WO1990003662A1 - Article pour le transfert automatique sur bande de puces hybrides - Google Patents
Article pour le transfert automatique sur bande de puces hybrides Download PDFInfo
- Publication number
- WO1990003662A1 WO1990003662A1 PCT/GB1989/001158 GB8901158W WO9003662A1 WO 1990003662 A1 WO1990003662 A1 WO 1990003662A1 GB 8901158 W GB8901158 W GB 8901158W WO 9003662 A1 WO9003662 A1 WO 9003662A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- article according
- bonding
- carrier sheet
- article
- tubular
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 4
- 238000005755 formation reaction Methods 0.000 claims abstract 7
- 239000004642 Polyimide Substances 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 3
- 239000012876 carrier material Substances 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 238000000608 laser ablation Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 239000002195 soluble material Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229920001646 UPILEX Polymers 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000004986 phenylenediamines Chemical class 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0333—Organic insulating material consisting of one material containing S
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Definitions
- This invention relates to a hybrid bonding article which can be provided in arrangements suitable for use in tape-automated bonding (TAB) of semiconductor micro- circuits (microchips).
- TAB tape-automated bonding
- a polymer tape Al having edge sprocket holes A2 for feeding the tape in automated bonding equipment carries a series of arrays (one shown) of conductive tracks A3 arranged in a pattern suitable for bonding their inner ends A4 to the bonding sites of a microchip (not shown).
- the tape Al is cut away under the ends A4 of the tracks so that the ends project as unsupported "fingers" over the cut-away space A5. Bonding is effected by bending the fingers into the space A5 to make contact with the chip positioned against the opposite side of the tape from that carrying the tracks. This is followed by bonding by known techniques which often require the chip bonding sites to "bumped" with bonding material, e.g. solder.
- the present invention can avoid such disadvan ⁇ tageous "bumping" processes.
- TAB device known as "area TAB” is described in U.S. Patents 3832769, 3868724 and 4472876, in which the conductive tracks do not project as “fingers”, but instead are connected to solid metal ter ⁇ minals formed in holes passing through the tape material.
- the terminals project from the surface of the tape remote from the tracks and can therefore make electrical contact with bonding sites on micro chips or other devices brought into contact therewith.
- the reliability of the electrical contacts thus established may be limited by the relative rigidity of the terminals hindering their ability to conform to variations in height of the bonding sites on the chip, especially as increasing miniaturization and complexity of microchips requires bonding sites n central areas of the chip as well as around its edges.
- the present invention alleviates these problems by means of an ingenious hybrid form of TAB article, and accordingly provides in one of its aspects a tape- automated bonding article comprising a carrier sheet carrying at least one array of electrically conductive tracks having ends arranged for bonding to a microcir- - cuit device, each such bondable track end being sup ⁇ ported by the carrier sheet material and being electrically connected to a surface region of the carrier material not carrying that track end by a tubu ⁇ lar formation of electrically conductive material within, preferably plated within, at least one con ⁇ necting hole of diameter less than 200 micrometres, pre ⁇ ferably less than 100 micrometres, more preferably less than 50 micrometres.
- the holes will usually pass more or less straight through the sheet to its opposite sur ⁇ face (i.e., the "surface region not carrying the track end"), but may be sloping or indirect (e.g. curved) if desired.
- the tubular conductive material in the connecting hole or holes projects beyond the said surface region so as to facilitate bonding to the micro- circuit, and this may be achieved by removing one or more layers from the carrier sheet after plating (or other provision) of the conductive material in the con ⁇ necting hole.
- tubular formation of conductive material preferably metal
- the tubes may crumple when compressed longitu ⁇ dinally against a microchip or other device, thus taking up irregularities without the major deviation from the longitudinal axis which normally results when solid columns or wires are so compressed.
- solder or other fusible material may be provided at or within the ends (at least) of the tubes to facilitate thermal bonding and electrical connection.
- This hybrid TAB article according to the invention may be constructed with cut-away "fingers" of the carrier sheet material supporting the conductive track ends to be bonded, thus providing a “fingered” construc ⁇ tion corresponding to, but with advantages over, the ordinary TAB article; or may be constructed with “fingers” extending also to the central regions of the chip.
- These "fingered” hybrids may be regarded as a separate aspect of the invention, for which alternative forms of connection (e.g. solid wires or posts) may also be useful.
- Cutting away the carrier is not essential, since the tubular projections from the connecting holes can be arranged to render unnecessary the bending of the track ends, but the "fingered” construction may provide advantageous flexibility in articles with central, as well as peripheral, connection sites.
- An example of a fingered construction accordingly to the present invention is illustrated schematically in Figure 1 of the accompanying drawings, wherein the reference numerals correspond to the numerals used in Sketch A.
- the present invention preferably hybridizes the TAB concept with methods and materials for making self- supporting uniaxial connectors described in any one or more of copending British Patent Applications 8802567, 8802565, 8802566, 8802568, 8815447.1, and European Published Patent Applications EP-A-0213774, 0327399, 0329314 and 0327398, the disclosures of all of which are incorporated herein by reference.
- FIG. 2 illustrates schematically the use of a TAB article according to the invention with central connec ⁇ tion sites but without the easily envisaged cut-away "fingers".
- Metal tubes 21 project from holes through a polyimide sheet 22, with conductive tracks 23 connecting to the tubes, ft standard unbumped I.C. is shown in posi ⁇ tion for thermocompression (or other) bonding to the hybrid TAB article.
- FIG. 3 illustrates shcematically a TAB production line in which a polyimide tape article 31 according to the invention with projecting plated metal tubes 32 is assembled with unbumped.. integrated circuit chips 33.
- the tape 31 is fed from left to right (as shown) by means not shown, passing under guides 35, and is bonded to the chips 33, feeding from right to left, by thermode 34.
- Figure 4 shows in more detail part of the TAB article and chip of Fig. 3 (inverted), with metal tracks 41 on the surface of tape 31.
- Figure 5 shows a TAB article with a chip 33 inset in a support substrate 51, the metal tubes 32 in this case electrically bridging, via the tracks 41, between the chip 33 and the substrate 51.
- Figure 6 shows a multilayer polymer/metal laminate suitable for making a multi-level TAB article (see Fig 7) according to the invention.
- Copper track-forming layers 61 and 62 are provided on the opposite faces of polyimide sheet 63, with an optional further layer 64 of polyimide and a soluble layer 65 (e.g. of polyamide) .
- the polyimide and soluble polymer layers may be those described in the aforementioned British applications and published European applications.
- Figure 7 shows the use of a multi-level hybrid TAB article made by drilling and plating the laminate of Fig. 6, (optional layer 64 omitted) followed by removal of the soluble polymer layer 65. " Such a structure per ⁇ mits closer spacing of the metal tubes 71 to connect to high density I.C. 72 (standard unbumped form).
- the hybrid TAB articles according to the present invention can advantageously be impedance matched with the other circuitry to be connected.
- Multi-layer articles e.g. Fig 7
- a preferred polymer material is a substantially fully cyclised polyimide capable of retaining at least 50%, preferably at least 75%, more preferably at least 85%, of its original elongation after immersion in water of pHlO at 100°C for 4 days according to ASTM D882. It will be readily understood that a "substantially fully cyclised" polyimide is one having substantially no open imide rings or uncyclised - u -
- Such a polyimide is better able to survive hot alkaline metal plating baths, which attack incompletely cyclised polyimides such as Kapton (TM) .
- TM Kapton
- UPILEX polyimides
- UPILEX R polyimides
- UPILEX R is believed to be a relatively completely cyclised polymer having a repeat unit derived from biphenyl dianhydride and diaminodiphenylether, viz.
- UPILEX S is believed to have a repeat unit derived from the same anhydride and phenylene diamine, viz.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Packages (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Un article pour le transfert automatique sur bande de puces à circuits intégrés comprend une feuille de support (22) comportant des pistes conductrices (23) avec une partie conformée tubulaire en métal (21) traversant la feuille au niveau de l'extrémité de chaque piste en vue du raccordement avec une puce (24). Ces parties conformées tubulaires tendent à compenser les irrégularités de la puce et peuvent renfermer de la brasure ou un autre métal ayant un point de fusion inférieur à la partie conformée tubulaire en vue d'effectuer la connexion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900701136A KR900702568A (ko) | 1988-09-30 | 1989-09-29 | 하이브리드 마이크로칩 접착제품 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB888823057A GB8823057D0 (en) | 1988-09-30 | 1988-09-30 | Hybrid microchip bonding article |
GB8828245.4 | 1988-12-02 | ||
GB8823057.8 | 1988-12-02 | ||
GB888828245A GB8828245D0 (en) | 1988-12-02 | 1988-12-02 | Anisotropically electrically conductive articles |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1990003662A1 true WO1990003662A1 (fr) | 1990-04-05 |
Family
ID=26294463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1989/001158 WO1990003662A1 (fr) | 1988-09-30 | 1989-09-29 | Article pour le transfert automatique sur bande de puces hybrides |
Country Status (7)
Country | Link |
---|---|
US (1) | US5254811A (fr) |
EP (2) | EP0361985B1 (fr) |
JP (1) | JP2873032B2 (fr) |
KR (1) | KR900702568A (fr) |
AT (1) | ATE115335T1 (fr) |
DE (1) | DE68919792T2 (fr) |
WO (1) | WO1990003662A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130783A (en) * | 1991-03-04 | 1992-07-14 | Texas Instruments Incorporated | Flexible film semiconductor package |
US5455390A (en) * | 1994-02-01 | 1995-10-03 | Tessera, Inc. | Microelectronics unit mounting with multiple lead bonding |
US6828668B2 (en) * | 1994-07-07 | 2004-12-07 | Tessera, Inc. | Flexible lead structures and methods of making same |
US5688716A (en) | 1994-07-07 | 1997-11-18 | Tessera, Inc. | Fan-out semiconductor chip assembly |
US6117694A (en) * | 1994-07-07 | 2000-09-12 | Tessera, Inc. | Flexible lead structures and methods of making same |
US5518964A (en) * | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
US5830782A (en) * | 1994-07-07 | 1998-11-03 | Tessera, Inc. | Microelectronic element bonding with deformation of leads in rows |
US6429112B1 (en) | 1994-07-07 | 2002-08-06 | Tessera, Inc. | Multi-layer substrates and fabrication processes |
US5798286A (en) * | 1995-09-22 | 1998-08-25 | Tessera, Inc. | Connecting multiple microelectronic elements with lead deformation |
FR2730657B1 (fr) * | 1995-02-22 | 1997-03-28 | Solaic Sa | Procede et installation pour realiser des trous dans le film isolant d'une bande support pour modules de cartes electroniques |
KR19990007929A (ko) | 1995-04-26 | 1999-01-25 | 데이빗로스클리블랜드 | 다면 반복 노광 방법 및 장치 |
US6133072A (en) * | 1996-12-13 | 2000-10-17 | Tessera, Inc. | Microelectronic connector with planar elastomer sockets |
US6735387B1 (en) | 2001-01-10 | 2004-05-11 | Tim Schnell | Motion detector camera |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0171232A2 (fr) * | 1984-08-09 | 1986-02-12 | Minnesota Mining And Manufacturing Company | Ruban pour la soudure de surfaces |
EP0213774A1 (fr) * | 1985-08-05 | 1987-03-11 | Raychem Limited | Objet ayant une conductibilité électrique anisotrope |
EP0279769A2 (fr) * | 1987-02-17 | 1988-08-24 | Rogers Corporation | Matériau pour substrat électrique, circuit multicouche et support pour puce contenant un circuit intégré comportant ce matériau |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4177519A (en) * | 1975-07-28 | 1979-12-04 | Sharp Kabushiki Kaisha | Electronic control assembly mounted on a flexible carrier and manufacture thereof |
NL7610306A (nl) * | 1976-09-16 | 1978-03-20 | Du Pont | Contactinrichting voor een geintegreerde schakeling. |
FR2404990A1 (fr) * | 1977-10-03 | 1979-04-27 | Cii Honeywell Bull | Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation |
US4540226A (en) * | 1983-01-03 | 1985-09-10 | Texas Instruments Incorporated | Intelligent electronic connection socket |
JP2641869B2 (ja) * | 1987-07-24 | 1997-08-20 | 三菱電機株式会社 | 半導体装置の製造方法 |
FR2620586A1 (fr) * | 1987-09-14 | 1989-03-17 | Em Microelectronic Marin Sa | Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits |
-
1989
- 1989-09-29 JP JP1510808A patent/JP2873032B2/ja not_active Expired - Fee Related
- 1989-09-29 US US07/671,789 patent/US5254811A/en not_active Expired - Lifetime
- 1989-09-29 AT AT89310675T patent/ATE115335T1/de not_active IP Right Cessation
- 1989-09-29 EP EP89310675A patent/EP0361985B1/fr not_active Expired - Lifetime
- 1989-09-29 DE DE68919792T patent/DE68919792T2/de not_active Expired - Fee Related
- 1989-09-29 KR KR1019900701136A patent/KR900702568A/ko not_active Application Discontinuation
- 1989-09-29 EP EP89911588A patent/EP0436652A1/fr active Pending
- 1989-09-29 WO PCT/GB1989/001158 patent/WO1990003662A1/fr not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0171232A2 (fr) * | 1984-08-09 | 1986-02-12 | Minnesota Mining And Manufacturing Company | Ruban pour la soudure de surfaces |
EP0213774A1 (fr) * | 1985-08-05 | 1987-03-11 | Raychem Limited | Objet ayant une conductibilité électrique anisotrope |
EP0279769A2 (fr) * | 1987-02-17 | 1988-08-24 | Rogers Corporation | Matériau pour substrat électrique, circuit multicouche et support pour puce contenant un circuit intégré comportant ce matériau |
Also Published As
Publication number | Publication date |
---|---|
ATE115335T1 (de) | 1994-12-15 |
DE68919792T2 (de) | 1995-08-03 |
JPH04501486A (ja) | 1992-03-12 |
DE68919792D1 (de) | 1995-01-19 |
KR900702568A (ko) | 1990-12-07 |
EP0436652A1 (fr) | 1991-07-17 |
EP0361985A1 (fr) | 1990-04-04 |
US5254811A (en) | 1993-10-19 |
JP2873032B2 (ja) | 1999-03-24 |
EP0361985B1 (fr) | 1994-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0536076B1 (fr) | Appareil et procédé pour manufaction des liaisons électriques simultanées | |
US6653575B2 (en) | Electronic package with stacked connections and method for making same | |
US5254811A (en) | Hybrid microchip bonding article | |
EP0450950B1 (fr) | Structure d'interconnexion flexible à haute densité | |
CN102612252B (zh) | 印刷线路板 | |
EP0244666B1 (fr) | Structure de bande pour transport automatique sur bande, empaquetage multicouche et interconnexion universelle de puces | |
US6504104B2 (en) | Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array | |
EP0613332A1 (fr) | Interconnexion pour support de micropuce | |
US5631447A (en) | Uses of uniaxially electrically conductive articles | |
US5637925A (en) | Uses of uniaxially electrically conductive articles | |
EP0117348B1 (fr) | Procédé pour souder des fils aux composants semi-conducteurs | |
EP0139431B1 (fr) | Méthode pour le montage d'un porteur pour l'élément de construction micro-électronique au silicium | |
US5861322A (en) | Process for manufacturing an interconnection substrate to connect a chip onto a reception substrate | |
CA1321659C (fr) | Utilisations d'articles unixialement conducteurs d'electricite | |
KR930002909B1 (ko) | 지역 접합용 테이프 | |
EP0327399A1 (fr) | Procédé de fabrication d'un article électroconducteur uni-axial | |
CN101578929A (zh) | 印刷线路板及其制造方法 | |
JPH0785486B2 (ja) | パッケージング | |
JPH08264938A (ja) | プリント配線板とプリント配線板の接触パッドとメッキ・バーの接続方法 | |
JPH08213743A (ja) | 電子部品搭載用基板 | |
JPH0883862A (ja) | 回路基板および回路基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): BR DK JP KR NO US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE FR GB IT LU NL SE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1989911588 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1989911588 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1989911588 Country of ref document: EP |