WO1989007878A1 - Process for mounting components on component supports using surface mounting technology - Google Patents

Process for mounting components on component supports using surface mounting technology Download PDF

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Publication number
WO1989007878A1
WO1989007878A1 PCT/DE1988/000675 DE8800675W WO8907878A1 WO 1989007878 A1 WO1989007878 A1 WO 1989007878A1 DE 8800675 W DE8800675 W DE 8800675W WO 8907878 A1 WO8907878 A1 WO 8907878A1
Authority
WO
WIPO (PCT)
Prior art keywords
components
adhesive
positions
metering device
technology
Prior art date
Application number
PCT/DE1988/000675
Other languages
German (de)
French (fr)
Inventor
Hans Schimmelpfennig
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1989007878A1 publication Critical patent/WO1989007878A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method for equipping component carriers with components using surface mounting technology (SMD technology), in which an adhesive is applied to the component carriers from a positionable spray metering device at predeterminable fitting positions, and the components are bonded to the component positions provided for them - Averaging the adhesive to be fixed on the component carriers.
  • SMD technology surface mounting technology
  • component carriers such as printed circuit boards or ceramic substrates are equipped with electronic components in this way that first an adhesive in the form of an epoxy resin adhesive or a solder paste is applied to the component carrier at the intended placement positions and then the components are placed at the placement positions; the adhesive holds the components in their assembly positions until and during a subsequent soldering process.
  • the adhesive can be applied in the area of the placement positions, for example using screen printing technology or with the aid of a pen, with which the adhesive is removed dropwise from a supply and deposited at the placement positions.
  • the adhesive in each case composed directly of the fitting positions from at least two components which are delivered to the fitting positions from different metering channels of the spray metering device.
  • the main advantage of the method according to the invention is that the adhesive is only assembled from components directly at the individual placement positions, so that contact of the outlet openings of the spray metering device with the adhesive and associated sticking of the outlet openings with the adhesive is avoided .
  • the overall availability of the spray metering device is increased, especially since, in contrast to the known method, there is no risk that the spray metering device will clog with the adhesive during longer downtimes.
  • the delivery quantities of the components at the various placement positions can be metered particularly precisely and finely, because the outlet openings of the spray metering device can be made very narrow due to the lack of the possibility of gluing with the adhesive.
  • low-viscosity adhesive components are preferably used as components to form an adhesive as an adhesive.
  • the various two, three or more adhesive components which can be adjusted to be very thin due to their structure from low molecular weight compounds and / or by adding solvents and therefore can be metered particularly finely with regard to their dispensing quantities, crosslink when they meet at the placement positions to a high-molecular, viscous adhesive.
  • Components with electrically conductive components are preferably used. These are then delivered directly to the conductor tracks provided as electrical connections for the components, so that when the components are placed, both a mechanical and an electrical connection take place; in contrast to the known method, the subsequent soldering of the components is omitted.
  • an adhesive as an adhesive can be dispensed with in a known manner; then it is sufficient to press the components into a solder paste previously applied in the area of the placement positions, in which the relevant components * adhere until they are soldered by melting the solder paste.
  • a suspension of solder powder and low-viscosity components are advantageously used as components to form the solder paste as an adhesive.
  • an ink pen with the metering channels individually assigned to the expensive drive elements is used as a spray metering device.
  • it is used for inkjet made use of the characteristic property that, regardless of whether they are operated in high, low or low pressure processes, they can be used to eject droplets with an extraordinarily high volume constancy and, moreover, with a very high following speed.
  • the dosage amounts of the components of the adhesive to be dispensed, which are required for different sizes and shapes of components, can therefore be determined and controlled in a particularly simple manner in terms of control technology by the number of drops to be ejected.
  • the adhesive is applied at high speed. Another advantage is that with the use of an ink pen the reliability of a mature series product is taken over.
  • FIG. 1 shows an exemplary embodiment of a device for carrying out the method according to the invention
  • FIG. 2 shows an injection metering device used in the method according to the invention and its control.
  • Fig. 1 shows a schematic representation of an embodiment of an apparatus for performing the method according to the invention.
  • the component carriers 1 to be assembled which can be printed circuit boards or ceramic substrates provided with conductor tracks, are indicated by means of a transport device 2, which is indicated here in the form of a conveyor belt is transported in the direction of arrow 3 to a plurality of processing positions 4, 5 and 6 lying one behind the other.
  • a transport device 2 which is indicated here in the form of a conveyor belt is transported in the direction of arrow 3 to a plurality of processing positions 4, 5 and 6 lying one behind the other.
  • a first automatic positioning device 7 on which an injection metering device 8 is held in a spatially positionable manner via three movement units 9, 10 and 11 of the automatic positioning device 7, each of which can be moved perpendicularly to one another.
  • the spray metering device 8 With the aid of the spray metering device 8, the basic structure and mode of operation of which are shown below with reference to FIG. 2 is explained in more detail, an adhesive is applied to the component carrier 1
  • the component carrier 1 located in the region of the processing position 4 is transferred to the next processing position 5 with the aid of the transport device 2.
  • a second automatic positioning device 12 is arranged there, on which an actuatable gripping device 13 is held in a spatially positionable manner by means of three movement units 14, 15 and 16 which can be moved relative to one another in vertical axial directions.
  • components 17 stored on belts 17 and 18, which instead of wire connections have solderable, flat connection contact surfaces SMD
  • SMD solderable, flat connection contact surfaces
  • a plurality of automatic positioning devices provided with gripping devices can be provided; it is also possible to move the spray metering device and the gripping device simultaneously with the aid of a single automatic positioning device.
  • the spray metering device 8 consists of an ink-writing mechanism with an ink-printhead 20 and an ink-printhead holder 21, which is indicated here only by dash-dots.
  • Such an ink-writing mechanism is known, for example, from Siemens magazine 51 • (1977), number 5, pages 215-221.
  • the ink print head 20, which is shown here partly in section, has a plurality of metering channels 22 and 23, each of which is assigned a drive element 24 or 25 in the form of a tube-shaped piezo element.
  • a liquid reservoir 26 and 27 is connected to each metering channel 22 and 23, respectively.
  • Spray metering device 8 - shown here in the form of a block diagram - can be positioned in three perpendicular axial directions (x, y and z) via the three movement units 9, 10 and 11.
  • the movement units 9, 10 and 11 are controlled via a control device 28 as a function of position data, which are supplied to the control device 28 via a data bus 29 and which the individual component positions, e.g. 30, designated on the component carrier 1.
  • the position data are fed to an I pulse generator 31, which emits control pulses in a predetermined number for controlling the drive elements 24 and 25.
  • the respective number of control pulses to be emitted is dependent on the position data of the individual placement positions, e.g. B. 30, stored within the pulse generator 31.
  • the liquid storage containers 26 and 27 each contain components of the adhesive to be formed. Depending on the number of metering channels 22, 23, at least two, but also three to nine different components can be used. By driving the drive elements 24 and 25, these components are dispensed drop by drop onto the placement position 30, where they assemble to form the adhesive.
  • the components in the liquid storage containers 26 and 27 consist of low-molecular and therefore low-viscosity adhesive components which, when they meet at the assembly position 30, form a high-molecular, viscous adhesive (epoxy resin or other polymers) network.
  • a suspension of solder powder and other low-viscosity can be used as components of the adhesive to be formed
  • Components for forming a solder paste can be contained in the liquid storage containers 26 and 27; in this case, the components are delivered directly to the conductor tracks 32 and 33, on which the component with its solderable and flat connection contact surfaces is placed. The component is then soldered in a reflow process.

Abstract

In known processes for mounting components on component supports using surface mounted devices (SMD) technology the components are attached to the predetermined mounting positions, prior to soldering, by means of an adhesive previously applied to the support by a dosing spray device. To prevent adhesion of said device (8), the adhesive is first prepared directly on the mounting positions (30) from low-viscosity components preferably dispensed from the dosing channels (22, 23) of an ink recording mechanism (20, 21).

Description

Verfahren zum Bestücken von Bauelementeträge-rn mit Bauelementen in Oberflächen ontagetechnik Process for equipping component carriers with components using surface-mounted technology
Die Erfindung betrifft ein Verfahren zum Bestücken von Bau- elementeträgern mit Bauelementen in Oberflächenmontagetechnik (SMD-Technik) , bei dem an vorgebbaren Bestückpositionen auf den Bauelementeträgern aus einer positionierbaren Spritzdosierein¬ richtung ein Haftmittel aufgetragen wird und die Bauelemente an den für sie vorgesehenen Bestückpositionen unter Haftver- mittlung des Haftmittels auf den Bauelementeträgern fixiert werden.The invention relates to a method for equipping component carriers with components using surface mounting technology (SMD technology), in which an adhesive is applied to the component carriers from a positionable spray metering device at predeterminable fitting positions, and the components are bonded to the component positions provided for them - Averaging the adhesive to be fixed on the component carriers.
Bei einem derartigen bekannten Verfahren, von dem mehrere Ver¬ fahrensvarianten in der Firmendruckschrift Valvo: "Surface Mounted Devices", 1985/86, Ausgabe Sept. 1985 beschrieben sind, werden Bauelementeträger wie z.B. Leiterplatten oder Keramik¬ substrate in der Weise mit elektronischen Bauelementen bestückt, daß zunächst an den vorgesehenen Bestückpositionen ein Haftmittel in Form eines Epoxidharz-Klebers oder einer Lötpaste auf dem Bauelementeträger aufgebracht wird und dann die Bauelemente an den Bestückpositionen plaziert werden; das Haftmittel hält die Bauelemente bis zum und während eines anschließend erfolgenden Lötvorganges an ihren Bestückpositionen. Das Aufbringen des Haftmittels im Bereich der Bestückpositionen kann bei dem be- kannten Verfahren beispielsweise in Siebdrucktechnik oder mit Hilfe eines Stiftes erfolgen, mit dem das Haftmittel aus einem Vorrat tropfenweise entnommen und an den Bestückpositionen abge¬ setzt wird. Alternativ hierzu wird bei dem bekannten Verfahren im Hinblick auf unterschiedliche Größen und Formen der Bauelemente eine veränderbare und vergleichsweise genauere Dosierung des Haftmittels dadurch erzielt, daß das Haftmittel aus einer an den unterschiedlichen Bestückpositionen automatisch positionier¬ baren Spritzdosiereinrichtung unter Druckluft- oder Kolbenein- Wirkung auf die Bestückpositionen abgegeben wird. Hierbei ist jedoch kaum zu vermeiden, daß sich die Austrittsöffnung der Spritzdosiereinrichtung in Folge der Verfestigung von zurück¬ bleibenden Haftmittelresten zusetzt. Dem Verstopfen der Aus- trittsöffnung kann zwar durch eine Vergrößerung der Austritts- öffnung entgegengewirkt werden, jedoch wird dadurch die Dosierungs¬ genauigkeit verringert.In such a known method, of which several process variants are described in the company brochure Valvo: "Surface Mounted Devices", 1985/86, edition Sept. 1985, component carriers such as printed circuit boards or ceramic substrates are equipped with electronic components in this way that first an adhesive in the form of an epoxy resin adhesive or a solder paste is applied to the component carrier at the intended placement positions and then the components are placed at the placement positions; the adhesive holds the components in their assembly positions until and during a subsequent soldering process. In the known method, the adhesive can be applied in the area of the placement positions, for example using screen printing technology or with the aid of a pen, with which the adhesive is removed dropwise from a supply and deposited at the placement positions. As an alternative to this, in the known method with regard to different sizes and shapes of the components, a changeable and comparatively more precise metering of the adhesive is achieved in that the adhesive from a spray metering device that can be automatically positioned at the different placement positions under compressed air or piston insertion. Effect on the placement positions is given. However, it can hardly be avoided here that the outlet opening of the spray metering device becomes clogged as a result of the solidification of residual adhesive residues. The blockage of the outlet opening can be counteracted by enlarging the outlet opening, but this reduces the dosing accuracy.
Gemäß der Erfindung wird bei dem Verfahren der eingangs angegebenen Art das Haftmittel jeweils unmittelbar an den Be¬ stückpositionen aus mindestens zwei Komponenten zusammengesetzt, die aus unterschiedlichen Dosierkanälen der Spritzdosiereinrich¬ tung auf die Bestückpositionen abgegeben werden.According to the invention, in the method of the type specified at the outset, the adhesive is in each case composed directly of the fitting positions from at least two components which are delivered to the fitting positions from different metering channels of the spray metering device.
Der wesentliche Vorteil des erfindungsgemäßen Verfahrens besteht darin, daß das Haftmittel erst unmittelbar auf den ein¬ zelnen Bestückpositionen aus Komponenten zusammengesetzt wird, so daß eine Berührung der Austrittsöffnungen der Spritzdosier¬ einrichtung mit dem Haftmittel und damit verbunden ein Verkleben der Austrittsöffnungen mit dem Haftmittel vermieden wird. Da¬ durch wird insgesamt die Arbeitsverfügbarkeit der Spritzdosier¬ einrichtung erhöht, zumal auch im Unterschied zu dem bekannten Verfahren nicht die Gefahr besteht, daß sich die Spritzdosier¬ einrichtung bei längeren Stillstandszeiten mit dem Haftmittel zusetzt. Weiterhin lassen sich bei dem erfindungsgemäßen Ver¬ fahren die Abgabemengen der Komponenten an den verschiedenen Bestückpositionen besonders exakt und fein dosieren, weil die Austrittsöffnungen der Spritzdosiereinrichtung wegen der fehlen¬ den Möglichkeit des Verklebens mit dem Haftmittel sehr eng aus- gebildet sein können. Dies wird zusätzlich auch dadurch ermög¬ licht, daß anstelle des Haftmittels dessen Komponenten in den Dosierkanälen der Spritzdosiereinrichtung enthalten sind; die jeweiligen Viskositätswerte für die einzelnen verwendeten Komponenten können nämlich wesentlich niedriger eingestellt sein als die Viskosität des aus den Komponenten zusammenzu¬ setzenden Haftmittels. Vorzugsweise werden im Rahmen der Erfindung als Komponenten niedrigviskose Klebstoffkompoήenten zur Bildung eines Kleb¬ stoffes als Haftmittel verwendet. Die verschiedenen zwei, drei oder mehr Klebstoffkomponenten, die aufgrund ihres Aufbaus aus niedermolekularen Verbindungen und/oder durch Lösungsmittelzu¬ gabe sehr dünnflüssig eingestellt werden können und daher be¬ züglich ihrer Abgabemengen besonders fein dosierbar sind, ver¬ netzen sich bei ihrem Zusammentreffen an den Bestückpositionen zu einem hochmolekularen, dickflüssigen Klebstoff.The main advantage of the method according to the invention is that the adhesive is only assembled from components directly at the individual placement positions, so that contact of the outlet openings of the spray metering device with the adhesive and associated sticking of the outlet openings with the adhesive is avoided . As a result, the overall availability of the spray metering device is increased, especially since, in contrast to the known method, there is no risk that the spray metering device will clog with the adhesive during longer downtimes. Furthermore, in the method according to the invention, the delivery quantities of the components at the various placement positions can be metered particularly precisely and finely, because the outlet openings of the spray metering device can be made very narrow due to the lack of the possibility of gluing with the adhesive. This is also made possible by the fact that, instead of the adhesive, its components are contained in the metering channels of the spray metering device; the respective viscosity values for the individual components used can be set significantly lower than the viscosity of the adhesive to be composed of the components. In the context of the invention, low-viscosity adhesive components are preferably used as components to form an adhesive as an adhesive. The various two, three or more adhesive components, which can be adjusted to be very thin due to their structure from low molecular weight compounds and / or by adding solvents and therefore can be metered particularly finely with regard to their dispensing quantities, crosslink when they meet at the placement positions to a high-molecular, viscous adhesive.
Vorzugsweise werden Komponenten mit elektrisch leitenden Bestandteilen verwendet. Diese werden dann direkt auf die als elektrische Anschlüsse für die Bauelemente vorgesehenen Leiter¬ bahnen abgegeben, so daß beim Plazieren der Bauelemente sowohl eine mechanische als auch elektrische Verbindung erfolgt; im Unterschied zu dem bekannten Verfahren entfällt dabei das an¬ schließende Löten der Bauelemente.Components with electrically conductive components are preferably used. These are then delivered directly to the conductor tracks provided as electrical connections for the components, so that when the components are placed, both a mechanical and an electrical connection take place; in contrast to the known method, the subsequent soldering of the components is omitted.
Insbesondere bei Verwendung von Keramiksubstraten als Bauelemen- teträger kann in Verbindung mit einem sog. Aufschmelzlötver¬ fahren (Reflow-Lötverfahren) zum Löten der Bauelemente in be¬ kannter Weise auf einen Klebstoff als Haftmittel verzichtet werden; dann genügt es, die Bauelemente in eine vorher im Be¬ reich der Bestückpositionen aufgebrachte Lötpaste einzudrücken, in der die betreffenden Bauelemente* bis zu ihrem Löten durch Aufschmelzen der Lötpaste haften. In diesem Fall werden bei dem erfindungsgemäßen Verfahren in vorteilhafter Weise als Kompo¬ nenten eine Suspension von Lotpulver und niedrigviskose Kompo¬ nenten zur Bildung der Lötpaste als Haftmittel verwendet.In particular when using ceramic substrates as component carriers, in connection with a so-called reflow soldering method (reflow soldering method) for soldering the components, an adhesive as an adhesive can be dispensed with in a known manner; then it is sufficient to press the components into a solder paste previously applied in the area of the placement positions, in which the relevant components * adhere until they are soldered by melting the solder paste. In this case, in the method according to the invention, a suspension of solder powder and low-viscosity components are advantageously used as components to form the solder paste as an adhesive.
Zum Aufbringen der Komponenten des zu bildenden Haftmittels auf die Best ückpositionen wird entsprechend einer vorteilha ften Ausgestaltung des er findungsgemäßen Verfahrens als S pritzdos ier¬ einrichtung ein Tintenschreibwerk mi t den Dosierkan älen e inzeln zugeordneten , individuell ans teuerbaren Antriebselementen v er¬ wendet . Auf diese Weise wird von der für Tintenschreibwerke charakteristischen Eigenschaft Gebrauch gemacht, daß mit ihnen unabhängig davon, ob sie im Hoch-, Nieder- oder Unterdruckver¬ fahren betrieben werden, Tröpfchen mit außerordentlich hoher Volumenkonstanz und dazu mit sehr hoher Folgegeschwindigkeit ausgestoßen werden können. Die für unterschiedliche Größen und Formen von Bauelementen erforderlichen Dosierungsmengen der abzugebenden Komponenten des Haftmittels lassen sich daher in steuerungstechnisch besonders einfacher Weise durch die Anzahl der auszustoßenden Tropfen bestimmen und steuern. Außerdem er- folgt das Aufbringen des Haftmittels mit hoher Geschwindigkeit. Ein weiterer Vorteil besteht darin, daß mit der Verwendung eines Tintenschreibwerkes die Zuverlässigkeit eines ausgereiften Serienproduktes übernommen wird.In order to apply the components of the adhesive to be formed to the placement positions, in accordance with an advantageous embodiment of the method according to the invention, as a spray metering device, an ink pen with the metering channels individually assigned to the expensive drive elements is used. In this way it is used for inkjet made use of the characteristic property that, regardless of whether they are operated in high, low or low pressure processes, they can be used to eject droplets with an extraordinarily high volume constancy and, moreover, with a very high following speed. The dosage amounts of the components of the adhesive to be dispensed, which are required for different sizes and shapes of components, can therefore be determined and controlled in a particularly simple manner in terms of control technology by the number of drops to be ejected. In addition, the adhesive is applied at high speed. Another advantage is that with the use of an ink pen the reliability of a mature series product is taken over.
Zur Erläuterung des erfindungsgemäßen Verfahrens wird im folgenden auf die Figuren der Zeichnung Bezug genommen. Im einzelnen zeigenTo explain the method according to the invention reference is made below to the figures of the drawing. Show in detail
Fig. 1 ein Ausführungsbeispiel für eine Vorrichtung zur Durch¬ führung des erfiπdungsgemäßen Verfahrens und Fig. 2 eine in dem erfindungsgemäßeπ Verfahren verwendete Spritzdosiereinrichtung und ihre Ansteuerung.1 shows an exemplary embodiment of a device for carrying out the method according to the invention, and FIG. 2 shows an injection metering device used in the method according to the invention and its control.
Fig. 1 zeigt in sche atischer Darstellung ein Ausführungsbeispiel einer Vorrichtung zur Durchführung des erfindungsgemäßen Verfahren Die zu bestückenden Bauelementeträger 1, bei denen es sich um mit Leiterbahnen versehene Leiterplatten oder Keramiksubstrate handeln kann, werden mittels einer Transporteinrichtung 2, die hier in Form eines Förderbandes angedeutet ist, in Richtung des Pfeiles 3 zu mehreren, hintereinander liegenden Bearbeitungspo- sitionen 4, 5 und 6 transportiert. Im Bereich der ersten Be¬ arbeitungsposition 4 ist ein erster Positionierautomat 7 an¬ geordnet, an dem eine Spritzdosiereinrichtung 8 über drei jeweils senkrecht zueinander verfahrbare Bewegungseinheiten 9, 10 und 11 des Positionierautomaten 7 räumlich positionierbar gehalten ist. Mit Hilfe der Spritzdosiereinrichtung 8, deren prinzipieller Aufbau und Funktionsweise untenstehend anhand von Fig. 2 noch näher erläutert wird, wird auf dem zu bestückenden Bauelemente- träger 1 an vorgegebenen Bestückpositionen, an denen später Bauelemente plaziert werden sollen, ein Haftmittel aufgetragen.Fig. 1 shows a schematic representation of an embodiment of an apparatus for performing the method according to the invention. The component carriers 1 to be assembled, which can be printed circuit boards or ceramic substrates provided with conductor tracks, are indicated by means of a transport device 2, which is indicated here in the form of a conveyor belt is transported in the direction of arrow 3 to a plurality of processing positions 4, 5 and 6 lying one behind the other. In the area of the first machining position 4 there is a first automatic positioning device 7, on which an injection metering device 8 is held in a spatially positionable manner via three movement units 9, 10 and 11 of the automatic positioning device 7, each of which can be moved perpendicularly to one another. With the aid of the spray metering device 8, the basic structure and mode of operation of which are shown below with reference to FIG. 2 is explained in more detail, an adhesive is applied to the component carrier 1 to be assembled at predetermined assembly positions at which components are to be placed later.
Nach dem Aufbringen des Haftmittels wird der sich jeweils im Bereich der Bearbeitungsposition 4 befindliche Bauelementeträger 1 mit Hilfe der Transporteinrichtung 2 zu der nächsten Bearbei¬ tungsposition 5 überführt. Dort ist ein zweiter Positionier¬ automat 12 angeordnet, an dem eine betätigbare Greifeinrich- tung 13 über drei in senkrechten Achsrichtungen zueinander ver¬ fahrbaren Bewegungseinheiten 14, 15 und 16 räumlich positionier¬ bar gehalten ist. Mit Hilfe der Greifereinrichtung 13 werden auf Gurten 17 und 18 bevorratete Bauelemente, die anstelle von Drahtanschlüssen über lötfähige, flächige Anschlußkontaktflächen verfügen (sog. Chip-Bauelemente oder surface mounted devices = SMD), von den Gurten 17 und 18 aufgenommen und an den für sie vorgesehenen Bestückpositionen auf dem Bauelementeträger 1 plaziert. Dort bleiben sie unter der Einwirkung des Haftmittels unverrückbar haften, während der Bauelementeträger 1 in eine Löteinrichtung 19 transportiert wird, in der die Bauelemente an die Leiterbahnen auf dem Bauelementeträger 1 angelötet werden.After the adhesive has been applied, the component carrier 1 located in the region of the processing position 4 is transferred to the next processing position 5 with the aid of the transport device 2. A second automatic positioning device 12 is arranged there, on which an actuatable gripping device 13 is held in a spatially positionable manner by means of three movement units 14, 15 and 16 which can be moved relative to one another in vertical axial directions. With the aid of the gripper device 13, components 17 stored on belts 17 and 18, which instead of wire connections have solderable, flat connection contact surfaces (so-called chip components or surface mounted devices = SMD), are picked up by the belts 17 and 18 and attached to them provided placement positions placed on the component carrier 1. There they remain immovably under the action of the adhesive, while the component carrier 1 is transported into a soldering device 19 in which the components are soldered to the conductor tracks on the component carrier 1.
Alternativ zu dem in Fig. 1 gezeigten Ausführungsbeispiel können in Abhängigkeit von der Anzahl und der Verschiedenartig- keit der Bauelemente mehrere mit Greifeinrichtungen versehene Positionierautomaten vorgesehen werden; auch ist es möglich, die Spritzdosiereinrichtung und die Greifeinrichtung simultan mit Hilfe eines einzigen Positionierautomaten zu bewegen.As an alternative to the exemplary embodiment shown in FIG. 1, depending on the number and the diversity of the components, a plurality of automatic positioning devices provided with gripping devices can be provided; it is also possible to move the spray metering device and the gripping device simultaneously with the aid of a single automatic positioning device.
Im folgenden wird der Aufbau und die Funktionsweise der Spritz¬ dosiereinrichtung 8 anhand von Figur 2 erläutert. Die Spritz¬ dosiereinrichtung 8 besteht aus einem Tintenschreibwerk mit einem Tintendruckkopf 20 und einer hier lediglich strichpunktiert angedeuteten Tintendruckkopfhalterung 21. Ein derartiges Tinten- Schreibwerk ist beispielsweise aus der Siemens-Zeitschrift 51 • (1977), Heft 5, Seiten 215 - 221 bekannt. Der Tintendruckkopf 20, der hier teilweise im Schnitt dargestellt ist, weist mehrere Dosierkanäle 22 und 23 auf, denen jeweils ein Antriebselement 24 bzw. 25 in Form eines röhrchenförraigen Piezoelementes zuge¬ ordnet ist. An jedem Dosierkanal 22 bzw. 23 ist jeweils ein Flüssigkeitsvorratsbehälter 26 und 27 angeschlossen. DieThe structure and the mode of operation of the spray metering device 8 are explained below with reference to FIG. 2. The spray metering device 8 consists of an ink-writing mechanism with an ink-printhead 20 and an ink-printhead holder 21, which is indicated here only by dash-dots. Such an ink-writing mechanism is known, for example, from Siemens magazine 51 • (1977), number 5, pages 215-221. The ink print head 20, which is shown here partly in section, has a plurality of metering channels 22 and 23, each of which is assigned a drive element 24 or 25 in the form of a tube-shaped piezo element. A liquid reservoir 26 and 27 is connected to each metering channel 22 and 23, respectively. The
Spritzdosiereinrichtung 8 ist - hier in Art eines Blockschalt¬ bildes dargestellt - über die drei Bewegungseinheiten 9, 10 und 11 in drei senkrecht zueinander stehenden Achsrichtungen (x,y und z) positionierbar. Hierzu werden die Bewegungseinheiten 9, 10 und 11 über eine Steuereinrichtung 28 in Abhängigkeit von Positionsdaten gesteuert, die der Steuereinrichtung 28 über einen Datenbus 29 zugeführt werden und die die einzelnen Be¬ stückpositionen, z.B. 30, auf dem Bauelementeträger 1 bezeich¬ nen. Gleichzeitig werden die Positionsdaten einem I pulsgene- rator 31 zugeführt, der Steuerimpulse in vorgegebener Anzähl zur Ansteuerung der Antriebselemente 24 und 25 abgibt. Die jeweilige Anzahl der abzugebenden Steuerimpulse ist in Ab¬ hängigkeit von den Positionsdaten der einzelnen Bestückposi¬ tionen, z. B. 30, innerhalb des Impulsgenerators 31 gespeichert.Spray metering device 8 - shown here in the form of a block diagram - can be positioned in three perpendicular axial directions (x, y and z) via the three movement units 9, 10 and 11. For this purpose, the movement units 9, 10 and 11 are controlled via a control device 28 as a function of position data, which are supplied to the control device 28 via a data bus 29 and which the individual component positions, e.g. 30, designated on the component carrier 1. At the same time, the position data are fed to an I pulse generator 31, which emits control pulses in a predetermined number for controlling the drive elements 24 and 25. The respective number of control pulses to be emitted is dependent on the position data of the individual placement positions, e.g. B. 30, stored within the pulse generator 31.
Die Flüssigkeitsvorratsbehälter 26 und 27 enthalten jeweils Komponenten des zu bildenden Haftmittels. Entsprechend der Anzahl der Dosierkanäle 22, 23 können mindestens zwei, jedoch auch drei bis neun verschiedene Komponenten Verwendung finden. Diese Komponenten werden durch Ansteuerung der Antriebselemente 24 und 25 tröpfchenweise auf die Bestückpositioπ 30 abgegeben, wo sie sich zu dem Haftmittel zusammensetzen. Bei dem in Figur 2 gezeigten Beispiel bestehen die Komponenten in den Flüssig¬ keitsvorratsbehältern 26 und 27 aus niedermolekularen und daher dünnflüssigen Klebstoffkomponenten, die sich bei ihrem Zusammen¬ treffen an der Bestückposition 30 zu einem hochmolekularen, dickflüssigen Klebstoff (Epoxidharz oder andere Polymere) ver¬ netzen.The liquid storage containers 26 and 27 each contain components of the adhesive to be formed. Depending on the number of metering channels 22, 23, at least two, but also three to nine different components can be used. By driving the drive elements 24 and 25, these components are dispensed drop by drop onto the placement position 30, where they assemble to form the adhesive. In the example shown in FIG. 2, the components in the liquid storage containers 26 and 27 consist of low-molecular and therefore low-viscosity adhesive components which, when they meet at the assembly position 30, form a high-molecular, viscous adhesive (epoxy resin or other polymers) network.
Alternativ hierzu können als Komponenten des zu bildenden Haft¬ mittels eine Suspension von Lotpulver und weitere niedrigviskose Komponenten zur Bildung einer Lötpaste in den Flüssigkeits¬ vorratsbehältern 26 und 27 enthalten sein; in diesem Fall werden die Komponenten direkt auf die Leiterbahnen 32 und 33 abgegeben, auf denen das Bauelement mit seinen lötfähigen und flächigen Anschlußkontaktflächen aufgesetzt wird. Das Löten des Bauelementes erfolgt dann in einem Aufschmelzlötverfahren.Alternatively, a suspension of solder powder and other low-viscosity can be used as components of the adhesive to be formed Components for forming a solder paste can be contained in the liquid storage containers 26 and 27; in this case, the components are delivered directly to the conductor tracks 32 and 33, on which the component with its solderable and flat connection contact surfaces is placed. The component is then soldered in a reflow process.
Schließlich kann auch mit elektrisch leitende Bestandteile ent¬ haltenden Klebstoffkomponenten gearbeitet werden, die ebenfalls direkt auf die Leiterbahnen 32 und 33 abgegeben werden. Auf diese Weise werden die Bauelemente nach ihrem Aufsetzen auf die Leiterbahnen 32 und 33 mit diesen sowohl mechanisch als auch elektrisch leitend verbunden, so daß auf ein nachfolgendes Löten und eine dazu erforderliche Löteinrichtung verzichtet werden kann. Finally, it is also possible to work with adhesive components containing electrically conductive constituents, which are likewise released directly onto the conductor tracks 32 and 33. In this way, the components after they have been placed on the conductor tracks 32 and 33 are connected to them both mechanically and electrically, so that subsequent soldering and the soldering device required for this purpose can be dispensed with.

Claims

Patentansprüche Claims
1. Verfahren zum Bestücken von Bauele enteträgern (1) mit Bau¬ elementen in Oberflächenmontagetechnik (SMD-Technik) , bei dem an vorgebbaren Bestückpositionen (30) auf den Bauelementeträgern (1) aus einer positionierbaren Spritzdosiereinrichtung (8) ein Haftmittel aufgetragen wird und die Bauelemente an den für sie vorgesehenen Bestückpositionen unter Haftvermittlung des Haft¬ mittels auf den Bauelementeträgern (1) fixiert werden, d a d u r c h g e k e n n z e i c h n e t , daß das Haftmittel jeweils unmittelbar an den Bestückpositionen (30) aus mindestens zwei Komponenten zusammengesetzt wird, die aus unterschiedlichen Dosierkanälen (22 und 23) der Spritz¬ dosiereinrichtung (8) auf die Bestückpositionen (30) abgegeben werden.1. A method for equipping components (1) with components using surface mounting technology (SMD technology), in which an adhesive is applied to the component carriers (1) from a positionable spray metering device (8) at predeterminable placement positions (30) and the Components are fixed to the component positions (1) provided for them, with adhesion of the adhesive, on the component carriers (1), characterized in that the adhesive is composed in each case directly at the mounting positions (30) from at least two components, which consist of different metering channels (22 and 23 ) of the spray metering device (8) are delivered to the placement positions (30).
2. Verfahren nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß als Komponenten niedrigviskose Klebstoffkomponenten unter Bildung eines Klebstoffes als Haftmittel verwendet werden.2. The method according to claim 1, d a d u r c h g e k e n n z e i c h n e t that low-viscosity adhesive components are used as components to form an adhesive as an adhesive.
3. Verfahren nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t , daß Komponenten mit elektrisch leitenden Bestandteilen verwendet werden.3. The method of claim 1 or 2, d a d u r c h g e k e n n z e i c h n e t that components with electrically conductive components are used.
4. Verfahren nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß als Komponenten eine Suspension von Lotpulver und niedrigviskose Komponenten zur Bildung einer Lötpaste als Haftmittel verwendet werden. 4. The method according to claim 1, characterized in that a suspension of solder powder and low-viscosity components are used as components to form a solder paste as an adhesive.
5. Verfahren nach einem der vorangehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , daß als Spritzdosiereinrichtung (8) ein Tintenschreibwerk (20,21) mit den Dosierkanälen (22 und 23) einzeln zugeordneten, indviduell ansteuerbaren Antriebselementen (24 und 25) verwendet wird. 5. The method according to any one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t that an ink pen (20,21) with the metering channels (22 and 23) individually assigned, individually controllable drive elements (24 and 25) is used as the spray metering device (8).
PCT/DE1988/000675 1988-02-22 1988-10-28 Process for mounting components on component supports using surface mounting technology WO1989007878A1 (en)

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DE3805841A DE3805841A1 (en) 1988-02-22 1988-02-22 METHOD FOR EQUIPPING COMPONENT CARRIERS WITH COMPONENTS IN SURFACE MOUNTING TECHNOLOGY
DEP3805841.3 1988-02-22

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EP0580260A3 (en) * 1992-07-17 1994-06-01 Eilam Yair Novel sewing machines and processes
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US6730714B2 (en) 2000-11-09 2004-05-04 3M Innovative Properties Company Inks and other compositions incorporating limited quantities of solvent advantageously used in ink jetting applications
US7423072B2 (en) 2000-11-09 2008-09-09 3M Innovative Properties Company Weather resistant, ink jettable, radiation curable, fluid compositions particularly suitable for outdoor applications
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