WO1997026616A3 - Chip-card blank - Google Patents

Chip-card blank Download PDF

Info

Publication number
WO1997026616A3
WO1997026616A3 PCT/DE1997/000047 DE9700047W WO9726616A3 WO 1997026616 A3 WO1997026616 A3 WO 1997026616A3 DE 9700047 W DE9700047 W DE 9700047W WO 9726616 A3 WO9726616 A3 WO 9726616A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip
card blank
recess
central zone
card
Prior art date
Application number
PCT/DE1997/000047
Other languages
German (de)
French (fr)
Other versions
WO1997026616A2 (en
Inventor
Erich Hopf
Detlef Houdeau
Peter Stampka
Original Assignee
Siemens Ag
Erich Hopf
Detlef Houdeau
Peter Stampka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Erich Hopf, Detlef Houdeau, Peter Stampka filed Critical Siemens Ag
Priority to RU98115309A priority Critical patent/RU2143741C1/en
Priority to EP97914052A priority patent/EP0875041A2/en
Priority to JP9525589A priority patent/JPH11502967A/en
Publication of WO1997026616A2 publication Critical patent/WO1997026616A2/en
Publication of WO1997026616A3 publication Critical patent/WO1997026616A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Described is a chip-card blank (1) with a recess (10) designed to hold a chip module (30). The card blank described is characterized in that it has, inside the recess, a restraining device which entirely or partly surrounds the central zone of the recess and prevents adhesive from spreading into the central zone.
PCT/DE1997/000047 1996-01-16 1997-01-13 Chip-card blank WO1997026616A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
RU98115309A RU2143741C1 (en) 1996-01-16 1997-01-13 Housing for card with embedded microprocessor
EP97914052A EP0875041A2 (en) 1996-01-16 1997-01-13 Chip-card blank
JP9525589A JPH11502967A (en) 1996-01-16 1997-01-13 Chip card

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19601389.5 1996-01-16
DE19601389A DE19601389A1 (en) 1996-01-16 1996-01-16 Chip card body

Publications (2)

Publication Number Publication Date
WO1997026616A2 WO1997026616A2 (en) 1997-07-24
WO1997026616A3 true WO1997026616A3 (en) 1997-09-04

Family

ID=7782896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/000047 WO1997026616A2 (en) 1996-01-16 1997-01-13 Chip-card blank

Country Status (7)

Country Link
EP (1) EP0875041A2 (en)
JP (1) JPH11502967A (en)
KR (1) KR19990077292A (en)
CN (1) CN1213448A (en)
DE (1) DE19601389A1 (en)
RU (1) RU2143741C1 (en)
WO (1) WO1997026616A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10006514C5 (en) * 2000-02-15 2004-08-12 Datacard Corp., Minnetonka Method for installing chips in card bodies
DE10006515C5 (en) * 2000-02-15 2004-09-16 Datacard Corp., Minnetonka Method for installing chips in card bodies
DE10139395A1 (en) 2001-08-10 2003-03-06 Infineon Technologies Ag Contacting of semiconductor chips in chip cards
DE102008053368A1 (en) * 2008-10-27 2010-04-29 Giesecke & Devrient Gmbh Method of making a portable data carrier and portable data carrier
EP2341471B1 (en) * 2009-12-28 2013-02-20 NagraID S.A. Method for manufacturing electronic cards
TW201128756A (en) * 2010-02-02 2011-08-16 Forward Electronics Co Ltd Semiconductor package structure
CN102467677B (en) * 2010-11-09 2015-09-30 珠海市金邦达保密卡有限公司 The production equipment of anti-counterfeiting IC-card and production method
JP6923293B2 (en) * 2015-09-24 2021-08-18 三菱ケミカル株式会社 Fine concavo-convex structure and joint

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197847A1 (en) * 1985-03-28 1986-10-15 Schlumberger Industries Method of manufacturing electronic-memory boards, and boards obtained by this method
EP0334733A1 (en) * 1988-03-22 1989-09-27 Schlumberger Industries Manufacturing process of an electronic memory card and card obtained by such process

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9110057U1 (en) * 1991-08-14 1992-02-20 Orga Kartensysteme GmbH, 6072 Dreieich Data carrier card with glued-in circuit carrier
JPH0885285A (en) * 1994-07-21 1996-04-02 Hitachi Maxell Ltd Manufacture of board for security card and the same board for the card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197847A1 (en) * 1985-03-28 1986-10-15 Schlumberger Industries Method of manufacturing electronic-memory boards, and boards obtained by this method
EP0334733A1 (en) * 1988-03-22 1989-09-27 Schlumberger Industries Manufacturing process of an electronic memory card and card obtained by such process

Also Published As

Publication number Publication date
RU2143741C1 (en) 1999-12-27
WO1997026616A2 (en) 1997-07-24
CN1213448A (en) 1999-04-07
DE19601389A1 (en) 1997-07-24
EP0875041A2 (en) 1998-11-04
KR19990077292A (en) 1999-10-25
JPH11502967A (en) 1999-03-09

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