WO1996036995A1 - A heatsink and a method and an assembly for forming the same - Google Patents
A heatsink and a method and an assembly for forming the same Download PDFInfo
- Publication number
- WO1996036995A1 WO1996036995A1 PCT/GB1996/001160 GB9601160W WO9636995A1 WO 1996036995 A1 WO1996036995 A1 WO 1996036995A1 GB 9601160 W GB9601160 W GB 9601160W WO 9636995 A1 WO9636995 A1 WO 9636995A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fin
- heatsink
- portions
- members
- base member
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- an assembly for forming a heatsink comprising a block-like base member and at least one generally planar fin member, said fin member comprising a plurality of fin portions, wherein said base member and said fin member are made of thermally conductive material.
- Figure 1 is a plan view of a first embodiment of a heatsink in accordance with the invention.
- the method of fixing the fin members 12 to the block-like base member 10 is by press- fitting without the use of soldering, brasing, etc. to ensure good thermal contact between the base member 10 and the fin members 12.
- the fin members 12 can be fixed to the base member 10 by any suitable retaining method or means.
- the base member 10 and the fin members 12 are made of the same thermally conductive material in order to avoid bi-metallic bending which can occur when the fin members and the base member are made of different metals.
- the heatsink 1 formed with fin members 12 and a base member 10 of the same thermally conductive metallic material will have greater corrosion resistance over a heatsink 1 utilising different metals.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8534631A JPH11505373A (en) | 1995-05-16 | 1996-05-15 | Heat sink, method of forming the same, and assembly |
EP96915108A EP0826240A1 (en) | 1995-05-16 | 1996-05-15 | A heatsink and a method and an assembly for forming the same |
AU56994/96A AU5699496A (en) | 1995-05-16 | 1996-05-15 | A heatsink and a method and an assembly for forming the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9509866.1A GB9509866D0 (en) | 1995-05-16 | 1995-05-16 | A heatsink and a method and an assembly for forming the same |
GB9509866.1 | 1995-05-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996036995A1 true WO1996036995A1 (en) | 1996-11-21 |
Family
ID=10774528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1996/001160 WO1996036995A1 (en) | 1995-05-16 | 1996-05-15 | A heatsink and a method and an assembly for forming the same |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0826240A1 (en) |
JP (1) | JPH11505373A (en) |
KR (1) | KR19990014819A (en) |
AU (1) | AU5699496A (en) |
GB (2) | GB9509866D0 (en) |
WO (1) | WO1996036995A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19700432A1 (en) * | 1997-01-10 | 1998-07-16 | Swg Metallverarbeitung Und Mon | Heat sink for electric and-or electronic component |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2347206A (en) * | 1998-12-18 | 2000-08-30 | Alstom Uk Ltd | Heatsink assembly |
EP1328019A1 (en) * | 2002-01-10 | 2003-07-16 | Wen-Chen Wei | Leaf piece structure for heat dissipater |
DE102005007041A1 (en) * | 2005-02-15 | 2006-08-17 | Alcan Technology & Management Ag | Heat sink for semiconductor devices or the like. Facilities and method for its preparation |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2502472A1 (en) * | 1975-01-22 | 1976-07-29 | Siemens Ag | Thyristor heat sink with lateral ribs - has each rib pressed in base-plate groove and with deformations in press region |
US4009752A (en) * | 1975-02-24 | 1977-03-01 | Honeywell Information Systems Inc. | Warp-resistant heat sink |
EP0278240A2 (en) * | 1987-02-07 | 1988-08-17 | Behr GmbH & Co. | Heat sink, particularly for cooling electronic components |
US5311928A (en) * | 1993-06-28 | 1994-05-17 | Marton Louis L | Heat dissipator |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8700842D0 (en) * | 1987-01-15 | 1987-02-18 | Marston Palmer Ltd | Heat sink |
JP3122173B2 (en) * | 1990-11-09 | 2001-01-09 | 株式会社東芝 | Heatsink, heatsink, and method of manufacturing heatsink |
-
1995
- 1995-05-16 GB GBGB9509866.1A patent/GB9509866D0/en active Pending
-
1996
- 1996-05-15 AU AU56994/96A patent/AU5699496A/en not_active Abandoned
- 1996-05-15 EP EP96915108A patent/EP0826240A1/en not_active Withdrawn
- 1996-05-15 KR KR1019970708163A patent/KR19990014819A/en not_active Application Discontinuation
- 1996-05-15 WO PCT/GB1996/001160 patent/WO1996036995A1/en not_active Application Discontinuation
- 1996-05-15 GB GB9610170A patent/GB2300975A/en not_active Withdrawn
- 1996-05-15 JP JP8534631A patent/JPH11505373A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2502472A1 (en) * | 1975-01-22 | 1976-07-29 | Siemens Ag | Thyristor heat sink with lateral ribs - has each rib pressed in base-plate groove and with deformations in press region |
US4009752A (en) * | 1975-02-24 | 1977-03-01 | Honeywell Information Systems Inc. | Warp-resistant heat sink |
EP0278240A2 (en) * | 1987-02-07 | 1988-08-17 | Behr GmbH & Co. | Heat sink, particularly for cooling electronic components |
US5311928A (en) * | 1993-06-28 | 1994-05-17 | Marton Louis L | Heat dissipator |
Non-Patent Citations (1)
Title |
---|
"furnace brazed forged heatsink of stacked fins", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 32, no. 2, July 1989 (1989-07-01), NEW YORK, pages 180 - 181, XP000033391 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19700432A1 (en) * | 1997-01-10 | 1998-07-16 | Swg Metallverarbeitung Und Mon | Heat sink for electric and-or electronic component |
Also Published As
Publication number | Publication date |
---|---|
GB9509866D0 (en) | 1995-07-12 |
AU5699496A (en) | 1996-11-29 |
GB2300975A (en) | 1996-11-20 |
JPH11505373A (en) | 1999-05-18 |
GB9610170D0 (en) | 1996-07-24 |
KR19990014819A (en) | 1999-02-25 |
EP0826240A1 (en) | 1998-03-04 |
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