteurs inférieurs 72 sur la face qui sera tournée vers l'intérieur de la cavité. Les conducteurs sont formés sur une feuille isolante et des via conducteurs relient les conducteurs supérieurs et inférieurs. Une puce noyée dans une résine de protection 74 est montée sur la face inférieure et connectée aux conducteurs 72 (et par là aux conducteurs 70) .The cavity is preferably formed by two successive milling operations. After formation of the cavity, the ends 24 and 26 of the antenna conductor are accessible through the perforations 34 and 36; this means that the depth of the bottom 54 is at least sufficient to pierce the entire thickness of the sheet 40 and reach the sheet 30 and its perforations (FIG. 3). A drop of conductive glue 60, 62 is then preferably placed in each of the perforations 34 and 36. The ends of the antenna thus covered constitute the conductive areas for access to the antenna (FIG. 4). Then, the electronic module M is installed containing the integrated circuit ensuring the electronic operation of the smart card. This module can be a single-sided printed circuit module or a double-sided printed-circuit module, and in the latter case it can have two possible configurations to which we will return later. A module M is shown in FIG. 4 above the cavity 52. In this example it is a double-sided printed circuit module comprising upper conductors 70 on the face which will be turned towards the outside of the cavity and lower conductors 72 on the face which will face the interior of the cavity. The conductors are formed on an insulating sheet and via conductors connect the upper and lower conductors. A chip embedded in a protective resin 74 is mounted on the underside and connected to the conductors 72 (and thereby the conductors 70).
Le module s'adapte dans la cavité 52 qui a été usinée à ses dimensions. La figure 5 représente le module monté dans la carte. Deux plages conductrices de la face inférieure du module, disposées juste au dessus des extrémités 24, 26 de l'antenne, sont reliées électriquement à ces deux extrémités grâce à la colle conductrice présente dans les perforations 34 et 36. La colle conductrice maintient le module en place, mais on peut envisager aussi un maintien supplémentaire par une colle non conductrice déposée dans le fond de la cavité ou sur la face inférieure du module en dehors des endroits réservés au contact avec les extrémités d'antenne. Une colle conductrice anisotrope, conduisant perpendiculairement à la couche de colle mais non parallèlement à la couche peut aussi être utilisée pour éviter des court-circuits entre certaines parties électriques du module ou de l'antenne qui ne doivent pas être reliées ensemble. Cette colle anisotrope pourrait être déposée à la fois dans les perforations 34, 36 et dans le reste de la cavité 52 sans précaution particulière.The module fits in the cavity 52 which has been machined to its dimensions. Figure 5 shows the module mounted in the card. Two conductive pads on the underside of the module, arranged just above the ends 24, 26 of the antenna, are electrically connected to these two ends by means of the conductive adhesive present in the perforations 34 and 36. The conductive adhesive holds the module in place, but we can also consider additional support with a non-conductive adhesive deposited in the bottom of the cavity or on the underside of the module outside the places reserved for contact with the antenna ends. An anisotropic conductive glue, leading perpendicular to the adhesive layer but not parallel to the layer can also be used to avoid short circuits between certain electrical parts of the module or antenna which must not be connected together. This anisotropic adhesive could be deposited both in the perforations 34, 36 and in the rest of the cavity 52 without special precautions.
Le procédé est utilisable facilement aussi avec un module de circuit intégré simple face. Dans ce cas, la puce est déposée sur une grille métallique dont la face supérieure constituera les contacts d'accès de la carte à puce et dont la face inférieure, tournée vers les extrémités d'antenne, permettra la connexion avec ces extrémités par la colle conductrice. Cette grille métallique sera en général recouverte, du côté inférieur, par une feuille isolante. La feuille isolante est ajourée là où le contact doit être fait avec l'antenne, les autres parties conductrices de la face inférieure de la grille étant de préférence protégées soit par cette feuille isolante soit par la résine de protection de la puce.The method can also be easily used with a single-sided integrated circuit module. In this case, the chip is placed on a metal grid whose upper face will constitute the access contacts of the smart card and whose lower face, facing the antenna ends, will allow connection with these ends by glue. conductive. This metal grid will generally be covered, on the lower side, by an insulating sheet. The insulating sheet is perforated where contact must be made with the antenna, the other conductive parts of the underside of the grid preferably being protected either by this insulating sheet or by the chip protection resin.
Dans une variante de réalisation particulièrement intéressante, le module est constitué par un circuit imprimé double face portant la puce de circuit intégré, mais ce circuit double face est réalisé sans via conducteur entre les conducteurs des deux faces, ce qui le rend moins coûteux.In a particularly advantageous variant embodiment, the module consists of a double-sided printed circuit carrying the integrated circuit chip, but this double-sided circuit is produced without a conductor between the conductors of the two faces, which makes it less expensive.
La figure 6 représente en détail la réalisation d'un tel module double face sans via. Le module comprend une feuille isolante 80 avec des premiers conducteurs 70 déposés et gravés sur sa face supérieure (face externe lorsque le module est placé dans la carte) , et des seconds conducteurs 72 déposés et gravés sur la face inférieure. Les premiers conducteurs serviront de contacts d'accès de la carte à puce. Les seconds sont destinés à assurer la liaison de la puce avec l'antenne. La puce de circuit intégré 82 est collée sur la face inférieure et est reliée par des fils soudés d'une part directement à des conducteurs de la face inférieure et d'autre part, à travers des ouvertures de la feuille isolante, à l'arrière des conducteurs 70 de la face supérieure.Figure 6 shows in detail the realization of such a double-sided module without via. The module comprises an insulating sheet 80 with first conductors 70 deposited and etched on its upper face (external face when the module is placed in the card), and second conductors 72 deposited and etched on the lower face. The first conductors will serve as access contacts for the smart card. The second are intended to ensure the connection of the chip with the antenna. The circuit chip integrated 82 is bonded to the underside and is connected by wires welded on the one hand directly to conductors on the underside and on the other hand, through openings in the insulating sheet, behind the conductors 70 of the upper side.
Plus précisément, deux fils de liaison soudés partent de la puce et aboutissent à deux conducteurs 72 de la face inférieure, ces conducteurs étant destinés à être connectés aux extrémités de l'antenne. Un seul de ces fils, 84, est représenté sur la figure 6. Et d'autres fils de liaison partent de la puce et sont soudés à l'arrière des conducteurs 70 de la face supérieure en vue de réaliser les accès de la carte dans un lecteur avec contacts. Un seul de ces fils soudés, 86, est représenté sur la figure 6. L'exemple de réalisation qui a été décrit aux figures 1 à 6 utilise une lamination de quatre feuilles de matière plastique. On comprendra que les feuilles 10 et 20 peuvent être remplacées par une seule feuille 20, éventuellement plus épaisse, et de même les feuilles 30 et 40 peuvent être remplacées par une seule feuille 30, éventuellement plus épaisse. Dans ce dernier cas, les perforations 34 et 36 affleurent à la surface de la plaquette laminée 50; les perforations sont alors mises à jour quelle que soit la profondeur du fond 54 de la cavité. Dans une autre variante de réalisation, les dépôts de colle conductrice 60 et 62 peuvent être faits avant de coller la feuille supérieure 40 sur la feuille 30, mais après collage de la feuille 30 sur la feuille 20. La lamination se fait dans ce cas en deux passages, le dépôt de colle étant effectué entre les deux passages. La colle est alors enfermée dans les perforations 34 et 36 et est mise à nu lors de l'usinage de la cavité 52. On peut alors, si on le désire, remettre une dose de colle sur les perforations 34 et 36 déjà remplies de colle, avant de mettre en place le module électronique. Dans une autre variante de réalisation, représentée à la figure 7, on prévoit qu'une substance anti-adhérente est placée entre deux feuilles de l'assemblage dans la région prévue pour la cavité de manière à empêcher le collage des deux feuilles dans cette région et à faciliter l'enlèvement de matière dans cette région lors de l'ouverture de la cavité; l'une des feuilles est celle qui porte l'antenne de sorte que l'ouverture de la cavité met à nu les extrémités d'antenne. Plus précisément, la feuille supérieure 30 ne comporte pas de perforations 34 et 36 mais comporte, au dessus de la cavité 52 cette substance anti-adhérente 90 qui empêchera le collage de la feuille 30 sur les extrémités de l'antenne. Après lamination, le plastique de la feuille 30 est arraché là où il n'est pas adhérent, mettant à nu les contacts et établissant en partie la cavité 52 (figure 8) .More specifically, two welded connecting wires start from the chip and lead to two conductors 72 on the underside, these conductors being intended to be connected to the ends of the antenna. Only one of these wires, 84, is shown in FIG. 6. And other connecting wires leave the chip and are soldered to the rear of the conductors 70 of the upper face in order to provide the accesses of the card in a reader with contacts. Only one of these welded wires, 86, is shown in FIG. 6. The embodiment which has been described in FIGS. 1 to 6 uses a lamination of four sheets of plastic material. It will be understood that the sheets 10 and 20 can be replaced by a single sheet 20, possibly thicker, and likewise the sheets 30 and 40 can be replaced by a single sheet 30, possibly thicker. In the latter case, the perforations 34 and 36 are flush with the surface of the laminated wafer 50; the perforations are then updated regardless of the depth of the bottom 54 of the cavity. In another alternative embodiment, the deposits of conductive adhesive 60 and 62 can be made before gluing the upper sheet 40 on the sheet 30, but after gluing the sheet 30 on the sheet 20. The lamination is done in this case by two passages, the adhesive deposit being carried out between the two passages. The glue is then enclosed in the perforations 34 and 36 and is exposed during the machining of the cavity 52. We can then, if desired, put a dose of glue on the perforations 34 and 36 already filled with glue , before installing the electronic module. In another alternative embodiment, shown in Figure 7, it is provided that a non-stick substance is placed between two sheets of the assembly in the region provided for the cavity so as to prevent the sticking of the two sheets in this region and to facilitate the removal of material in this region during the opening of the cavity; one of the sheets is that which carries the antenna so that the opening of the cavity exposes the ends of the antenna. More specifically, the upper sheet 30 does not have perforations 34 and 36 but comprises, above the cavity 52 this non-stick substance 90 which will prevent the sheet 30 from sticking to the ends of the antenna. After lamination, the plastic from the sheet 30 is torn off where it is not adherent, exposing the contacts and partially establishing the cavity 52 (FIG. 8).
La forme définitive de la cavité peut être obtenue par usinage, notamment pour définir une partie plus profonde. Une goutte de colle conductrice peut alors être déposée sur les extrémités du conducteur d'antenne avant collage du module (figure 9) .The final shape of the cavity can be obtained by machining, in particular to define a deeper part. A drop of conductive glue can then be deposited on the ends of the antenna conductor before bonding the module (Figure 9).
Enfin, dans certains cas on peut préférer utiliser une antenne en fil bobiné plutôt qu'une antenne imprimée sur une feuille isolante. Dans ce cas, l'antenne bobinée est pressée contre une feuille de matière plastique analogue à la feuille 20 et est ainsi enfermée dans la carte à puce pendant la lamination à chaud ou à froid. Des perforations telles que 34 et 36 peuvent être prévues dans la feuille 30, mais elles ne sont pas obligatoires car on peut prévoir que les extrémités de l'antenne bobinée sont mises à nu pendant l'opération d'usinage de la cavité. Cette solution est en effet possible du fait que le fil bobiné est plus épais que le conducteur imprimé et qu'on peut donc limiter l'usinage lorsque le fil est mis à nu. Une goutte de colle conductrice peut alors être déposée sur les extrémités de fil mis à nu avant de mettre en place le module électronique. Finally, in some cases it may be preferable to use a wound wire antenna rather than an antenna printed on an insulating sheet. In this case, the coiled antenna is pressed against a sheet of plastic material similar to the sheet 20 and is thus locked in the smart card during hot or cold lamination. Perforations such as 34 and 36 can be provided in the sheet 30, but they are not compulsory because it can be provided that the ends of the coiled antenna are exposed during the machining operation of the cavity. This solution is indeed possible due to the fact that the wound wire is thicker than the printed conductor and that machining can therefore be limited when the wire is exposed. A drop of conductive glue can then be deposited on the ends of bare wire before installing the electronic module.

Claims

REVENDICATIONS
1. Procédé de fabrication de carte à puce comportant les étapes suivantes : - assemblage de feuilles de matière plastique (10, 20, 30, 40) superposées en enfermant dans la superposition une antenne (22) comportant deux zones d'accès conductrices (60, 24; 62, 26) ;1. A method of manufacturing a smart card comprising the following steps: - assembly of plastic sheets (10, 20, 30, 40) superimposed by enclosing in the superposition an antenna (22) comprising two conductive access zones (60 , 24; 62, 26);
- ouverture d'une cavité (52) dans une face supérieure de l'assemblage, et mise à jour des zones d'accès conductrices lors de cette ouverture;- opening a cavity (52) in an upper face of the assembly, and updating the conductive access zones during this opening;
- collage d'un module électronique (M) dans la cavité, le module ayant sur sa face inférieure, tournée vers l'intérieur de la cavité, des plages conductrices (72) venant en contact électrique avec les zones d'accès conductrices de l'antenne.bonding of an electronic module (M) in the cavity, the module having on its underside, turned towards the interior of the cavity, conductive pads (72) coming into electrical contact with the conductive access zones of the 'antenna.
2. Procédé de fabrication selon la revendication 1, caractérisé en ce que les zones d'accès conductrices de l'antenne sont constituées par deux extrémités conductrices (24, 26) de l'antenne recouvertes de colle conductrice (60, 62) .2. The manufacturing method according to claim 1, characterized in that the conductive access zones of the antenna consist of two conductive ends (24, 26) of the antenna covered with conductive adhesive (60, 62).
3. Procédé de fabrication selon la revendication 2, caractérisé en ce que la colle conductrice est déposée sur les extrémités de l'antenne après ouverture de la cavité.3. Manufacturing method according to claim 2, characterized in that the conductive adhesive is deposited on the ends of the antenna after opening of the cavity.
4. Procédé de fabrication selon l'une des revendications 2 et 3 , caractérisé en ce que l'assemblage de feuilles comporte une feuille (30) pourvue de perforations (34, 36) venant au dessus des extrémités de l'antenne, les perforations étant mises à jour lors de l'ouverture de la cavité et de la colle conductrice (60, 62) étant déposée dans ces perforations. 4. Manufacturing method according to one of claims 2 and 3, characterized in that the sheet assembly comprises a sheet (30) provided with perforations (34, 36) coming above the ends of the antenna, the perforations being updated during the opening of the cavity and the conductive adhesive (60, 62) being deposited in these perforations.
5. Procédé de fabrication selon la revendication 2, caractérisé en ce que l'assemblage comporte au moins une feuille (20) portant l'antenne conductrice (22) , une feuille (30) pourvue de perforations (34, 36) au dessus des extrémités (24, 26) de l'antenne, et une feuille supérieure de fermeture (40), en ce qu'on assemble d'abord les deux premières feuilles (20, 30), on dépose de la colle conductrice dans les perforations, et on assemble la troisième feuille (40), puis, lors de l'ouverture de la cavité, on fait apparaître la colle conductrice, et on met en place le module électronique.5. Manufacturing method according to claim 2, characterized in that the assembly comprises at least one sheet (20) carrying the conductive antenna (22), a sheet (30) provided with perforations (34, 36) above the ends (24, 26) of the antenna, and an upper closure sheet (40), in that the first two sheets are assembled first (20, 30), conductive adhesive is deposited in the perforations, and the third sheet (40) is assembled, then, when the cavity is opened, the conductive adhesive appears, and the electronic module is put in place.
6. Procédé de fabrication selon l'une des revendications 1 à 5, caractérisé en ce que le module électronique (M) comporte une puce de circuit-intégré (82) et un circuit imprimé double face sans via conducteurs entre les deux faces, le circuit double face comportant une feuille isolante (80) portant sur une face des premiers conducteurs (70) destinés à servir de contacts d'accès de la carte à puce et sur l'autre face des seconds conducteurs6. Manufacturing method according to one of claims 1 to 5, characterized in that the electronic module (M) comprises an integrated circuit chip (82) and a double-sided printed circuit without via conductors between the two faces, the double-sided circuit comprising an insulating sheet (80) on one side of the first conductors (70) intended to serve as access contacts for the smart card and on the other side of the second conductors
(72) destinés à être reliés à l'antenne, des fils de liaison (86) étant soudés entre la puce et les premiers conducteurs (70) à travers des zones ajourées de la feuille isolante et d'autres fils de liaison (84) étant soudés entre la puce et les seconds conducteurs (72) sans passer à travers la feuille isolante.(72) intended to be connected to the antenna, connection wires (86) being welded between the chip and the first conductors (70) through openwork areas of the insulating sheet and other connection wires (84) being soldered between the chip and the second conductors (72) without passing through the insulating sheet.
7. Procédé de fabrication selon l'une des revendications 1 à 6, caractérisé en ce que l'antenne est réalisée sous forme de conducteur imprimé sur l'une des feuilles de matière plastique (20) de l'assemblage.7. The manufacturing method according to one of claims 1 to 6, characterized in that the antenna is produced in the form of a conductor printed on one of the plastic sheets (20) of the assembly.
8. Procédé de fabrication selon l'une des revendications 1 à 6, caractérisé en ce que l'antenne est réalisée sous forme d'un fil bobiné. 8. Manufacturing method according to one of claims 1 to 6, characterized in that the antenna is produced in the form of a wound wire.
9. Procédé de fabrication selon la revendication 1, caractérisé en ce qu'une substance anti-adhérente (90) est placée entre deux feuilles de l'assemblage dans la région prévue pour la cavité de manière à empêcher le collage des deux feuilles dans cette région et à faciliter l'enlèvement de matière dans cette région lors de l'ouverture de la cavité, l'une des feuilles portant l'antenne de sorte que l'ouverture de la cavité met à nu les extrémités d'antenne. 9. The manufacturing method according to claim 1, characterized in that a non-stick substance (90) is placed between two sheets of the assembly in the region provided for the cavity so as to prevent the sticking of the two sheets in this region and to facilitate the removal of material in this region when opening the cavity, one of the sheets carrying the antenna so that the opening of the cavity exposes the antenna ends.
PCT/FR1998/001192 1997-06-10 1998-06-10 Method for making a contactless smart card WO1998057298A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP98929541A EP0988619A1 (en) 1997-06-10 1998-06-10 Method for making a contactless smart card
KR19997011585A KR20010013578A (en) 1997-06-10 1998-06-10 Method for making a contactless smart card
JP50177999A JP2002505022A (en) 1997-06-10 1998-06-10 Manufacturing method of contactless chip card
AU79257/98A AU7925798A (en) 1997-06-10 1998-06-10 Method for making a contactless smart card
CA002293460A CA2293460A1 (en) 1997-06-10 1998-06-10 Method for making a contactless smart card

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR97/07191 1997-06-10
FR9707191A FR2764414B1 (en) 1997-06-10 1997-06-10 NON-CONTACT CHIP CARD MANUFACTURING PROCESS

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WO1998057298A1 true WO1998057298A1 (en) 1998-12-17

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JP (1) JP2002505022A (en)
KR (1) KR20010013578A (en)
CN (1) CN1264480A (en)
AU (1) AU7925798A (en)
CA (1) CA2293460A1 (en)
FR (1) FR2764414B1 (en)
WO (1) WO1998057298A1 (en)

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AU7925798A (en) 1998-12-30
CA2293460A1 (en) 1998-12-17
JP2002505022A (en) 2002-02-12
FR2764414B1 (en) 1999-08-06
KR20010013578A (en) 2001-02-26
CN1264480A (en) 2000-08-23
FR2764414A1 (en) 1998-12-11

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