WO1985005758A1 - Gaseous lock for entrance and exit of tunnel, in which transport and processing of wafers take place under double floating condition - Google Patents
Gaseous lock for entrance and exit of tunnel, in which transport and processing of wafers take place under double floating condition Download PDFInfo
- Publication number
- WO1985005758A1 WO1985005758A1 PCT/NL1985/000022 NL8500022W WO8505758A1 WO 1985005758 A1 WO1985005758 A1 WO 1985005758A1 NL 8500022 W NL8500022 W NL 8500022W WO 8505758 A1 WO8505758 A1 WO 8505758A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tunnel
- dome
- passageway
- wafer
- transport
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
Definitions
- a positive feature of the apparatus according to the invention is characterized in making use of entrance- and exit domes, to which the tunnel is secured in that way, that during operatxon the tunnel is connected with such domes, filled with an inert gas.
- the gaseous medium in such domes is identical with one of the gaseous media, used in this tunnel. Furthermore, that the gaseous medium is lighter than air.
- Such dome is at its to side sealed off from the outer air, in a sidewall thereof an opening is located, which corresponds with the tunnel passageway , this dome further extends in downward direction as buffer compartment and whereby its bottom side at least temporary can be opened to enable the entering or removal of wafers or cassettes with wafers. In the tunnel the wafers, supplied in the intrance dome, are successively transported towards the exit dome.
- this dome is also higher than the pressure of the outer air and during at least such wafer transport this dome is sufficiently sealed off from the outer air.
- the pressure in the tunnel passagway is at least temporary higher than in the exit dome.
- the pressure in this exit dome is preferably higher than that of the outer air.
- Figure 1 shows a longitudinal sectional view of an apparatus according to the invention.
- Figure 2 shows the entrance dome of the apparatus according to Figure 1 in the supply position of the wafer cassette.
- Figure 3 is a cross section of a modified apparatus with a supply of a wafer cassette from a cassette track
- Figure 4 is a cross section over line 4-4 of the apparatus according to Figure 1
- Figure 5 shows a detail of the take-over section of the entrance dome.
- Figure 6 is an enlarged detail of the section according to Figure 5.
- Figure 7 shows a longitudinal sectional view of a modified dome structure with a sideward displacement of the cassette holder towards the tunnel entrance.
- FIG 8 shows enlarged details of the apparatus according to Digure 7.
- apparatus 10 for processing of wafers 12 is shown.
- this apparatus mainly consists of tunnel 14,with the entrance dome 16 and the exit dome 18 connected therewith.
- the botton ends 20 and 22 of the respective domes 16 and 18 are open and each is provided with a seal rim 25 respectively 28, Thereby by means of the respective mounting plates 30 and 32 a sufficient sealing off of these domes can be accomplished.
- the plates also function as carrier for cassette 34, wherein the wafers 12 can be stored.
- a mechanism 36 is mounted for the displacemant in vertical direction of this carrier, whereby a stepper motor provides the correct vertical positions of the cassette in relation to the tunnel 14.
- a structure for displacement such as air cylinders 38 and 40, the carriers 30 and 32 can also be displaced in upward direction, whereby in the highest position of such carrier it rests against the respective sealing-off rims 26 and 28.
- Such displacement of the cassette in sideward direction cooperates with a displacement in sideward direction of the adapted thrust block 56 for these wafers.
- the wafers 12 are successively brought into the cassette by means of a lower pressure in this dome than in the tunnel 14.
- a lower pressure in this dome than in the tunnel 14.
- the sidewalls of the cassette provide sufficient guidance for the wafers without the developing of contamination, which cannot easily be removed.
- domes 16 and 18 are applicable for an installation, . wherein pre-cleaning under double floating condition, main processing and post cleaning under double floating condition of the wafers take place.
- such apparatus might consist of an installation, wherein pre-cleaning takes place under double floating condition, thereafter one or more main processings of the wafers under for instance high vacuum and thereafter post cleaning under double floating condition.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Apparatus (10), comprising a tunnel (14) for transport and processing of wafers (12) under double floating condition by means of at least a gaseous medium, said tunnel (14) is connected with an entrance dome (16) and an exit dome (18) and both domes are at least partly filled with said gaseous medium to such extent, that during operation said tunnel by means of a gaseous lock in said domes is kept separated from the outer air.
Description
Gaseous lock for entrance and exit of tunnel,in wich transport and processing of wafers take place under double floating condition
In for instance the Dutch Patent Applications No's 8 103 979 and B 300649 of applicant double floating wafer transport and processing systems are described, wherein the transport of the wafers occur in a very narrow tunnel by means of numerous flows of fluid medium, It is desirable, that during the transport and processing of the wafers in the tunnel the outer air is exchanged for an inert gas. Such to prevent as much as possible a contamination of the wafers during the transport and processing.
Thereby a leakage of this relatively expensive and possibly poisinous medium has to be avoided as much as possible. In addition, the entering of the outer air through the entrance and exit of this tunnel has to be prevented as much as possible,
A positive feature of the apparatus according to the invention is characterized in making use of entrance- and exit domes, to which the tunnel is secured in that way, that during operatxon the tunnel is connected with such domes, filled with an inert gas.
Another positive feature is that the gaseous medium in such domes is identical with one of the gaseous media, used in this tunnel. Furthermore, that the gaseous medium is lighter than air, Such dome is at its to side sealed off from the outer air, in a sidewall thereof an opening is located, which corresponds with the tunnel passageway , this dome further extends in downward direction as buffer compartment and whereby its bottom side at least temporary can be opened to enable the entering or removal of wafers or cassettes with wafers. In the tunnel the wafers, supplied in the intrance dome, are successively transported towards the exit dome.
By transporting the wafer into the tunnel passageway it is desirable, that at least temporary the thrust on the wafer in this entrance dome is higher than the opposite thrust on this wafer in the entrance section of this tunnel
A following positive feature now is, that in this dome at least during the transport of a wafer towards the tunnel passageway the pressure of the inert gas is higher than that in the tunnel.
Thereby the pressure in this dome is also higher than the pressure of the outer air and during at least such wafer transport this dome is sufficiently sealed off from the outer air.
Furthermore it is desirous, that to enable the wafer transport by means of gaseous medium from the tunnel into the exit dome, the pressure in the tunnel passagway is at least temporary higher than in the exit dome.
Thereby the pressure in this exit dome is preferably higher than that of the outer air.
Other positive feaures follow from the description of the Figures, Figure 1 shows a longitudinal sectional view of an apparatus according to the invention.
Figure 2 shows the entrance dome of the apparatus according to Figure 1 in the supply position of the wafer cassette.
Figure 3 is a cross section of a modified apparatus with a supply of a wafer cassette from a cassette track, Figure 4 is a cross section over line 4-4 of the apparatus according to Figure 1,
Figure 5 shows a detail of the take-over section of the entrance dome.
Figure 6 is an enlarged detail of the section according to Figure 5. Figure 7 shows a longitudinal sectional view of a modified dome structure with a sideward displacement of the cassette holder towards the tunnel entrance.
Figure 8 shows enlarged details of the apparatus according to Digure 7. In Figure 1 apparatus 10 for processing of wafers 12 is shown. Thereby this apparatus mainly consists of tunnel 14,with the entrance dome 16 and the exit dome 18 connected therewith.
In the tunnel 14 wafer transport and processing takes place under double floating condition, During operation of the apparatus in this tunnel 14 an overpressure of an inert caseous medium is maintained, replacing the air.
The botton ends 20 and 22 of the respective domes 16 and 18 are open and each is provided with a seal rim 25 respectively 28, Thereby by means of the respective mounting plates 30 and 32 a sufficient sealing off of these domes can be accomplished.
The plates also function as carrier for cassette 34, wherein the wafers 12 can be stored.
On such carrier a mechanism 36 is mounted for the displacemant in vertical direction of this carrier, whereby a stepper motor provides the correct vertical positions of the cassette in relation to the tunnel 14. By means of a structure for displacement, such as air cylinders 38 and 40, the carriers 30 and 32 can also be displaced in upward direction, whereby in the highest position of such carrier it rests against the
respective sealing-off rims 26 and 28.
In the lowest position of such mounting plate 30 the emptied cassette 34 can be replaced by a new cassette, filled with wafers. This is shown in Figure 2. In Figure 3 is shown, how in a modified entrance dome 16' mounting plates 30' together with cassettes 34' are withdrawn from the cassette track 42 and after emptying thereof can be brought towards this track.
In the entrance dome 16 at least during the sealing off thereof a higher pressure is maintained than that in tunnel 14, As a result, wafers 12 can be successively suctioned into this tunnel. Thereby such wafer is already brought to the correct take-over position and by means of a flow of gaseous medium from supply manifolds 46 and 4B is urged towards the entrance 50 of the tunnel 14, see also Figures 4, 5 and 6, The sidewalls 52 and 54 of the cassette 34 provides sufficient guidance for the wafer 12, The thereby eventually produced contamination of the wafer is very limited and is removed in the tunnel 14 by means of cleaning thereof.
However, if such contamination has to be reduced, it is possible, that even in the cassette a double floating transport of the wafer takes place. This is shown in Figures 7 and 8,
Thereby the cassette is repeatedly displaced in direction of the tunnel 14, creating a double floating condition for this wafer in the adapted front end 50' of this tunnel.
Such displacement of the cassette in sideward direction cooperates with a displacement in sideward direction of the adapted thrust block 56 for these wafers.
In the exit dome 1B the wafers 12 are successively brought into the cassette by means of a lower pressure in this dome than in the tunnel 14. Such in cooperation with the flows of gaseous medium from the manifolds 58 and 60,
The sidewalls of the cassette provide sufficient guidance for the wafers without the developing of contamination, which cannot easily be removed.
Here it is also possible, that the cassette is moved in sideward direction with the double floating transport therein, as is shown in Figures 7 and 8.
With the double floating wafer transport and processing at least with every main processing of the wafers a pre-cleaning thereof takesplace under double floating condition. Furthermore, in that case often
a post cleaning under double floating condition occurs.
Thereby the domes 16 and 18 are applicable for an installation, . wherein pre-cleaning under double floating condition, main processing and post cleaning under double floating condition of the wafers take place.
With a following making use of the cassette, filled with wafers in the exit dome, it thereafter functions as sender cassette in the entrance dome of a following proces installation. Thereby removal of gathered contamination takes place in the cleaning section of the other proces installation, under the application of the dome structure according to the invention.
Within the scope of the invention modified structures of the apparatus including entrance dome and exit dome are possible.
For instance, such apparatus might consist of an installation, wherein pre-cleaning takes place under double floating condition, thereafter one or more main processings of the wafers under for instance high vacuum and thereafter post cleaning under double floating condition.
Furthermore it is possible, that thereby only pre-cleaning of thewafers cooperates with such processing.
Claims
1. Apparatus, comprising: a tunnel for double floating transport and processing of wafers by means of at least a highly filtered gaseous medium; and at least one dome , structured such, that therewith by means of an established gas lock the passageway of said tunnel is separated from the outer air.
2. Apparatus according to Claim 1, wherein said dome is structured in that way, that at least temporary it contains a seat for at least one wafer.
3. Apparatus according to Claim 2, wherein said dome is structured such, that therein at least temporary a wafer cassette is located.
4. Apparatus according to Claim 2, wherein the top of said dome is sealed off, in the sidewall an opening is located, which corresponds with said passageway of said tunnel and said dome over some distance extends in downward direction beyond said opening.
5. Method of said apparatus according to Claim 4, wherein in said dome at least temporary a gaseous medium is supplied, which is similar to the gaseous medium, used in said tunnel passageway for transport of said wafers under double floating condition.
6, Method according to Claim 5, wherein said gaseous medium is lighter than air.
7. Apparatus according to Claim 4, wherein said dome contains at its lower end such a sealing-off plate, that therewith at least temporary said lower end of said dome is sealed off and said plate at least temporary is rsmoved from said dome.
8. Method according to Claim 5, wherein in said entrance dome during the transport of a wafer towards said tunnel passareway, a higher pressure of the gaseous medium is maintained than in said passageway.
9. Method according to Claim 8, wherein the transport of a wafer towards said tunnel passageway is accomplished by means of a block, providing a thrust on the rear end of said wafer in direction of said passageway.
10. Method accoding to Claim 9, wherein said thrust is accomplished by means of a flow of gaseous medium,
11. Method according to Claim 5, wherein in an exit dome during the successive receipts of wafers out of said tunnel passageway a lower pressure of said gaseous medium is maintained than in said tunnel passageway.
12. Method according to Claim 11 wherein during the transport of a wafer from said tunnel passageway towards said exit done at the end of said passageway flows of gaseous medium provide a thrust on said wafer in direction of said exit dome.
13. Method according to Claim 12, wherein in said exit dome at least temporary a higher pressure is maintained than the pressure of the outer air.
14. Apparatus according to Claim 7, wherein in said entrance dome the sealing-off plate also functions as bearer for the cassette carrier and includes means to provide successive vertical positions of said casin relation to said tunnel passageway.
15. Apparatus according to Claim 7, wherein said sealing-off plate is structured such, that said wafer cassette is displaceable in direction towards and from said tunnel passageway.
16. Apparatus according to Claim 15, wherein both tunnel ends are provided with sections, temporary extending into said cassette over some distance for transport of said wafer in said cassette under at least partly a double floating condition.
17. Apparatus according to Claim 4, including a process installation, in which at least pre-cleaning of wafers as secundary processing and one main processing takes place.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8401777 | 1984-06-04 | ||
NL8401777A NL8401777A (en) | 1984-06-04 | 1984-06-04 | GAS LOCK FOR TUNNEL ENTRY AND OUTPUT, WHICH MOVES AND PROCESSES OF WAFERS USING MEDIA UNDER DOUBLE-FLOATING CONDITION. |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1985005758A1 true WO1985005758A1 (en) | 1985-12-19 |
Family
ID=19844036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/NL1985/000022 WO1985005758A1 (en) | 1984-06-04 | 1985-06-03 | Gaseous lock for entrance and exit of tunnel, in which transport and processing of wafers take place under double floating condition |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0182856A1 (en) |
JP (1) | JPS61502363A (en) |
NL (1) | NL8401777A (en) |
WO (1) | WO1985005758A1 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3719952A1 (en) * | 1987-06-15 | 1988-12-29 | Convac Gmbh | DEVICE FOR TREATING WAFERS IN THE PRODUCTION OF SEMICONDUCTOR ELEMENTS |
DE3735449A1 (en) * | 1987-10-20 | 1989-05-03 | Convac Gmbh | MANUFACTURING SYSTEM FOR SEMICONDUCTOR SUBSTRATES |
EP0494673A1 (en) * | 1991-01-10 | 1992-07-15 | Wacker-Siltronic Gesellschaft für Halbleitermaterialien mbH | Device for and methods of automatically separating stacked discs |
US5745946A (en) * | 1994-07-15 | 1998-05-05 | Ontrak Systems, Inc. | Substrate processing system |
US5762084A (en) * | 1994-07-15 | 1998-06-09 | Ontrak Systems, Inc. | Megasonic bath |
US5924154A (en) * | 1996-08-29 | 1999-07-20 | Ontrak Systems, Inc. | Brush assembly apparatus |
US5975736A (en) * | 1994-07-15 | 1999-11-02 | Ontrak Systems, Inc. | Scrubber control system |
NL1039111C2 (en) * | 2011-10-18 | 2013-04-22 | Edward Bok | EXCHANGEABLE SEMICONDUCTOR CASSETTE BEHIND A SEMICONDUCTOR TUNNEL SET-UP FOR TEMPORARILY STORING THEREIN THE RECTANGULAR PLATES PROTECTED THEREIN, ALREADY CONTAINING BASIC CHIPS. |
NL1039112C2 (en) * | 2011-10-18 | 2013-04-22 | Edward Bok | SEMICONDUCTOR CHIPS PROCESSED IN A SEMICONDUCTOR INSTALLATION, AND IN WHICH IT IS IN A TUNNEL SET-UP THEREOF THE PRODUCTION OF RECTANGULAR PLATES AND FINALLY IN A DEVICE THROUGH SHARING OBTAINED. |
NL1039113C2 (en) * | 2011-10-18 | 2013-04-22 | Edward Bok | SEMICONDUCTOR INSTALLATION, INCLUDING A SEMICONDUCTOR TUNNEL, IN WHICH THE PROCESSING OF FOLLOWING RECTANGULAR PLATES, CONTAINING A NUMBER OF SEMICONDUCTOR BASIC CHIPS, WITH A TEMPORARY STORAGE IN A LOCATED CASE. |
NL1039114C2 (en) * | 2011-10-18 | 2013-04-22 | Edward Bok | SEMICONDUCTOR INSTALLATION, INCLUDING IN A SEMICONDUCTOR TUNNEL THE PROCESSING OF FOLLOWING RECTANGULAR PLATES, CONTAINING A NUMBER OF BASIC CHIPS FOR THE OBTAINING OF A CHIP DEVICE. |
NL1039463C2 (en) * | 2012-03-13 | 2013-09-16 | Edward Bok | SEMICONDUCTOR CHIP MANUFACTURED IN A SEMICONDUCTOR INSTALLATION AND INCLUDING IN A SEMICONDUCTOR TUNNEL SET-UP OF THE RECORDING OF AN EXTREME ULTRA VIOLET LITHOGRAPHY SYSTEM FOR THE USE OF A SUMMARY OF THE SUBSIDENCE OF THE VIEW OF THE SUBSIDENCE OF THE VIEW OF THE SUBSIDENCE OF THE SUBSIDENCE OF THE VIEW. |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4275769B2 (en) | 1998-06-19 | 2009-06-10 | 株式会社渡辺商行 | Substrate transfer device |
NL2010471C2 (en) * | 2013-03-18 | 2014-09-24 | Levitech B V | Substrate processing apparatus. |
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EP0035844A2 (en) * | 1980-03-03 | 1981-09-16 | Texas Instruments Incorporated | Material handling system and method for manufacturing line |
WO1983000774A1 (en) * | 1981-08-26 | 1983-03-03 | Edward Bok | Method and apparatus for deposition of fluid and gaseous media on substrates for their transport |
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JPS5012663B1 (en) * | 1970-05-07 | 1975-05-13 | ||
JPS4994077A (en) * | 1973-01-12 | 1974-09-06 | ||
US3918706A (en) * | 1974-06-24 | 1975-11-11 | Ibm | Pneumatic sheet transport and alignment mechanism |
JPS5232150A (en) * | 1975-09-05 | 1977-03-11 | Komatsu Ltd | Reusing device of heat energy of indusrrial oven waste gas |
JPS5342636A (en) * | 1976-09-30 | 1978-04-18 | Yokogawa Hokushin Electric Corp | Setting condition output system of data gathering equipment |
US4533342A (en) * | 1983-06-06 | 1985-08-06 | Dayco Corporation | Belt construction for a continuously variable transmission, transverse belt element therefor and methods of making the same |
-
1984
- 1984-06-04 NL NL8401777A patent/NL8401777A/en not_active Application Discontinuation
-
1985
- 1985-06-03 EP EP19850902683 patent/EP0182856A1/en not_active Withdrawn
- 1985-06-03 JP JP50243185A patent/JPS61502363A/en active Pending
- 1985-06-03 WO PCT/NL1985/000022 patent/WO1985005758A1/en unknown
Patent Citations (2)
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EP0035844A2 (en) * | 1980-03-03 | 1981-09-16 | Texas Instruments Incorporated | Material handling system and method for manufacturing line |
WO1983000774A1 (en) * | 1981-08-26 | 1983-03-03 | Edward Bok | Method and apparatus for deposition of fluid and gaseous media on substrates for their transport |
Non-Patent Citations (2)
Title |
---|
IBM Technical Disclosure Bulletin, Volume 18, Nr. 11, April 1976, (New York, US) A. KOSTENKO, Sr.: "Wafer Entry System", pages 3669-3670, see page 3669, lines 11-13 * |
Western Electric Engineer, Volume 20, Nr. 2, April 1976, (New York, US) A.F. JOHNSON: "Contamination-Free Wafer Handling and Indentification", pages 42-49 * |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4979464A (en) * | 1987-06-15 | 1990-12-25 | Convac Gmbh | Apparatus for treating wafers in the manufacture of semiconductor elements |
DE3719952A1 (en) * | 1987-06-15 | 1988-12-29 | Convac Gmbh | DEVICE FOR TREATING WAFERS IN THE PRODUCTION OF SEMICONDUCTOR ELEMENTS |
DE3735449A1 (en) * | 1987-10-20 | 1989-05-03 | Convac Gmbh | MANUFACTURING SYSTEM FOR SEMICONDUCTOR SUBSTRATES |
EP0494673A1 (en) * | 1991-01-10 | 1992-07-15 | Wacker-Siltronic Gesellschaft für Halbleitermaterialien mbH | Device for and methods of automatically separating stacked discs |
US5975736A (en) * | 1994-07-15 | 1999-11-02 | Ontrak Systems, Inc. | Scrubber control system |
US5745946A (en) * | 1994-07-15 | 1998-05-05 | Ontrak Systems, Inc. | Substrate processing system |
US5762084A (en) * | 1994-07-15 | 1998-06-09 | Ontrak Systems, Inc. | Megasonic bath |
US5924154A (en) * | 1996-08-29 | 1999-07-20 | Ontrak Systems, Inc. | Brush assembly apparatus |
NL1039111C2 (en) * | 2011-10-18 | 2013-04-22 | Edward Bok | EXCHANGEABLE SEMICONDUCTOR CASSETTE BEHIND A SEMICONDUCTOR TUNNEL SET-UP FOR TEMPORARILY STORING THEREIN THE RECTANGULAR PLATES PROTECTED THEREIN, ALREADY CONTAINING BASIC CHIPS. |
NL1039112C2 (en) * | 2011-10-18 | 2013-04-22 | Edward Bok | SEMICONDUCTOR CHIPS PROCESSED IN A SEMICONDUCTOR INSTALLATION, AND IN WHICH IT IS IN A TUNNEL SET-UP THEREOF THE PRODUCTION OF RECTANGULAR PLATES AND FINALLY IN A DEVICE THROUGH SHARING OBTAINED. |
NL1039113C2 (en) * | 2011-10-18 | 2013-04-22 | Edward Bok | SEMICONDUCTOR INSTALLATION, INCLUDING A SEMICONDUCTOR TUNNEL, IN WHICH THE PROCESSING OF FOLLOWING RECTANGULAR PLATES, CONTAINING A NUMBER OF SEMICONDUCTOR BASIC CHIPS, WITH A TEMPORARY STORAGE IN A LOCATED CASE. |
NL1039114C2 (en) * | 2011-10-18 | 2013-04-22 | Edward Bok | SEMICONDUCTOR INSTALLATION, INCLUDING IN A SEMICONDUCTOR TUNNEL THE PROCESSING OF FOLLOWING RECTANGULAR PLATES, CONTAINING A NUMBER OF BASIC CHIPS FOR THE OBTAINING OF A CHIP DEVICE. |
NL1039463C2 (en) * | 2012-03-13 | 2013-09-16 | Edward Bok | SEMICONDUCTOR CHIP MANUFACTURED IN A SEMICONDUCTOR INSTALLATION AND INCLUDING IN A SEMICONDUCTOR TUNNEL SET-UP OF THE RECORDING OF AN EXTREME ULTRA VIOLET LITHOGRAPHY SYSTEM FOR THE USE OF A SUMMARY OF THE SUBSIDENCE OF THE VIEW OF THE SUBSIDENCE OF THE VIEW OF THE SUBSIDENCE OF THE SUBSIDENCE OF THE VIEW. |
Also Published As
Publication number | Publication date |
---|---|
EP0182856A1 (en) | 1986-06-04 |
NL8401777A (en) | 1986-01-02 |
JPS61502363A (en) | 1986-10-16 |
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