USD996424S1 - Solid state drive memory device - Google Patents
Solid state drive memory device Download PDFInfo
- Publication number
- USD996424S1 USD996424S1 US29/805,543 US202129805543F USD996424S US D996424 S1 USD996424 S1 US D996424S1 US 202129805543 F US202129805543 F US 202129805543F US D996424 S USD996424 S US D996424S
- Authority
- US
- United States
- Prior art keywords
- memory device
- solid state
- state drive
- drive memory
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007787 solid Substances 0.000 title claims description 4
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
- G11B33/022—Cases
- G11B33/025—Portable cases
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
- G11B33/04—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7017—Snap means
- H01R12/7023—Snap means integral with the coupling device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/621—Bolt, set screw or screw clamp
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
- H05K5/0008—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Casings For Electric Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.
Claims (1)
- The ornamental design for a solid state drive memory device, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/805,543 USD996424S1 (en) | 2020-06-09 | 2021-08-27 | Solid state drive memory device |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2020-0069865 | 2020-06-09 | ||
KR20200069865 | 2020-06-09 | ||
KR10-2020-0115976 | 2020-09-10 | ||
KR1020200115976A KR20210152914A (en) | 2020-06-09 | 2020-09-10 | Memory device and electroic device including the same |
US17/217,759 US11979996B2 (en) | 2020-06-09 | 2021-03-30 | Memory device and electronic device including the same |
US29/805,543 USD996424S1 (en) | 2020-06-09 | 2021-08-27 | Solid state drive memory device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/217,759 Continuation US11979996B2 (en) | 2020-06-09 | 2021-03-30 | Memory device and electronic device including the same |
Publications (1)
Publication Number | Publication Date |
---|---|
USD996424S1 true USD996424S1 (en) | 2023-08-22 |
Family
ID=75143530
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/217,759 Active US11979996B2 (en) | 2020-06-09 | 2021-03-30 | Memory device and electronic device including the same |
US29/805,536 Active USD997939S1 (en) | 2020-06-09 | 2021-08-27 | Solid state drive memory device |
US29/805,543 Active USD996424S1 (en) | 2020-06-09 | 2021-08-27 | Solid state drive memory device |
US29/805,549 Active USD998612S1 (en) | 2020-06-09 | 2021-08-27 | Solid state drive memory device |
US18/529,889 Pending US20240114638A1 (en) | 2020-06-09 | 2023-12-05 | Memory device and electronic device including the same |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/217,759 Active US11979996B2 (en) | 2020-06-09 | 2021-03-30 | Memory device and electronic device including the same |
US29/805,536 Active USD997939S1 (en) | 2020-06-09 | 2021-08-27 | Solid state drive memory device |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/805,549 Active USD998612S1 (en) | 2020-06-09 | 2021-08-27 | Solid state drive memory device |
US18/529,889 Pending US20240114638A1 (en) | 2020-06-09 | 2023-12-05 | Memory device and electronic device including the same |
Country Status (3)
Country | Link |
---|---|
US (5) | US11979996B2 (en) |
EP (1) | EP3923687B1 (en) |
CN (1) | CN113782062A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN215818843U (en) * | 2021-05-18 | 2022-02-11 | 上海宝存信息科技有限公司 | Electronic device with storage function |
US11985782B2 (en) * | 2022-04-08 | 2024-05-14 | Western Digital Technologies, Inc. | Enclosure fitting for electronic device |
TWI823388B (en) * | 2022-05-13 | 2023-11-21 | 威剛科技股份有限公司 | Storage device with heat dissipation function |
Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD327071S (en) * | 1990-04-23 | 1992-06-16 | British Telecommunications Public Limited Company | Network interface housing for telecommunication service |
USD345959S (en) * | 1992-09-29 | 1994-04-12 | Eldec Corporation | Electronic circuit housing |
USD348247S (en) * | 1993-06-09 | 1994-06-28 | Eldec Corporation | Electronic circuit housing |
EP0710955A2 (en) | 1994-11-02 | 1996-05-08 | Hitachi, Ltd. | Data storage apparatus |
USD400512S (en) * | 1997-02-12 | 1998-11-03 | Fibox Oy Ab | Enclosure for electronic and electric components |
US6287143B1 (en) | 1993-03-23 | 2001-09-11 | Berg Technology, Inc. | Multi-storage deck connector apparatus |
EP1494518A1 (en) * | 2003-07-03 | 2005-01-05 | Delphi Technologies, Inc. | Electronic package having fastener particle containment and assembly method |
USD669427S1 (en) * | 2012-01-10 | 2012-10-23 | Research In Motion Limited | Electronic device battery |
US9135957B2 (en) | 2011-03-03 | 2015-09-15 | Hewlett-Packard Development Company, L.P. | Electronic storage device mounts |
USD743399S1 (en) * | 2014-05-30 | 2015-11-17 | Emc Corporation | Flash module |
USD768134S1 (en) * | 2010-10-18 | 2016-10-04 | Apple Inc. | Electronic device |
US9501110B2 (en) | 2014-06-05 | 2016-11-22 | Liqid Inc. | Adjustable data storage drive module carrier assembly |
KR20170000709A (en) * | 2015-06-24 | 2017-01-03 | 주식회사 유텔 | Microwave module and method for packaging thereof |
US9607914B2 (en) | 2014-05-15 | 2017-03-28 | Intel Corporation | Molded composite enclosure for integrated circuit assembly |
USD826944S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826945S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD828358S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
US10140063B2 (en) | 2015-03-02 | 2018-11-27 | Samsung Electronics Co., Ltd. | Solid state drive multi-card adapter with integrated processing |
JP2018195436A (en) | 2017-05-17 | 2018-12-06 | 株式会社広田製作所 | External device connection adapter for SSD |
US10349542B2 (en) | 2017-08-15 | 2019-07-09 | Quanta Computer Inc. | System and method for a solid state drive (SSD) enclosure |
US20200174533A1 (en) | 2017-03-17 | 2020-06-04 | Intel Corporation | Solid state memory case with enhanced cooling |
USD888000S1 (en) * | 2018-08-29 | 2020-06-23 | Samsung Electronics Co., Ltd. | Case for a circuit board |
USD896229S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
US20200302259A1 (en) * | 2017-11-29 | 2020-09-24 | Phoenix Solution Co., Ltd. | Antenna for rf tag, and rf tag |
USD907031S1 (en) * | 2017-11-17 | 2021-01-05 | Intel Corporation | Electronic device |
USD943586S1 (en) * | 2019-05-22 | 2022-02-15 | Samsung Electronics Co., Ltd. | SSD (solid state drive) |
USD967823S1 (en) * | 2019-05-06 | 2022-10-25 | Dell Products L.P. | Information handling system storage device |
CN115440673A (en) * | 2021-06-02 | 2022-12-06 | 铠侠股份有限公司 | Semiconductor memory device with a plurality of memory cells |
US11585359B2 (en) * | 2021-03-15 | 2023-02-21 | Inventec (Pudong) Technology Corporation | Fixing device |
US11632878B2 (en) * | 2021-05-14 | 2023-04-18 | Shannon Systems Ltd. | Add-in module |
Family Cites Families (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5377080A (en) | 1993-12-28 | 1994-12-27 | Lin; Chung-I | Printed circuit board mounting box |
USD384648S (en) | 1995-11-02 | 1997-10-07 | Fibox Oy Ab | Enclosure for electronic and electric components |
US5673181A (en) | 1996-04-23 | 1997-09-30 | Hsu; Fu-Yu | IC card assembly |
US6317317B1 (en) | 1999-12-06 | 2001-11-13 | Compal Electronics, Inc. | Insertion cartridge for hard disc of portable computer |
EP1343037B1 (en) * | 2002-03-05 | 2003-12-17 | Agilent Technologies, Inc. (a Delaware corporation) | Opto-electronical module with EMI-shielding |
CN1262052C (en) * | 2002-12-23 | 2006-06-28 | 明基电通股份有限公司 | Connector device with adjustable connecting mode |
US7352601B1 (en) * | 2003-11-24 | 2008-04-01 | Michael Paul Minneman | USB flash memory device |
US20080144270A1 (en) * | 2006-12-15 | 2008-06-19 | Dal Porto Sandro F | Portable Data Storage Device |
USD570795S1 (en) | 2007-02-16 | 2008-06-10 | Sunonwealth Electric Machine Industry Co., Ltd. | Mini blower heat sink module |
WO2010054128A2 (en) * | 2008-11-05 | 2010-05-14 | Red E Innovations, Llc | Dta holder, system and method |
JP2011003253A (en) * | 2009-06-22 | 2011-01-06 | Sanyo Electric Co Ltd | Cartridge mounting device and electronic equipment equipped with the cartridge mounting device |
US8665601B1 (en) * | 2009-09-04 | 2014-03-04 | Bitmicro Networks, Inc. | Solid state drive with improved enclosure assembly |
USD660787S1 (en) | 2010-02-10 | 2012-05-29 | Kangaroo Media, Inc. | Battery |
TWI450100B (en) * | 2010-12-13 | 2014-08-21 | Phison Electronics Corp | Data storage device, stacking method thereof and data storage device assembly |
CN103068197A (en) * | 2011-10-21 | 2013-04-24 | 佛山普立华科技有限公司 | Universal serial bus (USB) popup device |
CN103259120B (en) * | 2011-12-30 | 2017-05-24 | 威斯科数据安全国际有限公司 | USB device with cap |
US9739543B2 (en) | 2013-02-06 | 2017-08-22 | Te Connectivity Corporation | Heat sink |
US9583153B1 (en) | 2013-06-28 | 2017-02-28 | Western Digital Technologies, Inc. | Memory card placement within a solid state drive |
US9247676B2 (en) | 2013-08-14 | 2016-01-26 | The Directv Group, Inc. | Electronic device cooling systems |
KR102178829B1 (en) * | 2013-11-20 | 2020-11-13 | 삼성전자 주식회사 | Semiconductor memory device |
JP2016085670A (en) * | 2014-10-28 | 2016-05-19 | 株式会社東芝 | Semiconductor storage unit |
WO2016085493A1 (en) * | 2014-11-26 | 2016-06-02 | Hewlett Packard Enterprise Development Lp | Storage drive carrier module |
TWM505043U (en) * | 2015-04-17 | 2015-07-11 | Phison Electronics Corp | Flash drive |
US10255215B2 (en) * | 2016-01-29 | 2019-04-09 | Liqid Inc. | Enhanced PCIe storage device form factors |
US10929327B1 (en) * | 2016-02-22 | 2021-02-23 | ZT Group Int'l, Inc. | Expansion device housing multiple components |
US10503685B2 (en) * | 2016-03-04 | 2019-12-10 | Toshiba Memory Corporation | Semiconductor memory device |
US10365697B2 (en) | 2016-06-06 | 2019-07-30 | Dell Products, Lp | Hot plug carrier with push to release mechanism |
US9955596B2 (en) * | 2016-08-10 | 2018-04-24 | Seagate Technology Llc | PCBA cartridge sub-assembly |
WO2018080466A1 (en) * | 2016-10-26 | 2018-05-03 | Intel Corporation | Integrated electronic card front emi cage and latch for data storage system |
CN108133722B (en) * | 2016-11-30 | 2020-02-21 | 上海宝存信息科技有限公司 | Solid state disk device |
FR3063863A1 (en) | 2017-03-08 | 2018-09-14 | M.B.H. Developpement | ELECTRONIC HOUSING FOR CONTROLLING AN ENGINE, IN PARTICULAR AN ELECTROPORTATIVE MACHINE |
US10955881B2 (en) | 2017-05-02 | 2021-03-23 | Seagate Technology Llc | Memory module cooling assembly |
US10356927B2 (en) * | 2017-08-01 | 2019-07-16 | Facebook, Inc. | Storage card adapter with compression latch |
US10520994B2 (en) * | 2018-01-31 | 2019-12-31 | Facebook, Inc. | Storage cartridge |
US10261554B1 (en) | 2018-03-22 | 2019-04-16 | Super Micro Computer Inc. | Drawer for receiving storage module |
KR102615769B1 (en) * | 2018-05-18 | 2023-12-20 | 삼성전자주식회사 | Memory device |
US10346735B1 (en) | 2018-09-29 | 2019-07-09 | Wen-Yi Lee | Assembling buckle structure for memory circuit board |
TWM573560U (en) * | 2018-11-01 | 2019-01-21 | 微星科技股份有限公司 | Heat sink |
KR20200051913A (en) * | 2018-11-05 | 2020-05-14 | 삼성전자주식회사 | Solid state drive device and computer server system having the same |
US10622026B1 (en) * | 2018-11-09 | 2020-04-14 | Quanta Computer Inc. | Universal storage carrier |
KR20200069865A (en) | 2018-12-07 | 2020-06-17 | 지테크이엔지 주식회사 | Biomass molded fuel with high calorific value, apparatus and manufacturing method for thermoelectric power plant using vegetable Oil generation by-product and high efficiency compression molding technique |
DE202019100078U1 (en) * | 2019-01-09 | 2020-04-15 | Weidmüller Interface GmbH & Co. KG | Control and modular control system of an industrial automation system |
JP2020119980A (en) * | 2019-01-23 | 2020-08-06 | キオクシア株式会社 | Electronic device |
CN111667852B (en) * | 2019-03-07 | 2021-11-30 | 上海宝存信息科技有限公司 | Solid state memory device |
FR3094173B1 (en) * | 2019-03-19 | 2021-04-23 | Bull Sas | DISSIPATING INTERCONNECTION MODULE FOR M.2 FORM FACTOR EXTENSION BOARD |
KR20200115976A (en) | 2019-03-30 | 2020-10-08 | 이상윤 | Interaction method and system of advertisement on the internet social platform website comment window |
US11678444B2 (en) * | 2019-05-15 | 2023-06-13 | Intel Corporation | Loading mechanism with integrated heatsink |
TWM585962U (en) | 2019-05-24 | 2019-11-01 | 宇瞻科技股份有限公司 | Solid state hard disk heat sink |
JP2021012993A (en) * | 2019-07-09 | 2021-02-04 | キオクシア株式会社 | Semiconductor storage device |
USD921627S1 (en) | 2019-07-30 | 2021-06-08 | Samsung Electronics Co., Ltd. | SSD(solid state drive) memory device |
US11209882B2 (en) | 2019-07-31 | 2021-12-28 | Microsoft Technology Licensing, Llc | Mechanical selection of power consumption indicator by form factor |
US11092996B2 (en) * | 2019-08-20 | 2021-08-17 | Getac Technology Corporation | Electronic device |
US11023020B2 (en) * | 2019-10-30 | 2021-06-01 | Smart Embedded Computing, Inc. | Carrier for one or more solid state drives (SSDs) |
US20210133139A1 (en) * | 2019-11-02 | 2021-05-06 | UNICOM Engineering, Inc. c/o UNICOM Systems, Inc. | Hot-swappable solid-state drive expansion cards |
CN115836594A (en) * | 2020-03-19 | 2023-03-21 | 耐科萨公司 | Packaging portable solid state devices |
US11291140B2 (en) | 2020-07-13 | 2022-03-29 | TEC CONNECTIVITY SERVICES GmbH | Heat sink assembly for an electrical component |
CN111988944A (en) | 2020-07-13 | 2020-11-24 | 重庆智行者信息科技有限公司 | Waterproof controller |
DE202020003265U1 (en) | 2020-07-29 | 2020-12-18 | Lutz Lothar Zamecki | Robust NVMe SSD cooling jacket based on heatpipe and zipper fin with a hinge between the upper and lower shell for use in industrial, automation, medical, military and embedded systems as well as for ISP server rack systems |
-
2021
- 2021-03-22 EP EP21163979.4A patent/EP3923687B1/en active Active
- 2021-03-30 US US17/217,759 patent/US11979996B2/en active Active
- 2021-05-27 CN CN202110586762.4A patent/CN113782062A/en active Pending
- 2021-08-27 US US29/805,536 patent/USD997939S1/en active Active
- 2021-08-27 US US29/805,543 patent/USD996424S1/en active Active
- 2021-08-27 US US29/805,549 patent/USD998612S1/en active Active
-
2023
- 2023-12-05 US US18/529,889 patent/US20240114638A1/en active Pending
Patent Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD327071S (en) * | 1990-04-23 | 1992-06-16 | British Telecommunications Public Limited Company | Network interface housing for telecommunication service |
USD345959S (en) * | 1992-09-29 | 1994-04-12 | Eldec Corporation | Electronic circuit housing |
US6287143B1 (en) | 1993-03-23 | 2001-09-11 | Berg Technology, Inc. | Multi-storage deck connector apparatus |
USD348247S (en) * | 1993-06-09 | 1994-06-28 | Eldec Corporation | Electronic circuit housing |
EP0710955A2 (en) | 1994-11-02 | 1996-05-08 | Hitachi, Ltd. | Data storage apparatus |
USD400512S (en) * | 1997-02-12 | 1998-11-03 | Fibox Oy Ab | Enclosure for electronic and electric components |
EP1494518A1 (en) * | 2003-07-03 | 2005-01-05 | Delphi Technologies, Inc. | Electronic package having fastener particle containment and assembly method |
USD768134S1 (en) * | 2010-10-18 | 2016-10-04 | Apple Inc. | Electronic device |
US9135957B2 (en) | 2011-03-03 | 2015-09-15 | Hewlett-Packard Development Company, L.P. | Electronic storage device mounts |
USD669427S1 (en) * | 2012-01-10 | 2012-10-23 | Research In Motion Limited | Electronic device battery |
US9607914B2 (en) | 2014-05-15 | 2017-03-28 | Intel Corporation | Molded composite enclosure for integrated circuit assembly |
USD743399S1 (en) * | 2014-05-30 | 2015-11-17 | Emc Corporation | Flash module |
US9501110B2 (en) | 2014-06-05 | 2016-11-22 | Liqid Inc. | Adjustable data storage drive module carrier assembly |
US10416731B2 (en) | 2014-06-05 | 2019-09-17 | Liqid Inc. | Data storage drive module carrier assembly |
US10140063B2 (en) | 2015-03-02 | 2018-11-27 | Samsung Electronics Co., Ltd. | Solid state drive multi-card adapter with integrated processing |
KR20170000709A (en) * | 2015-06-24 | 2017-01-03 | 주식회사 유텔 | Microwave module and method for packaging thereof |
USD828358S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826944S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826945S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
US20200174533A1 (en) | 2017-03-17 | 2020-06-04 | Intel Corporation | Solid state memory case with enhanced cooling |
JP2018195436A (en) | 2017-05-17 | 2018-12-06 | 株式会社広田製作所 | External device connection adapter for SSD |
US10349542B2 (en) | 2017-08-15 | 2019-07-09 | Quanta Computer Inc. | System and method for a solid state drive (SSD) enclosure |
USD907031S1 (en) * | 2017-11-17 | 2021-01-05 | Intel Corporation | Electronic device |
US20200302259A1 (en) * | 2017-11-29 | 2020-09-24 | Phoenix Solution Co., Ltd. | Antenna for rf tag, and rf tag |
USD888000S1 (en) * | 2018-08-29 | 2020-06-23 | Samsung Electronics Co., Ltd. | Case for a circuit board |
USD896229S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
USD967823S1 (en) * | 2019-05-06 | 2022-10-25 | Dell Products L.P. | Information handling system storage device |
USD943586S1 (en) * | 2019-05-22 | 2022-02-15 | Samsung Electronics Co., Ltd. | SSD (solid state drive) |
US11585359B2 (en) * | 2021-03-15 | 2023-02-21 | Inventec (Pudong) Technology Corporation | Fixing device |
US11632878B2 (en) * | 2021-05-14 | 2023-04-18 | Shannon Systems Ltd. | Add-in module |
CN115440673A (en) * | 2021-06-02 | 2022-12-06 | 铠侠股份有限公司 | Semiconductor memory device with a plurality of memory cells |
US20220394862A1 (en) * | 2021-06-02 | 2022-12-08 | Kioxia Corporation | Semiconductor storage device |
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USD997939S1 (en) | 2023-09-05 |
US11979996B2 (en) | 2024-05-07 |
EP3923687B1 (en) | 2024-04-03 |
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