USD980811S1 - Leadframe - Google Patents
Leadframe Download PDFInfo
- Publication number
- USD980811S1 USD980811S1 US29/814,007 US202129814007F USD980811S US D980811 S1 USD980811 S1 US D980811S1 US 202129814007 F US202129814007 F US 202129814007F US D980811 S USD980811 S US D980811S
- Authority
- US
- United States
- Prior art keywords
- leadframe
- view
- elevational view
- mirror image
- side elevational
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.
The shade lines in the figures show contours and not surface ornamentation.
Claims (1)
- The ornamental design for a leadframe, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/814,007 USD980811S1 (en) | 2019-05-29 | 2021-11-02 | Leadframe |
US17/803,180 US20230317567A1 (en) | 2019-05-29 | 2022-08-31 | Leadframe |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/692,906 USD939458S1 (en) | 2019-05-29 | 2019-05-29 | Leadframe |
US29/699,936 USD940090S1 (en) | 2019-05-29 | 2019-07-30 | Leadframe |
US29/814,007 USD980811S1 (en) | 2019-05-29 | 2021-11-02 | Leadframe |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/699,936 Division USD940090S1 (en) | 2019-05-29 | 2019-07-30 | Leadframe |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/692,906 Continuation-In-Part USD939458S1 (en) | 2019-05-29 | 2019-05-29 | Leadframe |
Publications (1)
Publication Number | Publication Date |
---|---|
USD980811S1 true USD980811S1 (en) | 2023-03-14 |
Family
ID=79165852
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/699,936 Active USD940090S1 (en) | 2019-05-29 | 2019-07-30 | Leadframe |
US29/814,007 Active USD980811S1 (en) | 2019-05-29 | 2021-11-02 | Leadframe |
US29/814,009 Active USD969093S1 (en) | 2019-05-29 | 2021-11-02 | Leadframe |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/699,936 Active USD940090S1 (en) | 2019-05-29 | 2019-07-30 | Leadframe |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/814,009 Active USD969093S1 (en) | 2019-05-29 | 2021-11-02 | Leadframe |
Country Status (1)
Country | Link |
---|---|
US (3) | USD940090S1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD940090S1 (en) * | 2019-05-29 | 2022-01-04 | Diodes Incorporated | Leadframe |
USD939458S1 (en) * | 2019-05-29 | 2021-12-28 | Diodes Incorporated | Leadframe |
USD954006S1 (en) * | 2020-11-03 | 2022-06-07 | Linxens Holding | Microcircuit for smart card |
Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050258520A1 (en) * | 2004-05-18 | 2005-11-24 | Dolan Douglas E | Packaged integrated circuit with MLP leadframe and method of making same |
US20090278241A1 (en) * | 2008-05-08 | 2009-11-12 | Yong Liu | Semiconductor die package including die stacked on premolded substrate including die |
US20150084172A1 (en) * | 2013-09-26 | 2015-03-26 | Byung Tai Do | Integrated circuit packaging system with side solderable leads and method of manufacture thereof |
US20150200156A1 (en) * | 2014-01-13 | 2015-07-16 | Altera Corporation | Module having mirror-symmetric terminals and methods of forming the same |
US20150221584A1 (en) * | 2014-02-05 | 2015-08-06 | Texas Instruments Incorporated | Stacked Synchronous Buck Converter Having Chip Embedded in Outside Recess of Leadframe |
US20180130723A1 (en) * | 2014-03-07 | 2018-05-10 | Bridge Semiconductor Corporation | Leadframe substrate with electronic component incorporated therein and semiconductor assembly using the same |
US20180182642A1 (en) * | 2016-12-23 | 2018-06-28 | Texas Instruments Incorporated | Qfn pin routing thru lead frame etching |
US20190198352A1 (en) * | 2017-12-22 | 2019-06-27 | Texas Instruments Incorporated | Semiconductor package with filler particles in a mold compound |
US10347571B1 (en) * | 2018-01-09 | 2019-07-09 | Macom Technology Solutions Holdings, Inc. | Intra-package interference isolation |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
US20190355651A1 (en) * | 2018-05-21 | 2019-11-21 | Texas Instruments Incorporated | Two sided bondable lead frame |
US20200035586A1 (en) * | 2018-07-25 | 2020-01-30 | Semiconductor Components Industries, Llc | Chip-on-lead semiconductor device packages with electrically isolated signal leads |
US20200194351A1 (en) * | 2018-12-12 | 2020-06-18 | Stmicroelectronics, Inc. | Compact leadframe package |
US20200194357A1 (en) * | 2018-12-14 | 2020-06-18 | Texas Instruments Incorporated | Package with dies mounted on opposing surfaces of a leadframe |
US20200211933A1 (en) * | 2018-12-31 | 2020-07-02 | Texas Instruments Incorporated | Leadframe die pad with partially-etched groove between through-hole slots |
US20200258825A1 (en) * | 2019-02-12 | 2020-08-13 | Texas Instruments Incorporated | High current packages with reduced solder layer count |
US20200303609A1 (en) * | 2019-03-22 | 2020-09-24 | Samsung Electronics Co., Ltd. | Light-emitting device packages |
US20200312754A1 (en) * | 2019-04-01 | 2020-10-01 | Fuji Electric Co., Ltd. | Semiconductor device |
US20200312958A1 (en) * | 2019-03-27 | 2020-10-01 | Intel Corporation | Source or drain structures with phosphorous and arsenic co-dopants |
US20200343168A1 (en) * | 2019-04-25 | 2020-10-29 | Stmicroelectronics, Inc. | Lead stabilization in semiconductor packages |
USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
US20200411421A1 (en) * | 2019-06-28 | 2020-12-31 | Semiconductor Components Industries, Llc | Semiconductor device assemblies |
US20210020553A1 (en) * | 2016-03-21 | 2021-01-21 | Infineon Technologies Ag | Leadframe leads having fully plated end faces |
US20210090980A1 (en) * | 2019-09-25 | 2021-03-25 | Texas Instruments Incorporated | Semiconductor package with solder standoff |
US20210225742A1 (en) * | 2020-01-22 | 2021-07-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure |
USD939458S1 (en) * | 2019-05-29 | 2021-12-28 | Diodes Incorporated | Leadframe |
USD940090S1 (en) * | 2019-05-29 | 2022-01-04 | Diodes Incorporated | Leadframe |
US20220020680A1 (en) * | 2020-07-14 | 2022-01-20 | Advanced Semiconductor Engineering, Inc. | Lead frame, package structure comprising the same and method for manufacturing the package structure |
US20220028767A1 (en) * | 2020-07-27 | 2022-01-27 | Texas Instruments Incorporated | Surface mount package for a semiconductor device |
US20220102248A1 (en) * | 2020-09-30 | 2022-03-31 | Semiconductor Components Industries, Llc | Concealed gate terminal semiconductor packages and related methods |
US20220139812A1 (en) * | 2020-11-03 | 2022-05-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10128171B1 (en) * | 2016-03-25 | 2018-11-13 | Marvell International Ltd. | Leadframe with improved half-etch layout to reduce defects caused during singulation |
US10763195B2 (en) * | 2018-03-23 | 2020-09-01 | Stmicroelectronics S.R.L. | Leadframe package using selectively pre-plated leadframe |
EP3840548A1 (en) * | 2019-12-20 | 2021-06-23 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier and method of manufacturing the same |
-
2019
- 2019-07-30 US US29/699,936 patent/USD940090S1/en active Active
-
2021
- 2021-11-02 US US29/814,007 patent/USD980811S1/en active Active
- 2021-11-02 US US29/814,009 patent/USD969093S1/en active Active
Patent Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050258520A1 (en) * | 2004-05-18 | 2005-11-24 | Dolan Douglas E | Packaged integrated circuit with MLP leadframe and method of making same |
US20090278241A1 (en) * | 2008-05-08 | 2009-11-12 | Yong Liu | Semiconductor die package including die stacked on premolded substrate including die |
US20150084172A1 (en) * | 2013-09-26 | 2015-03-26 | Byung Tai Do | Integrated circuit packaging system with side solderable leads and method of manufacture thereof |
US20150200156A1 (en) * | 2014-01-13 | 2015-07-16 | Altera Corporation | Module having mirror-symmetric terminals and methods of forming the same |
US20150221584A1 (en) * | 2014-02-05 | 2015-08-06 | Texas Instruments Incorporated | Stacked Synchronous Buck Converter Having Chip Embedded in Outside Recess of Leadframe |
US20180130723A1 (en) * | 2014-03-07 | 2018-05-10 | Bridge Semiconductor Corporation | Leadframe substrate with electronic component incorporated therein and semiconductor assembly using the same |
US20210020553A1 (en) * | 2016-03-21 | 2021-01-21 | Infineon Technologies Ag | Leadframe leads having fully plated end faces |
US20180182642A1 (en) * | 2016-12-23 | 2018-06-28 | Texas Instruments Incorporated | Qfn pin routing thru lead frame etching |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
US20190198352A1 (en) * | 2017-12-22 | 2019-06-27 | Texas Instruments Incorporated | Semiconductor package with filler particles in a mold compound |
US10347571B1 (en) * | 2018-01-09 | 2019-07-09 | Macom Technology Solutions Holdings, Inc. | Intra-package interference isolation |
US20190355651A1 (en) * | 2018-05-21 | 2019-11-21 | Texas Instruments Incorporated | Two sided bondable lead frame |
US20200035586A1 (en) * | 2018-07-25 | 2020-01-30 | Semiconductor Components Industries, Llc | Chip-on-lead semiconductor device packages with electrically isolated signal leads |
USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
US20200194351A1 (en) * | 2018-12-12 | 2020-06-18 | Stmicroelectronics, Inc. | Compact leadframe package |
US20200194357A1 (en) * | 2018-12-14 | 2020-06-18 | Texas Instruments Incorporated | Package with dies mounted on opposing surfaces of a leadframe |
US20200211933A1 (en) * | 2018-12-31 | 2020-07-02 | Texas Instruments Incorporated | Leadframe die pad with partially-etched groove between through-hole slots |
US20200258825A1 (en) * | 2019-02-12 | 2020-08-13 | Texas Instruments Incorporated | High current packages with reduced solder layer count |
US20200303609A1 (en) * | 2019-03-22 | 2020-09-24 | Samsung Electronics Co., Ltd. | Light-emitting device packages |
US20200312958A1 (en) * | 2019-03-27 | 2020-10-01 | Intel Corporation | Source or drain structures with phosphorous and arsenic co-dopants |
US20200312754A1 (en) * | 2019-04-01 | 2020-10-01 | Fuji Electric Co., Ltd. | Semiconductor device |
US20200343168A1 (en) * | 2019-04-25 | 2020-10-29 | Stmicroelectronics, Inc. | Lead stabilization in semiconductor packages |
USD939458S1 (en) * | 2019-05-29 | 2021-12-28 | Diodes Incorporated | Leadframe |
USD940090S1 (en) * | 2019-05-29 | 2022-01-04 | Diodes Incorporated | Leadframe |
US20200411421A1 (en) * | 2019-06-28 | 2020-12-31 | Semiconductor Components Industries, Llc | Semiconductor device assemblies |
US20210090980A1 (en) * | 2019-09-25 | 2021-03-25 | Texas Instruments Incorporated | Semiconductor package with solder standoff |
US20210225742A1 (en) * | 2020-01-22 | 2021-07-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure |
US20220020680A1 (en) * | 2020-07-14 | 2022-01-20 | Advanced Semiconductor Engineering, Inc. | Lead frame, package structure comprising the same and method for manufacturing the package structure |
US20220028767A1 (en) * | 2020-07-27 | 2022-01-27 | Texas Instruments Incorporated | Surface mount package for a semiconductor device |
US20220102248A1 (en) * | 2020-09-30 | 2022-03-31 | Semiconductor Components Industries, Llc | Concealed gate terminal semiconductor packages and related methods |
US20220139812A1 (en) * | 2020-11-03 | 2022-05-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
USD969093S1 (en) | 2022-11-08 |
USD940090S1 (en) | 2022-01-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |