WO1997026620A1 - Corps de carte a puce pour la production d'une carte a puce contenant une bobine - Google Patents

Corps de carte a puce pour la production d'une carte a puce contenant une bobine Download PDF

Info

Publication number
WO1997026620A1
WO1997026620A1 PCT/DE1997/000046 DE9700046W WO9726620A1 WO 1997026620 A1 WO1997026620 A1 WO 1997026620A1 DE 9700046 W DE9700046 W DE 9700046W WO 9726620 A1 WO9726620 A1 WO 9726620A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip card
card body
coil
chip
recess
Prior art date
Application number
PCT/DE1997/000046
Other languages
German (de)
English (en)
Inventor
Martin Gruber
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to JP9525588A priority Critical patent/JP2000503429A/ja
Priority to EP97906996A priority patent/EP0875040A1/fr
Publication of WO1997026620A1 publication Critical patent/WO1997026620A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Definitions

  • the size available for the chip module is determined by the size of the recess in the chip card body receiving the chip module.
  • the maximum size of the recess of the chip card body is in turn dependent on the desired mechanical properties of the chip card, in particular its stability and durability.
  • the present invention is therefore based on the object of developing a chip card body in accordance with the preamble of patent claim 1 in such a way that the production of a chip card containing a coil can be simplified.
  • the coil can be formed essentially outside of the recess, as a result of which the number of elements to be accommodated in the recess of the chip card can be reduced. This in turn enables (under otherwise constant conditions) a reduction in the packing density of the discrete components to be implanted in the recess, so that the high requirements for mechanical and / or electrical assembly can be reduced.
  • FIG. 2 shows a sectional view along the line A-A shown in FIG. 1, and
  • Figure 3 is a sectional view taken along line B-B shown in Figure 1.
  • the chip card body 1 of the chip card shown in the figures essentially has the shape of the finished chip card. To complete the chip card, all that is required is that shown in plan view in FIG. 1
  • the chip card body 1 has a recess 10 shown in FIG. 1 in plan view and in section in FIGS. 2 and 3, but is otherwise equipped with an essentially flat surface.
  • a first coil connection 21 and a second coil connection 22 are provided in the recess 10.
  • the first coil connection 21 is provided on the bottom section 13 near the left side wall 11 of the recess 10 as shown in FIG. 1, and the second coil connection 22 is on the bottom section as shown in FIG.
  • the coil is therefore no longer a discrete coil to be inserted into a recess, but rather a coil integrated in the chip card body or a coil which forms an inseparable unit with the chip card body and which can be provided entirely or at least essentially outside a recess.
  • the coil pattern represents an essentially surface-like (two-dimensional) structure (surface or surface coil).
  • a chip 30 is provided between the coil connections provided in the recess 10, preferably between the first coil connection 21 and the coil pattern section running through the recess, which chip 30 there, for example Gluing is fixed to the bottom portion 13 of the recess 10.
  • Connections of the chip 30 assigned to the coil connections 21, 22 are electrically connected to the coil connections 21, 22 by wire bonding.
  • wire bonding any other connection technology can also be used - for example, direct contacting using the so-called bump technique is also possible.
  • the chip card body shown in this state in FIGS. 1 to 3 is to be provided with foils or the like on its top and bottom (the same is preferably applied by lamination). If required, the recess 10 can additionally be completely filled with the said covering compound 31 or covered by a separate cover.
  • the coil pattern is formed on a surface of the chip card body. If the chip card body is made up of several layers, it is of course also possible instead to provide the coil pattern on a surface of any chip card body layer that does not coincide with the surface of the chip card body. In this way it can be achieved, for example, that the coil pattern runs along a non-curved surface, the height of which is the height of the S pulenan say 21, 22 supporting the bottom portion 13, he d recess 10 corresponds; the conductor guide on the o b ere side wall 14 of the recess 10 and the lower very ⁇ wall 15 of the recess 10 and possibly also among other things, provided for this purpose inclined courses of these by ⁇ walls could then be omitted.
  • the coil pattern also does not necessarily have to run on the surface of the chip card body or a chip card body layer or in depressions provided on these surfaces. Instead, it can also be provided that the coil raster inside the chip card body or a chip card body layer, i.e. to be provided in an (embedded) state (with the exception of the coil connections) surrounded on all sides by chip card body or chip card body layer or other material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Corps de carte à puce pour la production d'une carte à puce contenant une bobine, caractérisé en ce que la bobine est formée par une piste conductrice (20) formant une unité avec le corps (1) de la carte à puce.
PCT/DE1997/000046 1996-01-16 1997-01-13 Corps de carte a puce pour la production d'une carte a puce contenant une bobine WO1997026620A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9525588A JP2000503429A (ja) 1996-01-16 1997-01-13 チップカード体
EP97906996A EP0875040A1 (fr) 1996-01-16 1997-01-13 Corps de carte a puce pour la production d'une carte a puce contenant une bobine

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19601391.7 1996-01-16
DE19601391A DE19601391A1 (de) 1996-01-16 1996-01-16 Chipkartenkörper zur Herstellung einer eine Spule enthaltenden Chipkarte

Publications (1)

Publication Number Publication Date
WO1997026620A1 true WO1997026620A1 (fr) 1997-07-24

Family

ID=7782898

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/000046 WO1997026620A1 (fr) 1996-01-16 1997-01-13 Corps de carte a puce pour la production d'une carte a puce contenant une bobine

Country Status (6)

Country Link
EP (1) EP0875040A1 (fr)
JP (1) JP2000503429A (fr)
KR (1) KR19990077139A (fr)
CN (1) CN1208487A (fr)
DE (1) DE19601391A1 (fr)
WO (1) WO1997026620A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19639902C2 (de) * 1996-06-17 2001-03-01 Elke Zakel Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
US6651891B1 (en) 1997-11-04 2003-11-25 Elke Zakel Method for producing contactless chip cards and corresponding contactless chip card

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103761563A (zh) * 2014-01-22 2014-04-30 深圳西龙同辉技术股份有限公司 一种卡片及其植线方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0640940A2 (fr) * 1993-08-23 1995-03-01 N.V. Nederlandsche Apparatenfabriek NEDAP Carte à puce sans contacts
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce
DE4441122C1 (de) * 1994-11-19 1995-12-21 Karl Heinz Wendisch Kontaktlose Ausweis-Chipkarte

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE182225T1 (de) * 1991-05-14 1999-07-15 Skidata Ag Kartenförmiger datenträger
NL9200835A (nl) * 1992-05-11 1993-12-01 Nedap Nv Flexibele spoelconstructie in identificatiekaart.
DE4311493C2 (de) * 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
DE4337921C2 (de) * 1993-11-06 1998-09-03 Ods Gmbh & Co Kg Kontaktlose Chipkarte mit Antennenspule
EP0676716A1 (fr) * 1994-03-07 1995-10-11 Eric Bauer Support portable d'informations numériques
DE4410732C2 (de) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0640940A2 (fr) * 1993-08-23 1995-03-01 N.V. Nederlandsche Apparatenfabriek NEDAP Carte à puce sans contacts
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce
DE4441122C1 (de) * 1994-11-19 1995-12-21 Karl Heinz Wendisch Kontaktlose Ausweis-Chipkarte

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19639902C2 (de) * 1996-06-17 2001-03-01 Elke Zakel Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
US6651891B1 (en) 1997-11-04 2003-11-25 Elke Zakel Method for producing contactless chip cards and corresponding contactless chip card

Also Published As

Publication number Publication date
JP2000503429A (ja) 2000-03-21
CN1208487A (zh) 1999-02-17
DE19601391A1 (de) 1997-07-24
KR19990077139A (ko) 1999-10-25
EP0875040A1 (fr) 1998-11-04

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