WO1990008844A1 - Forming a metal coating - Google Patents
Forming a metal coating Download PDFInfo
- Publication number
- WO1990008844A1 WO1990008844A1 PCT/GB1990/000160 GB9000160W WO9008844A1 WO 1990008844 A1 WO1990008844 A1 WO 1990008844A1 GB 9000160 W GB9000160 W GB 9000160W WO 9008844 A1 WO9008844 A1 WO 9008844A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- compound
- reagent
- metals
- paint
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
Definitions
- This invention relates to a method of forming a single-metal or mixed-metals coating on a surface, to a metallic paint, to a method of painting and to a method of spray-forming powders using the paint.
- Metallic paints which comprise metal (e.g. zinc or aluminium) particles suspended in binder, pigment and volatile solvent. Such paints are easy to apply but cannot give a seamless coherent metal coating, which can be required in demanding and advanced technical applications.
- metal e.g. zinc or aluminium
- a metallic paint comprises a compound between the metal or each of the metals of the paint and a polydentate reagent, said compound(s) being dissolved in a paintable solvent.
- An object is painted, according to the invention, by applying thereto a paint as set forth above, allowing the solvent to evaporate, and applying a gaseous or volatile substance which can decompose said compound(s) to release said metal(s).
- Metal powder may be made by atomising the paint and applying a said gaseous compound.
- the method of forming mixed-metal coatings on a surface comprises decomposing at the surface a fluid e.g. vapour comprising:
- a first preferably volatile compound between a first metal and a polydentate reagent and a second preferably volatile compound between a second metal and the same or another polydentate reagent, wherein the reagent(s) is/are volatile, whereby the metals are co-deposited on the surface.
- the reagent(s) and the compounds are preferably stable in air.
- the decomposition preferably yields the reagent(s) directly, which accordingly may be recovered for re-use.
- the said second metal is the surface and the said second volatile compound is formed from reagent liberated upon decomposition of the first volatile compound.
- the decomposition of the polydentate reagent(s) to metal is by reduction.
- the reduction is performed by a gas or gases.
- the donor atoms of the said reagent(s) are any selection from N, O and S.
- the said reagent (or one of said reagents) is a Schiff base or a ⁇ -diketone. Both theseare air-stable and non-toxic, unlike for example metal alkyls and metal carbonyls.
- At least one may comprise ballasting substituents.
- their relative vapour pressures can be varied so as to adjust the composition of the resulting metal mixture if other ways of altering the vapour composition are not available.
- the substrate may be a metal or glass or ceramic (e.g. alumina) or a membrane requiring to be metallised.
- UK Patent GB 2135984B the disclosure of which is imported by reference, claims a method of winning metal from ore, and discloses for that purpose compounds which may find use in this invention, such as, in the case of Cu(II), tetradentate Schiff base reagents.
- ⁇ -diketones which may be used include for example 2,2,6,6 tetramethyl 3,5 heptadione (trivially called tert-butyl acetyl acetone), two molecules of which complex each copper atom:
- surface oxide can be removed at low temperature (e.g. 300oC), below the onset of rapid diffusion. This feature improves the adhesion of deposited metal.
- deposition temperatures of between 350 - 450 ⁇ 10°C and total gas flow (carrier and reductant) of 75 ⁇ 5 cm 3 /min were used.
- EXAMPLE 1 NiCu alloy is deposited on mild steel.
- Porosity of the resulting NiCu alloy deposit on the mild steel substrate was determined using a chemical staining technique, incorporating a sensitivity test for the substrate metal.
- a piece of filter paper was dipped into a solution of hexacyanoferrate (III), then pressed lightly on to the thin deposit. Although a quantitive result was not obtained from the test, it gave an indication as to the porosity of the deposit, in that any holes in the deposit resulted in a blue stain on the filter paper.
- NiFe alloy is deposited on mild steel by depositing Ni and relying on the freshly liberated ligand to react with the substrate iron, the iron complex then being decomposed alongside the nickel complex.
- the nickel complex used was nickel bis 1,1,1-tr-fluoro-2,4-pentanedioate, Ni(tfa) 2 for short.
- Ni(tfa) 2 was nickel bis 1,1,1-tr-fluoro-2,4-pentanedioate
- NiCu alloy is deposited on silica glass/on alumina/on aluminium.
- Example 5 aluminium substrate
- the operating conditions were identical to Example 1.
- Coating powder particles can radically alter their properties.
- the coatings may only be a few atoms thick - less than 1% of the weight of the powder, yet be effective.
- metallic copper is deposited on supermagnetic flakes, 1 ⁇ 2mm ⁇ 1 ⁇ 2mm ⁇ 1 /10mm for example, of iron neodymium boride Fe 14 NdB, known as Magnequench, or equally successfully on 5-micron Fe 14 NdB powder known as B14.
- This copper provides a non-magnetic 'insulation'; on compressing the flakes (or powder particles), a small-domain highly magnetic material is obtained.
- This task would be difficult to achieve using conventional metal paint, and is conventionally performed by tumbling the flakes with copper powder in a process known as 'tumble-co-milling', which cannot yield the same uniformity of magnetic insulation without greater volumetric dilution of the supermagnetic material.
- a copper complex consisting of the compound 2,2,6,6-tetramethyl-3,5-heptadione described above, two molecules of which complex each copper atom, was used.
- B14 is very pyrophoric and is therefore stored under cyclohexane.
- the copper complex is dissolved directly into this, in an amount depending on the thickness of copper coating required after calculating the particle surface area; for magnetic purposes the coating thickness should be the minimum which will survive compression without rupturing.
- the complex was calculated to amount to 1% (based on copper) by mass of the B14.
- Example 6 the copper complex of Example 6 dissolved in cyclohexane or diethyl ether was brush painted onto a substrate, which was heated to 210°C for 1 hour in hydrogen. A continuous copper coating was left on the substrate, and the liberated ligand could be recycled to make further paint.
- the copper complex of Example 6 in solution was jetted, through an atomising nozzle, as a fine spray into a chamber containing hydrogen at 250°C. Copper powder was recovered from the chamber. The liberated ligand could be recycled. Care must be taken to avoid an undue proportion of the complex from decomposing on the chamber walls and simply plating them, for example a cyclonic gas flow path may be established within the chamber so that the complex does not contact the chamber wall.
- a mixture of such compounds may be used, in the same or separate sprays, to yield a mixture of liberated metals, in precalculated volumetric proportions of liquid to yield the metals in the desired ratios.
- the metal is one or more of a mixture of copper and nickel.
- a mixture of such metal powders may permit alloys to be made by pressures-sintering which would otherwise be unobtainable or only obtainable by extraordinary techniques such as implantation by nuclear bombardment.
Abstract
Description
Claims
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB898902311A GB8902311D0 (en) | 1989-02-02 | 1989-02-02 | Metallic paint |
GB898902312A GB8902312D0 (en) | 1989-02-02 | 1989-02-02 | Making metal powder |
GB8902312.1 | 1989-02-02 | ||
GB8902311.3 | 1989-02-02 | ||
GB8902310.5 | 1989-02-02 | ||
GB898902310A GB8902310D0 (en) | 1989-02-02 | 1989-02-02 | Forming mixed-metal coating |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1990008844A1 true WO1990008844A1 (en) | 1990-08-09 |
Family
ID=27264297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1990/000160 WO1990008844A1 (en) | 1989-02-02 | 1990-02-01 | Forming a metal coating |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0456679A1 (en) |
JP (1) | JPH04503085A (en) |
CA (1) | CA2046335A1 (en) |
GB (1) | GB2229453A (en) |
WO (1) | WO1990008844A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008029691A1 (en) * | 2008-06-24 | 2009-12-31 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Mixtures of precursors for the production of ceramic layers by means of MOCVD |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3071493A (en) * | 1961-11-15 | 1963-01-01 | Ethyl Corp | Metal plating process |
US3092510A (en) * | 1959-03-02 | 1963-06-04 | Sperry Rand Corp | Magnetic devices and preparation thereof |
US3092511A (en) * | 1958-11-19 | 1963-06-04 | Sperry Rand Corp | Magnetic devices and preparation thereof |
FR1406882A (en) * | 1963-09-13 | 1965-07-23 | Ass Chem Co | Improvements to surface coating |
GB1077619A (en) * | 1964-06-25 | 1967-08-02 | Siemens Ag | A process for the production of intermetallic superconducting compounds |
FR1568666A (en) * | 1967-05-24 | 1969-05-23 | ||
US3594216A (en) * | 1969-06-19 | 1971-07-20 | Westinghouse Electric Corp | Vapor phase deposition of metal from a metal-organic beta-ketoamine chelate |
US3615888A (en) * | 1969-09-04 | 1971-10-26 | American Cyanamid Co | Chemical treatment of metal |
FR2090384A1 (en) * | 1970-05-29 | 1972-01-14 | Inst Khim Akademii | |
FR2118996A1 (en) * | 1970-12-24 | 1972-08-04 | Montedison Spa | |
FR2314263A1 (en) * | 1975-06-13 | 1977-01-07 | Anvar | Vacuum vapour deposition of metals or metalloids - by thermal decomposition of their coordination cpds. with (2,2')-bipyridyl |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB872610A (en) * | 1958-03-07 | 1961-07-12 | Union Carbide Corp | Gas plating of aggregates |
US3242102A (en) * | 1960-06-30 | 1966-03-22 | Sperry Rand Corp | Metal chelate polymers |
NL286046A (en) * | 1961-12-01 | |||
SE306771B (en) * | 1965-09-14 | 1968-12-09 | Asea Ab | |
GB1109890A (en) * | 1965-12-21 | 1968-04-18 | Int Nickel Ltd | Preparation of finely divided metals |
US4042163A (en) * | 1974-08-23 | 1977-08-16 | Schladitz Hermann J | Method for the manufacture of a heat exchanger or heat transfer element |
FR2325621A1 (en) * | 1975-09-29 | 1977-04-22 | Engelhard Mineral Chemical Cor | DECORATION FOR CERAMIC MATERIALS WITH A SHINY WHITE METAL APPEARANCE |
US4250210A (en) * | 1977-12-27 | 1981-02-10 | The International Nickel Co., Inc. | Chemical vapor deposition |
-
1990
- 1990-02-01 WO PCT/GB1990/000160 patent/WO1990008844A1/en not_active Application Discontinuation
- 1990-02-01 EP EP19900902310 patent/EP0456679A1/en not_active Withdrawn
- 1990-02-01 GB GB9002268A patent/GB2229453A/en not_active Withdrawn
- 1990-02-01 CA CA 2046335 patent/CA2046335A1/en not_active Abandoned
- 1990-02-01 JP JP50238590A patent/JPH04503085A/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3092511A (en) * | 1958-11-19 | 1963-06-04 | Sperry Rand Corp | Magnetic devices and preparation thereof |
US3092510A (en) * | 1959-03-02 | 1963-06-04 | Sperry Rand Corp | Magnetic devices and preparation thereof |
US3071493A (en) * | 1961-11-15 | 1963-01-01 | Ethyl Corp | Metal plating process |
FR1406882A (en) * | 1963-09-13 | 1965-07-23 | Ass Chem Co | Improvements to surface coating |
GB1077619A (en) * | 1964-06-25 | 1967-08-02 | Siemens Ag | A process for the production of intermetallic superconducting compounds |
FR1568666A (en) * | 1967-05-24 | 1969-05-23 | ||
US3594216A (en) * | 1969-06-19 | 1971-07-20 | Westinghouse Electric Corp | Vapor phase deposition of metal from a metal-organic beta-ketoamine chelate |
US3615888A (en) * | 1969-09-04 | 1971-10-26 | American Cyanamid Co | Chemical treatment of metal |
FR2090384A1 (en) * | 1970-05-29 | 1972-01-14 | Inst Khim Akademii | |
FR2118996A1 (en) * | 1970-12-24 | 1972-08-04 | Montedison Spa | |
FR2314263A1 (en) * | 1975-06-13 | 1977-01-07 | Anvar | Vacuum vapour deposition of metals or metalloids - by thermal decomposition of their coordination cpds. with (2,2')-bipyridyl |
Non-Patent Citations (1)
Title |
---|
CHEMICAL ABSTRACTS, Vol. 87, No. 22, 28 November 1977, (Columbus, Ohio, US), see page 612* Abstract 176768s, & JP-A-7772498 (TDK Electronics Co., Ltd) 16 June 1977* * |
Also Published As
Publication number | Publication date |
---|---|
GB9002268D0 (en) | 1990-03-28 |
JPH04503085A (en) | 1992-06-04 |
CA2046335A1 (en) | 1990-08-03 |
GB2229453A (en) | 1990-09-26 |
EP0456679A1 (en) | 1991-11-21 |
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