WO1998050218A1 - Extruded core laminates for circuit boards - Google Patents
Extruded core laminates for circuit boards Download PDFInfo
- Publication number
- WO1998050218A1 WO1998050218A1 PCT/US1998/008872 US9808872W WO9850218A1 WO 1998050218 A1 WO1998050218 A1 WO 1998050218A1 US 9808872 W US9808872 W US 9808872W WO 9850218 A1 WO9850218 A1 WO 9850218A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laminate
- core
- extruded
- catalyst
- microspheres
- Prior art date
Links
- 239000003054 catalyst Substances 0.000 claims abstract description 27
- 239000004005 microsphere Substances 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000005350 fused silica glass Substances 0.000 claims abstract description 9
- 239000002657 fibrous material Substances 0.000 claims abstract description 8
- 239000011162 core material Substances 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 15
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000011889 copper foil Substances 0.000 claims description 7
- 239000002648 laminated material Substances 0.000 claims description 6
- 239000011152 fibreglass Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000003989 dielectric material Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 238000010924 continuous production Methods 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- -1 2 -ethyl Chemical group 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
- B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/74—Partially cured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0254—Microballoons or hollow filler particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Definitions
- Circuit boards used in electronic circuitry typically comprise a multi-layer composite made of laminations comprising a thermosetting polymer and a suitable reinforcing material.
- the reinforcing material is a woven glass material, such as fiberglass
- the thermosetting polymer is an epoxy resin.
- One limitation that must be considered in the manufacture of multi-layer composites is reduced dimensional stability of the laminates, particularly in response to temperature. Thermocycling during circuit board processing can cause the laminates to expand and contract, which can result in a loss of the intended adhesion or interconnections between the inner layers. Because effective functioning of electronic equipment depends on proper registration of these interconnections, a failure in interconnect layers is cause for rejection of a multilayer circuit board.
- U.S. Patent No. 5,273,816 discloses a laminate with improved dimensional stability, in which the laminate is prepared by impregnating reinforcing fibers, such as a glass cloth, with an epoxy resin of a relatively high molecular weight, i.e., in excess of 850, and pressing the material.
- This invention relates to a novel continuous process for fabrication of an extruded core laminate.
- the extruded core laminate may be laminated in a continuous process with copper on one or both sides, with epoxy prepregs on one or both sides, or with prepreg on one side and copper on the other side .
- the extruded core laminate of this invention comprises chopped glass, fused silica or hollow microspheres as the substrate.
- the inclusion of this material has the advantage of allowing selection of a desired dielectric constant and dissipation factor of the laminate by varying the relative concentrations of the materials in the laminate.
- the use of inexpensive chopped glass, fused silica and microspheres as raw materials in the manufacture of laminates reduces the cost of manufacture.
- the laminate extruder is a co-rotating twin screw extruder that features self-cleaning screw elements, an optimized feed arrangement, and a die design that allows uniform flow and orients the glass fibers in a manner that contributes to the dimensional stability and flex strength of the laminate.
- extruded core laminate can be fed directly from the extruder to the b- staging oven by means of calendar rolls placed between the extruder and the b- staging oven.
- the core can be co-fed into the b-staging oven with prepreg and/or copper and laminated in the oven.
- Figure 1 is a cross-sectional illustration of a laminate constructed in accordance with the present invention.
- Figure 2 is a schematic flow illustration of the overall process design for the construction of the extruded core laminate of the present invention.
- Figure 3 is a side plan elevation of the twin screw extruder used in the process of Figure 1.
- Figure 4A is a top plan view of the extruder die used in the process of Figure 1.
- Figure 4B is a side view of the extruder die used in the process of Figure 1.
- Figure 5 is a graphical representation of the viscosity of the extruded laminate as a function of time.
- Figure 6 illustrates certain details of the b-stage oven constructed in accordance with the present invention.
- Figure 7 is a cross-sectional view of the belt used in the oven of Figure 5.
- the present invention relates to an extruded core laminate board for use in electronic packaging connection materials such as circuit boards or chip carriers.
- the extruded core laminate board is formed of an extruded core onto which are laminated on either side either with the circuit board laminate material, known as prepreg, or with copper layers, or both, or a combination of the two.
- Shown in Figure 1 is a circuit board laminate 10 made in accordance with the present invention.
- the laminate 10 is made up of a laminate core 12 to which are adhered one to four additional laminate layers.
- the maximum number of four layers are shown, the inner two layers 14 and 16 being thin laminations of partial cured woven fiber and epoxy based circuit board laminates known in the trade as prepregs.
- the outer layers 18 and 19 are layers of copper foil.
- the circuit board laminate 10 differs from prior art circuit board laminates principally because of the make up of the laminate core 12.
- the laminate core 12 is a non-woven, extruded sheet of material rather than the usual woven core.
- the core is formed from four principal ingredients, a fibrous material component, a thermosetting resin and a catalyst, and may include other materials to improved dielectric performance such as microspheres or fused silica.
- the fibers can be any fibrous material that is durable and that adds strength and stability, such as cellulose fibers from shredded paper, but is preferably a shredded fiberglass.
- the optional microspheres are hollow air-filled spheres which reduce the weight and increase the dielectric properties of the core.
- the preferred microspheres are in the range of 1 micron to 100 microns in size and are also formed of hollow glass.
- the fused silica is also in the size range of about 1 micron to 100 microns.
- the thermosetting resin can be any of the thermosetting resins used in circuit board products and is typically an epoxy resin.
- the catalyst is a catalyst selected for use with the selected thermosetting resin to catalyze its curing, although it is envisioned also that resins may be used which are auto catalytic and then do not require a catalyst.
- Other materials with good dielectric properties may be substituted or added, such as, for example, quartz crystals.
- FIG 2 Shown in Figure 2 is a schematic illustration of the overall process which is used to produce the extruded core laminate board described herein. It is envisioned that other variations may be used for the outer layers 18 and 19 other than conventional copper foils. Any other metal conductive layers may also be used. Conductive layers can be applied to the extruded core after fabrication by sputtering or vacuum deposition.
- an extruder 22 Feeding into the extruder 22 are suitable supply reservoirs for the four basic ingredients of the extruded core of the board. Shown at 24 is the reservoir for the fibrous material such as glass fiber. Shown at 26 is the reservoir for microspheres. Shown at 28 is the feed reservoir for catalyst. Shown at 30 is the feed reservoir for the thermosetting resin.
- the outputs from each of the feed reservoirs 24, 26, 28, and 30 are each fed into the extruder 22.
- the extruder die 32 from which the output of the extruder issues.
- the output of the extruder is an extruded web of laminate core material, indicated at 34. That web is then passed into a staging zone 36.
- the staging zone 36 are up to two feed rolls 38 of prepreg sheet material and up to two feed rolls 40 of copper foil sheet material.
- the appropriate sheet materials to be laminated to the core, either or both of prepreg or copper foil is rolled off the appropriate feed rolls and pressed adjacent to one or both surfaces of the extruded laminate core by a pair of rollers 42. It is to be understood that on any given application of the use of the laminate core, there may be from zero to two layers of prepreg and zero to two layers of copper foil, with the selection of the laminates being as needed for a particular application.
- the laminate now consisting of the extruded laminate core, plus whichever layers of prepreg and copper have been applied, to it then passes through a b-stage curing oven 44.
- a b-stage curing oven 44 When the laminate material exits from the oven it is cut by shears at 46 and then placed in a press 48 for final pressing and curing.
- the extruder 12 consists of twin screws 52 and 54 each of which is made up of a series of matching segments labeled 56, 58, 60, 62, 64, 66, 68, 70, and 72. In each of the segments of the screws the pitch and spacing of the two screws are matching. The screw threads are interleaved so that the screws are self-cleaning of each other. It is specifically envisioned that the first two component feed items to the extruded laminate material of the present invention be added at the end of the extruder screw farthest from the extrusion end, that would be in the left of Figure 3. The first material added is the fiber.
- the fiber is preferably a chopped fiberglass .
- microspheres from the microsphere feed reservoir 26 are also added at the upstream end of the extruder screw.
- the microspheres lightened the overall weight of the extruded laminate and increase its dielectric constant.
- Further down the extruder screws 52 is the site of entry of the catalyst from the catalyst feed reservoir 28.
- the catalyst enters the extruder screw at one of the extruder screw elements 60, 62, 64, or 66.
- the catalyst is injected first from the catalyst feed reservoir 28 followed closely thereafter by the epoxy from the epoxy feed reservoir 30.
- the epoxy resin is injected about one inch downstream from the catalyst. By doing it in this manner, it is ensured that the fiber and the microspheres are well mixed before the epoxy and catalyst are added. This mixing is achieved in spite of the fact that the feed materials have different weights and solubilities. These differences are handled by relative placement of the input streams. In this way, a laminate material of homogenous character can be created.
- the extruder screws 52 and 54 feed the combined material for the laminate to the extruder die 32, shown in greater detail in Figures 4A and 4B.
- the extruder die greater expands the material laterally and also thins it down to a thin sheet material.
- the input to the extruder die 74 which receives the material from the extruder screw.
- the massive material passes through the extruder die to the narrowed end 76 from which a sheet of raw uncured extruded laminate core issues.
- the extrusion temperature will vary with the epoxy resin.
- the most desirable range is defined by dependence of the melt viscosity of the resin on temperature. Any resin which solidifies above room temperature can be utilized within the practice of the present invention. Similarly, the type and amount of catalyst as well as the extrusion temperature will define the processing window. For a preferred embodiment using XUR brominated epoxy (Dow) a plot of the processing window is shown in Figure 4, which indicates that the proper extrusion temperature is about ten minutes at 80°. The extrusion is therefore run at 60 to 90°C in the extruder and the die. The most desirable temperature range is 65 to 73° with the most desirable range being 68 to 70°C. The contact time in the extruder is four minutes and in the die two minutes.
- biased rollers are placed at the entrance to the oven and by adjusting the bias of the bias rollers, the thickness of the entire b-stage laminate can be controlled.
- the oven is shown in Figure 6 which simply illustrates that rollers pass the laminate passed the heating section after which it passes a cooling section.
- the hot temperature section is controlled to approximately 175°C.
- the oven has a cooling or cold section as well.
- the cold stage is used for cooling the b-stage cores.
- the cooling section may or may not be needed for a particular application, but would be useful if the extruded core is to be maintained as an a-stage material.
- Copper foil, prepreg layers, or both can be co-fed with the extruded core into the b-stage oven. In the hot section of the oven all the layers are pre-laminated together.
- a system found to be effective for the continuous production of a b-staged extruded core laminate comprises a Leistritz 34 mm co-rotating twin screw extruder with a screw elements configuration as shown in Figure 2, take-up rolls, and a b-staging oven.
- the twin screw extruder is equipped with the following components: 1) a loss weight feeder (Ktron, K 2LDS- T20) for metering the chopped glass; 2) a calibrated screw feeder (Ktron, T20-87-035-F1, with a separately designed feeder screw for delivering the microspheres; 3) an injection port connected to a pump and container for the catalyst, both housed within a temperature-controlled oven; 4) an injection port connected to a pump and container for the epoxy resin, both housed within a temperature-controlled oven, and a die for sheet casting.
- Ktron, K 2LDS- T20 a loss weight feeder
- Ktron, T20-87-035-F1 calibrated screw feeder
- the raw materials used in the production of the extruded core laminate included chopped E-glass (3/16 inch long, Certainteed) , glass hollow microspheres (B38/4000, 3M) , epoxy resin (XUR 1544-53744-6, Dow), and a catalyst (2E4MI, Aldrich) .
- the catalyst and epoxy resins were placed in their respective containers and the ovens in which the containers were housed were heated to and maintained at 100°C.
- the catalyst reservoir was pressurized by nitrogen to 10 psig, and the epoxy reservoir was pressurized by nitrogen to 60 psig.
- the tubings from the pumps to the corresponding injection ports were heated to and maintained at 80°C.
- the temperature of the extruder and die were set to 70°C. Both feeders were set for 12 g/min.
- the extruder speed was set at 50 rpms .
- Production runs were performed as follows. First, the epoxy pump was started at 5 rpm and slowly increased to 28 rpm. Next, the chopped glass and microsphere feeders were started. After the material flow from the extruder die stabilized, the extruded sheet was placed between the take-up rolls and the rolls closed. After stabilization of sheet thickness and speed, the catalyst pump was started. The amount of catalyst delivered was 1.2% (w/w) , based on the epoxy resin content. The output from the take-up rolls was then fed into the fa- staging oven. The contact time in the b-staging oven was five minutes. Curing of the b-staged cores was done in a press at 175°C and at either 500 or 1000 psig.
- the fully cured cores made using the Dow resin had a Tg in the range of approximately 145 to 180°C, depending upon the amount of catalyst used, and a Dk in the range of about 2.5 to 3.5, depending on the ratio of microspheres to chopped glass.
- the extruded core laminates made in this fashion can be used alone or as a laminate core circuit board, if copper clad, or can be supplied as a laminate component to be incorporated in multiple laminate boards.
- the extruded core board is dimensionally stable and has a lower dielectric constant and lower cost than comparable thickness laminates made by layering conventional prepregs. It is to be understood that the present invention is not limited to the particular embodiments described here, but embraces all such modified forms thereof as come within the scope of the following claims .
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU72764/98A AU7276498A (en) | 1997-05-02 | 1998-05-01 | Extruded core laminates for circuit boards |
JP10548259A JP2000512232A (en) | 1997-05-02 | 1998-05-01 | Extruded core material laminate for circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4538797P | 1997-05-02 | 1997-05-02 | |
US60/045,387 | 1997-05-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998050218A1 true WO1998050218A1 (en) | 1998-11-12 |
Family
ID=21937589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/008872 WO1998050218A1 (en) | 1997-05-02 | 1998-05-01 | Extruded core laminates for circuit boards |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2000512232A (en) |
KR (1) | KR20010012177A (en) |
CN (1) | CN1261844A (en) |
AU (1) | AU7276498A (en) |
WO (1) | WO1998050218A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018167441A1 (en) * | 2017-03-17 | 2018-09-20 | Linxens Holding | Method for manufacturing complexes for electric circuits, electric circuit and electronic component |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2932408B1 (en) * | 2008-06-11 | 2010-05-28 | Aircelle Sa | PREFORM FOR FORMING A HOLLOW STRUCTURING MECHANICAL PIECE |
CN110734626B (en) * | 2019-11-13 | 2022-05-06 | 上海彤程电子材料有限公司 | Epoxy resin material for circuit board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4550128A (en) * | 1984-04-16 | 1985-10-29 | International Business Machines Corporation | Epoxy composition |
US4798762A (en) * | 1985-08-14 | 1989-01-17 | Toray Industries, Inc. | Laminate board containing uniformly distributed filler particles and method for producing the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3351852B2 (en) * | 1992-04-20 | 2002-12-03 | 電気化学工業株式会社 | Insulating material and circuit board using the same |
-
1998
- 1998-05-01 CN CN98806693A patent/CN1261844A/en active Pending
- 1998-05-01 KR KR19997010126A patent/KR20010012177A/en not_active Application Discontinuation
- 1998-05-01 AU AU72764/98A patent/AU7276498A/en not_active Abandoned
- 1998-05-01 JP JP10548259A patent/JP2000512232A/en active Pending
- 1998-05-01 WO PCT/US1998/008872 patent/WO1998050218A1/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4550128A (en) * | 1984-04-16 | 1985-10-29 | International Business Machines Corporation | Epoxy composition |
US4798762A (en) * | 1985-08-14 | 1989-01-17 | Toray Industries, Inc. | Laminate board containing uniformly distributed filler particles and method for producing the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018167441A1 (en) * | 2017-03-17 | 2018-09-20 | Linxens Holding | Method for manufacturing complexes for electric circuits, electric circuit and electronic component |
FR3064151A1 (en) * | 2017-03-17 | 2018-09-21 | Linxens Holding | METHOD OF MANUFACTURING ELECTRIC CIRCUITS, ELECTRIC CIRCUIT AND ELECTRONIC COMPONENT |
Also Published As
Publication number | Publication date |
---|---|
JP2000512232A (en) | 2000-09-19 |
KR20010012177A (en) | 2001-02-15 |
AU7276498A (en) | 1998-11-27 |
CN1261844A (en) | 2000-08-02 |
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