WO1995005901A1 - Device for coating substrates in semiconductor manufacture - Google Patents

Device for coating substrates in semiconductor manufacture Download PDF

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Publication number
WO1995005901A1
WO1995005901A1 PCT/DE1993/000778 DE9300778W WO9505901A1 WO 1995005901 A1 WO1995005901 A1 WO 1995005901A1 DE 9300778 W DE9300778 W DE 9300778W WO 9505901 A1 WO9505901 A1 WO 9505901A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
coating
spinning process
protective ring
coated
Prior art date
Application number
PCT/DE1993/000778
Other languages
German (de)
French (fr)
Inventor
Eberhard MÜHLFRIEDEL
Martin Kallis
Karl Appich
Original Assignee
Steag Micro-Tech Gmbh Sternenfels
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE59308233T priority Critical patent/DE59308233D1/en
Priority claimed from SG1995001632A external-priority patent/SG41944A1/en
Priority to CA002165069A priority patent/CA2165069C/en
Priority to PCT/DE1993/000778 priority patent/WO1995005901A1/en
Priority to SG1995001632A priority patent/SG41944A1/en
Priority to KR1019960700938A priority patent/KR0159247B1/en
Priority to DE4397539T priority patent/DE4397539D2/en
Priority to EP93918919A priority patent/EP0711108B1/en
Application filed by Steag Micro-Tech Gmbh Sternenfels filed Critical Steag Micro-Tech Gmbh Sternenfels
Priority to TW082107765A priority patent/TW335507B/en
Priority to MYPI93001932A priority patent/MY110030A/en
Priority to US08/268,845 priority patent/US5650196A/en
Priority to CN94115782A priority patent/CN1042861C/en
Priority to JP6202338A priority patent/JP2657044B2/en
Publication of WO1995005901A1 publication Critical patent/WO1995005901A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/105—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material by capillary action, e.g. using wicks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

Definitions

  • the invention relates to an apparatus for coating semiconductor substrates in two steps.
  • the lacquer is applied through an open capillary gap which is filled with the lacquer and through which the substrates with the surface to be lacquered are guided downwards.
  • the second step the thickness of the lacquer layer is also reduced and made even with the coated surface downwards in a spinning process.
  • the task often arises of providing rectangular or round substrates with a uniform layer of lacquer or other initially liquid media such as color filters or special protective layers.
  • the substrates are fastened horizontally with the surface to be coated on a turntable. A certain amount of the lacquer or liquid is dripped onto the center of the plate from above via a nozzle. Then the turntable is set in motion. The centrifugal force distributes the liquid on the substrate during the rotation. A large part of the liquid is thrown away over the edge of the plate.
  • the uniformity of the layer thickness that can be achieved depends on the magnitude of the rotational acceleration and rotational speed. 5
  • a disadvantage of this known method is that up to 95% of the amount of paint used is spun off over the edge of the substrate. This spun off paint can no longer be used and is therefore lost. 0
  • this holder is attached to a horizontally arranged linear transport unit, which not only transports the substrates from the loading station to the unloading station and between the treatment stations, but also the uniform movement of the substrates over the capillary channel required for pre-coating accomplished.
  • a further advantageous embodiment of the invention is characterized in that the protective ring is lowered into a lower waiting position outside of the spinning process.
  • the substrate can be transported unhindered in the horizontal direction from the pre-coating station to the spin position. If the substrate has reached this position, the protective ring is moved from below to the substrate level in order to take over its function during the spinning process.
  • the coating device according to the invention is also very advantageously provided with an automatic loading and unloading device, so that the entire coating process can be automated. This is necessary to adapt to the production conditions in semiconductor production and enables uniform and reproducible coating results over large quantities.
  • Fig. 1 a view of the overall structure of an inventive
  • Fig. 2 a view of the device for pre-coating as part of
  • FIG. 1 shows a first exemplary embodiment of a coating device 10 according to the invention.
  • Both the channel for the preliminary coating 12 and the protective ring of the centrifugal station 13 and the stands 14 and 15 for the linear transport unit 16 are fastened to the frame 11.
  • the rotary motor 17 is fastened to the movable part of the linear transport unit 16 and the rotary plate 19 is fastened to the shaft 18 thereof.
  • the holding device 19 has corresponding vacuum bores, not shown.
  • other holding devices as are known to the person skilled in the art can also be used within the scope of the invention.
  • the open channel 12 with the capillary gap 21 for pre-coating is in
  • FIG. 1 in section and in Fig. 2 in perspective view also shown in section.
  • the protective ring 22 is arranged for the spinning process. It is on one or more stands
  • the protective ring 22 is moved vertically upwards over the stand or stands 23 and 24 until it does
  • FIG. 1 Encloses substrate in a suitable manner. 2 that is to be lacquered Substrate on the turntable 19 and the motor shaft 18 shown above the protective ring 22.
  • the same representation is indicated in FIG. 1 with dashed lines. This corresponds to the situation before or after the spinning process, in which the substrate is in the position on the linear transport unit 16 intended for the spinning process, but the protective ring has not yet been moved upwards or has already been moved downwards. This up and down movement of the protective ring 22 is necessary so that it is not in the way of the substrate during its horizontal transport on the linear unit 16.
  • the protective ring 22 is shown cut open. Its cross section consists of a bevelled U-profile. This ensures that the paint thrown off over the edge of the substrate is safely caught in the ring profile and directed to the lower inner edge of the protective ring, from where it can be completely disposed of via a paint drain (25).
  • an automatic loading device is installed in the area labeled 26 in FIG. 1 and an automatic loading device is mounted in the area labeled 27.
  • the loading device takes the substrate 20 to be coated from a magazine placed at a certain point and feeds it to the plate holding device 19.
  • the unloading device takes over the substrate 20 from the holding device 19 and in turn loads it into a magazine placed at a certain point.
  • a substrate 20 is attached to the turntable 19 either automatically or manually.
  • the turntable is to this
  • the linear transport unit 16 then starts to move in the direction of the arrow marked 28, that is to say in the direction of the channel 12.
  • the pre-coating begins.
  • the substrate 20 is moved over the capillary gap 21 in the channel 12 during this pre-coating.
  • the substrate 20 with the turntable 19 and motor 17 together with the shaft 18 is transported further in the direction of the arrow 28 until it is located exactly centrally above the protective ring 22 which is in the waiting position. If this position is reached, the protective ring 22 is raised until it surrounds the substrate 20 in a suitable manner. The spin process then begins, by means of which the lacquer layer thickness on the substrate is evened out and reduced. The excess paint is thrown into the protective ring 22 and from there discharged through the paint drain 25.
  • the protective ring 22 moves down again. Thereafter, the substrate 20 is transported further via the transport unit 16 to the area designated 27 in FIG. 1, where it is automatically or manually released from the turntable 19.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention concerns a device for coating substrates (20). The coating material is first applied to the substrate (20) by means of a capillary slit (21), and in a subsequent centrifuging operation the film is made uniform and reduced in thickness.

Description

Vorrichtung zur Belackung von Substraten in der Halbleiterfertigung Device for coating substrates in semiconductor production
Die Erfindung betrifft eine Vorrichtung zur Belackung von Halbleiter- 5 Substraten in zwei Schritten. Im ersten Schritt wird der Lack über einen offenen Kapillarspalt, der mit dem Lack gefüllt ist und über welchen die Substrate mit der zu belackenden Fläche nach unten geführt werden, auf¬ gebracht. Im zweiten Schritt wird die Lackschichtdicke in einem Schleudervorgang ebenfalls mit der belackten Fläche nach unten ver- o ringert und vergleichmäßigt.The invention relates to an apparatus for coating semiconductor substrates in two steps. In the first step, the lacquer is applied through an open capillary gap which is filled with the lacquer and through which the substrates with the surface to be lacquered are guided downwards. In the second step, the thickness of the lacquer layer is also reduced and made even with the coated surface downwards in a spinning process.
Im Bereich der Halbleiterfertigimg ergibt sich häufig die Aufgabe, recht¬ eckige oder runde Substrate mit einer gleichmäßigen Schicht aus Lack oder anderen zunächst flüssigen Medien wie Farbfiltern oder speziellen 5 Schutzschichten zu versehen. Nach herkömmlichen Vorrichtungen werden dabei die Substrate horizontal mit der zu belackenden Fläche nach oben auf einem Drehteller befestigt. Auf den Mittelpunkt der Platte wird von oben über eine Düse eine bestimmte Menge des Lackes oder der Flüssigkeit auf getropft. Danach wird der Drehteller in Bewegung gesetzt. o Durch die Zentrifugalkraft wird die Flüssigkeit während der Drehbe¬ wegung auf dem Substrat verteilt. Ein großer Teil der Flüssigkeit wird dabei über den Rand der Platte weggeschleudert. Die erreichbare Gleich¬ förmigkeit der Schichtdicke hängt von der Größe der Drehbeschleunigung und Drehgeschwindigkeit ab. 5In the field of semiconductor production, the task often arises of providing rectangular or round substrates with a uniform layer of lacquer or other initially liquid media such as color filters or special protective layers. According to conventional devices, the substrates are fastened horizontally with the surface to be coated on a turntable. A certain amount of the lacquer or liquid is dripped onto the center of the plate from above via a nozzle. Then the turntable is set in motion. The centrifugal force distributes the liquid on the substrate during the rotation. A large part of the liquid is thrown away over the edge of the plate. The uniformity of the layer thickness that can be achieved depends on the magnitude of the rotational acceleration and rotational speed. 5
Ein Nachteil dieses bekannten Verfahrens ist, daß dabei bis zu 95 % der eingesetzten Lackmenge über den Rand des Substrates abgeschleudert werden. Dieser abgeschleuderte Lack kann nicht mehr verwendet werden und ist damit verloren. 0A disadvantage of this known method is that up to 95% of the amount of paint used is spun off over the edge of the substrate. This spun off paint can no longer be used and is therefore lost. 0
Eine Verbesserung dieser Belackungs- und Beschichtungsvorgänge wurde bereits dadurch erreicht, daß die Flüssigkeit über eine sehr schmale offene Rinne durch Kapillar- und Adhäsionseffekte auf die nach unten weisende Plattenoberfläche aufgebracht wird. 5 Diese Vorrichtung ist beispielsweise für die Belackung oder Beschichtung von verhältnismäßig großen Platten in der Dünnschichttechnologie wie LCD-Bildschirme etc. besonders gut geeignet. Die damit erreichbare 5 Gleichmäßigkeit der Lackdicke ist jedoch für die Belackung von Sub¬ straten in der Fertigung hochintegrierter Schaltkreise nicht in allen Fällen hinreichend.An improvement of these coating and coating processes has already been achieved in that the liquid is applied to the downward-facing plate surface through a very narrow open channel by capillary and adhesive effects. 5 This device is particularly well suited, for example, for the coating or coating of relatively large plates in thin-film technology such as LCD screens etc. The uniformity of lacquer thickness that can be achieved in this way is, however, not sufficient in all cases for the coating of substrates in the production of highly integrated circuits.
Eine Aufgabe der Erfindung wird deshalb darin gesehen, die bekannten o Belackungs- und Beschichtungsvorrichtungen im Hinblick auf die vorge¬ nannten Kriterien zu verbessern und die für die Belackung von Halb¬ leitersubstraten erforderliche hohe Gleichmäßigkeit der Lackschichtdicke zu erreichen.It is therefore an object of the invention to improve the known coating and coating devices with regard to the aforementioned criteria and to achieve the high uniformity of the coating layer thickness required for the coating of semiconductor substrates.
5 Nach der Erfindung besteht die Lösung dieser Aufgabe bei einer eingangs genannten Vorrichtung in den kennzeichnenden Merkmalen des Patent¬ anspruchs 1. Der Lack wird zunächst über einen Kapillarspalt auf das Substrat aufgebracht wird. Anschließend wird das Substrat ebenfalls mit der belackten Oberfläche nach unten mit einer geeigneten Drehge- o seh windigkeit geschleudert. Dabei wirkt auf die Lackschicht die Zentri¬ fugalkraft, also eine nach außen gerichtete Verdrängungskraft. Naturge¬ mäß muß sich in der Lackschicht ein Gleichgewicht aus Verdrängungs¬ und Adhäsionskraft einstellen. Die Bereiche des Lackes, deren Adhäsion an die Substratoberfläche bzw. an die darunterliegenden Lackschichten 5 zu klein ist, werden zum Substratrand hin verdrängt und ein Teil davon über den Rand hinausgeschleudert. Dadurch wird die Lackschichtdicke über die Substratoberfläche vereinheitlicht und insgesamt verringert.5 According to the invention, this object is achieved in a device mentioned at the outset in the characterizing features of patent claim 1. The lacquer is first applied to the substrate via a capillary gap. The substrate is then also hurled with the coated surface downwards with a suitable rotational speed. The centrifugal force acts on the lacquer layer, that is to say an outward displacement force. Naturally, a balance of displacement and adhesive force must be established in the lacquer layer. The areas of the lacquer whose adhesion to the substrate surface or to the underlying lacquer layers 5 is too small are displaced toward the edge of the substrate and some of them are flung over the edge. This standardizes the thickness of the lacquer layer over the substrate surface and reduces it overall.
Besonders vorteilhaft hat sich erwiesen, den Lack auf die Substratober- 0 fläche aufzubringen (Vorbelackung). Damit werden optimale Voraus¬ setzungen für die Wirksamkeit des anschließenden Schleudervorganges geschaffen.It has proven to be particularly advantageous to apply the lacquer to the substrate surface (pre-coating). This creates optimal conditions for the effectiveness of the subsequent spinning process.
5 Ferner ist es von besonderem Vorteil, die Substrate für die Vorbelackung und den anschließenden Schleudervorgang mit der zu belackenden Oberfläche nach unten an derselben Halterung, bestehend aus einem Drehteller mit Antriebswelle und zugehörigem Drehmotor, zu befestigen.5 Furthermore, it is particularly advantageous to fasten the substrates for the pre-coating and the subsequent spinning process with the surface to be coated down on the same holder, consisting of a turntable with a drive shaft and associated rotary motor.
Auch geht man bevorzugt so vor, daß diese Halterung an einer waage¬ recht angeordneten Lineartransporteinheit befestigt wird, die sowohl den Transport der Substrate von der Beladestation bis zur Entladestation und zwischen den Behandlungsstationen als auch die bei der Vorbelackung notwendige gleichförmige Bewegung der Substrate über die Kapillarrinne hinweg bewerkstelligt.It is also preferred that this holder is attached to a horizontally arranged linear transport unit, which not only transports the substrates from the loading station to the unloading station and between the treatment stations, but also the uniform movement of the substrates over the capillary channel required for pre-coating accomplished.
Vorteilhaft ist es, bei dem Schleudervorgang einen Schutzring geeigneter Form um das rotierende Substrat anzuordnen. Darin wird der Lack, der wie oben beschrieben über den Substratrand hinausgeschleudert wird, aufgefangen und gezielt abgeleitet.It is advantageous to arrange a protective ring of suitable shape around the rotating substrate during the spinning process. The paint, which is flung over the edge of the substrate as described above, is collected and specifically discharged.
Eine weitere vorteilhafte Ausbildung der Erfindung ist dadurch gekenn- zeichnet, daß der Schutzring außerhalb des Schleudervorganges in eine tiefergelegene Warteposition abgesenkt wird. Dadurch kann das Substrat ungehindert in horizontaler Richtung von der Vorbelackungsstation zur Schleuderposition transportiert werden. Hat das Substrat diese Position erreicht, wird der Schutzring von unten auf Substrathöhe gefahren, um seine Funktion während des Schleudervorganges zu übernehmen.A further advantageous embodiment of the invention is characterized in that the protective ring is lowered into a lower waiting position outside of the spinning process. As a result, the substrate can be transported unhindered in the horizontal direction from the pre-coating station to the spin position. If the substrate has reached this position, the protective ring is moved from below to the substrate level in order to take over its function during the spinning process.
Auch wird die erfindungsgemäße Beschichtungsvorrichtung sehr vorteil¬ haft mit einer automatischen Be- und Entladevorrichtung versehen, so daß der gesamte Belackungsprozeß automatisiert werden kann. Dies ist zur Anpassung an die Fertigungsbedingungen in der Halbleiterpro¬ duktion notwendig und ermöglicht gleichmäßige und reproduzierbare Belackungsergebnisse über große Stückzahlen.The coating device according to the invention is also very advantageously provided with an automatic loading and unloading device, so that the entire coating process can be automated. This is necessary to adapt to the production conditions in semiconductor production and enables uniform and reproducible coating results over large quantities.
Weitere Einzelheiten und vorteilhafte Weiterbildungen der Erfindung er- geben sich aus den im folgenden beschriebenen und in der Zeichnung dargestellten, in keiner Weise als Einschränkung der Erfindung zu ver- stehenden Ausführungsbeispielen, sowie aus den übrigen Unteran¬ sprüchen. Es zeigt:Further details and advantageous developments of the invention result from the description of the invention described below and shown in the drawing, which is in no way intended to limit the invention. standing embodiments, as well as from the other subclaims. It shows:
Fig. 1: eine Ansicht des Gesamtaufbaus einer erfindungsgemäßenFig. 1: a view of the overall structure of an inventive
Belackungs- und BeschichtungsvorrichtungCoating and coating device
Fig. 2: eine Ansicht der Vorrichtung zur Vorbelackung als Teil derFig. 2: a view of the device for pre-coating as part of
Vorrichtung nach Fig. 11
Fig. 3: eine Ansicht der Schleuderstation als Teil der Vorrichtung nach Fig. 23: a view of the centrifugal station as part of the device according to FIG. 2
Fig. 1 zeigt ein erstes Ausführungsbeispiel einer erfindungsgemäßen Be- schichtungsvorrichtung 10. Auf dem Gestell 11 sind sowohl die Rinne für die Vorbelackung 12 und der Schutzring der Schleuderstation 13 als auch die Ständer 14 und 15 für die Lineartransporteinheit 16 befestigt. An dem beweglichen Teil der Lineartransporteinheit 16 ist der Drehmotor 17 be¬ festigt und an dessen Welle 18 der Drehtelller 19. Das Substrat 20 wird z. B. durch Vakuum an der Plattenhaltevorrichtung 19 festgesaugt. Dazu hat die Haltevorrichtung 19 entsprechende nicht dargestellte Vakuum¬ bohrungen. Im Rahmen der Erfindung können aber auch andere Halte¬ vorrichtungen verwendet werden, wie sie dem Fachmann bekannt sind.1 shows a first exemplary embodiment of a coating device 10 according to the invention. Both the channel for the preliminary coating 12 and the protective ring of the centrifugal station 13 and the stands 14 and 15 for the linear transport unit 16 are fastened to the frame 11. The rotary motor 17 is fastened to the movable part of the linear transport unit 16 and the rotary plate 19 is fastened to the shaft 18 thereof. B. sucked by vacuum on the plate holder 19. For this purpose, the holding device 19 has corresponding vacuum bores, not shown. However, other holding devices as are known to the person skilled in the art can also be used within the scope of the invention.
Die offene Rinne 12 mit dem Kapillarspalt 21 für die Vorbelackung ist inThe open channel 12 with the capillary gap 21 for pre-coating is in
Fig. 1 im Schnitt und in Fig. 2 in perspektivischer Darstellung ebenfalls im Schnitt dargestellt.Fig. 1 in section and in Fig. 2 in perspective view also shown in section.
Neben der Vorbelacki gsvorrichtung ist der Schutzring 22 für den Schleudervorgang angeordnet. Er ist auf einem oder mehreren StändernIn addition to the Vorbelacki gsvorrichtung the protective ring 22 is arranged for the spinning process. It is on one or more stands
23 und 24 befestigt, die selbsttätig die Höhenposition des Schutzringes einstellen können. Dies können beispielsweise pneumatisch verstellbare Einheiten sein, aber auch andere Vorrichtungen, wie sie dem Fachmann bekannt sind. Für den Schleudervorgang wird der Schutzring 22 über den bzw. die Ständer 23 und 24 senkrecht nach oben gefahren bis er das23 and 24 attached, which can automatically adjust the height position of the guard ring. These can be, for example, pneumatically adjustable units, but also other devices as are known to the person skilled in the art. For the spinning process, the protective ring 22 is moved vertically upwards over the stand or stands 23 and 24 until it does
Substrat in geeigneter Weise umschließt. In Fig. 2 ist das zu belackende Substrat an dem Drehteller 19 und der Motorwelle 18 oberhalb des Schutzringes 22 dargestellt. Dieselbe Darstellung ist in Fig. 1 mit Strich¬ linien angedeutet. Dies entspricht der Situation vor oder nach dem Schleudervorgang, in der sich das Substrat in der für den Schleudervor¬ gang vorgesehenen Position an der Lineartransporteinheit 16 befindet, der Schutzring jedoch noch nicht nach oben gefahren oder bereits wieder nach unten gefahren wurde. Diese Auf- und Abbewegung des Schutringes 22 ist notwendig, damit er dem Substrat während dessen horizontalen Transportes an der Lineareinheit 16 nicht im Weg ist.Encloses substrate in a suitable manner. 2 that is to be lacquered Substrate on the turntable 19 and the motor shaft 18 shown above the protective ring 22. The same representation is indicated in FIG. 1 with dashed lines. This corresponds to the situation before or after the spinning process, in which the substrate is in the position on the linear transport unit 16 intended for the spinning process, but the protective ring has not yet been moved upwards or has already been moved downwards. This up and down movement of the protective ring 22 is necessary so that it is not in the way of the substrate during its horizontal transport on the linear unit 16.
In Fig. 1 ist der Schutzring 22 aufgeschnitten dargestellt. Sein Querschnitt besteht aus einem angeschrägten U-Profil. Dies stellt sicher, daß der über den Rand des Substrates abgeschleuderte Lack sicher in dem Ringprofil aufgefangen und zum unteren inneren Rand des Schutzringes geleitet wird, von wo er über einen Lackablauf (25) vollständig entsorgt werden kann.In Fig. 1, the protective ring 22 is shown cut open. Its cross section consists of a bevelled U-profile. This ensures that the paint thrown off over the edge of the substrate is safely caught in the ring profile and directed to the lower inner edge of the protective ring, from where it can be completely disposed of via a paint drain (25).
Für eine vollautomatisierte Version der Belackungsvorrichtung wird in dem in Fig. 1 mit 26 gekennzeichneten Bereich eine automatische Belade- vorrichtung und in dem mit 27 gekennzeichneten Bereich eine auto¬ matische Enüadevorrichtung montiert. Die Beladevorrichtung entnimmt das zu belackende Substrat 20 einem an einer bestimmten Stelle aufge¬ setzten Magazin und führt es der Plattenhaltevorrichtung 19 zu. Die Ent- lade Vorrichtung übernimmt das Substrat 20 von der Haltevoπichtung 19 und lädt es wiederum in ein an einer bestimmten Stelle aufgesetztes Magazin. For a fully automated version of the coating device, an automatic loading device is installed in the area labeled 26 in FIG. 1 and an automatic loading device is mounted in the area labeled 27. The loading device takes the substrate 20 to be coated from a magazine placed at a certain point and feeds it to the plate holding device 19. The unloading device takes over the substrate 20 from the holding device 19 and in turn loads it into a magazine placed at a certain point.
Arbeitsweise der Belackungsvorrichtung:Operation of the coating device:
Zunächst wird ein Substrat 20 entweder automatisch oder manuell an dem Drehteller 19 befestigt. Der Drehteller befindet sich zu diesemFirst, a substrate 20 is attached to the turntable 19 either automatically or manually. The turntable is to this
Zeitpunkt in dem Bereich, der in Fig. 1 mit 26 gekennzeichnet ist. Da¬ nach setzt sich die Lineartransporteinheit 16 in Richtung des mit 28 ge¬ kennzeichneten Pfeiles, also in Richtung auf die Rinne 12, in Bewegung.Time in the area which is identified by 26 in FIG. 1. The linear transport unit 16 then starts to move in the direction of the arrow marked 28, that is to say in the direction of the channel 12.
Sobald der vorderste Punkt des Substrates die Oberkante des Kapillar¬ spaltes 21 erreicht hat, beginnt die Vorbelackung. Naturgemäß wird das Substrat 20 während dieser Vorbelackung über den Kapillarspalt 21 in der Rinne 12 hinwegbewegt.As soon as the foremost point of the substrate has reached the upper edge of the capillary gap 21, the pre-coating begins. Naturally, the substrate 20 is moved over the capillary gap 21 in the channel 12 during this pre-coating.
Nach Abschluß der Vorbelackung wird das Substrat 20 mit Drehteller 19 und Motor 17 samt Welle 18 weiter in Richtung des Pfeiles 28 trans¬ portiert bis es sich genau zentrisch oberhalb des in Wartestellung stehenden Schutzringes 22 befindet. Ist diese Position erreicht, wird der Schutzring 22 hochgefahren, bis er das Substrat 20 in geeigneter Weise umschließt. Danach beginnt der Schleudervorgang, durch den die Lack¬ schichtdicke auf dem Substrat vergleichmäßigt und verringert wird. Der überschüssige Lack wird in den Schutzring 22 geschleudert und von dort über den Lackablauf 25 abgeleitet.After the pre-coating has been completed, the substrate 20 with the turntable 19 and motor 17 together with the shaft 18 is transported further in the direction of the arrow 28 until it is located exactly centrally above the protective ring 22 which is in the waiting position. If this position is reached, the protective ring 22 is raised until it surrounds the substrate 20 in a suitable manner. The spin process then begins, by means of which the lacquer layer thickness on the substrate is evened out and reduced. The excess paint is thrown into the protective ring 22 and from there discharged through the paint drain 25.
Nach Abschluß des Schleudervorganges fährt der Schutzring 22 wieder nach unten. Danach wird das Substrat 20 über die Transporteinheit 16 weiter bis zu dem in Fig. 1 mit 27 bezeichneten Bereich transportiert, wo es automatisch oder manuell von dem Drehteller 19 gelöst wird. After completion of the spinning process, the protective ring 22 moves down again. Thereafter, the substrate 20 is transported further via the transport unit 16 to the area designated 27 in FIG. 1, where it is automatically or manually released from the turntable 19.

Claims

Patentansprüche claims
1. Vorrichtung zur Belackung (10) von Substraten (20) in zwei Schritten, dadurch gekennzeichnet, daß im ersten Schritt das Substrat (20) über einen Kapillarspalt (21) vorbelackt und im zweiten Schritt die so auf¬ gebrachte Lackschichtdicke in einem Schleudervorgang vergleich¬ mäßigt und verringert wird.1. A device for coating (10) substrates (20) in two steps, characterized in that in the first step the substrate (20) is pre-coated via a capillary gap (21) and in the second step the coating layer thickness applied in this way is compared in a spinning process ¬ is moderated and reduced.
2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß sowohl bei Vorbelackung als auch bei dem Schleudervorgang die zu be¬ lackende Oberfläche des Substrates (20) nach unten gerichtet ist.2. Apparatus according to claim 1, characterized in that the surface to be coated of the substrate (20) is directed downwards both during pre-coating and during the spinning process.
3. Vorrichtung nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß das Substrat (20) für den gesamten Be- lackungsvorgang mit der zu belackenden Oberfläche nach unten an einem Drehteller (19) mit Motor und Motorwelle (18) befestigt wird.3. Device according to at least one of the preceding claims, characterized in that the substrate (20) for the entire painting process with the surface to be coated down is attached to a turntable (19) with motor and motor shaft (18).
4. Vorrichtung nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Bearbeitungsstationen für die Vor¬ belackung und den Schleudervorgang nebeneinander angeordnet sind und das Substrat (20) über eine Lineartransporteinheit (16) zwischen diesen Stationen transportiert wird.4. The device according to at least one of the preceding claims, characterized in that the processing stations for the Vor¬ lacquering and the spinning process are arranged side by side and the substrate (20) is transported via a linear transport unit (16) between these stations.
5. Vorrichtung nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß für den Schleudervorgang ein Schutz¬ ring (22) mit einem angeschrägten U-Profilquerschnitt um das rotierende Substrat (20) angeordnet wird, um den abgeschleuderten Lack aufzufangen.5. The device according to at least one of the preceding claims, characterized in that a protective ring (22) with a bevelled U-profile cross-section is arranged around the rotating substrate (20) for the spinning process in order to collect the spun off paint.
6. Vorrichtung nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß der Schutzring (22) außerhalb des Schleudervorganges in eine Warteposition unterhalb des Substrates (20) abgesenkt wird. Vorrichtung nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Belackungsvorrichtung (10) mit je einer automatischen Belade (26) - und Entladestation (27) versehen und damit vollautomatisch betreibbar ist. 6. The device according to at least one of the preceding claims, characterized in that the protective ring (22) is lowered outside the spinning process into a waiting position below the substrate (20). Device according to at least one of the preceding claims, characterized in that the coating device (10) is each provided with an automatic loading (26) and unloading station (27) and can thus be operated fully automatically.
PCT/DE1993/000778 1993-05-05 1993-08-26 Device for coating substrates in semiconductor manufacture WO1995005901A1 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
DE4397539T DE4397539D2 (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor production
CA002165069A CA2165069C (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor manufacture
PCT/DE1993/000778 WO1995005901A1 (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor manufacture
SG1995001632A SG41944A1 (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor production
KR1019960700938A KR0159247B1 (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor manufacture
DE59308233T DE59308233D1 (en) 1993-08-26 1993-08-26 DEVICE FOR LACQUERING SUBSTRATES IN SEMICONDUCTOR PRODUCTION
EP93918919A EP0711108B1 (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor manufacture
TW082107765A TW335507B (en) 1993-08-26 1993-09-21 A substrate coating device for manufacturing of semiconductor
MYPI93001932A MY110030A (en) 1993-08-26 1993-09-23 Device for coating substrates in semiconductor production
US08/268,845 US5650196A (en) 1993-05-05 1994-06-30 Device for coating substrates in semiconductor production
CN94115782A CN1042861C (en) 1993-08-26 1994-08-23 Apparatus for coating base sheet of semiconductor products with film
JP6202338A JP2657044B2 (en) 1993-08-26 1994-08-26 Substrate coating equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/DE1993/000778 WO1995005901A1 (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor manufacture
SG1995001632A SG41944A1 (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor production

Publications (1)

Publication Number Publication Date
WO1995005901A1 true WO1995005901A1 (en) 1995-03-02

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JP (1) JP2657044B2 (en)
CN (1) CN1042861C (en)
WO (1) WO1995005901A1 (en)

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CN102641823B (en) * 2012-05-14 2015-10-28 中国科学院微电子研究所 A kind of even adhesive dispenser of microwave and even gluing method
CN102744538B (en) * 2012-06-11 2015-01-21 台州欧信环保净化器有限公司 Device for removing paste from wave crest for metal honeycomb carrier
JP6272138B2 (en) * 2014-05-22 2018-01-31 東京エレクトロン株式会社 Application processing equipment
CN104289386B (en) * 2014-09-16 2016-09-21 宁波大学 A kind of high-temperature spin-on device and method preparing thin film
CN109789440A (en) * 2016-09-27 2019-05-21 富士胶片株式会社 The manufacturing method of film
CN107731661A (en) * 2017-11-14 2018-02-23 山东芯诺电子科技股份有限公司 A kind of glassivation chip glass cement painting method and device

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GB2098510A (en) * 1981-05-20 1982-11-24 Integrated Technologies Inc Meniscus coating
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CN1042861C (en) 1999-04-07
JPH07232126A (en) 1995-09-05
CN1104372A (en) 1995-06-28
JP2657044B2 (en) 1997-09-24

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